CN105586623A - Aluminum-copper alloy surface film plating method - Google Patents
Aluminum-copper alloy surface film plating method Download PDFInfo
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Abstract
The invention provides an aluminum-copper alloy surface film plating method, which comprises: firstly conducting surface treatment on an aluminum-copper alloy blank to improve the aluminum-copper alloy surface roughness; and then conducting anodic oxidation treatment on the aluminum-copper alloy subjected to surface treatment to form an oxidized plated film layer on the aluminum-copper alloy blank surface. Specifically, after surface treatment on the aluminum-copper alloy blank, the aluminum-copper alloy surface roughness can be effectively improved, so that when anodic oxidation treatment is carried out on the aluminum-copper alloy, the bonding strength of aluminum oxide (i.e. the oxidized plated film layer) formed after oxidation of aluminum and aluminum-copper alloy can be improved, the shedding phenomenon of aluminum oxide on the aluminum-copper alloy surface can be effectively reduced, all parts on the aluminum-copper alloy surface can all form the oxidized plated film layer, so that the aluminum oxide thickness difference at different positions on the aluminum-copper alloy surface can be reduced, the thickness uniformity of the oxidized plated film layer formed on the aluminum-copper alloy surface can be improved, and then the quality of the oxidized plated film layer is enhanced.
Description
Technical field
The present invention relates to semiconductor applications, especially relate to a kind of aluminium copper method for plating film on surface.
Background technology
Anodic oxidation (AnodicOxidation) is a kind of electrochemical oxidation method of metal or metal alloy.Can form metal oxide film on metal or metal alloy surface by anode oxidation process, thereby reach raisingMetal or metal alloy case hardness, wearability and flatness object.
In existing application, often adopt anodizing technology, aluminium and aluminium alloy are placed in to corresponding electrolyteIn, under the effect of impressed current, on aluminium and aluminium alloy (anode) surface, form one deck oxidation afterwardsFilm, thus aluminium and aluminum alloy surface hardness improved, and mar proof, thereby expansion aluminium and aluminium alloyRange of application, the service life of prolongation aluminium and aluminium alloy.
In preparation of target materials field, the anodic oxidation of target back veneer material is a kind of novel target back plate surface placeReason technology, adopts anodic oxidation to form the technology of plated film and has that cost is low, the transparency of plated film is good, corrosion resistantThe advantages such as erosion property is high, rub resistance good, technique is simple, easy to operate. Thereby employing anodic oxidation plated filmTechnology has become this area study hotspot at target back veneer material surface coating.
But, in practical operation process, find, adopt anodizing technology on aluminum copper alloy material surfaceThe uniformity of the plated film forming is poor, and the difference in thickness of plated film each several part is obvious, thereby coated surface shapeBecome obvious crack structtire, thereby affect the use of follow-up target backboard.
For this reason, the coating quality that how to improve aluminium copper surface is that those skilled in the art need solution badlyProblem.
Summary of the invention
The problem that the present invention solves is to provide a kind of aluminium copper method for plating film on surface, thereby can close at aluminum bronzeGold surface forms the good plated film of thickness evenness.
For addressing the above problem, aluminium copper method for plating film on surface provided by the present invention, comprising:
Aluminium copper blank is provided;
Described aluminium copper blank is carried out to surface treatment, to improve aluminium copper surface roughness;
Surface treated aluminium copper blank is carried out to anodized, at described aluminium copper baseMaterial surface forms oxidation film plating layer.
Alternatively, described aluminium copper blank being carried out to surface-treated step comprises: adopt sand paper to instituteState aluminium copper blank and carry out surface treatment, to improve aluminium copper blank surface roughness.
Alternatively, the particle size of the sand paper of employing is 50～100 microns.
Alternatively, the step of described anodized comprises: the sulfuric acid using concentration as 1～3mol/l asElectrolyte, carries out anodized to surface treated aluminium copper blank.
Alternatively, the temperature of electrolyte is-3～3 DEG C.
Alternatively, the step of described anodized comprises: the current density of the electric current passing into is1.5～5A/dm2。
Alternatively, the time of described anodized is 15～25min.
Alternatively, aluminium copper blank is being carried out after anodized formation oxidation film plating layer, described inAluminium copper method for plating film on surface also comprises: described oxidation film plating layer is carried out to hot water sealing of hole.
Alternatively, in the step of described hot water sealing of hole: the hot water temperature of employing is 90～100 DEG C, while continuingBetween be 30～45min.
Alternatively, described aluminium copper blank is carried out before surface treatment, described aluminium copper plated surfaceFilm method also comprises: with aluminium copper blank described in washed with de-ionized water.
Alternatively, providing after aluminium copper blank, described aluminium copper blank carried out before surface treatment,Described aluminium copper method for plating film on surface also comprises: described aluminium copper blank is carried out to blade cuts.
Alternatively, the thickness of described oxidation film plating layer is 10～15 μ m.
Compared with prior art, technical scheme of the present invention has the following advantages:
Aluminium copper blank is being carried out after surface treatment, and the aluminium copper of aluminium copper blank surface occursPlastic deformation, slippage, distortion and spacing occur metallic crystal lattice simultaneously changes, and makes dislocation in crystal grainDensity increases, and forms pit in aluminium copper blank surface, has effectively improved the coarse of aluminium copper surfaceDegree, thus follow-up in the time that aluminium copper blank is carried out to anodized, be convenient to the oxidized rear formation of aluminiumAluminium oxide (being oxidized film plating layer) and the interlock of aluminium copper blank surface, improve aluminium oxide and aluminum bronze and closeGold blank bond strength, makes aluminium copper blank surface each several part all can form efficiently oxidation film plating layer,Reduce to be oxidized the phenomenon that film plating layer comes off in aluminium copper blank surface, thereby reduce aluminium copper blank tableThe aluminium oxide difference in thickness of face diverse location, improves the oxidation film plating layer that is formed at aluminium copper blank surfaceEven thickness degree, and then improve the quality that is oxidized film plating layer.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of aluminium copper method for plating film on surface of the present invention;
Fig. 2 is the structural representation of the each step of aluminium copper method for plating film on surface one embodiment of the present invention.
Detailed description of the invention
As described in the background art, the plating that adopts existing anodizing technology to form on aluminium copper surfaceThe difference in thickness of film each several part is obvious, can form obvious crack structtire, thereby affects follow-up target backboardUse, cause one of them reason of above-mentioned defect to be:
Before aluminium copper is carried out to anodic oxidation, can adopt blade to cut described aluminium copperProcess, on the one hand for aluminium copper is machined to specific dimensions, on the other hand in order to improve aluminium copperSurface smoothness, to improve the flatness of the follow-up plated film forming on aluminium copper surface. But practical operationIn, blade cuts technique has improved the smoothness on aluminium copper surface simultaneously, at follow-up anodic metal oxideIn process, if aluminium copper surface flatness is too high, can reduce oxidation plated film (the general oxidation plating of formationThe composition of film is aluminium oxide) with the bond strength of aluminium copper, make the only part aluminium copper surface can be fastSpeed forms oxidation plated film, and the oxidation plated film that aluminium copper remainder surface forms can come off and cannot be smoothAnd be firmly attached to aluminium copper surface, and then cause the formation oxidation of aluminium copper surface zones of differentThe speed difference of plated film, and after anode oxidation process finishes, the oxidation plated film zones of different thickness of formationDifference.
For this reason, the invention provides a kind of aluminium copper method for plating film on surface, comprising: first to aluminium copperBlank carries out surface treatment, to improve aluminium copper surface roughness; Afterwards to surface treated aluminiumCopper alloy carries out anodized, forms oxidation film plating layer in described aluminium copper blank surface. Wherein,Aluminium copper blank is being carried out after surface treatment, can effectively improve aluminium copper surface roughness, therebyIn the time that aluminium copper is carried out to anodized, the aluminium oxide that can improve the oxidized rear formation of aluminium (is oxygenChange film plating layer) with aluminium copper bond strength, make all efficient landform of aluminium copper blank surface each several partBecome oxidation film plating layer, effectively reduce the phenomenon that oxidation film plating layer comes off in aluminium copper blank surface, therebyReduce the aluminium oxide difference in thickness of aluminium copper blank surface diverse location, improve and be formed at aluminium copper baseExpect the uniformity of surperficial oxidation film plating layer thickness, and then improve the quality of oxidation film plating layer.
For above-mentioned purpose of the present invention, feature and advantage can more be become apparent, below in conjunction with accompanying drawing,So that specific embodiments of the invention are described in detail.
Fig. 1 is the schematic flow sheet of aluminium copper method for plating film on surface of the present invention.
Described aluminium copper method for plating film on surface comprises:
First perform step S1, aluminium copper blank is provided.
Described aluminium copper blank is aluminium copper conventional in this area, and the present invention is to described aluminium copperThe concrete component of blank does not limit.
In the present embodiment, providing after aluminium copper blank, described aluminium copper blank is being carried out to surfaceBefore reason, described aluminium copper blank is carried out to blade cuts. Particularly, can adopt lathe tool to cut technique pairDescribed aluminium copper raw material carries out blade cuts, thus by described aluminium copper Raw material processing to specific dimensions,Improve described aluminium copper stock chart surface evenness simultaneously.
In conjunction with reference to figure 2, Fig. 2 is the knot of the each step of aluminium copper method for plating film on surface one embodiment of the present inventionStructure schematic diagram.
In the present embodiment, the aluminium copper blank 100 after blade cuts is round sheet structure, but except thisIn other embodiment outside embodiment, the aluminium copper blank 100 after blade cuts can also be rectangular sheetOther structures such as shape, the present invention does not limit described aluminium copper blank 100 shapes.
In preparation of target materials field, described aluminium copper can be used as back veneer material, and it has specific size and wantsAsk, surface has higher flatness requirement simultaneously, so that the welding of backboard and target blank, therebyMeet follow-up magnetron sputtering instructions for use.
In described blade cuts technique, the blade that cutting aluminium copper blank adopts, and tool path pattern isThis area maturation process, the present invention does not limit this.
In the present embodiment, carrying out cutting process, to form after the aluminium copper blank of specific dimensions, rightDescribed aluminium copper blank carries out cleaning treatment, to remove the impurity on aluminium copper surface.
Particularly, the step of described cleaning treatment comprises and adopts aluminium copper blank described in washed with de-ionized water,Thereby in the impurity while of removing aluminium copper blank surface, avoid aluminium copper blank surface to be corroded.
Continue afterwards with reference to figure 1, execution step S2, carries out surface treatment to described aluminium copper blank, withImprove aluminium copper blank surface roughness.
Guaranteeing the aluminium copper blank surface flatness while, aluminium copper blank is being carried out to surface treatmentIn process, there is plastic deformation in the aluminium copper of aluminium copper blank surface, and metallic crystal lattice is sent out simultaneouslyRaw slippage, distortion and spacing change, and cause dislocation density in crystal grain to increase, at aluminium copper blank tableFace forms pit, improves the roughness on aluminium copper surface. Thereby follow-up, aluminium copper blank is being enteredWhen row anodized, compare with existing at ganoid aluminium copper blank, the present invention is carryingAfter the roughness on high alumina copper alloy blank surface, be conducive to aluminium oxide (the i.e. oxidation of the oxidized rear formation of aluminiumFilm plating layer) and the interlock of aluminium copper blank surface, it is strong that raising aluminium oxide is attached to aluminium copper blank surfaceSpend, improve the bond strength of aluminium oxide and aluminium copper blank, make aluminium copper blank surface each several partAll can form efficiently oxidation film plating layer, thereby can effectively reduce the phenomenon that aluminium oxide comes off, and then reduceThe aluminium oxide difference in thickness of aluminium copper blank surface diverse location, improves and is formed at aluminium copper blank tableThe oxidation film plating layer thickness evenness of face, and then improve the quality that is oxidized film plating layer.
In conjunction with reference to figure 2, in the present embodiment, described aluminium copper blank 100 is carried out to surface-treated stepSuddenly be: adopt sand paper 200 to carry out surface treatment to described aluminium copper blank 100, thereby do not destroying instituteState under the condition of aluminium copper blank 100 surface smoothness, increase described aluminium copper blank 100 surfacesRoughness. In Fig. 2, aluminium copper blank 100 surfaces are obvious through the roughness of Sandpapering processing section 101Be greater than the roughness of carrying out surface treatment without sand paper.
In addition, adopt sand paper to carry out surface treatment to described aluminium copper blank 100, can effectively reduce aluminum bronzeThe coarse rough error of alloy blank 100 surperficial each several parts is different, to improve after follow-up anodized, is formed atThe uniformity of the oxidation film plating layer each several part on described aluminium copper blank 100 surfaces.
If the particle of sand paper 200 adopting is too small, described aluminium copper blank 100 surfaces coarse not thick,Reduce the surperficial interlock dynamics of aluminium oxide and aluminium copper blank 100, and then reduction aluminium oxide is attached to aluminum bronzeThe intensity on alloy blank 100 surfaces; If the particle of sand paper 200 is excessive, aluminium copper blank 100 surfaces thickRough slightly excessive, form large pit on aluminium copper blank 100 surfaces excessive, be unfavorable for that aluminium oxide is in instituteState pit and 100 interlocks of aluminium copper blank, can reduce on the contrary aluminium oxide and aluminium copper blank 100Bond strength, and to form large pit excessive on aluminium copper blank 100 surface, reduces aluminium copper blank100 surface smoothness, affect the uniformity of the oxidation film plating layer each several part thickness of follow-up formation.
In the present embodiment, the particle size of the sand paper 200 of employing be 50～100 microns (μ m), as adoptedDescribed aluminium copper blank 100 is carried out to surface treatment with 400# sand paper, thus processing aluminium copper blank100 surfaces are to suitable roughness, to improve oxidation film plating layer and the aluminium copper blank 100 of follow-up formationBond strength.
Described aluminium copper blank 100 is carried out to surface treatment, thick to improve aluminium copper blank 100 surfacesAfter rugosity, with reference to figure 1, execution step S3, carries out anode to surface treated aluminium copper blankOxidation processes, forms oxidation film plating layer in described aluminium copper blank surface.
In conjunction with reference to figure 2, in described anodized process, using aluminium copper blank 100 as sunThe utmost point is placed in the electrolyte of electrolytic cell 300, and under impressed current effect, aluminium copper blank 100 enters afterwardsRow electrolysis is reacted with electrolyte, and the aluminium in aluminium copper blank 100 is oxidized, thereby at described aluminium copperBlank surface forms aluminum oxide film (being oxidized film plating layer) 110, shows to improve aluminium copper blank 100The hardness of face and rub resistance.
In the present embodiment, the step of described anodized specifically comprises: using sulfuric acid as electrolyte,Aluminium copper blank 100 is carried out to anodized.
The oxidation forming in aluminium copper blank surface after adopting sulfuric acid as the anodized of electrolyteThe aluminium transparency is good, hardness is large, wearability is good, space is little, and process conditions are simple.
But in other embodiment except the present embodiment, other electrolyte such as chromic acid, oxalic acid and phosphoric acid are sameSample can be realized object of the present invention, forms the oxidation film plating layer of even thickness on aluminium copper blank 100 surfaces110, the present invention does not limit bath composition.
In the process of anodized, if excessive as the concentration of the sulfuric acid of electrolyte, can cause aluminiumCopper alloy blank 100 is corroded; If the concentration of sulfuric acid is too small, reduces aluminium oxide and form speed, and affect oxygenThe quality of changing aluminium, as too small in the concentration of sulfuric acid, aluminium copper blank oxidation rate is excessively slow, the oxygen first formingChanging aluminium can become the obstruction of follow-up continuation aluminium oxide copper alloy blank 100, causes further cupric oxide aluminiumAlloy blank to be to form the aluminium oxide rete of larger thickness, thereby causes being finally formed at aluminium copper blankThe alumina layer thickness on 100 surfaces is too small, and reduces thus hardness and the wearability of oxidation film plating layer 110.
Alternatively, be 1～3 mol/L (mol/l) as the concentration of the sulfuric acid of electrolyte.
In addition, in the present embodiment, if electrolyte temperature is too low, be unfavorable for that the reaction in electrolyte is carried out,The aluminum oxide film rete 110 that reduces aluminium copper blank 100 surfaces forms speed, and the energy consumption of equipment is wantedAsk large; If electrolyte temperature is too high, in anodized, anodic oxidation reactions (is aluminium copper baseExpect oxidized reaction) be exothermic reaction, excessive temperature can hinder anodic oxidation reactions equally to carry out, and fallsAl suboxide thin layer 110 forms speed.
Alternatively, in the present embodiment, it is-3～3 DEG C as the temperature of the sulfuric acid of electrolyte.
And in anodized process, form aluminum oxide film rete 110 on aluminium copper blank 100 surfacesAfter, the resistance on aluminium copper blank 100 surfaces increases, if the current density of the electric current passing into is excessive, can causeMake voltage excessive, thereby cause machine utilization excessive; If but current density is too small, cause anodic oxidation anti-Should be excessively slow, reduce aluminium oxide and form speed, affect the ginseng such as thickness of the aluminum oxide film rete 110 of follow-up formationNumber, reduces aluminum oxide film rete 110 quality that form.
Alternatively, in the present embodiment, current density is 1.5～5A/dm2, be further 2.5A/dm alternatively2LeftRight.
In the present embodiment, under these conditions aluminium copper blank 100 is carried out to anodized 15～25Minute (min), is fully oxidized aluminium copper blank 200 surfaces, to form thickness as 10～15 micro-(μ aluminum oxide film rete 110 m) is as oxidation film plating layer, to improve aluminium copper blank 100 surfaces for riceHardness, the performances such as wearability and corrosion resistance.
In possibility, at execution step S3, form oxidation film plating layer 110 in aluminium copper blank 100 surfacesAfter, enter described oxidation film plating layer 110 is carried out to hot water hole-sealing technology.
After anodized, the oxidation film plating layer 110 forming on described aluminium copper blank 100 surfacesFor microcellular structure, micropore activity is high, adsorptivity is strong, easily adsorbs the pollutant in environment, has a strong impact onThe quality of oxidation film plating layer 110, seals after processing oxidation film plating layer 110, can make to be oxidized film plating layerMicropore closure in 110, thus aluminium copper blank 100 is played a good protection.
With reference to figure 2, in hot water sealing of hole step, aluminium copper blank 100 is placed in to hot water 400, make aluminiumThere is hydration reaction in the plating aluminium oxide film layer 110 on copper alloy blank 100 surfaces, amorphous state aluminium oxide is transformedBecome the hydrated alumina (A1 of vigorous nurse body2O3-H20). Due to dividing in the former oxidation film plating layer of aqua oxidation aluminum ratioThe volume of son (aluminium oxide) is large, and volumetric expansion makes to be oxidized the micropore filling sealing in film plating layer, improvesResistance tocrocking and the corrosion resistance of the oxidation film plating layer 120 after hot water sealing of hole are significantly improved.
In hot water sealing of hole process, if water temperature is too low, alumina hydration reaction can form product A l2O3·3H2O，Its anti-corrosion capability a little less than, oxidation film plating layer 120 sealing qualities are poor; If water temperature over-high, increases technique and becomesThis.
In the present embodiment, the water temperature in hot water sealing of hole step is more than or equal to 94 DEG C, to improve oxidation plated filmThe sealing quality of layer 120, further alternatively, the water temperature in hot water sealing of hole step is 94～100 DEG C.
In the present embodiment, under these conditions to oxidation film plating layer 110 carry out hot water sealing of hole process 30min withUpper, fully to complete to oxidation film plating layer 110 sealing of hole steps, to improve the quality of oxidation film plating layer 120.Alternatively, in the present embodiment, described hot water hole-sealing technology continues to carry out 30～45min.
In the present embodiment, adopting sand paper to carry out, after surface treatment, can effectively improving to aluminium copper blankAluminium copper surface roughness, thereby follow-uply after anodized, have aluminium copper blank is carried outEffect improves the aluminium oxide (being oxidized film plating layer) and aluminium copper blank bond strength of the oxidized rear formation of aluminium,Effectively reduce the phenomenon that aluminium oxide comes off in aluminium copper blank surface, make the each portion of aluminium copper blank surfaceDivide and all can form efficiently oxidation film plating layer, thereby reduce the oxidation of aluminium copper blank surface diverse locationAluminium difference in thickness, improves the oxidation film plating layer thickness evenness that is formed at aluminium copper blank surface, and thenImprove the quality of oxidation film plating layer.
Although the present invention discloses as above, the present invention is not defined in this. Any those skilled in the art,Without departing from the spirit and scope of the present invention, all can make various changes or modifications, therefore guarantor of the present inventionThe scope of protecting should be as the criterion with claim limited range.
Claims (12)
1. an aluminium copper method for plating film on surface, is characterized in that, comprising:
Aluminium copper blank is provided;
Described aluminium copper blank is carried out to surface treatment, to improve aluminium copper blank surface roughness;
Surface treated aluminium copper blank is carried out to anodized, at described aluminium copper blankSurface forms oxidation film plating layer.
2. aluminium copper method for plating film on surface as claimed in claim 1, is characterized in that, described aluminum bronze is closedGold blank carries out surface-treated step and comprises: adopt sand paper to carry out surface to described aluminium copper blankProcess, to improve aluminium copper blank surface roughness.
3. aluminium copper method for plating film on surface as claimed in claim 2, is characterized in that, the sand paper of employingParticle size is 50～100 microns.
4. aluminium copper method for plating film on surface as claimed in claim 1, is characterized in that, described anodic oxidationThe step of processing comprises: the sulfuric acid using concentration as 1～3mol/l is as electrolyte, to process surface treatmentAluminium copper blank carry out anodized.
5. aluminium copper method for plating film on surface as claimed in claim 4, is characterized in that, the temperature of electrolyteFor-3～3 DEG C.
6. aluminium copper method for plating film on surface as claimed in claim 1, is characterized in that, described anodic oxidationThe step of processing comprises: the current density of the electric current passing into is 1.5～5A/dm2。
7. aluminium copper method for plating film on surface as claimed in claim 1, is characterized in that, described anodic oxidationThe time of processing is 15～25min.
8. aluminium copper method for plating film on surface as claimed in claim 1, is characterized in that, to aluminium copperBlank carries out anodized and forms after oxidation film plating layer, and described aluminium copper method for plating film on surface alsoComprise: described oxidation film plating layer is carried out to hot water sealing of hole.
9. aluminium copper method for plating film on surface as claimed in claim 8, is characterized in that, described hot water sealing of holeStep in: the hot water temperature of employing is 90～100 DEG C, and the duration is 30～45min.
10. aluminium copper method for plating film on surface as claimed in claim 1, is characterized in that, to described aluminum bronzeAlloy blank carries out before surface treatment, and described aluminium copper method for plating film on surface also comprises: with deionizationWater cleans described aluminium copper blank.
11. aluminium copper method for plating film on surface as claimed in claim 1, is characterized in that, are providing aluminum bronze to closeAfter gold blank, described aluminium copper blank is carried out before surface treatment to described aluminium copper surface coatingMethod also comprises: described aluminium copper blank is carried out to blade cuts.
12. aluminium copper method for plating film on surface as described in claim 1～11 any one claim, its feature existsIn, the thickness of described oxidation film plating layer is 10～15 μ m.
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| CN108690992A (en) * | 2018-06-06 | 2018-10-23 | 天通（嘉兴）新材料有限公司 | A kind of optical coating copper jig overlay coating removal treatment process |
| CN111321444A (en) * | 2020-04-09 | 2020-06-23 | 宁波江丰电子材料股份有限公司 | Method for reducing surface treatment rework of back plate |
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Application publication date: 20160518 |