CN105552095B - A kind of antivacuum thermoelectric cooling unit for area array CCD - Google Patents
A kind of antivacuum thermoelectric cooling unit for area array CCD Download PDFInfo
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- CN105552095B CN105552095B CN201510969058.1A CN201510969058A CN105552095B CN 105552095 B CN105552095 B CN 105552095B CN 201510969058 A CN201510969058 A CN 201510969058A CN 105552095 B CN105552095 B CN 105552095B
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- 238000001816 cooling Methods 0.000 title claims abstract description 35
- 239000011521 glass Substances 0.000 claims abstract description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 238000003384 imaging method Methods 0.000 claims abstract description 5
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000005357 flat glass Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005619 thermoelectricity Effects 0.000 description 2
- 229920002449 FKM Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000036413 temperature sense Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of antivacuum thermoelectric cooling unit for area array CCD, including the airtight cavity all around closed by upper lid, cavity with heat dissipation base, upper lid is provided with glass envelope window, the side wall of cavity all around is provided with inflation inlet, all around opposite side is provided with electric interfaces to cavity, TEC cooling pieces, cold finger, CCD chip and temperature sensor are provided with cavity, chamber is filled with inert nitrogen gas.TEC cooling pieces are fixed on the heat dissipation base by TEC hold-doun nuts, cold finger is fixed on the cold end of the TEC cooling pieces, CCD chip is fixed on the cold finger, glass described in the photosurface face of CCD chip seals window, the area of glass envelope window is more than the imaging area of the CCD chip, and the temperature sensor is fixed on the side that the cold finger leans on CCD chip.Design structure is simple, good refrigeration effect, is adapted to occasion of the cryogenic temperature more than 30 degree, to reduce influence of the thermal noise to signal, influence of the steam to light path.
Description
Technical field
The present invention relates to a kind of photodetector Refrigeration Technique, more particularly to a kind of antivacuum thermoelectricity for area array CCD
Refrigerating plant, the encapsulation to the less demanding area array CCD detector that freezes can be met.
Background technology
In field of photodetectors, many detectors are all semiconductor detectors, and semiconductor detector is especially quick to temperature
Sense, need to remove the influence come due to temperature band especially when signal detection, such as scientific grade CCD,
At room temperature, dark current can bring very big influence, be inputted for faint signal, image quality can be excessively poor.Dark current
Refer under no light conditions, thermocurrent caused by the work of semiconductor optoelectronic image device.Its presence can be to phototube
The image quality of part affects.The temperature when size of dark current works with semiconductor devices is relevant, typically often drops
Low 5~7 DEG C, undercurrent is reduced by half.Therefore when being imaged using area array CCD, it is necessary to which dark current is controlled rational
In the range of, for the light source of some strength, refrigeration is ignored to -10~-30 degrees Celsius of cans, it is therefore desirable to which CCD chip is entered
The design of row refrigerating plant, and maintain suitable temperature.
The content of the invention
It is an object of the invention to provide a kind of antivacuum thermoelectricity system simple in construction, good refrigeration effect for area array CCD
Device for cooling.
The purpose of the present invention is achieved through the following technical solutions：
The present invention the antivacuum thermoelectric cooling unit for area array CCD, including by it is upper cover, cavity all around with heat dissipation base
The airtight cavity of closing, the upper lid are provided with glass envelope window, and the side wall of the cavity all around is provided with inflation inlet, the cavity
All around another side wall has electric interfaces, and TEC cooling pieces, cold finger, CCD chip and temperature sensor are provided with the cavity, described
Chamber is filled with inert nitrogen gas.
As seen from the above technical solution provided by the invention, it is provided in an embodiment of the present invention for the non-of area array CCD
Vacuum thermoelectric refrigerating plant, design structure is simple, good refrigeration effect, is adapted to occasion of the cryogenic temperature more than -30 degree, to reduce
Influence of the thermal noise to signal, influence of the steam to light path.
Brief description of the drawings
Fig. 1 is the structural representation of the antivacuum thermoelectric cooling unit provided in an embodiment of the present invention for area array CCD.
Fig. 2 is the appearance schematic diagram of the antivacuum thermoelectric cooling unit provided in an embodiment of the present invention for area array CCD.
Embodiment
The embodiment of the present invention will be described in further detail below.
The antivacuum thermoelectric cooling unit for area array CCD of the present invention, its preferable embodiment are：
Including by upper lid, cavity, all around the airtight cavity with heat dissipation base closing, the upper lid are provided with glass envelope window, institute
State the side wall of cavity all around and be provided with inflation inlet, all around opposite side is provided with electric interfaces to the cavity, and TEC is provided with the cavity
Cooling piece, cold finger, CCD chip and temperature sensor, the chamber are filled with inert nitrogen gas.
The TEC cooling pieces are fixed on the heat dissipation base by TEC hold-doun nuts, and the cold finger is fixed on described
The cold end of TEC cooling pieces, the CCD chip are fixed on the cold finger, and glass described in the photosurface face of the CCD chip seals
Window, the area of the glass envelope window are more than the imaging area of the CCD chip, and the temperature sensor is fixed on the cold finger and leaned on
The side of CCD chip.
The upper lid and cavity all around between and the cavity sealing ring is all around respectively equipped between heat dissipation base, and lead to
Cross fixed screw closely to connect, the glass envelope window is bonded on the upper lid by fluid sealant, and the electric interfaces pass through close
Sealing or sealing ring are fixed on the cavity four and placed, and the inflation inlet is screwed in cavity four and places and be provided with gasket seal, institute
State inflation inlet and be connected with inflating rubber pipe, aerating device is inflated, and inflation inlet is sealed using sealing plug.
The clock bias signal and vision signal of the CCD chip pass through the electric interfaces and CCD controller system phases
Even, the drive signal of the TEC cooling pieces and the signal of temperature sensor pass through the electric interfaces and temperature control panel phase
Even.
The antivacuum thermoelectric cooling unit for area array CCD of the present invention, the demand freezed for CCD chip, using each
Thermal conduction characteristic, mechanical property and the optical characteristics of kind material are designed to antivacuum thermoelectric cooling unit, and completion one is small-sized
, simply, it can freeze to -30 antivacuum thermoelectric cooling units of degree.Design structure is simple, be adapted to cryogenic temperature -30 degree with
On occasion, to reduce influence of the thermal noise to signal, influence of the steam to light path.
The antivacuum thermoelectric cooling unit for area array CCD of the present invention, by the high heat-dissipating cavity base of thermal conductivity, rigidity
Strong cavity all around and with glass seals the upper lid of window, the semiconductor chilling plate to be freezed, temperature sensor, the high copper of thermal conductivity
Cold finger is formed.Base is formed by the high aluminum fin-stock fansink designs of thermal conductivity factor, and TEC cooling pieces can be made to pass through good heat conduction
It is directly anchored on heat dissipation base, improves radiating effect.All around the high aluminum alloy materials of use intensity design cavity, and dissipate
Hot base and upper lid are sealed by viton seal ring, and are fixed using screw, form a seal cavity.Seal window
Glass can pass through various optical signals, in order to avoid influence of the steam to detector and light path in refrigeration, be filled with cavity lazy
Property gas nitrogen, washing away original air includes steam therein, would not be condensed and frosting when refrigeration.Upper lid is by intensity
High aluminum alloy materials make, and centre is Hermetic window glass, is bonded in using fluid sealant on upper lid, and whole upper lid passes through sealing ring,
Cavity four is screwed in place.The side of cavity all around is air-tightness electric interfaces, there is provided ccd signal and CCD controllers
The connection of circuit, TEC cooling piece signals, the electrical connection of temperature sensor signal and temperature control system.Cavity all around another
Side provide an inflated with nitrogen inflation inlet, inflation inlet is sealed on cavity by seal washer, in inflated with nitrogen, inflation inlet and
Do not tightened between cavity, when inflated with nitrogen, the air of the inside can be washed away from this gap, and inflation is tightened after nitrogen is charged
Mouthful, and sealed up using sealing plug.
By the hot junction of the good fixed multistage TEC cooling pieces of thermo-contact on the base of cavity, exponent number is according to CCD chip
The demand of size and refrigerating capacity can select three ranks, quadravalence or more multistage.The heat in TEC hot junctions can pass through base fin
Radiator and fan, heat is quickly scattered in air.Cold finger is made by the high red copper of thermal conductivity, is connect by good heat
Tactile one end is fixed on TEC cooling piece cold ends, and the other end is fixed on the dorsal part of CCD chip by good thermo-contact.CCD chip is consolidated
Be scheduled on cold finger, at the same imaging surface and Hermetic window glass formed it is coaxial.Temperature sensor is fixed on cold finger and leans on CCD chip side, can
To measure the temperature at the CCD chip back side at any time.
The clock bias signal of CCD chip is connected with vision signal by electric interfaces with CCD controller systems, is completed
The driving and data acquisition of CCD chip.TEC cooling pieces drive signal and temperature sensor signal are also by electric interfaces and temperature
Degree control panel is connected, and completes the driving and temperature survey and control of TEC cooling pieces.
Specific embodiment：
As shown in Figure 1 and Figure 2, including cavity 1, heat dissipation base 3, glass envelope window 2, upper lid 4, cavity all around 5, inflation inlet 6,
Electric interfaces 12, fixed screw 7, TEC cooling pieces 8, cold finger 9, CCD chip 10, sealing ring 13, sealing ring 14, TEC hold-doun nuts
11, gasket seal 15, temperature sensor 16, sealing plug 17.Cavity 1 is by heat dissipation base 3, upper lid 4, glass envelope window 2, cavity four
5 are enclosed to form by sealing ring 13 and the fastening of sealing ring 14.Heat dissipation base 3 and cavity all around 5 pass through sealing ring 13 and fixed spiral shell
Silk 7 closely connection, cavity all around 5 and upper lid 4 closely connected by sealing ring 14 and fixed screw 7, glass envelope window 2 pass through sealing
Glue sticking is on upper lid, and electric interfaces 12 are fixed on cavity all around on 5 using fluid sealant or sealing ring, and inflation inlet 6 is by close
Gasket 15 is screwed in cavity all around on 5, and inflation inlet 6 is inflated by rubber tube or charge valve to cavity 1, after inflation,
Inflation inlet is sealed using sealing plug 17.
Inside cavity, TEC cooling pieces 8 are fixed on heat dissipation base 3 by good thermo-contact using hold-doun nut 11.
Cold finger 9 is fixed on the cold end of TEC cooling pieces 8 by good thermo-contact, and another side passes through good thermo-contact and CCD chip 10
It is fixed, the photosurface face glass envelope window 2 of CCD chip 10, the size of glass envelope window 2 is greater than the imaging of CCD chip 10
Area.Temperature sensor 16 is fixed on cold finger 9 and leans on the side of CCD chip 10, can measure the temperature at the back side of CCD chip 10 at any time.
The clock bias signal of CCD chip 10 is connected with vision signal by electric interfaces 12 with CCD controller systems,
The drive signal of TEC cooling pieces 8 and the signal of temperature sensor 16 are connected by electric interfaces 12 with temperature control panel, are completed
The driving and temperature survey and control of TEC cooling pieces 8.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art is in the technical scope of present disclosure, the change or replacement that can readily occur in,
It should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of claims
Enclose and be defined.
Claims (1)
- A kind of 1. antivacuum thermoelectric cooling unit for area array CCD, it is characterised in that including by it is upper lid, cavity all around with dissipate The airtight cavity of hot base closing, the upper lid are provided with glass envelope window, and the side wall of the cavity all around is provided with inflation inlet, institute Stating another side wall of cavity all around has electric interfaces, and TEC cooling pieces, cold finger, CCD chip and TEMP are provided with the cavity Device, the chamber are filled with inert nitrogen gas；The TEC cooling pieces are fixed on the heat dissipation base by TEC hold-doun nuts, and the cold finger is fixed on the TEC systems The cold end of cold, the CCD chip are fixed on the cold finger, and glass described in the photosurface face of the CCD chip seals window, institute The area for stating glass envelope window is more than the imaging area of the CCD chip, and the temperature sensor is fixed on the cold finger and leans on CCD cores The side of piece；The upper lid and cavity all around between and the cavity be all around respectively equipped with sealing ring between heat dissipation base, and by solid Determine screw closely to connect, the glass envelope window is bonded on the upper lid by fluid sealant, and the electric interfaces pass through fluid sealant Or sealing ring is fixed on the cavity four and placed, the inflation inlet is screwed in cavity four and places and be provided with gasket seal, described to fill Gas port is connected with inflating rubber pipe, and aerating device is sealed after being inflated using sealing plug to inflation inlet；The clock bias signal and vision signal of the CCD chip are connected by the electric interfaces with CCD controller systems, institute State the drive signal of TEC cooling pieces and the signal of temperature sensor is connected by the electric interfaces with temperature control panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510969058.1A CN105552095B (en) | 2015-12-17 | 2015-12-17 | A kind of antivacuum thermoelectric cooling unit for area array CCD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510969058.1A CN105552095B (en) | 2015-12-17 | 2015-12-17 | A kind of antivacuum thermoelectric cooling unit for area array CCD |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105552095A CN105552095A (en) | 2016-05-04 |
| CN105552095B true CN105552095B (en) | 2018-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510969058.1A Active CN105552095B (en) | 2015-12-17 | 2015-12-17 | A kind of antivacuum thermoelectric cooling unit for area array CCD |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108493261A (en) * | 2018-03-13 | 2018-09-04 | 谱诉光电科技（苏州）有限公司 | Photosensor package and packaging method |
| CN110752198B (en) * | 2019-10-28 | 2022-02-22 | 中国电子科技集团公司第四十四研究所 | Back-illuminated avalanche gain type EMCCD refrigeration packaging structure and method |
| CN111399320B (en) * | 2020-03-30 | 2021-10-26 | 厦门大学 | CCD camera refrigerating device based on thermoelectric refrigeration |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2257931Y (en) * | 1995-11-24 | 1997-07-16 | 中国科学院上海技术物理研究所 | Semiconductor refrigerating red infrared finder assembly |
| CN2663983Y (en) * | 2003-12-24 | 2004-12-15 | 中国科学院上海技术物理研究所 | Thermoelectric refrigeration type multiband infrared detector |
| CN201322841Y (en) * | 2008-12-12 | 2009-10-07 | 北京空间机电研究所 | Multi-CCD device isothermal heat dissipation structure of space optical camera |
-
2015
- 2015-12-17 CN CN201510969058.1A patent/CN105552095B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2257931Y (en) * | 1995-11-24 | 1997-07-16 | 中国科学院上海技术物理研究所 | Semiconductor refrigerating red infrared finder assembly |
| CN2663983Y (en) * | 2003-12-24 | 2004-12-15 | 中国科学院上海技术物理研究所 | Thermoelectric refrigeration type multiband infrared detector |
| CN201322841Y (en) * | 2008-12-12 | 2009-10-07 | 北京空间机电研究所 | Multi-CCD device isothermal heat dissipation structure of space optical camera |
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| CN105552095A (en) | 2016-05-04 |
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