CN105562588A - Full mold binding agent and preparation method thereof - Google Patents
Full mold binding agent and preparation method thereof Download PDFInfo
- Publication number
- CN105562588A CN105562588A CN201610034147.1A CN201610034147A CN105562588A CN 105562588 A CN105562588 A CN 105562588A CN 201610034147 A CN201610034147 A CN 201610034147A CN 105562588 A CN105562588 A CN 105562588A
- Authority
- CN
- China
- Prior art keywords
- binding agent
- parts
- paraffin
- preparation
- evaporative pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/02—Sand moulds or like moulds for shaped castings
- B22C9/04—Use of lost patterns
Abstract
The invention relates to the technical field of binding agent production, in particular to a full mold binding agent and a preparation method thereof. The full mold binding agent is characterized by being prepared from, by weight, 60-80 parts of polyvinyl acetate emulsion, 10-16 parts of polybutadiene, 5-10 parts of ethenyl ethanoate, 5-8 parts of bone glue, 10-18 parts of paraffin, 3-5 parts of maleic anhydride and 2-6 parts of dimethylethanolamine. The bone glue and the paraffin are firstly ground, then the paraffin, the bone glue, the polyvinyl acetate emulsion, polybutadiene, ethenyl ethanoate, maleic anhydride and dimethylethanolamine are fully mixed and heated to 60 DEG C to 70 DEG C, and then cooling and packaging are carried out. In the full mold workpiece casting process, the binding agent is high in binding performance, small in pollution, low in boiling point and free of residues.
Description
Technical field:
The present invention relates to adhesive production technical field, specifically a kind of evaporative pattern binding agent and preparation method thereof.
Background technology:
Lost foam casting is that foam mould adopts bindless dry sand in conjunction with the cavityless casting of vacuum pumping technology.Domestic main call has " dry sand cavityless casting ", " vacuum full mold casting ", is called for short EPC casting.Lost foam casting is current one of state-of-the-art casting technique in the world, is described as once " revolution " in casting history, is referred to as 21 century Green foundry both at home and abroad.Not much that overall time is shaping in the prior art of evaporative pattern, need just can be completed by bonding moulding, and there is coating outside, binding agent for evaporative pattern bonding of the prior art is fairly simple, some boiling point is high, is unfavorable for casting, easily leaves some residues after evaporation, metalwork for casting has a certain impact, and stickiness is not high.
Summary of the invention:
It is high that technical problem to be solved by this invention is to provide a kind of caking property, and pollute little, boiling point is low, without the evaporative pattern binding agent and preparation method thereof of residue.
Solve technical problem adopt following technical scheme:
A kind of evaporative pattern binding agent, is characterized in that: be made up of following parts by weight of component,
Be made up of following parts by weight of component,
A kind of preparation method of evaporative pattern binding agent, described adhesive is made up of following methods, first by gelatine and paraffin abrasive dust, again paraffin, gelatine are fully mixed with polyvinyl acetate emulsion, polybutadiene, vinyl acetate, maleic anhydride and dimethylethanolamine, be heated to 60 ~ 70 DEG C, then cooling packing.
Described adhesive in use heating temperatures to 60 ~ 70 DEG C.
The binding agent used in the present invention has and has good viscosity, be not easy cracking, and binding agent becomes pasty state after bonding, and inner homogeneous without slag, and is at high temperature easy to evaporation disappearance, and at high temperature noresidue residue generates, due to the casting of workpiece.Maleic anhydride in the present invention has the effect increasing binding agent viscosity, and can increase the uniformity of binding agent.
The preparation method of the binding agent in the present invention can make binding agent evenly, binding agent of the present invention by heating temperatures 60 ~ 70 DEG C, has better bond effect in use.
The invention has the beneficial effects as follows: evaporative pattern of the present invention is when workpiece is cast, and the caking property of binding agent is high, and pollute little, boiling point is low, without residue.
Detailed description of the invention:
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with instantiation, setting forth the present invention further.
Embodiment 1
A kind of evaporative pattern binding agent, is made up of following parts by weight of component,
A kind of preparation method of evaporative pattern binding agent, adhesive is made up of following methods, first by gelatine and paraffin abrasive dust, then paraffin, gelatine is fully mixed with polyvinyl acetate emulsion, polybutadiene, vinyl acetate, maleic anhydride and dimethylethanolamine, be heated to 60 DEG C, then cooling packing.
Adhesive in use heating temperatures to 60 DEG C.
Embodiment 2
A kind of evaporative pattern binding agent, is made up of following parts by weight of component,
A kind of preparation method of evaporative pattern binding agent, adhesive is made up of following methods, first by gelatine and paraffin abrasive dust, then paraffin, gelatine is fully mixed with polyvinyl acetate emulsion, polybutadiene, vinyl acetate, maleic anhydride and dimethylethanolamine, be heated to 60 ~ 70 DEG C, then cooling packing.
Adhesive in use heating temperatures to 60 ~ 70 DEG C.
Embodiment 3
A kind of evaporative pattern binding agent, is made up of following parts by weight of component,
A kind of preparation method of evaporative pattern binding agent, adhesive is made up of following methods, first by gelatine and paraffin abrasive dust, then paraffin, gelatine is fully mixed with polyvinyl acetate emulsion, polybutadiene, vinyl acetate, maleic anhydride and dimethylethanolamine, be heated to 60 ~ 70 DEG C, then cooling packing.
Adhesive in use heating temperatures to 60 ~ 70 DEG C.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (4)
1. an evaporative pattern binding agent, is characterized in that: be made up of following parts by weight of component,
2. a kind of evaporative pattern binding agent according to claim 1, is characterized in that: be made up of following parts by weight of component,
3. the preparation method of a kind of evaporative pattern binding agent according to claim 1, it is characterized in that: described adhesive is made up of following methods, first by gelatine and paraffin abrasive dust, again paraffin, gelatine are fully mixed with polyvinyl acetate emulsion, polybutadiene, vinyl acetate, maleic anhydride and dimethylethanolamine, be heated to 60 ~ 70 DEG C, then cooling packing.
4. a kind of evaporative pattern binding agent according to claim 1,2 or 3, is characterized in that: described adhesive in use heating temperatures to 60 ~ 70 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610034147.1A CN105562588A (en) | 2016-01-19 | 2016-01-19 | Full mold binding agent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610034147.1A CN105562588A (en) | 2016-01-19 | 2016-01-19 | Full mold binding agent and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105562588A true CN105562588A (en) | 2016-05-11 |
Family
ID=55873525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610034147.1A Pending CN105562588A (en) | 2016-01-19 | 2016-01-19 | Full mold binding agent and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105562588A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86105702A (en) * | 1985-07-29 | 1987-05-20 | 花王奎克株式会社 | Mold adhesive composition and mold manufacturing process |
| CN1155856A (en) * | 1994-08-19 | 1997-07-30 | 花王株式会社 | Binder composition for mold production and process for producing mold |
| CN101287566A (en) * | 2005-10-14 | 2008-10-15 | 东洋油墨制造株式会社 | Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film |
| CN102197444A (en) * | 2008-10-22 | 2011-09-21 | 东曹株式会社 | Composition for producing metal film, method for producing metal film, and method for producing metal powder |
| CN102921887A (en) * | 2012-10-10 | 2013-02-13 | 安徽红星阀门有限公司 | EPS white die producing process |
| CN104624922A (en) * | 2015-01-29 | 2015-05-20 | 石家庄满鼎福铸造有限公司 | Lost foam casting coating for gray cast iron and preparation method of lost foam casting coating |
| CN105246857A (en) * | 2013-05-28 | 2016-01-13 | 柯马杜股份有限公司 | Binder for injection-moulding composition |
-
2016
- 2016-01-19 CN CN201610034147.1A patent/CN105562588A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86105702A (en) * | 1985-07-29 | 1987-05-20 | 花王奎克株式会社 | Mold adhesive composition and mold manufacturing process |
| CN1155856A (en) * | 1994-08-19 | 1997-07-30 | 花王株式会社 | Binder composition for mold production and process for producing mold |
| CN101287566A (en) * | 2005-10-14 | 2008-10-15 | 东洋油墨制造株式会社 | Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film |
| CN102197444A (en) * | 2008-10-22 | 2011-09-21 | 东曹株式会社 | Composition for producing metal film, method for producing metal film, and method for producing metal powder |
| CN102921887A (en) * | 2012-10-10 | 2013-02-13 | 安徽红星阀门有限公司 | EPS white die producing process |
| CN105246857A (en) * | 2013-05-28 | 2016-01-13 | 柯马杜股份有限公司 | Binder for injection-moulding composition |
| CN104624922A (en) * | 2015-01-29 | 2015-05-20 | 石家庄满鼎福铸造有限公司 | Lost foam casting coating for gray cast iron and preparation method of lost foam casting coating |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160511 |