CN105603474A - Local thick copper plating process - Google Patents
Local thick copper plating process Download PDFInfo
- Publication number
- CN105603474A CN105603474A CN201610125767.6A CN201610125767A CN105603474A CN 105603474 A CN105603474 A CN 105603474A CN 201610125767 A CN201610125767 A CN 201610125767A CN 105603474 A CN105603474 A CN 105603474A
- Authority
- CN
- China
- Prior art keywords
- copper
- pcb
- pcb board
- glued membrane
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
A local thick copper plating process comprises the following steps that a copper plating solution is prepared from, by weight, 40 parts of blue copperas, 30 parts of sulfuric acid and 1 part of chloride ions which are evenly mixed; the whole surface of a PCB is covered with a glue film, and the blowing temperature ranges from 45 DEG C to 55 DEG C; a xylene solution is taken, the position, needing to be plated with thick copper, of the PCB is determined, then the corresponding position of the surface, covered with the glue film, of the PCB is evenly coated with the xylene solution, and the PCB is placed in an environment at the temperature of 60 DEG C to 70 DEG C till the glue film coated with the xylene solution is dissolved; the copper plating solution is placed in an electroplating tank, the PCB is placed in the electroplating tank, the electroplating tank is started, and local thick plating is carried out on the PCB; the PCB is taken out, the glue film on the surface of the PCB is removed, and the operation of local thick copper plating of the PCB is completed. By means of the local thick copper plating process for the PCB, local copper plating operation can be carried out on any portion of the PCB according to actual needs.
Description
Technical field
Invention relates to pcb board field, especially the thick process for copper of a kind of local plating.
Background technology
Copper is electroplated in pcb board is electroplated and is being accounted for very consequence, and the quality that sour copper is electroplated is straightConnect and affect the quality of copper electroplating layer and related mechanical properties, and following process is produced to a photographic fixingRing, the quality that the sour copper of therefore how controlling well is electroplated is a ring important in circuit board making, alsoIt is one of operation that a lot of large factories technology controlling and process is more difficult.
In electroplating process, because other operations such as PCB perforate cause needing under actual conditionsDifferent to the copper-plated requirement in some positions of pcb board.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of local plating thick process for copper.
The present invention solves the problems of the technologies described above the technical scheme of employing to be:
The thick process for copper of a kind of local plating, method step is as follows:
A. be equipped with copper plating solution, comprise by weight: 30 parts, 40 parts of sulfuric acid of cupric sulfate pentahydrate1 part of chlorion, evenly mixes, and obtains copper plating solution;
B. get pcb board, all cover glued membrane on pcb board surface, blowing temp is 45-55 DEG CHot blast, until glued membrane and pcb board surface closely bond;
C. get xylene solution, determine the position that needs to plate thick copper on pcb board, then evenBe applied in the corresponding position, pcb board surface that is coated with glued membrane, be placed in temperature and be 60-70 DEG CIn environment, dissolve the exposed PCB that need to plate thick copper until be coated with the glued membrane of xylene solutionThe position of plate;
D. copper plating solution step a being obtained is put into electroplating bath, then by step cPcb board is put into electroplating bath, enables electroplating bath, and pcb board is carried out to the thick copper of part plating;
E. take out pcb board, remove the glued membrane on PCB surface, complete pcb board part degree thickThe operation of copper.
Further, the glued membrane in described step b is hot melt adhesive film.
Further, in described steps d, electroplating time is 60-80min.
Further, in described step e, the pcb board after copper facing is put into xylene solutionIn, be heated to 60-70 DEG C, until the glued membrane on pcb board surface dissolves.
Beneficial effect of the present invention is:
By adopting the thick process for copper of the local plating of pcb board of the present invention, can be according to actual needTo carry out local copper facing operation at any part of pcb board, not only can be applied to pcb boardCopper facing in production process needs, and can be applied to the maintenance operation in pcb board later stage simultaneously, shouldVery large by scope.
Detailed description of the invention
Embodiment 1:
A. be equipped with copper plating solution, comprise by weight: 30 parts, 40 parts of sulfuric acid of cupric sulfate pentahydrate1 part of chlorion, evenly mixes, and obtains copper plating solution;
B. get pcb board, all cover glued membranes on pcb board surface, blowing temp is 45 DEG CHot blast, until glued membrane and pcb board surface closely bond;
C. get xylene solution, determine the position that needs to plate thick copper on pcb board, then evenBe applied in the corresponding position, pcb board surface that is coated with glued membrane, be placed in temperature and be the ring of 60 DEG CIn border, dissolve the exposed PCB that need to plate thick copper until be coated with the glued membrane of xylene solutionThe position of plate;
D. copper plating solution step a being obtained is put into electroplating bath, then by step cPcb board is put into electroplating bath, enables electroplating bath, and pcb board is carried out to the thick copper of part plating;
E. take out pcb board, remove the glued membrane on PCB surface, complete pcb board part degree thickThe operation of copper.
Glued membrane in step b is hot melt adhesive film.
In steps d, electroplating time is 60min.
In step e, the pcb board after copper facing is put into xylene solution, is heated to 60 DEG C,Until the glued membrane on pcb board surface dissolves.
Embodiment 2:
A. be equipped with copper plating solution, comprise by weight: 30 parts of chlorine of 40 parts of sulfuric acid of cupric sulfate pentahydrate1 part, ion, evenly mixes, and obtains copper plating solution;
B. get pcb board, all cover glued membranes on pcb board surface, blowing temp is 55 DEG CHot blast, until glued membrane and pcb board surface closely bond;
C. get xylene solution, determine the position that needs to plate thick copper on pcb board, then evenBe applied in the corresponding position, pcb board surface that is coated with glued membrane, be placed in temperature and be the ring of 70 DEG CIn border, dissolve the exposed PCB that need to plate thick copper until be coated with the glued membrane of xylene solutionThe position of plate;
D. copper plating solution step a being obtained is put into electroplating bath, then by step cPcb board is put into electroplating bath, enables electroplating bath, and pcb board is carried out to the thick copper of part plating;
E. take out pcb board, remove the glued membrane on PCB surface, complete pcb board part degree thickThe operation of copper.
Glued membrane in step b is hot melt adhesive film.
In steps d, electroplating time is 80min.
In step e, the pcb board after copper facing is put into xylene solution, is heated to 70 DEG C,Until the glued membrane on pcb board surface dissolves.
By adopting the thick process for copper of the local plating of pcb board of the present invention, can be according to actual needTo carry out local copper facing operation at any part of pcb board, not only can be applied to pcb boardCopper facing in production process needs, and can be applied to the maintenance operation in pcb board later stage simultaneously, shouldVery large by scope.
Claims (4)
1. the thick process for copper of local plating, is characterized in that: method step is as follows:
A. be equipped with copper plating solution, comprise by weight: 30 parts, 40 parts of sulfuric acid of cupric sulfate pentahydrate1 part of chlorion, evenly mixes, and obtains copper plating solution;
B. get pcb board, all cover glued membrane on pcb board surface, blowing temp is 45-55 DEG CHot blast, until glued membrane and pcb board surface closely bond;
C. get xylene solution, determine the position that needs to plate thick copper on pcb board, then evenBe applied in the corresponding position, pcb board surface that is coated with glued membrane, be placed in temperature and be 60-70 DEG CIn environment, dissolve the exposed PCB that need to plate thick copper until be coated with the glued membrane of xylene solutionThe position of plate;
D. copper plating solution step a being obtained is put into electroplating bath, then by step cPcb board is put into electroplating bath, enables electroplating bath, and pcb board is carried out to the thick copper of part plating;
E. take out pcb board, remove the glued membrane on PCB surface, complete pcb board part degree thickThe operation of copper.
2. the thick process for copper of local plating according to claim 1, is characterized in that: described inGlued membrane in step b is hot melt adhesive film.
3. the thick process for copper of local plating according to claim 1, is characterized in that: described inIn steps d, electroplating time is 60-80min.
4. the thick process for copper of local plating according to claim 1, is characterized in that: described inIn step e, the pcb board after copper facing is put into xylene solution, is heated to 60-70 DEG C,Until the glued membrane on pcb board surface dissolves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610125767.6A CN105603474A (en) | 2016-03-04 | 2016-03-04 | Local thick copper plating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610125767.6A CN105603474A (en) | 2016-03-04 | 2016-03-04 | Local thick copper plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105603474A true CN105603474A (en) | 2016-05-25 |
Family
ID=55983800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610125767.6A Pending CN105603474A (en) | 2016-03-04 | 2016-03-04 | Local thick copper plating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105603474A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110029375A (en) * | 2019-05-14 | 2019-07-19 | 四川海英电子科技有限公司 | The circulation copper electroplating method of high-order high-density circuit board |
| CN111926355A (en) * | 2020-06-18 | 2020-11-13 | 江门市众阳电路科技有限公司 | PCB electroplating method for uniformly electroplating thick copper |
| CN112593265A (en) * | 2020-11-26 | 2021-04-02 | 中国电子科技集团公司第四十三研究所 | Local electroplating method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302636A (en) * | 2008-01-18 | 2008-11-12 | 深圳市深南电路有限公司 | Metal piece electroplating method |
| CN103266336A (en) * | 2013-04-26 | 2013-08-28 | 胜宏科技（惠州）股份有限公司 | Method for thickening copper surface of thick copper circuit board |
| CN104593837A (en) * | 2013-10-30 | 2015-05-06 | 青岛旺裕橡胶制品有限公司 | Tire steel cord acid copper plating method |
-
2016
- 2016-03-04 CN CN201610125767.6A patent/CN105603474A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302636A (en) * | 2008-01-18 | 2008-11-12 | 深圳市深南电路有限公司 | Metal piece electroplating method |
| CN103266336A (en) * | 2013-04-26 | 2013-08-28 | 胜宏科技（惠州）股份有限公司 | Method for thickening copper surface of thick copper circuit board |
| CN104593837A (en) * | 2013-10-30 | 2015-05-06 | 青岛旺裕橡胶制品有限公司 | Tire steel cord acid copper plating method |
Non-Patent Citations (2)
| Title |
|---|
| 肖云顺等: "关于厚板镀厚铜要求的电镀探讨与实践", 《印制电路信息》 * |
| 贾思盛: "一种电镀绝缘方法", 《电镀与精饰》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110029375A (en) * | 2019-05-14 | 2019-07-19 | 四川海英电子科技有限公司 | The circulation copper electroplating method of high-order high-density circuit board |
| CN111926355A (en) * | 2020-06-18 | 2020-11-13 | 江门市众阳电路科技有限公司 | PCB electroplating method for uniformly electroplating thick copper |
| CN112593265A (en) * | 2020-11-26 | 2021-04-02 | 中国电子科技集团公司第四十三研究所 | Local electroplating method |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20160525 |