CN105611718B - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN105611718B CN105611718B CN201610065136.XA CN201610065136A CN105611718B CN 105611718 B CN105611718 B CN 105611718B CN 201610065136 A CN201610065136 A CN 201610065136A CN 105611718 B CN105611718 B CN 105611718B
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- CN
- China
- Prior art keywords
- metal layer
- differential signal
- signal line
- circuit board
- flexible circuit
- Prior art date
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- 239000002184 metal Substances 0.000 claims abstract description 67
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000011889 copper foil Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 108010076504 Protein Sorting Signals Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the application discloses flexible circuit board includes: the flexible printed circuit board comprises a first metal layer, a second metal layer and a flexible substrate arranged between the first metal layer and the second metal layer; at least one pair of differential signal lines is arranged in the first metal layer; a plurality of hollow patterns are arranged in the second metal layer, and the hollow patterns at least have two parallel edges; in one of the hollow patterns, only the two opposite parallel sides intersect with the pair of differential signal lines. The embodiment of the application can reduce the impedance difference of the differential signal lines.
Description
Technical field
This application involves electronic technology fields, and in particular to field of circuit technology more particularly to a kind of flexible circuit board.
Background technique
Flexible circuit board (Flexible Printed Circuit board, FPC) is made of insulating substrate flexible
Printed circuit, have many advantages, such as that Distribution density is high, light-weight, thickness is thin, bending is good, therefore have extensively in electric field
General application.Multi-layer FPC may include the signals layer for transmitting signal and the reference ground for making reference face, and in signals layer
Pairs of differential signal line can be set and be used for transmission high speed signal.
In the prior art, although differential signal line can improve the anti-interference ability of signal transmission, essence to a certain extent
Really control signal sequence, but since differential signal line is difficult to equably configure on reference layer, differential signal can be caused
Line impedence inconsistence problems.Fig. 1 shows a kind of structural schematic diagram of flexible circuit board in the prior art.As shown in Figure 1, flexible
It include reference layer ground wire 11 and a pair of of differential lines signal wire 12 on circuit board 10.Existing on reference layer ground wire 11 by angle is 45 degree
With the diamond shape of 135 degree of conducting wire formation.A pair of of differential lines signal wire 12 includes signal wire 121 and signal wire 122, wherein signal
Line 121 is located at the symmetrical centre of the diamond shape of reference layer ground wire 11, and signal wire 122 is located at the center of asymmetry of diamond shape.From
In Fig. 1 as can be seen that due to signal wire 121 and signal wire 122 relative to the position of reference layer ground wire 11 be it is inconsistent,
They relative to the area of reference layer ground wire 11 be also it is different, this, which will lead to, generates resistance between two signal wires 121 and 122
Robust is different, to will increase transmission delay of the signal on differential signal line is to 12, influences the stability of high speed transmission of signals.
Summary of the invention
In view of drawbacks described above in the prior art or deficiency, differential signal line resistance difference can be reduced by being intended to provide one kind
Scheme.In order to realize that said one or multiple purposes, the embodiment of the present application provide a kind of flexible circuit board, the flexible circuit
Plate includes：It the first metal layer, second metal layer and is set to soft between the first metal layer and the second metal layer
Property substrate；At least a pair of of differential signal line is provided in the first metal layer；Multiple engrave is provided in the second metal layer
Empty graphic, the hollow out figure at least have two relatively parallel sides；It is only described opposite in a hollow out figure
Intersect with a pair of differential signal line on two parallel sides.
Flexible circuit board provided by the embodiments of the present application can be arranged to pair in the first metal layer of flexible circuit board
Differential signal line, and multiple hollow out figure are set in second metal layer, and in a hollow out figure, it is only relatively parallel
Two sides intersect with a pair of of differential signal line.Since differential signal line itself is parallel to each other, its only with hollow out
When two parallel edges intersection in figure, each differential signal line relative to the area of hollow out figure be it is the same, in this way may be used
It is consistent with two difference line impedences for ensuring pairs of, so as to the delay for avoiding signal from transmitting, improve the stabilization of signal transmission
Property.
Detailed description of the invention
By reading a detailed description of non-restrictive embodiments in the light of the attached drawings below, the application's is other
Feature, objects and advantages will become more apparent upon：
Fig. 1 is a kind of structural schematic diagram of flexible circuit board in the prior art；
Fig. 2A and 2B is the structural schematic diagram of one embodiment of the application flexible circuit board；
Fig. 3 is the structural schematic diagram of another embodiment of the application flexible circuit board；
Fig. 4 is the structural schematic diagram of another embodiment of the application flexible circuit board.
Specific embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
Convenient for description, part relevant to related invention is illustrated only in attached drawing.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Fig. 2A and Fig. 2 B is please referred to, it illustrates the structural schematic diagrams of one embodiment of the application flexible circuit board.Figure
2A is the top view of the flexible circuit board 20 of the present embodiment, and Fig. 2 B is section view of the flexible circuit board 20 in Fig. 2A along A1-A2 line
Figure.
As shown in Figure 2 B, the flexible circuit board 20 of the present embodiment includes：It the first metal layer 21, second metal layer 22 and sets
The flexible base board 23 being placed between the first metal layer 21 and second metal layer 22.
As shown in Figure 2 A and 2 B, a pair of of differential signal line 211 and 212 is provided in the first metal layer 21.Second gold medal
Belonging to setting in layer 22, there are two hollow out figure 221 and 222.
In the present embodiment, hollow out figure 221 and 222 is that shapes and sizes are all identical trapezoidal.Each trapezoidal top
It is parallel to each other below, and two sides are not parallel to each other.It is only relatively flat in hollow out figure 221 and 222
Capable bottom and upper segment intersects with differential signal line 211 and 212, the side on and other sides of hollow out figure 221 and 222, that is, trapezoidal
It is non-intersecting with differential signal line 211 or 212.
In some optional implementations of the present embodiment, the shapes and sizes of hollow out figure 221 and 222 can be different.
For example, hollow out figure 221 can be rectangle, and hollow out figure 222 can be parallelogram.As long as hollow out figure 221 and 222
In only have relatively parallel two sides and intersect 211 and 212 with a pair of differential signal line.
In the present embodiment, the first metal layer 21 and second metal layer 22 are copper foil layer, are set to the first metal layer 21
Flexible base board 23 between second metal layer 22 can be flexible parent metal made of polyimides or polyester film.In the first gold medal
Belong to the differential signal line 211 and 212 being arranged in layer 21, the copper foil conducting wire that can be formed in the one side of flexible base board 23.And
On the another side of flexible base board 23, it can be initially formed entire copper foil layer i.e. second metal layer 22, then again in the copper foil layer
On etch hollow out figure 221 and 222.
In the present embodiment, second metal layer 22 can be used as the reference layer of differential signal line 211 and 212.Carrying out letter
When number transmission, signal is all transmitted on differential signal line 211 and 212, and the signal amplitude of the two transmission is equal, opposite in phase.
Since 211 and 212 intersections are intersected with a pair of of differential signal line in two sides for only having relatively parallel in hollow out figure 221 and 222.
Therefore, as differential signal line 211 and 212 relative to the area of the hollow out figure 221 in reference layer is, differential signal line
211 with 212 relative to the hollow out figure 222 in reference layer area be also as, so as to ensure differential signal line 211
It is consistent with 212 impedance.
Flexible circuit board provided in this embodiment, the difference that can be arranged in the first metal layer of flexible circuit board pair
Signal wire, and multiple hollow out figure are set in second metal layer, and in a hollow out figure, only relatively parallel two
Side intersect with a pair of of differential signal line.Since differential signal line itself is parallel to each other, its only with hollow out figure
In the intersection of two parallel edges when, each differential signal line relative to the area of hollow out figure be it is the same, in this way can be true
Two pairs of difference line impedences of guarantor are consistent, so as to the delay for avoiding signal from transmitting, improve the stability of signal transmission.
With further reference to Fig. 3, it illustrates the structural schematic diagrams of another embodiment of the application flexible circuit board.
The flexible circuit board 30 of the present embodiment includes：The first metal layer, second metal layer and it is set to the first metal layer
Flexible base board between second metal layer.Its cross-section structure is similar with the flexible circuit board 20 in Fig. 2 B, no longer superfluous herein
It states.
Fig. 3 is the top view of the flexible circuit board 30 of the present embodiment.As shown in figure 3, being provided with one in the first metal layer
To differential signal line 311 and 312.There are two hollow out figure 321 and 322 for setting in second metal layer 32.
In the present embodiment, hollow out figure 321 and 322 can be all identical rectangle of shapes and sizes.In hollow out figure
In 321 and 322, only have two relatively parallel sides to intersect with differential signal line 311 and 312, and other sides are believed with difference
Number line 311 or 312 is non-intersecting.Also, a pair of of difference of two relatively parallel sides and intersection is believed in hollow out figure 321 and 322
Number line is mutually perpendicular to.
Specifically, as shown in figure 3, in hollow out figure 321, relatively parallel two sides 321a and 321b believe with difference
The intersection of number line 311 and 312 is simultaneously vertical.In hollow out figure 322, relatively parallel two sides 322a and 322b are and differential signal
The intersection of line 311 and 312 is simultaneously vertical.
In the present embodiment, the side length on two side intersecting, relatively parallel with differential signal line 311 and 312, i.e. side
The side length of 321a and 321b and side 322a and 322b, can be according to the differential signal line 311 and 312 of perpendicular intersection
Line width and spacing determine.
In some optional implementations of the present embodiment, while 321a and 321b and while 322a and 322b side length, can
With twice of the line width of the differential signal line 311 and 312 more than or equal to perpendicular intersection and differential signal line 311 and 312
The sum of spacing.If the line width of differential signal line 311 and 312 is m, differential signal line 311 and 312 the distance between be n, then side
The side length l of 321a and 321b and side 322a and 322b should meet：l≥2m+n.In this way, as the side 321a that be parallel to each other and
When 321b is vertical with differential signal line 311 and 312, it can be ensured that the overall width of differential signal line pair is without departing from perpendicular side
Side length, so that it is guaranteed that side 321a and 321b can intersect vertically simultaneously with differential signal line 311 and 312.It similarly, can also be true
Protecting side 322a and 322b can intersect vertically simultaneously with differential signal line 311 and 312.
In some optional implementations of the present embodiment, hollow out figure 321 and 322 can have N side, wherein N
For the even number more than or equal to 4.That is, hollow out figure 321 and 322 can be the even numbers such as quadrangle, hexagon or octagon
One kind of side shape.
In the present embodiment, in the present embodiment, the first metal layer and second metal layer 32 are copper foil layer, are set to
Flexible base board between one metal layer and second metal layer 32 can be flexible parent metal made of polyimides or polyester film.?
The differential signal line 311 and 312 being arranged in the first metal layer, the copper foil conducting wire that can be formed in the one side of flexible base board.
And on the another side of flexible base board, it can be initially formed entire copper foil layer i.e. second metal layer 32, then again in the copper foil layer
On etch hollow out figure 321 and 322.Second metal layer 32 can be used as the reference layer of differential signal line 311 and 312.At this point,
As differential signal line 311 and 312 relative to the area of the hollow out figure 321 in reference layer is, 311 He of differential signal line
312 relative to the hollow out figure 322 in reference layer area be also it is the same, it is hereby ensured that differential signal lines 311 and 312
Impedance it is consistent.
In one hollow out figure of the flexible circuit board provided by the present embodiment, not only only have two relatively parallel sides
Intersect with a pair of of differential signal line, to ensure two consistent and relatively parallel sides of two pairs of difference line impedences and phase
A pair of of differential signal line of friendship is mutually perpendicular to, so as to avoid other of differential signal line and hollow out figure to a certain extent
The case where side is intersected, reduce the positioning difficulty between differential signal line and hollow out figure.
With further reference to Fig. 4, it illustrates the structural schematic diagrams of another embodiment of the application flexible circuit board.
The flexible circuit board 40 of the present embodiment includes：The first metal layer, second metal layer and it is set to the first metal layer
Flexible base board between second metal layer.Its cross-section structure is similar with the flexible circuit board 20 in Fig. 2 B, no longer superfluous herein
It states.
Fig. 4 is the top view of the flexible circuit board 40 of the present embodiment.As shown in figure 4, being provided with four in the first metal layer
To differential signal line 411,412,413 and 414.Identical hollow out figure 421 there are four settings in second metal layer 42, and hollow out
Figure 421 is octagon.
In the present embodiment, differential signal line can extend in the first metal layer along first direction A.Optionally, first
Direction A and the angle of the horizontal direction in flexible circuit board 40 are 0 °, 45 °, 90 ° or 135 °.Specifically, as shown in figure 4, first
Direction A can be the horizontal direction in flexible circuit board 40 from left to right.The folder of a pair of of differential signal line 411 and first direction A
Angle is 45 °, and the angle of another pair differential signal line 412 and first direction A are 0 °, another to differential signal line 413 and first party
It is 135 ° to the angle of A, is further 90 ° to the angle of differential signal line 414 and first direction A.
In the present embodiment, there are two sides being parallel to each other parallel with first direction A in each hollow out figure 421.This
The angle of sample, four pairs of parallel edges and first direction A in each hollow out figure 421 is respectively 0 °, 45 °, 90 ° and 135 °.Also
It is to say, always there is the extending direction of a pair of of parallel edges in each hollow out figure 421, mutually hangs down with the extending direction of differential signal line
Directly.As long as in this way, this intersects parallel edges with perpendicular a pair of of differential signal line, so that it may relatively easily realize each
Hollow out figure 421 only has a pair of of parallel edges and intersects with a pair of of differential signal line.
In the present embodiment, side length, that is, octagon side length of hollow out figure 421, can be according to perpendicular intersection
The line width and spacing of a pair of of differential signal line determine.Specifically, the side length of hollow out figure 421 can be more than or equal to perpendicular phase
Twice of the line width of a pair of of differential signal line of friendship and the sum of the spacing to differential signal line, to ensure hollow out figure 421
Two parallel edges can all intersect vertically with each signal line in a pair of of differential signal line.
In the present embodiment, the first metal layer and second metal layer 42 are copper foil layer, are set to the first metal layer and
Flexible base board between two metal layers 42 can be flexible parent metal made of polyimides or polyester film.In the first metal layer
The four pairs of differential signal lines 411,412,413 and 414 being arranged, the copper foil conducting wire that can be formed in the one side of flexible base board.
And on the another side of flexible base board, it can be initially formed entire copper foil layer i.e. second metal layer 42, then again in the copper foil layer
On etch 2X2 arrangement hollow out figure 421.Second metal layer 42 can be used as four pairs of differential signal lines, 411,412,413 and
414 reference layer.At this point, every a pair of differential signal line is the same relative to the area of the hollow out figure 421 in reference layer,
It is hereby ensured that the impedance of two signal lines in every a pair of of differential signal line is consistent.
Compared with the embodiment shown in Fig. 3, the hollow out figure in flexible circuit board provided by the present embodiment is positive eight
Side shape, since it always has the extending direction of a pair of of parallel edges and the extending direction of differential signal line to be mutually perpendicular to, as long as will
A pair of of differential signal line intersects with perpendicular a pair of of parallel edges, it will be able to avoid other of differential signal line and hollow out figure side
The case where intersection, to further reduced the positioning difficulty between differential signal line and hollow out figure.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art
Member is it should be appreciated that invention scope involved in the application, however it is not limited to technology made of the specific combination of above-mentioned technical characteristic
Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature
Any combination and the other technical solutions formed.Such as features described above has similar function with (but being not limited to) disclosed herein
Can technical characteristic replaced mutually and the technical solution that is formed.
Claims (8)
1. a kind of flexible circuit board, which is characterized in that including：The first metal layer, second metal layer and it is set to described first
Flexible base board between metal layer and the second metal layer；
At least a pair of of differential signal line is provided in the first metal layer；
Multiple hollow out figure are provided in the second metal layer, the hollow out figure at least has two relatively parallel sides,
The second metal layer is the reference layer of the differential signal line；
In a hollow out figure, only described two relatively parallel sides are intersected with a pair of differential signal line, and
Form the angle of non-90 degree.
2. flexible circuit board according to claim 1, which is characterized in that the side length on two relatively parallel sides according to
The line width and spacing of a pair differential signal line intersected with it determine.
3. flexible circuit board according to claim 2, which is characterized in that the side length on two relatively parallel sides is greater than
Equal to twice of the line width of a pair differential signal line intersected with it and the sum of the spacing to the differential signal line.
4. flexible circuit board according to claim 3, which is characterized in that the hollow out figure has N side, and the N is
Even number more than or equal to 4.
5. flexible circuit board according to claim 4, which is characterized in that the hollow out figure is octagon.
6. flexible circuit board according to claim 1, which is characterized in that the differential signal line is in the first metal layer
Inside extend in a first direction.
7. flexible circuit board according to claim 6, which is characterized in that in the first direction and the flexible circuit board
The angle of horizontal direction be 0 °, 45 °, 90 ° or 135 °.
8. flexible circuit board according to claim 1, which is characterized in that the first metal layer and the second metal layer
It is copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610065136.XA CN105611718B (en) | 2016-01-29 | 2016-01-29 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610065136.XA CN105611718B (en) | 2016-01-29 | 2016-01-29 | Flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105611718A CN105611718A (en) | 2016-05-25 |
| CN105611718B true CN105611718B (en) | 2018-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610065136.XA Active CN105611718B (en) | 2016-01-29 | 2016-01-29 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105611718B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402018A (en) * | 2019-08-22 | 2019-11-01 | 广东浪潮大数据研究有限公司 | A kind of multilayer circuit board |
| CN111295039A (en) * | 2020-02-26 | 2020-06-16 | 安捷利电子科技（苏州）有限公司 | Circuit board and electronic equipment |
| CN113573464B (en) * | 2021-06-30 | 2022-11-15 | 武汉天马微电子有限公司 | Circuit board, preparation method thereof and display panel |
| CN113709989A (en) * | 2021-09-03 | 2021-11-26 | 博敏电子股份有限公司 | Method for improving reliability of product required by electromagnetic shielding film impedance matching |
| CN115023026B (en) * | 2021-10-27 | 2023-04-14 | 荣耀终端有限公司 | Circuit board and electronic device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2579046B2 (en) * | 1990-09-19 | 1997-02-05 | 日本電気株式会社 | Multilayer wiring board |
| JPH05343820A (en) * | 1992-06-04 | 1993-12-24 | Toshiba Corp | Circuit board for multichip module |
| JPH07235741A (en) * | 1993-12-27 | 1995-09-05 | Ngk Spark Plug Co Ltd | Multilayer wiring board |
| JP2006086293A (en) * | 2004-09-15 | 2006-03-30 | Canon Inc | Printed wiring board and method for designing ground pattern thereof |
| CN2770275Y (en) * | 2004-12-30 | 2006-04-05 | 鸿富锦精密工业（深圳）有限公司 | Improvement of printing circuit board ground plane structure |
| JP4798483B2 (en) * | 2005-10-24 | 2011-10-19 | 住友ベークライト株式会社 | Circuit board |
| CN101207968B (en) * | 2006-12-22 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN101370351B (en) * | 2007-08-17 | 2012-05-30 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board |
| CN101594732A (en) * | 2008-05-27 | 2009-12-02 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN203616552U (en) * | 2013-12-13 | 2014-05-28 | Tcl显示科技（惠州）有限公司 | Liquid crystal display module and double-layer flexible circuit board structure used for transmitting signals of liquid crystal display module |
| KR102093159B1 (en) * | 2014-05-23 | 2020-03-25 | 삼성전기주식회사 | Printed circuit board and printed circuit board for camera module |
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2016
- 2016-01-29 CN CN201610065136.XA patent/CN105611718B/en active Active
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