CN105575854B - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
- Publication number
- CN105575854B CN105575854B CN201510732532.9A CN201510732532A CN105575854B CN 105575854 B CN105575854 B CN 105575854B CN 201510732532 A CN201510732532 A CN 201510732532A CN 105575854 B CN105575854 B CN 105575854B
- Authority
- CN
- China
- Prior art keywords
- substrate
- surge tank
- treatment fluid
- unit
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Liquid Crystal (AREA)
Abstract
The present invention relates to a kind of devices carrying out liquid handling to substrate.Substrate board treatment includes the fluid supply unit for being used to support the substrate supporting unit of substrate and treatment fluid being supplied to aforesaid substrate processing unit, and aforesaid liquid feed unit includes：Inside has the supplying tank of the storage space of storage treatment fluid；Inside has multiple surge tanks of the cushion space of storage treatment fluid；The treatment fluid that above-mentioned surge tank provides is supplied to the processing nozzle for liquid on substrate, and above-mentioned supplying tank is connected to a supply line of above-mentioned multiple surge tanks side by side respectively.Thus, the liquid processing process to substrate can be continued to execute when treatment fluid to be filled into the surge tank of spent condition by the surge tank of occupied state.
Description
Technical field
The present invention relates to a kind of devices carrying out liquid handling to substrate.
Background technology
Recently, liquid crystal display device is widely used on the display screen of the electronic equipments such as phone, portable computer.It is this
Liquid crystal display device is to inject liquid crystal into the colored filter formed by black matrix, colored filter, public electrode and alignment film
Space between mating plate substrate and the array substrate formed by thin film transistor (TFT) (TFT), pixel electrode and alignment film, to profit
Image effect is obtained with according to the difference of the refractive index of the anisotropic light of liquid crystal.
As the device of the coating such as treatment fluid of alignment liquid or liquid crystal on colored filter substrate and array substrate, mainly
Use the applying device of ink-jet mode.Fig. 1 is to show that treatment fluid is supplied to fluid supply unit in conventional applying device
Figure.Referring to Fig.1, fluid supply unit includes replacing tank 2 and surge tank 4.It replaces tank 2 and surge tank 4 is respectively provided with identical greatly
Small bottle (not shown).Surge tank 4 can be supplied to by replacing the treatment fluid stored in tank 2, be provided to the processing of surge tank 4
Liquid is fed into injector head 6.When the treatment fluid for being stored in replacement tank 2 is all depleted, the bottle for being located at and replacing in tank 2 is replaced.
However, the storage space of bottle is about 3 to 4 liters, and in order to remove the bubble occurred when replacement bottle, should be discharged
At least 0.6 to 0.7 liter for the treatment of fluid.Such bottle replacement operation will frequently occur in tens to hundreds of techniques carry out,
And there will be a large amount for the treatment of fluid to be discharged during this.
Invention content
The technical problem to be solved in the present invention
The purpose of the present invention is to provide the devices for the liquid processing process that can carry out substrate rapidly.
In addition, the purpose of the present invention is to provide can reduce to exhaust treatment fluid tank in bottle carry out replacement operation
Frequency.
In addition, the purpose of the present invention is to provide can reduce to the greatest extent replacing the treatment fluid consumed when the operation of bottle
Device.
Technical solution
The embodiment of the present invention provides the device that liquid handling is carried out to substrate.Substrate board treatment includes being used to support base
The substrate supporting unit of plate and the fluid supply unit that treatment fluid is supplied to aforesaid substrate processing unit, aforesaid liquid supply
Unit includes：Inside has the supplying tank of the storage space of storage treatment fluid；Inside has the cushion space of storage treatment fluid
Multiple surge tanks；The treatment fluid that above-mentioned surge tank provides is supplied to the processing nozzle for liquid on substrate, and by above-mentioned supplying tank
It is connected to a supply line of above-mentioned multiple surge tanks side by side respectively.
Aforesaid liquid feed unit may include two that above-mentioned multiple surge tanks are parallel-connected to above-mentioned processing nozzle for liquid
Secondary supply line.Aforesaid liquid feed unit can also include the supply for adjusting the treatment fluid for being provided to an above-mentioned supply line
The controller of valve part and the above-mentioned valve part of control, above controller can be opened and closed an above-mentioned supply line,
It is fed into the respective above-mentioned cushion space of above-mentioned multiple surge tanks from above-mentioned supplying tank to handle liquid energy and consumes processing
In the cushion space of liquid.Further include the secondary valve part for the supply for adjusting the treatment fluid for being provided to above-mentioned secondary supply line,
Above controller can be opened and closed above-mentioned secondary supply line, and the slow for the treatment of fluid is filled up to handle liquid energy from above-mentioned multiple surge tanks
It rushes tank and is fed into above-mentioned processing nozzle for liquid.Above-mentioned storage space can have the space bigger than above-mentioned cushion space.Above-mentioned liquid
Object supply unit can also include：Adjust the pressure regulating part of the pressure of the respective above-mentioned cushion space of above-mentioned multiple surge tanks
Part, above controller can adjust above-mentioned pressure regulating part, so as in above-mentioned multiple respective above-mentioned cushion spaces of surge tank
The pressure for exhausting the above-mentioned storage space of pressure ratio of the cushion space for the treatment of fluid is small.The material of above-mentioned supplying tank may include propylene
Sour material.Aforesaid liquid feed unit can also include that the liquid level for the water level for measuring the treatment fluid stored by above-mentioned storage space passes
Sensor.
In addition, substrate board treatment includes the substrate supporting unit of supporting substrate；Treatment fluid is supplied at aforesaid substrate
Manage the fluid supply unit of unit, wherein aforesaid liquid feed unit includes：Inside has the storage space of storage treatment fluid
Supplying tank；Inside has the surge tank of the cushion space of storage treatment fluid；The treatment fluid that above-mentioned surge tank provides is supplied to base
Processing nozzle for liquid on plate；Adjust the pressure regulating part of the pressure of above-mentioned cushion space；And with above-mentioned cushion space
The controller of the above-mentioned pressure regulating part of status adjustment, above controller adjust above-mentioned pressure regulating part so that above-mentioned slow
The pressure of the above-mentioned storage space of pressure ratio of above-mentioned cushion space is small under the punching spent condition that spatially treatment fluid is depleted, and adjusts
Save above-mentioned pressure regulating part so that above-mentioned cushion space under the occupied state that treatment fluid is filled on above-mentioned cushion space
Pressure is identical as the pressure of above-mentioned storage space.
The material of above-mentioned supplying tank may include acrylic acid material.Aforesaid liquid feed unit can also include that measurement is above-mentioned
The liquid level sensor of the water level for the treatment of fluid stored by storage space, above-mentioned liquid level sensor can be located at the outer of above-mentioned supplying tank
Side.
Advantageous effect
According to an embodiment of the invention, multiple surge tanks are set.Thus, treatment fluid is filled into the surge tank of spent condition
When liquid processing process to substrate can also be continued to execute by the surge tank in occupied state.
In addition, according to an embodiment of the invention, the storage space of supplying tank is arranged to bigger than the cushion space of surge tank.
Thus, even if the treatment fluid on cushion space is depleted, can also be supplied to the cushion space in the case where being changed without supplying tank
To treatment fluid.
In addition, according to an embodiment of the invention, the pressure of the cushion space of surge tank is less than the pressure of storage space, to
It can supply to obtain treatment fluid from storage space.Thus, the material of supplying tank could be provided as saving than stainless steel (SUS)
The acrylic acid material of cost
In addition, according to an embodiment of the invention, the material of supplying tank can be set as transparent material, thus can be from supplying tank
Outside accurately learn the capacity of the treatment fluid for being stored in storage space.
Description of the drawings
Fig. 1 is the figure for showing the fluid supply unit of supply treatment fluid in conventional applying device.
Fig. 2 is the figure of the structure for the substrate board treatment for showing ink-jet mode according to an embodiment of the invention.
Fig. 3 is the stereogram for showing liquid crystal discharge unit in Fig. 2.
Fig. 4 is the sectional view for showing gantry mobile unit in Fig. 3.
Fig. 5 is the figure of the side for the head mobile unit for showing Fig. 3.
Fig. 6 is the figure for the fluid supply unit for showing Fig. 3.
Fig. 7 is to show to fill treatment fluid to the first surge tank of Fig. 6, and handle to injector head supply by the second surge tank
The figure of the process of liquid.
Specific implementation mode
Hereinafter, appended attached drawing will be referred to, a preferred embodiment of the present invention is described in detail.As described above
Project to be solved by this invention, technology solution and effect can be by appended attached drawing and relevant embodiment easily
Understand.In order to clearly illustrate, the part in each attached drawing simply or is turgidly indicated.It should be noted that in the knot of each attached drawing
When attached drawings mark in structure element, same structural element is identified as on different attached drawings as much as possible identical
Symbol.In addition, in the following description of the present invention, if it is considered to can mould to relevant known structure or illustrating for function
The main points for pasting the present invention, then detailed description thereof will be omitted.
In the present embodiment, treatment fluid is coated on to the substrate board treatment of object to the ink-jet mode by discharge drop
It illustrates.For example, object can be colored filter (CF) substrate or thin film transistor (TFT) (TFT) base of liquid crystal display panel
Plate；Treatment fluid can be liquid crystal (Liquid Crystal), alignment liquid, the red (R) for being mixed into granules of pigments in a solvent, green
(G), the ink of blue (B).Wherein, polyimides (polymide) can be used as alignment liquid.
Alignment liquid is coatable in the entire surface of colored filter (CF) substrate and thin film transistor (TFT) (TFT) substrate, liquid crystal
It is coatable in the entire surface of colored filter (CF) substrate or thin film transistor (TFT) (TFT) substrate.Ink is coatable in colour
With the interior zone of the black matrix of clathrate arrangement on optical filter (CF) substrate.
The substrate board treatment 1 of the present embodiment be in a manner of the ink-jet that drop is discharged on substrate coated with liquid crystal (Liquid
Crystal equipment).
Substrate can be colored filter (CF) substrate or thin film transistor (TFT) (TFT) substrate of liquid crystal display panel, liquid crystal
It can be coated in the entire surface of colored filter (CF) substrate or thin film transistor (TFT) (TFT) substrate.
Fig. 2 is the figure for the substrate board treatment for showing ink-jet mode.With reference to Fig. 2, substrate board treatment 1 includes:Liquid crystal is arranged
Go out portion 10, base plate transfer portion 20, loading part 30, uninstalling portion 40, liquid crystal supply unit 50 and main control unit 90.Liquid crystal discharge unit 10
A row can be configured to along first direction I with base plate transfer portion 20, and could be provided as adjacent to each other.50 He of liquid crystal supply unit
Main control unit 90 configures position centered on by liquid crystal discharge unit 10 and opposite with base plate transfer portion 20.50 He of liquid crystal supply unit
Main control unit 90 can be configured to a row in a second direction II.Loading part 30 and the configuration of uninstalling portion 40 are being with base plate transfer portion 20
Center and the position opposite with liquid crystal discharge unit 10.Loading part 30 and uninstalling portion 40 can form a line in a second direction II.
Wherein, first direction I is the orientation of liquid crystal discharge unit 10 and base plate transfer portion 20, and second direction II is in water
Perpendicular to the direction of first direction I in plane, third direction III is perpendicular to the direction of first direction I and second direction II.
The substrate of liquid crystal to be applied will be moved to loading part 30.Base plate transfer portion 20 will be moved to the substrate of loading part 30
It is transplanted on liquid crystal discharge unit 10.Liquid crystal discharge unit 10 obtains liquid crystal from liquid crystal supply unit 50, is discharged on substrate in a manner of ink-jet
Liquid crystal.After completing the discharge of liquid crystal, base plate transfer portion 20 transfers substrate to uninstalling portion 40 from liquid crystal discharge unit 10.It is coated with liquid
Brilliant substrate is moved out from uninstalling portion 40.Main control unit 90 controls liquid crystal discharge unit 10, base plate transfer portion 20, loading part 30, unloading
The molar behavior of portion 40 and liquid crystal supply unit 50.
Fig. 3 is the stereogram for showing liquid crystal discharge unit in Fig. 2.With reference to Fig. 3, liquid crystal discharge unit 10 includes pedestal B, substrate branch
Support unit 100, gantry 200, gantry mobile unit 300, head unit 400, head mobile unit 500, head control unit
600, cleaning unit 700, inspection unit 800 and fluid supply unit 900.
Pedestal B can be with certain thickness rectangular shape.The upper surface of pedestal B placement substrates support unit 100.Base
Plate support unit 100 has the support plate 110 for placing substrate S.Support plate 110 can be the plate of quadrangle form.Support plate 110
Below connect rotary driving part 120.Rotary driving part 120 can be rotation motor (motor).Rotary driving part
120 rotate support plate 110 centered on the Pivot axle perpendicular to support plate 110.
When support plate 110 is rotated by rotary driving part 120, substrate S can be revolved with the rotation of support plate 110
Turn.When the unit for the substrate for being formed in liquid crystal to be appliedLong side direction towards second direction II when, rotary driving part
120 can make the long side direction of unit towards first direction I by rotary plate.
Support plate 110 and rotary driving part 120 can be moved linearly by linear drives component 130 along first direction I.Directly
Line driving part 130 includes slider 132 and guiding parts 134.Rotary driving part 120 is arranged in the upper surface of slider 132.
Upper surface central part of the guiding parts 134 in pedestal B extends in long way along first direction I.Slider 132 can be with built-in linear horse
Up to (not shown), slider 132 is by linear motor (not shown) as guiding parts 134 is along the progress straight line shifting of first direction I
It is dynamic.
Gantry 200 is located at the top in the path of the movement of support plate 110.Gantry 200 is spaced upwardly from the upper table of pedestal B matches
It sets, and gantry 200 is configured to its length direction towards second direction II.
Gantry mobile unit 300 can make gantry 200 move linearly along first direction I, or gantry 200 is made to rotate, so as to
The length direction direction of gantry 200 is set to favour the direction of first direction I.Gantry mobile unit 300 includes the first driving unit
310 and second driving unit 320.Second driving unit 320 is located at one end of the gantry 200 as rotation center, and first drives
Moving cell 310 is located at the other end of gantry 200.
Fig. 4 is the sectional view for showing gantry mobile unit in Fig. 3.With reference to Fig. 4, the first driving unit 310 includes guide rail 315
With slider 317.The length direction of guide rail 315 is towards first direction I, and with the guiding parts of substrate supporting unit 100 134
Center configuration is at the both sides of the edge of the upper surfaces pedestal B.Slider 317 is movably coupled to guide rail 315.317 knot of slider
Together in the bottom surface of gantry.Slider 317 can be with built-in linear motor (not shown).Slider 317 (can not show by linear motor
Go out) driving force with guide rail 315 along first direction I move linearly.
Second driving unit 320 is set as centered on the central shaft of gantry symmetrical with the first driving unit 310.Second drives
Moving cell 320 has structure identical with the first driving unit 310, therefore omits its description.
Treatment fluid is discharged to substrate S in head unit 400.Head unit 400 can be arranged multiple.It illustrates in the present embodiment
The case where 3 head 410,420,430 of bright setting, but not limit and this.Head unit 400 II can line up one in a second direction
Row, and it is incorporated into gantry 200.Head unit 400 can rely on head mobile unit 500 along length direction, i.e. second of gantry 200
Direction II moves linearly, and moves linearly along first direction I by gantry mobile unit 300.Head unit 400 can rely on head
Portion's mobile unit 500 and gantry mobile unit 300 are moved to process station and spare space.Here process station is head and base
The opposite position of plate, spare space are the position that head is detached from process station.According to an example, spare space can be head
The position opposite with cleaning point and inspection unit 800 of unit 400.
Head unit 400 includes injector head 402.Injector head 402 is equipped with multiple treatment fluids spray that treatment fluid is discharged to lower end
Mouth (not shown).For example, injector head 402 can be respectively equipped with 128 or 256 processing nozzle for liquid (not shown).Treatment fluid sprays
Mouth (not shown) is formed a line with certain spacing.Multiple processing nozzle for liquid (not shown) can be with the amount of the unit of microgram (μ g)
Liquid crystal is discharged.
Respective injector head 400 can be equipped with the piezoelectric element of quantity corresponding with multiple processing nozzle for liquid (not shown), pass through
The voltage that control is applied to piezoelectric element can separately adjust multiple drop discharge rates for handling nozzle for liquid (not shown).
Head mobile unit 500 includes first movement unit 520 and the second mobile unit 540.Fig. 5 is the head for showing Fig. 3
The figure of the side of portion's mobile unit.With reference to Fig. 5, first movement unit 520 makes individual head unit 400 along the length side of gantry
To that is, second direction II moves linearly, and the second mobile unit 540 makes individual head unit 400 move linearly along third direction III.
First movement unit 520 includes multiple guide rail 522a, 522b, multiple slider 524a, 524b and movable plate
526.Multiple guide rail 522a, 522b II extend in long way in a second direction, and with along III phase of third direction before gantry 200
The mode at interval configures.Multiple slider 524a, 524b are movably coupled to multiple guide rail 522a, 522b, and multiple slidings
Device 524a, 524b can be built-in with linear actuator.Such as linear actuator can be linear motor (not shown).Movable plate
526 are incorporated into multiple slider 524a, 524b.The upper area of movable plate 526 is incorporated into superposed slider 524a, moves
The lower area of movable plate 526 is incorporated into the slider 524b positioned at lower part.Movable plate 526 relies on the drive of linear motor (not shown)
Power is with multiple guide rail 522a, 522b II linear movement in a second direction.As multiple head units 400 are along second direction
II moves respectively, can adjust its mutual spacing.
Second mobile unit 540 includes guiding parts 542 and slider 544.Guiding parts 542 is incorporated into first movement list
The movable plate 526 of member 520, and for guiding slider 544 to move linearly along third direction III.Slider 544 is with can
The mode of linear movement is incorporated into guiding parts 542, and slider 544 can built-in linear actuator.For example, linear actuator can
Think linear motor (not shown).Head unit 400 is incorporated into slider 544, and as slider 544 is along third direction III
Linear movement and moved along third direction III.
Head control unit 600 controls the liquid crystal discharge of respective head unit 410,420,430.Head control unit 600
It can be only fitted in liquid crystal discharge unit 10, adjacent to head unit 410,420,430.For example, head control unit 600 can match
It sets in the upper end of gantry 200.In the present embodiment, feelings of illustration head control unit 600 configuration in the upper end of gantry 200
Condition, but the position of head control unit 600 is not limited to this.
Although it is not shown in the diagrams, head control unit 600 is electrically connected to each head unit 410,420,430, to each
Head unit 410,420,430 applies control signal.It can be equipped on each head unit 410,420,430 and processing nozzle for liquid
The piezoelectric element (not shown) of the corresponding quantity of quantity of (not shown), head control unit can be applied to pressure by control
The voltage of electric device handles the drop discharge rate of nozzle for liquid (not shown) to adjust.
Referring again to Fig. 3, cleaning unit 700 cleans head.It is single that cleaning unit 700 can be equipped with discharge in advance
Member, to which treatment fluid be discharged in advance before head unit 400 supplies treatment fluid to substrate S.Cleaning unit 700 is discharged from head
The treatment fluid that unit 400 is discharged, and the treatment fluid of the outlet side to remaining in head unit 400 starts the cleaning processing.Cleaning is single
Member 700 can be equipped with multiple.For example, cleaning unit 700 can be equipped with number corresponding with head unit 400 one to one.Cleaning
Unit 700 can be 3.Cleaning unit provides negative pressure to the outlet side of head unit 400And it sucks and to remove its residual
The treatment fluid stayed.
Inspection unit 800 confirms that the individual nozzles for being provided in head unit 410,420,430 are no different by optical check
Often.After inspection unit 800 macroscopically confirms that nozzle has without exception, when judging that unspecific processing nozzle for liquid has abnormal,
Inspection unit 800 can to indivedual process nozzle for liquid confirm have it is without exception, so as to processing nozzle for liquid checked comprehensively.
Fluid supply unit 900 is used to supply treatment fluid to the processing nozzle for liquid of injector head 402.Fig. 6 is the liquid for showing Fig. 3
The figure of object supply unit.With reference to Fig. 6, fluid supply unit 900 includes supplying tank 910, the first surge tank 930, the second surge tank
940, a supply line 920, secondary supply line 950, valve parts 970, secondary valve part 980, a pressure regulating parts
960, liquid level sensor 905 and controller 990.
The inside of supplying tank 910 has the storage space 910a of storage treatment fluid.Supplying tank 910 is set as having barrel-shaped
Shape.The one side material of supplying tank 910 could be provided as acrylic acid material.Selectively, supplying tank 910 could be provided as making packet
The two sides for including one side are transparent material.
First surge tank 930 and the second surge tank 940 obtain treatment fluid from supplying tank 910 respectively.First surge tank, 930 He
Second surge tank 940 is respectively internally provided with cushion space 930a, 940a.Cushion space 930a, 940a are for supplying treatment fluid
It is given to the space for storing treatment fluid before handling nozzle for liquid temporarily.For example, the first surge tank 930 and the second surge tank 940 are respectively interior
Portion can be equipped with the bottle with cushion space 930a, 940a.First surge tank 930 and the second surge tank 940 can be set as mutual
Identical shape.According to one embodiment, the first cushion space 930a of the first surge tank 930 and the of the second surge tank 940
Two cushion space 940a can be respectively set to relatively small space compared with storage space 910a.Each cushion space 930a and
940a can be 3.5 liters, and storage space 910a can be 20 liters.Selectively, 3 or more surge tanks can be set.
Supplying tank 910 is respectively connected to the first surge tank 930 and the second surge tank 940 by supply line 920.It is primary to supply
Supplying tank 910 is connected to the first surge tank 930 and the second surge tank 940 side by side respectively to line 920.Thus, it is provided to storage
The first surge tank 930 and the second surge tank 940 can be supplied to simultaneously by depositing the treatment fluid of space 910a, or can be supplied to wherein
Any one.
First surge tank 930 and the second surge tank 940 are connected to injector head 402 by secondary supply line 950 respectively.Secondary confession
First surge tank 930 and the second surge tank 940 are connected to injector head 402 side by side to line 950.Thus, injector head 402 can be from
Any one in first surge tank 930 and the second surge tank 940 obtains treatment fluid.Selectively, the first surge tank 930 is connected
The circuit independently of the second surge tank 940 and injector head 402 of connection is could be provided as with the circuit of injector head 402.
Valve part 970 is used to supply or stop the treatment fluid provided from supplying tank 910 to multiple surge tanks.Once
Valve part 970 is arranged in a manner of it can be opened and closed a supply line 920 in a supply line 920.One time valve part 970 is set
There is at least two valve 972,974, is set in a manner of corresponding in the first surge tank 930 and the second surge tank 940 respectively
It sets in supply line 920.For example, one in the valve 972,974 of a valve part 970 can supply or stop to be provided to
The treatment fluid of first surge tank 930, another can then supply or stop the treatment fluid for being provided to the second surge tank 940.
Secondary valve part 980 is for supplying or stopping the treatment fluid for being provided to injector head 402 from multiple surge tanks.It is secondary
Valve part 980 is arranged in a manner of it can be opened and closed secondary supply line 950 in secondary supply line 950.Secondary valve part 980 is set
There is at least two valve 982,984, is set in a manner of corresponding in the first surge tank 930 and the second surge tank 940 respectively
In secondary supply line 950.For example, one in the valve 982,984 of secondary valve part 980 can supply or stop from first
The treatment fluid that surge tank 930 provides, another can then supply or stop the treatment fluid provided from the second surge tank 940.
Pressure regulating part 960 is for adjusting for 940 respective cushion space of the first surge tank 930 and the second surge tank
The pressure of 930a, 940a.Pressure regulating part 960 adjusts the pressure of cushion space 930a and 940a so that it is empty to be stored in storage
Between the treatment fluid of 910a can be fed into cushion space 930a, 940a.According to one embodiment, pressure regulating part 960 is adjusted
The pressure of cushion space 930a, 940a are saved, so that cushion space 930a, 940a have the pressure smaller than storage space 910a
Power.Thus, pressure difference is generated between storage space 910a and cushion space 930a, 940a, treatment fluid can be from storage space 910a
It is fed into cushion space.According to one embodiment, pressure regulating part 960 can make cushion space 930a, 940a and storage
The pressure difference for depositing space 910a is 60KPa to 120KPa.
Liquid level sensor 905 measures the capacity for the treatment fluid for being stored in storage space 910a.Liquid level sensor 905, which is located at, to be supplied
To the outside of tank 910.Liquid level sensor 905 is located at the one side of supplying tank 910 and opposite with it.According to one embodiment, liquid
Level sensor 905 can be the optical sensor of irradiation light.Unlike this, it is stored in the capacity of the treatment fluid of storage space 910a
It can be measured by the naked eyes of operator.
Controller 990 controls a valve part 970, secondary valve part 980 and pressure regulating part 960.When slow
When rushing the treatment fluid of space 930a, 940a and being in spent condition, 990 control pressure of controller adjusts press member 960, to make
The pressure of cushion space 930a, 940a are less than the pressure of storage space 910a.In addition, when the processing of cushion space 930a, 940a
When liquid is in occupied state, 990 control pressure of controller adjusts press member 960, to make the pressure of cushion space 930a, 940a
Power is identical as the pressure of storage space 910a.Wherein, spent condition refers to that the capacity for the treatment fluid for being provided to cushion space can not
The state of the liquid processing process of substrate is executed, and occupied state refers to the processing by being provided to cushion space 930a, 940a
The capacity of liquid is able to carry out the state of the liquid processing process of substrate.
Hereinafter, explanation using above-mentioned fluid supply unit 900 is filled treatment fluid and to injection to surge tank 930,940
The process of first 402 supply treatment fluid.In the state that the first surge tank 930 and the second surge tank 940 are respectively filled with treatment fluid,
Treatment fluid is supplied from the first surge tank 930 to injector head 402.Later, when treatment fluid is depleted in the first cushion space 930a
Interrupt the treatment fluid supplied from the first surge tank 930 to injector head 402.It later, will be from the second surge tank 940 to injector head 402
Supply treatment fluid.Fig. 7 is to show that the first surge tank fills treatment fluid into Fig. 6, and supplied to injector head by the second surge tank
The figure of the process for the treatment of fluid.With reference to Fig. 7, treatment fluid is filled into the first cushion space 930a, and is filled into the second surge tank 940
Treatment fluid be fed into injector head 402.Pressure regulating part 960 makes the pressure of the first cushion space 930a be less than storage space
The pressure of 910a, treatment fluid is due to the pressure difference between storage space 910a and the first cushion space 930a from storage space 910a quilts
It is supplied to the first cushion space 930a.
Treatment fluid is supplied to injector head 402 by any one in multiple surge tanks 930,940 in the above embodiments.
It, can be by another to injector head 402 while filling treatment fluid when treatment fluid is depleted in the surge tank 930,940 used
Supply treatment fluid.Therefore, it is possible to continue to supply treatment fluid to injector head 402.
In addition, the sky that the storage space 910a of supplying tank 910 has cushion space 930a, 940a for using than usual big
Between, thus the replacement frequency of supplying tank 910 will reduce.Therefore, it is possible to reduce the treatment fluid brought by replacement supplying tank 910
Waste.
In addition, treatment fluid between supplying tank 910 and surge tank 930,940 exchange can by adjust cushion space 930a,
The pressure of 940a carries out.Thus, during executing treatment fluid exchange, pressure will not be supplied to the storage of supplying tank 910
It deposits on the 910a of space, supplying tank 910 can be applicable in the transparent material such as acrylic acid.Therefore, it is possible to be surveyed from the outside of supplying tank 910
Determine the capacity of the treatment fluid stored in storage space 910a.
The explanation of reference numeral
100：Substrate supporting unit 900：Fluid supply unit
910：Supplying tank 910a：Storage space
920：Supply line 930,940：Surge tank
930a,940a：Cushion space 960：Pressure regulating part
990：Controller
Claims (4)
1. a kind of substrate board treatment comprising：
Substrate supporting unit is used to support substrate；And
Fluid supply unit is used to treatment fluid being supplied to the substrate processing unit,
Wherein, the fluid supply unit includes：
Supplying tank, the internal storage space with storage treatment fluid；
Multiple surge tanks, the internal cushion space with storage treatment fluid；
Nozzle for liquid is handled, is used to the treatment fluid that the surge tank is provided being supplied to substrate；
Supply line is used to the supplying tank being connected respectively to the multiple surge tank in a juxtaposed fashion；
Secondary supply line is used to the multiple surge tank being connected to the processing nozzle for liquid in a juxtaposed fashion；
Pressure regulating part is used to adjust the pressure of the respective cushion space of the multiple surge tank；And
Controller is used to control the opening and closing of a supply line and the secondary supply line,
Wherein, the controller is enabled to by the opening and closing of the control pressure regulating part and a supply line
It is stored described in the pressure ratio of the cushion space for running out for the treatment of fluid in the multiple respective cushion space of surge tank empty
Between pressure it is small, and make processing liquid energy be fed into the respective cushion space of the multiple surge tank from the supplying tank
In the cushion space for running out for the treatment of fluid；Also, the controller is by controlling the pressure regulating part and described two
The opening and closing of secondary supply line enables to the buffering for being filled with treatment fluid in the respective cushion space of the multiple surge tank
The pressure in space is identical as the pressure of the storage space, and makes processing liquid energy from being filled in the multiple surge tank
The surge tank of reason liquid is supplied to the processing nozzle for liquid.
2. substrate board treatment according to claim 1, wherein
It is the space bigger than the cushion space that the storage space, which has,.
3. substrate board treatment according to claim 1, wherein
The material of the supplying tank includes acrylic acid material.
4. substrate board treatment according to claim 3, wherein
The fluid supply unit further includes：
Liquid level sensor is used to measure the water level of the treatment fluid stored by the storage space.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140149879A KR20160053142A (en) | 2014-10-31 | 2014-10-31 | Apparatus for treating substrate |
| KR10-2014-0149879 | 2014-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105575854A CN105575854A (en) | 2016-05-11 |
| CN105575854B true CN105575854B (en) | 2018-08-17 |
Family
ID=55885847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510732532.9A Active CN105575854B (en) | 2014-10-31 | 2015-11-02 | Substrate board treatment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20160053142A (en) |
| CN (1) | CN105575854B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10518199B2 (en) * | 2016-09-08 | 2019-12-31 | Tokyo Electron Limited | Treatment solution supply apparatus |
| US11171019B2 (en) | 2016-12-30 | 2021-11-09 | Semes Co., Ltd. | Substrate treating apparatus, method for measuring discharge amount by using the same, and substrate treating method |
| KR20200051084A (en) * | 2018-11-02 | 2020-05-13 | 세메스 주식회사 | Assembly for Supplying Liquid Chemical |
| CN111415888A (en) * | 2020-04-07 | 2020-07-14 | 芯米(厦门)半导体设备有限公司 | Liquid supply system for semiconductor industry |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5405443A (en) * | 1992-04-24 | 1995-04-11 | Tokyo Electron Limited | Substrates processing device |
| CN1456709A (en) * | 2002-05-10 | 2003-11-19 | 韩国Dns株式会社 | Chemical agent supplier |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5503602B2 (en) * | 2011-07-29 | 2014-05-28 | 東京エレクトロン株式会社 | Processing liquid supply apparatus, processing liquid supply method, program, and computer storage medium |
-
2014
- 2014-10-31 KR KR1020140149879A patent/KR20160053142A/en active Search and Examination
-
2015
- 2015-11-02 CN CN201510732532.9A patent/CN105575854B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5405443A (en) * | 1992-04-24 | 1995-04-11 | Tokyo Electron Limited | Substrates processing device |
| CN1456709A (en) * | 2002-05-10 | 2003-11-19 | 韩国Dns株式会社 | Chemical agent supplier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105575854A (en) | 2016-05-11 |
| KR20160053142A (en) | 2016-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105575854B (en) | Substrate board treatment | |
| KR20120011643A (en) | Apparatus of discharging treating fluid | |
| CN102371221A (en) | Treating Fluid Discharging Device | |
| TWI266101B (en) | Film forming method, film forming device, liquid crystal arrangement method, liquid crystal arrangement device, liquid crystal device, liquid crystal device production method and electronic equipment | |
| US20090092761A1 (en) | Discharge method, continuous film formation method, alignment film formation method, method for forming liquid crystal display device, head unit, droplet discharge device, and electronic apparatus | |
| KR20160083420A (en) | Apparatus and method for treating substrate, and discharge rate measuring unit | |
| KR20140003986A (en) | Apparatus fdr treating substrates | |
| KR20130015612A (en) | Array method for inkjet head | |
| KR20080028598A (en) | Printer | |
| KR20130060848A (en) | Apparatus of dispensing liquid crystal | |
| KR102232668B1 (en) | Chemical discharging unit, Apparatus and Method for treating substrate with the unit | |
| KR20160040372A (en) | Unit of measuring quantity of liquid crystal and apparatus of dispensing liquid crystal with the same | |
| KR102216332B1 (en) | A unit for checking the discharge state of chemical liquid | |
| KR102250363B1 (en) | Apparatus and Method for treating substrate | |
| KR20110013917A (en) | Ink-jet printing apparatus and ink-jet printing method | |
| KR102068977B1 (en) | Unit for supplying chemical, Apparatus and Method for treating substrate | |
| US7133097B2 (en) | Apparatus for forming alignment film of liquid crystal display device comprising an alignment material removal unit for backflushing residual alignment material and a method for forming alignment film using the same. | |
| KR101955604B1 (en) | Chemical supplying unit and apparatus for treating substrates | |
| JP2008168247A (en) | Material feeding and removing apparatus for head unit, discharge inspection device provided with the same and droplet discharge apparatus, and method of manufacturing electro-optical device, electro-optical device and eectronic equipment | |
| KR20210041677A (en) | Reservoir and Apparatus for treating substrate with the reservoir | |
| KR102297380B1 (en) | Apparatus and method for treating substrate | |
| KR102323321B1 (en) | Head assembly and Apparatus for treating substrate with the assembly | |
| KR20160083419A (en) | Apparatus and method for treating substrate, and discharge rate measuring unit | |
| KR20240009020A (en) | Droplet discharge control device and inkjet printing method | |
| KR102218380B1 (en) | Apparatus for treating a subtrate and the cleaning method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |