CN105562660A - Preparation method of integral toothed water-cooling plate used for IGBT and provided with S-shaped water-cooling tube - Google Patents
Preparation method of integral toothed water-cooling plate used for IGBT and provided with S-shaped water-cooling tube Download PDFInfo
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Abstract
The invention discloses a preparation method of an integral toothed water-cooling plate used for an IGBT and provided with an S-shaped water-cooling tube, and belongs to the field of manufacturing of semiconductor devices. The preparation method comprises the following steps: machining a cuboid mold with a plurality of toothed holes in one surface and the S-shaped water-cooling tube at first; burying the S-shaped water-cooling tube in silicon carbide particles, pressing into a rectangular-plate-shaped green body, and then degreasing the green body to obtain a preform; placing the preform on the upper surface of the cuboid mold with the toothed holes, and then placing the cuboid mold in a pressure infiltration mold; injecting an aluminum alloy solution in the pressure infiltration mold; after the aluminum alloy solution soaks the preform, pressurizing the pressure infiltration mold until the pressure of the pressure infiltration mold reaches 8 MPa-20 MPa; and removing the pressure when the temperature of the pressure infiltration mold is reduced to be below 500 DEG C. A product obtained by the preparation method is the integral toothed water-cooling plate used for the IGBT and provided with the S-shaped water-cooling tube, the process is simple and easy to control, the manufactured product can provide the optimal cooling effect for the IGBT, and the integral toothed water-cooling plate is suitable for high-power-density IGBT products.
Description
Technical field
The invention belongs to field of manufacturing semiconductor devices, be specifically related to the dentation cooled plate integral preparation method that a kind of IGBT is with S shape water cooling tube.
Background technology
Along with the enforcement that national energy-saving reduces discharging, the use face of IGBT is constantly widened, and IGBT is also continuous towards high power density, miniaturization.Traditional copper soleplate+aluminium oxide ceramic substrate, add that the mode of outside aluminium radiator is due to shortcomings such as thermal resistance value is large, encapsulation passage is many, thermal expansion matching differences, its reliability significantly declines, and has been difficult to continue to obtain application under new demand.
Carborundum aluminium composite material base plate+aluminum nitride ceramic substrate, add that the mode of external aluminium radiator is succeeded in developing in recent years and obtains the application of certain limit, it is advantageous that: carborundum aluminium composite material substrate and aluminium nitride thermal expansion matching better, although its thermal conductivity (≤250W/mK) comparatively copper (being about 400W/mK) decreases, but its service condition reliability increases substantially, especially, under the environment for use for service condition harshness, the service life of IGBT device can extend successful.
But IGBT device current Problems existing adopts the modes such as welding when being and connecting as two discrete assemblies between base plate and external aluminium radiator usually, and the existence of the two interface resistance greatly reduces the reliability of the outside transmission capacity of heat and system.So this area is in the urgent need to developing the IGBT product of a kind of base plate+external heat sink integration, and require that the better product of cooling effect occurs.
Summary of the invention
The present invention is directed to the shortcoming existed in existing prior art, its object is to provide a kind of IGBT to be with the dentation cooled plate integral preparation method of S shape pressure pipe laying.
To achieve these goals, the technical scheme taked of the present invention is as follows:
IGBT is with an integral preparation method for the dentation cooled plate of S shape water cooling tube, and described preparation method comprises the following steps:
(1) prepare S shape water cooling tube, then imbedded pressed compact in the silicon-carbide particle of band binding agent and obtain rectangular plate-like base substrate, afterwards degreasing is carried out to rectangular plate-like base substrate and form prefabricated component;
Described S shape water cooling tube pipe is silicon carbide ceramic;
(2) the cuboid mould wearing multiple scallop is prepared;
Described mold materials is metal, graphite, pottery or devitrified glass;
The cross sectional shape of described scallop be circle, ellipse, rhombus, square, triangle and trapezoidal in one or more;
(3) prefabricated component is placed in the upper surface of the cuboid mould being with multiple scallop, and is fixed by the position of jig by prefabricated component;
The material of described jig is graphite or metal;
The shape of described jig is the uncovered cuboid sylphon of back-off, has the through hole of 4-8 Φ 1mm-Φ 20mm bottom jig;
(4) the cuboid mould of multiple for the band being fixed with prefabricated component scallop is put into the molten osmole tool of pressure, and be preheated to 650 DEG C-700 DEG C;
Found aluminium alloy, obtain aluminium alloy solution, glass melting temperature is 900 DEG C-1000 DEG C, and the time is 20min-40min; Then by molten for aluminium alloy solution injection pressure osmole tool;
When aluminium alloy solution submergence prefabricated component, molten for pressure osmole tool is forced into 8-20MPa, is down to after below 500 DEG C when its temperature and removes pressure, obtain the integration product that IGBT is with the dentation cooled plate of S shape water cooling tube.
Described in step (1), the cross section of S shape water cooling tube is rounded or oval, and wall thickness is 0.5mm-2mm, and internal diameter is 2mm-4mm.
The preparation method of described S shape water cooling tube is:
To contain 90wt%-96wt% silicon carbide powder, 3.2wt%-8.0wt% graphite powder and 0.8wt%-2.0wt% boron carbide for main material, in above-mentioned main material, add the deionized water of binding agent that quality is main material quality 3-5%, the plasticizer of 0.5-0.8%, the dispersant of 0.4-0.6%, the lubricant of 8-12% and 20-22%, then carry out ball milling and obtain the water base carborundum plastic mud material that solid concentration is 68-72wt%;
After water base carborundum plastic mud material repeatedly pugging 6-10 time, to put it in tube extruding machine and be aided with mould extruding and obtain required S shape water cooling tube base substrate, the stainless steel cable of S shape adopting diameter to be less than S shape water cooling tube base substrate internal diameter 0.3-0.8mm subsequently props up S shape water cooling tube base substrate inwall and carries out conformal;
S shape water cooling tube base substrate is carried out 3-10 days drying in the shade, and is under the condition of 60 DEG C-90 DEG C in temperature after drying in the shade, dry 6-10 hour; Then the lower pressureless sintering to 1800 of protection DEG C-2100 DEG C under an argon atmosphere, and be incubated 0.5-1.5 hour, obtain S shape water cooling tube;
Described binding agent is polyvinyl alcohol colloidal sol;
Described plasticizer is glycerine;
Described dispersant is ammoniacal liquor;
Described lubricant is the atoleine of emulsification.
Binding agent described in step (1) is one or more in biphosphate Alumina gel, waterglass colloidal sol, aluminum hydroxide sol, polyvinyl alcohol colloidal sol and dextrin.
Silicon-carbide particle described in step (1) is the mixture of particle diameter at the two or more silicon-carbide particle of 1 μm-100 μm, and after pressed compact, in rectangular plate-like base substrate, the solid concentration of silicon-carbide particle is 65-75vol%.
Compacting pressure described in step (1) is 60MPa-200Mpa, and after pressed compact, S shape water cooling tube is positioned at rectangular plate-like base substrate center, and its intake-outlet is positioned at the same side of rectangular plate-like base substrate, a little higher than delivery port of water inlet position.
The mode of step (1) described degreasing is for put into tubular type debinding furnace by sheet-shaped blank, in to be bonded dose after volatile component volatilization completely, debinding furnace temperature is risen to 800 DEG C-1200 DEG C, with debinding furnace cooling after insulation 40-80min, thus obtains prefabricated component.
Containing gypsum component in devitrified glass described in step (2), its content accounts for the 5wt%-15wt% of devitrified glass gross mass.
Described in step (3), the bottom thickness of jig is 2mm-4mm, and the wall thickness of surrounding is 2mm-20mm; Jig is connected with being with the cuboid mould of multiple scallop by metal or graphite bolt, makes bottom jig and leaves the space of 0.2mm-2mm between surrounding inwall and prefabricated component.
Silicon containing 5-10wt% in aluminium alloy described in step (4).
Beneficial effect of the present invention is: the dentation cooled plate of the IGBT band S shape water cooling tube that the product obtained by preparation method of the present invention is integrated, and preparation method is simple, raw material is cheaply easy to get, technique is simply easy to control, obtained product can provide best cooling effect for IGBT, is specially adapted to high power density IGBT product and uses.
Detailed description of the invention
The invention provides the dentation cooled plate integral preparation method that a kind of IGBT is with S shape water cooling tube, below in conjunction with embodiment, the invention will be further described.Following examples are only not used in for illustration of the present invention and limit the scope of the invention.The experimental technique of unreceipted actual conditions in the following example, usually conveniently conditional operation.The raw material used all can be commercially.
Embodiment 1
(1) preparation of S shape water cooling tube: with containing the silicon carbide powder of 90wt%, 8.0wt% powdered graphite and 2.0wt% boron carbide for main material, add in above-mentioned main material polyvinyl alcohol adhesive that quality is main material quality 5%, 0.8% glycerol plasticizer, 0.6% ammoniacal liquor dispersant, 12% emulsifying liquid paraffin wax lubricants and 22% deionized water, then carry out ball milling and be mixed with the water base carborundum plastic mud material that solid concentration is 68wt%;
By water base carborundum plastic mud material on vacuum deairing machine repeatedly after pugging 6 times, putting it in tube extruding machine and to be aided with mould, under 15MPa pressure, extruding obtains basis density is 2.00g/cm
3s shape water cooling tube base substrate; Prop up tubing base substrate inwall with the stainless steel cable of S shape that diameter is less than S shape water cooling tube base substrate internal diameter 0.5mm subsequently and carry out conformal;
Dry in the shade 3 days to S shape water cooling tube base substrate subsequently, under the condition of temperature 60 C, descend dry 10 hours after drying in the shade, then pressureless sintering to 1800 DEG C under the protection of argon gas atmosphere, and be incubated 1.5 hours, obtain wall thickness 0.5mm, internal diameter 3mm, density is 3.14g/cm
3ultra-thin-wall silicon carbide ceramics S shape water cooling tube.
(2) silicon-carbide particle is got, granularity 100 μm: 10 μm=7:3, and the biphosphate Alumina gel adding that quality is carborundum quality 5%, mixing 40min, obtains silicon carbide blend.Afterwards silicon carbide blend is spread in pressed compact mould, guarantee that the thickness after its compacting is 0.5mm, again S shape water cooling tube is put into intermediate position, be finally after the silicon carbide blend of 5mm adds by thickness after compacting, under 80MPa, be pressed into the rectangular plate-like base substrate that carborundum solid concentration is 65vol%, guarantee that S shape water cooling tube is positioned at the center of rectangular plate-like base substrate.Sheet-shaped blank is of a size of 190mm*140mm*5mm, and the entery and delivery port of S shape water cooling tube is at the same side of rectangular plate-like base substrate.After rectangular plate-like base substrate is warming up to 200 DEG C, under air conditions, degreasing is after 2 hours, then rises to 1200 DEG C under nitrogen protection and be incubated 60min, obtains prefabricated component.
(3) on the graphite cake machining center region 150mm*100mm that a piece is of a size of 230mm*180mm*20mm, evenly process the deep hole of the tight arrangement of Φ 2mm*6mm, the cross section in hole is circular, makes the multiple scallop graphite cake mould of band.
(4) precast body is placed in the multiple scallop graphite cake die surface of band, it covers jig, thickness bottom jig is 2mm, surrounding wall thickness is 2mm, jig is connected by graphite bolt with the graphite cake mould of the multiple scallop of band, guarantees bottom jig and leaves the uniform pore of 0.2mm between surrounding inwall and prefabricated component; The through hole of 6 Φ 1mm-Φ 20mm is opened, as the passage that aluminium alloy solution enters when ensureing that follow-up aluminium alloy solution is poured into a mould bottom jig.
(5) the cuboid mould of multiple for the band being fixed with prefabricated component scallop is put into the molten osmole tool of pressure, and be preheated to 650 DEG C;
Be that the aluminium alloy of 6wt% adopts intermediate frequency crucible to found by silicone content, glass melting temperature is after 900 DEG C of insulation 30min, the intermediate frequency crucible that verts by aluminium alloy solution by being heated in the molten osmole tool of graphite spout note pressure of 750 DEG C;
Treat aluminium alloy solution submergence prefabricated component, by hydraulic press, molten for pressure osmole tool is forced into 20MPa, after its temperature is down to 500 DEG C, removes pressure, obtain the integration product that IGBT is with the dentation cooled plate of S shape water cooling tube.
Embodiment 2
(1) preparation of S shape water cooling tube: with containing the silicon carbide powder of 96wt%, 3.2wt% powdered graphite and 0.8wt% boron carbide for main material, add in above-mentioned main material polyvinyl alcohol adhesive that quality is main material quality 3%, 0.5% glycerol plasticizer, 0.4% ammoniacal liquor dispersant, 8% emulsifying liquid paraffin wax lubricants and 20% deionized water, then carry out ball milling and be mixed with the water base carborundum plastic mud material that solid concentration is 72wt%;
By water base carborundum plastic mud material on vacuum deairing machine repeatedly after pugging 10 times, putting it in tube extruding machine and to be aided with mould, under 15MPa pressure, extruding obtains basis density is 2.00g/cm
3s shape water cooling tube base substrate; Prop up tubing base substrate inwall with the stainless steel cable of S shape that diameter is less than S shape water cooling tube base substrate internal diameter 0.5mm subsequently and carry out conformal;
Subsequently S shape water cooling tube base substrate is dried in the shade 10 days, after drying in the shade at 90 DEG C of temperature dry 6 hours; Then the lower pressureless sintering to 2100 DEG C of protection under an argon atmosphere, and be incubated 1 hour, obtain wall thickness 0.5mm, internal diameter 3mm, density is 3.14g/cm
3ultra-thin-wall silicon carbide ceramics S shape water cooling tube.
(2) get silicon-carbide particle, granularity 63 μm: 28 μm: 5 μm=8:4:1, and the modulus adding carborundum quality 5% is the waterglass of 2.8, and the deionized water of adding 8% carries out mixing 40min, obtains silicon carbide blend.Afterwards silicon carbide blend is spread in pressed compact mould, after guaranteeing its compacting, thickness is 0.5mm, again S shape water cooling tube is put into intermediate position, be finally after the silicon carbide blend of 5mm adds by thickness after compacting, carry out being pressed into the blank that carborundum solid concentration is 75vol% under 200MPa, guarantee that S line pipe is positioned at rectangular plate-like base substrate center.Rectangular plate-like base substrate is of a size of 190mm*140mm*8mm, and the entery and delivery port of S shape water cooling tube is at the same side of rectangular plate-like base substrate.Under rectangular plate-like blank being warming up to 80 DEG C of air conditionses, degreasing is after 4 hours, rises to 800 DEG C under nitrogen protection and is incubated 70min, obtaining prefabricated component.
(3) on the microcrystal glass plate central area 160mm*110mm that a piece is of a size of 230mm*180mm*30mm, evenly process the deep hole of the tight arrangement of Φ 3mm*8mm, cross section, hole is rhombus.
(4) precast body is placed in the multiple scallop graphite cake die surface of band, it covers jig, thickness bottom jig is 4mm, surrounding wall thickness is 20mm, jig is connected by graphite bolt with the graphite cake mould of the multiple scallop of band, guarantees bottom jig and leaves the uniform pore of 2mm between surrounding inwall and prefabricated component; The through hole of 8 Φ 1mm-Φ 20mm is opened, as the passage that aluminium alloy solution enters when ensureing that follow-up aluminium alloy solution is poured into a mould bottom jig.
(5) the cuboid mould of multiple for the band being fixed with prefabricated component scallop is put into the molten osmole tool of pressure, and be preheated to 700 DEG C;
Be that the aluminium alloy of 8wt% adopts intermediate frequency crucible to found by silicone content, glass melting temperature is after 1000 DEG C of insulation 30min, the intermediate frequency crucible that verts by aluminium alloy solution by being heated in the molten osmole tool of graphite spout note pressure of 800 DEG C;
Treat aluminium alloy solution submergence prefabricated component, by hydraulic press, molten for pressure osmole tool is forced into 8MPa, after its temperature is down to 500 DEG C, removes pressure, obtain the integration product that IGBT is with the dentation cooled plate of S shape water cooling tube.
Claims (10)
1. an IGBT integral preparation method for the dentation cooled plate of band S shape water cooling tube, it is characterized in that, described preparation method comprises the following steps:
(1) prepare S shape water cooling tube, then imbedded pressed compact in the silicon-carbide particle of band binding agent and obtain rectangular plate-like base substrate, afterwards degreasing is carried out to rectangular plate-like base substrate and form prefabricated component;
Described S shape water cooling tube pipe is silicon carbide ceramic;
(2) the cuboid mould wearing multiple scallop is prepared;
Described mold materials is metal, graphite, pottery or devitrified glass;
The cross sectional shape of described scallop be circle, ellipse, rhombus, square, triangle and trapezoidal in one or more;
(3) prefabricated component is placed in the upper surface of the cuboid mould being with multiple scallop, and is fixed by the position of jig by prefabricated component;
The material of described jig is graphite or metal;
The shape of described jig is the uncovered cuboid sylphon of back-off, has the through hole of 4-8 Φ 1mm-Φ 20mm bottom jig;
(4) the cuboid mould of multiple for the band being fixed with prefabricated component scallop is put into the molten osmole tool of pressure, and be preheated to 650 DEG C-700 DEG C;
Found aluminium alloy, obtain aluminium alloy solution, glass melting temperature is 900 DEG C-1000 DEG C, and the time is 20min-40min; Then by molten for aluminium alloy solution injection pressure osmole tool;
When aluminium alloy solution submergence prefabricated component, molten for pressure osmole tool is forced into 8-20MPa, is down to after below 500 DEG C when its temperature and removes pressure, obtain the integration product that IGBT is with the dentation cooled plate of S shape water cooling tube.
2. a kind of IGBT according to claim 1 is with the integral preparation method of the dentation cooled plate of S shape water cooling tube, it is characterized in that, described in step (1), the cross section of S shape water cooling tube is rounded or oval, and wall thickness is 0.5mm-2mm, and internal diameter is 2mm-4mm.
3. a kind of IGBT according to claim 2 is with the integral preparation method of the dentation cooled plate of S shape water cooling tube, and it is characterized in that, the preparation method of described S shape water cooling tube is:
To contain 90wt%-96wt% silicon carbide powder, 3.2wt%-8.0wt% graphite powder and 0.8wt%-2.0wt% boron carbide for main material, in above-mentioned main material, add the deionized water of binding agent that quality is main material quality 3-5%, the plasticizer of 0.5-0.8%, the dispersant of 0.4-0.6%, the lubricant of 8-12% and 20-22%, then carry out ball milling and obtain the water base carborundum plastic mud material that solid concentration is 68-72wt%;
After water base carborundum plastic mud material repeatedly pugging 6-10 time, to put it in tube extruding machine and be aided with mould extruding and obtain required S shape water cooling tube base substrate, the stainless steel cable of S shape adopting diameter to be less than S shape water cooling tube base substrate internal diameter 0.3-0.8mm subsequently props up S shape water cooling tube base substrate inwall and carries out conformal;
S shape water cooling tube base substrate is carried out 3-10 days drying in the shade, and is under the condition of 60 DEG C-90 DEG C in temperature after drying in the shade, dry 6-10 hour; Then the lower pressureless sintering to 1800 of protection DEG C-2100 DEG C under an argon atmosphere, and be incubated 0.5-1.5 hour, obtain S shape water cooling tube;
Described binding agent is polyvinyl alcohol colloidal sol;
Described plasticizer is glycerine;
Described dispersant is ammoniacal liquor;
Described lubricant is the atoleine of emulsification.
4. a kind of IGBT according to claim 1 is with the integral preparation method of the dentation cooled plate of S shape water cooling tube, it is characterized in that, the binding agent described in step (1) is one or more in biphosphate Alumina gel, waterglass colloidal sol, aluminum hydroxide sol, polyvinyl alcohol colloidal sol and dextrin.
5. a kind of IGBT according to claim 1 is with the integral preparation method of the dentation cooled plate of S shape water cooling tube, it is characterized in that, silicon-carbide particle described in step (1) is the mixture of particle diameter at the two or more silicon-carbide particle of 1 μm-100 μm, and after pressed compact, in rectangular plate-like base substrate, the solid concentration of silicon-carbide particle is 65-75vol%.
6. a kind of IGBT according to claim 1 is with the integral preparation method of the dentation cooled plate of S shape water cooling tube, it is characterized in that, compacting pressure described in step (1) is 60MPa-200Mpa, after pressed compact, S shape water cooling tube is positioned at rectangular plate-like base substrate center, and its intake-outlet is positioned at the same side of rectangular plate-like base substrate, a little higher than delivery port of water inlet position.
7. a kind of IGBT according to claim 1 is with the integral preparation method of the dentation cooled plate of S shape water cooling tube, it is characterized in that, the mode of step (1) described degreasing is for put into tubular type debinding furnace by sheet-shaped blank, in to be bonded dose after volatile component volatilization completely, debinding furnace temperature is risen to 800 DEG C-1200 DEG C, with debinding furnace cooling after insulation 40-80min, thus obtain prefabricated component.
8. the integral preparation method of the dentation cooled plate of S shape water cooling tube is with according to a kind of IGBT in claim 1, it is characterized in that, containing gypsum component in devitrified glass described in step (2), its content accounts for the 5wt%-15wt% of devitrified glass gross mass.
9. a kind of IGBT according to claim 1 is with the integral preparation method of the dentation cooled plate of S shape water cooling tube, and it is characterized in that, described in step (3), the bottom thickness of jig is 2mm-4mm, and the wall thickness of surrounding is 2mm-20mm; Jig is connected with being with the cuboid mould of multiple scallop by metal or graphite bolt, makes bottom jig and leaves the space of 0.2mm-2mm between surrounding inwall and prefabricated component.
10. a kind of IGBT according to claim 1 is with the integral preparation method of the dentation cooled plate of S shape water cooling tube, it is characterized in that, the silicon containing 5-10wt% in the aluminium alloy described in step (4).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510926650.3A CN105562660B (en) | 2015-12-14 | 2015-12-14 | Dentation cooled plate integral preparation methods of the IGBT with S-shaped water cooling tube |
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| CN201510926650.3A CN105562660B (en) | 2015-12-14 | 2015-12-14 | Dentation cooled plate integral preparation methods of the IGBT with S-shaped water cooling tube |
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| CN105562660A true CN105562660A (en) | 2016-05-11 |
| CN105562660B CN105562660B (en) | 2018-03-27 |
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| CN201510926650.3A Active CN105562660B (en) | 2015-12-14 | 2015-12-14 | Dentation cooled plate integral preparation methods of the IGBT with S-shaped water cooling tube |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358270A (en) * | 2000-06-14 | 2001-12-26 | Mitsubishi Electric Corp | Cooling apparatus |
| CN102515781A (en) * | 2011-12-16 | 2012-06-27 | 湖南浩威特科技发展有限公司 | Preparation method for silicon carbide preform based on water-based adhesive |
| CN103433491A (en) * | 2013-09-18 | 2013-12-11 | 湖南航天工业总公司 | Silicon carbide IGBT (Insulated Gate Bipolar Transistor) substrate framework vacuum pressure aluminizing device and double-sided aluminum coating method |
| CN103600053A (en) * | 2013-12-06 | 2014-02-26 | 湖南航天诚远精密机械有限公司 | Accurate forming tool of aluminum silicon carbide composite IGBT (insulated gate bipolar translator) baseplate |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358270A (en) * | 2000-06-14 | 2001-12-26 | Mitsubishi Electric Corp | Cooling apparatus |
| CN102515781A (en) * | 2011-12-16 | 2012-06-27 | 湖南浩威特科技发展有限公司 | Preparation method for silicon carbide preform based on water-based adhesive |
| CN103433491A (en) * | 2013-09-18 | 2013-12-11 | 湖南航天工业总公司 | Silicon carbide IGBT (Insulated Gate Bipolar Transistor) substrate framework vacuum pressure aluminizing device and double-sided aluminum coating method |
| CN103600053A (en) * | 2013-12-06 | 2014-02-26 | 湖南航天诚远精密机械有限公司 | Accurate forming tool of aluminum silicon carbide composite IGBT (insulated gate bipolar translator) baseplate |
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