CN105576087A - Surface treatment process and system of LED product - Google Patents
Surface treatment process and system of LED product Download PDFInfo
- Publication number
- CN105576087A CN105576087A CN201510989438.1A CN201510989438A CN105576087A CN 105576087 A CN105576087 A CN 105576087A CN 201510989438 A CN201510989438 A CN 201510989438A CN 105576087 A CN105576087 A CN 105576087A
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- China
- Prior art keywords
- led product
- surface treatment
- led
- carrying
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000004381 surface treatment Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 58
- 238000001035 drying Methods 0.000 claims abstract description 30
- 230000008595 infiltration Effects 0.000 claims description 16
- 238000001764 infiltration Methods 0.000 claims description 16
- 229920002313 fluoropolymer Polymers 0.000 claims description 14
- 239000004811 fluoropolymer Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 13
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 3
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 claims description 3
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 238000002791 soaking Methods 0.000 abstract 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The embodiment of the invention discloses a surface treatment process and system of an LED product, solving the technical problem that brightness, uniformity and other important optical indexes are not ideal under the limitation of thickness since resin material is used for solving the problem of three proofings at present. The surface treatment process of the LED product, disclosed by the invention, comprises the following steps: step 1, putting a surface treatment material for the LED product in treatment equipment; step 2, soaking a component, to be subjected to surface treatment, of the LED product, into the treatment equipment in which the surface treatment material for the LED product is put; and step 3, drying the LED product after soaking treatment.
Description
Technical field
The present invention relates to optical technical field, particularly relate to a kind of LED product process of surface treatment and system.
Background technology
LED display (LEDdisplay): a kind of flat-panel monitor, is made up of LED module panel little one by one.LED (light-emitting diode, lightemittingdiode abridges).It is a kind of display mode by controlling semiconductor light-emitting-diode, the diode be made up with the compound of arsenic (As), phosphorus (P), nitrogen (N), indium (In) of gallium (Ga), can visible ray be given off when electronics and hole-recombination, thus can be used for making light-emitting diode.As indicator light in circuit and instrument, or form word or numerical monitor.Gallium arsenide phosphide diode glows, gallium phosphide diode green light, silicon carbide diode Yellow light-emitting low temperature, indium gallium nitrogen diode blue light-emitting.
At present along with LED display gets more and more as indoor use; LED reliability more and more comes into one's own; Due to LED structure design particularity, there is air-tightness problem; If do not do surface treated product cannot meet waterproof, protection against the tide, Defend salt fog, mould proof etc.; If at special climate as hot and humid area and specialities such as military use product, LED can not cause dead lamp problem through special surface process, thus affect display effect; Existing LED product adopts the material of resinae to solve three anti-problems; This resin had certain thickness at that time, and thickness, between 10 ~ 100um, because thickness is too thick, can badly influence the important optical index such as brightness, uniformity.
The material of the above-mentioned employing resinae mentioned solves three anti-problems, due to the restriction of its thickness, result in the technical problem that the important optical index such as brightness, uniformity is undesirable.
Summary of the invention
A kind of LED product process of surface treatment that the embodiment of the present invention provides and system, the material solving current employing resinae solves three anti-problems, due to the restriction of its thickness, the technical problem that the important optical indexes such as the brightness caused, uniformity are undesirable.
A kind of LED product process of surface treatment that the embodiment of the present invention provides, treatment process steps comprises:
Step one: LED product finish materials is put in treatment facility;
Step 2: pending for LED product surface-treated assembly is infiltrated and has in the described treatment facility of described LED product finish materials in storing;
Step 3: carry out drying process to carrying out the described LED product infiltrated after process.
Preferably, also comprise before described step one:
Baking process is carried out to described LED product.
Preferably, described finish materials is liquid fluoropolymer.
Preferably, described liquid fluoropolymer be in ethylene-tetrafluoroethylene copolymer, polytetrafluoroethylene, fluorinated ethylene-propylene copolymer, polychlorotrifluoroethylene, ethene one chlorotrifluoroethylene co-polymer, Kynoar and polyvinyl fluoride one or more.
Preferably, fluorescent material is added with in described liquid fluoropolymer.
Preferably, my 1000:1 to 10000:1 of ratio of described liquid fluoropolymer and described fluorescent material.
Preferably, described drying is treated to nature and dries or drying and processing.
Preferably, also comprise after described step 3:
Described LED product after drying process is checked by ultraviolet light.
A kind of LED product superficial treatment system that the embodiment of the present invention provides, comprising:
Infiltration apparatus, for putting LED product finish materials, and to the pending surface infiltration process of described LED product;
Drying process device, for carrying out drying process to carrying out the described LED product infiltrated after process.
Preferably,
Apparatus for baking, for carrying out baking process to described LED product;
Ultraviolet light, for carrying out purple light inspection to the described LED product after drying process.
As can be seen from the above technical solutions, the embodiment of the present invention has the following advantages:
A kind of LED product process of surface treatment that the embodiment of the present invention provides and system, wherein, the step of LED product process of surface treatment comprises: step one: put in treatment facility by LED product finish materials; Step 2: pending for LED product surface-treated assembly is infiltrated and has in the described treatment facility of described LED product finish materials in storing; Step 3: carry out drying process to carrying out the described LED product infiltrated after process.In the present embodiment, have in the described treatment facility of described LED product finish materials by pending for LED product surface-treated assembly is infiltrated in storing, the material solving current employing resinae solves three anti-problems, due to the restriction of its thickness, the technical problem that the important optical indexes such as the brightness caused, uniformity are undesirable.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The schematic flow sheet of an embodiment of a kind of LED product process of surface treatment that Fig. 1 provides for the embodiment of the present invention;
The schematic flow sheet of another embodiment of a kind of LED product process of surface treatment that Fig. 2 provides for the embodiment of the present invention;
The structural representation of an embodiment of a kind of LED product superficial treatment system that Fig. 3 provides for the embodiment of the present invention;
The structural representation of another embodiment of a kind of LED product superficial treatment system that Fig. 4 provides for the embodiment of the present invention.
Embodiment
A kind of LED product process of surface treatment that the embodiment of the present invention provides and system, the material solving current employing resinae solves three anti-problems, due to the restriction of its thickness, the technical problem that the important optical indexes such as the brightness caused, uniformity are undesirable.
For making goal of the invention of the present invention, feature, advantage can be more obvious and understandable, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, the embodiments described below are only the present invention's part embodiments, and the embodiment of not all.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, an embodiment of a kind of LED product process of surface treatment that the embodiment of the present invention provides comprises:
101, LED product finish materials is put in treatment facility;
In the present embodiment, when needs carry out three anti-process to LED product surface, first need LED product finish materials to put in treatment facility.
102, pending for LED product surface-treated assembly infiltration is had in the treatment facility of LED product finish materials in storing;
After LED product finish materials is put in treatment facility, need pending for LED product surface-treated assembly to infiltrate to have in the treatment facility of LED product finish materials in storing.
103, drying process is carried out to carrying out the LED product infiltrated after process.
When pending for LED product surface-treated assembly is infiltrated after storing has in the treatment facility of LED product finish materials, need to carry out drying process to carrying out the LED product infiltrated after process.
In the present embodiment, have in the treatment facility of LED product finish materials by pending for LED product surface-treated assembly is infiltrated in storing, the material solving current employing resinae solves three anti-problems, due to the restriction of its thickness, the technical problem that the important optical indexes such as the brightness caused, uniformity are undesirable.
The above is described in detail the process of LED product process of surface treatment, will be described in detail below, and refer to Fig. 2 to additional process, and another embodiment of a kind of LED product process of surface treatment that the embodiment of the present invention provides comprises:
201, baking process is carried out to LED product;
In the present embodiment, when needs carry out three anti-process to LED product surface, first need to carry out baking process to LED product.
202, LED product finish materials is put in treatment facility;
After LED product being carried out to baking process, LED product finish materials is needed to put in treatment facility, finish materials is liquid fluoropolymer, liquid fluoropolymer be in ethylene-tetrafluoroethylene copolymer, polytetrafluoroethylene, fluorinated ethylene-propylene copolymer, polychlorotrifluoroethylene, ethene one chlorotrifluoroethylene co-polymer, Kynoar and polyvinyl fluoride one or more, fluorescent material is added with, my 1000:1 to 10000:1 of the ratio of liquid fluoropolymer and fluorescent material in liquid fluoropolymer.
Do surface treatment to can effectively identify and do not done surface-treated difference, and quality whether ok in the process done; We add a kind of fluorescent material inside original main material, to examine the quality of the production detection methods or instrument under ultraviolet light, main material and fluorescent material weight ratio are 1000:1 ~ 10000:1
203, pending for LED product surface-treated assembly infiltration is had in the treatment facility of LED product finish materials in storing;
After LED product finish materials is put in treatment facility, need pending for LED product surface-treated assembly to infiltrate to have in the treatment facility of LED product finish materials in storing.
204, drying process is carried out to carrying out the LED product infiltrated after process;
When being infiltrated after storing has in the treatment facility of LED product finish materials by pending for LED product surface-treated assembly, need to carry out drying process to carrying out the LED product infiltrated after process, drying is treated to nature and dries or drying and processing.
205, the LED product after drying process is checked by ultraviolet light.
After carrying out drying process to the LED product of carrying out after infiltration process, the LED product after by drying process is needed to be checked by ultraviolet light.
Be described embodiment illustrated in fig. 2 with an embody rule scene below, application examples comprises:
1, by material type selecting and reliability testing, we find that fluoropolymer (liquid) can make to be used as LED lamp panel surface-treated main material; Three anti-effects can be played;
2, we by increasing fluorescent material (formula: main material and fluorescent material weight ratio are 5000:1) inside main material;
3, LED lamp panel carries out toasting (baking condition: temperature: 85 degree, time: 24 hours) before infiltration;
4, the lamp plate toasted is placed on the receptacle that fluoropolymer is housed to soak, the time can management and control between 5 seconds ~ 3 minutes;
5, the lamp plate infiltrated is taken out from receptacle; Carry out the bright dry or use baking of nature;
6, check under the lamp plate dried being placed on ultraviolet light; The lamp plate evaluation non-defective unit of OK, the lamp plate of OK does not judge bad plate; Do process of doing over again.
In the present embodiment, have in the treatment facility of LED product finish materials by pending for LED product surface-treated assembly is infiltrated in storing, the material solving current employing resinae solves three anti-problems, due to the restriction of its thickness, the technical problem that the important optical indexes such as the brightness caused, uniformity are undesirable, improves operating efficiency, improves the optical parametric index of LED, save surface-treated cost, solve surface-treated detectability.
Refer to Fig. 3, an embodiment of a kind of LED product superficial treatment system provided in the embodiment of the present invention comprises:
Infiltration apparatus 301, for putting LED product finish materials, and to the pending surface infiltration process of LED product;
Drying process device 302, for carrying out drying process to carrying out the LED product infiltrated after process.
In the present embodiment, by infiltration apparatus 301, pending for LED product surface-treated assembly infiltration is had in the treatment facility of LED product finish materials in storing, the material solving current employing resinae solves three anti-problems, due to the restriction of its thickness, the technical problem that the important optical indexes such as the brightness caused, uniformity are undesirable.
The above is described in detail the device of LED product superficial treatment system, and attachment device will be carried out to detailed wonderfully to protect below, refer to Fig. 4, another embodiment of a kind of LED product superficial treatment system provided in the embodiment of the present invention comprises:
Apparatus for baking 401, for carrying out baking process to LED product;
Infiltration apparatus 402, for putting LED product finish materials, and to the pending surface infiltration process of LED product;
Drying process device 403, for carrying out drying process to carrying out the LED product infiltrated after process.
Ultraviolet light 404, for carrying out purple light inspection to the LED product after drying process.
In the present embodiment, by infiltration apparatus 402, pending for LED product surface-treated assembly infiltration is had in the treatment facility of LED product finish materials in storing, the material solving current employing resinae solves three anti-problems, due to the restriction of its thickness, the technical problem that the important optical indexes such as the brightness caused, uniformity are undesirable, and the lamp plate dried is placed on ultraviolet light checks for 404 times, improvement more.
The above, above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a LED product process of surface treatment, is characterized in that, treatment process steps comprises:
Step one: LED product finish materials is put in treatment facility;
Step 2: pending for LED product surface-treated assembly is infiltrated and has in the described treatment facility of described LED product finish materials in storing;
Step 3: carry out drying process to carrying out the described LED product infiltrated after process.
2. LED product process of surface treatment according to claim 1, is characterized in that, also comprises before described step one:
Baking process is carried out to described LED product.
3. LED product process of surface treatment according to claim 2, is characterized in that, described finish materials is liquid fluoropolymer.
4. LED product process of surface treatment according to claim 3, it is characterized in that, described liquid fluoropolymer be in ethylene-tetrafluoroethylene copolymer, polytetrafluoroethylene, fluorinated ethylene-propylene copolymer, polychlorotrifluoroethylene, ethene one chlorotrifluoroethylene co-polymer, Kynoar and polyvinyl fluoride one or more.
5. LED product process of surface treatment according to claim 4, is characterized in that, is added with fluorescent material in described liquid fluoropolymer.
6. LED product process of surface treatment according to claim 5, is characterized in that, my 1000:1 to 10000:1 of the ratio of described liquid fluoropolymer and described fluorescent material.
7. LED product process of surface treatment as claimed in any of claims 1 to 6, is characterized in that, described drying is treated to nature and dries or drying and processing.
8. LED product process of surface treatment according to claim 1, is characterized in that, also comprises after described step 3:
Described LED product after drying process is checked by ultraviolet light.
9. a LED product superficial treatment system, is characterized in that, comprising:
Infiltration apparatus, for putting LED product finish materials, and to the pending surface infiltration process of described LED product;
Drying process device, for carrying out drying process to carrying out the described LED product infiltrated after process.
10. LED product superficial treatment system according to claim 9, is characterized in that,
Apparatus for baking, for carrying out baking process to described LED product;
Ultraviolet light, for carrying out purple light inspection to the described LED product after drying process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510989438.1A CN105576087A (en) | 2015-12-23 | 2015-12-23 | Surface treatment process and system of LED product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510989438.1A CN105576087A (en) | 2015-12-23 | 2015-12-23 | Surface treatment process and system of LED product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105576087A true CN105576087A (en) | 2016-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510989438.1A Pending CN105576087A (en) | 2015-12-23 | 2015-12-23 | Surface treatment process and system of LED product |
Country Status (1)
| Country | Link |
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| CN (1) | CN105576087A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070155030A1 (en) * | 2005-12-30 | 2007-07-05 | Atomic Energy Council - Institute Of Nuclear Energy Research | Method for making red-light emitting diode having silicon quantum dots |
| CN101065443A (en) * | 2004-10-29 | 2007-10-31 | 大金工业株式会社 | Fluorine-containing treatment composition |
| CN101603170A (en) * | 2009-07-21 | 2009-12-16 | 黄益新 | A kind of method that is coated with poly-to the dimethyl benzene film on the led chip surface |
| CN102219973A (en) * | 2011-05-31 | 2011-10-19 | 广州市花都华宇化工有限公司 | Organofluorine emulsion with low fluorine content, preparation method and application of organofluorine emulsion |
| TW201336111A (en) * | 2012-02-16 | 2013-09-01 | Cheng-Wei Wang | Surface treatment methods for LED housing packages |
-
2015
- 2015-12-23 CN CN201510989438.1A patent/CN105576087A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101065443A (en) * | 2004-10-29 | 2007-10-31 | 大金工业株式会社 | Fluorine-containing treatment composition |
| US20070155030A1 (en) * | 2005-12-30 | 2007-07-05 | Atomic Energy Council - Institute Of Nuclear Energy Research | Method for making red-light emitting diode having silicon quantum dots |
| CN101603170A (en) * | 2009-07-21 | 2009-12-16 | 黄益新 | A kind of method that is coated with poly-to the dimethyl benzene film on the led chip surface |
| CN102219973A (en) * | 2011-05-31 | 2011-10-19 | 广州市花都华宇化工有限公司 | Organofluorine emulsion with low fluorine content, preparation method and application of organofluorine emulsion |
| TW201336111A (en) * | 2012-02-16 | 2013-09-01 | Cheng-Wei Wang | Surface treatment methods for LED housing packages |
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Application publication date: 20160511 |
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