CN105552002A - Lead wedge bonding micro force output mechanism - Google Patents
Lead wedge bonding micro force output mechanism Download PDFInfo
- Publication number
- CN105552002A CN105552002A CN201510950555.7A CN201510950555A CN105552002A CN 105552002 A CN105552002 A CN 105552002A CN 201510950555 A CN201510950555 A CN 201510950555A CN 105552002 A CN105552002 A CN 105552002A
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- voice coil
- coil motor
- strain
- rectangular block
- transducer
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- 230000007246 mechanism Effects 0.000 title claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 30
- 238000005259 measurement Methods 0.000 claims description 15
- 229910000906 Bronze Inorganic materials 0.000 claims description 7
- 239000010974 bronze Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 4
- 230000003111 delayed effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008844 regulatory mechanism Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
The invention discloses a lead wedge bonding micro force output mechanism, and solves the problem of low micro force output stability and difficulty in control and adjustment existing in the lead wedge bonding. The lead wedge bonding micro force output mechanism comprises a micro force executing mechanism mounting plate (1), a voice coil motor, an industrial control computer and a lead bonding ultrasonic transducer, wherein a piezoelectric ceramic (10) is arranged at the right end of the lead bonding ultrasonic transducer; a chopper (11) is connected with the left end of the lead bonding ultrasonic transducer; a voice coil motor stator (6) is inversely fixed and suspended on the lower end plane of the micro force executing mechanism mounting plate (1); an elastically-deformed rectangular block (2) is connected between the micro force executing mechanism mounting plate and a transducer mounting sleeve (9); the top end plane of a voice coil motor rotor (7) is connected with the top end plane of the transducer mounting sleeve in a jacking manner; and the piezoelectric ceramic, the voice coil motor and a position sensor (8) are electrically connected with the industrial control computer separately. The lead wedge bonding micro force output mechanism is stable and reliable in pressure control and high in repeatability in the whole pressure journey.
Description
Technical field
The present invention relates to the voice coil loudspeaker voice coil Output pressure mechanism that a kind of small power exports, particularly a kind of small power output mechanism based on voice coil motor for full-automatic lead bonding equipment.
Background technology
Full-automatic lead wedge bonding machine utilizes pressurization, heating, ultrasonic mode, with spun gold as connected medium, completes the wire bonding between chip and substrate, to realize the function of its electric interconnection.In wire bonding process, the accurate control of the small power of bonding and output are the important guarantees obtaining good bonding effect, and the pressure chip that may cause bigger than normal damages, and pressure meeting less than normal makes Joint Strength not reach requirement.At present, lead key closing process is manual equipment mostly, what adopt is that the dual force regulation mechanism of cylinder and spring cooperation is as small power output executing mechanism, cylinder pressure regulates easily delayed, be difficult to meet high-speed lead bonding technology, common spring pressuring method there is output pressure poor stability and wayward and regulate defect, make the control of small power and output accuracy limited.
Summary of the invention
The invention provides the small power output mechanism of a kind of lead-in wire wedge bonding, solve the technical problem of small power output stability difference and the regulating and controlling difficulty existed in lead-in wire wedge bonding.
The present invention solves above technical problem by the following technical programs:
The small power output mechanism of a kind of lead-in wire wedge bonding, comprise small power actuator mounting panel, voice coil motor, Industrial Control Computer and wire bonding ultrasonic transducer, the right-hand member of wire bonding ultrasonic transducer is provided with piezoelectric ceramic, chopper is connected with at the left end of wire bonding ultrasonic transducer, strain rectangular block is provided with the voice coil motor passing hole in upper and lower vertical direction, the left end of strain rectangular block is provided with left-hand thread hole, the right-hand member of strain rectangular block is provided with right-hand thread hole, voice coil motor stator is upside down fixedly hanging connected on the lower surface of small power actuator mounting panel, the left end of strain rectangular block and small power actuator mounting panel link together by the left-hand thread hole that left connecting bolt is arranged by the left end of strain rectangular block, the right-hand member of strain rectangular block is fixed together by the right connecting bolt in right-hand thread hole and transducer installation sleeve, wire bonding ultrasonic transducer is provided with in transducer installation sleeve, strain rectangular block in the voice coil motor passing hole arranged be provided with voice coil motor stator, the top end face of voice coil motor mover is together with the top end face apical grafting of transducer installation sleeve, the right-hand member of transducer installation sleeve is provided with position measurement portal frame, position measurement portal frame is fixed together by portal frame connecting bolt and transducer installation sleeve, small power actuator mounting panel below the back timber of position measurement portal frame is provided with position transducer, piezoelectric ceramic, voice coil motor and position transducer are electrically connected with Industrial Control Computer respectively.
The I shape groove through hole on anterior-posterior horizontal direction is provided with in the strain rectangular block be made up of beryllium-bronze material.
The present invention uses strain rectangular block and the leaf spring of beryllium-bronze material, improve elastic performance and the stability of chopper, the voice coil motor with unlimited resolution adopted makes the small power output area of lead-in wire wedge bonding control at 5-150 gram force, Stress control resolution ± 3 gram force, and in whole pressure stroke, Stress control is reliable and stable, reproducible.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of strain rectangular block 2 of the present invention;
Fig. 3 is the structural principle schematic diagram of the present invention before strain rectangular block 2 is out of shape;
Fig. 4 is the structural principle schematic diagram of the present invention after strain rectangular block 2 is out of shape.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
The small power output mechanism of a kind of lead-in wire wedge bonding, comprise small power actuator mounting panel 1, voice coil motor, Industrial Control Computer and wire bonding ultrasonic transducer, the right-hand member of wire bonding ultrasonic transducer is provided with piezoelectric ceramic 10, chopper 11 is connected with at the left end of wire bonding ultrasonic transducer, strain rectangular block 2 is provided with the voice coil motor passing hole 3 in upper and lower vertical direction, the left end of strain rectangular block 2 is provided with left-hand thread hole 4, the right-hand member of strain rectangular block 2 is provided with right-hand thread hole 5, voice coil motor stator 6 is upside down fixedly hanging connected on the lower surface of small power actuator mounting panel 1, the left end of strain rectangular block 2 and small power actuator mounting panel 1 link together by the left-hand thread hole 4 that left connecting bolt is arranged by the left end of strain rectangular block 2, the right-hand member of strain rectangular block 2 is fixed together by the right connecting bolt in right-hand thread hole 5 and transducer installation sleeve 9, wire bonding ultrasonic transducer is provided with in transducer installation sleeve 9, strain rectangular block 2 in the voice coil motor passing hole 3 arranged be provided with voice coil motor stator 6, the top end face of voice coil motor mover 7 is together with the top end face apical grafting of transducer installation sleeve 9, the right-hand member of transducer installation sleeve 9 is provided with position measurement portal frame 13, position measurement portal frame 13 is fixed together by portal frame connecting bolt 12 and transducer installation sleeve 9, small power actuator mounting panel 1 below the back timber of position measurement portal frame 13 is provided with position transducer 8, piezoelectric ceramic 10, voice coil motor and position transducer 8 are electrically connected with Industrial Control Computer respectively.
The I shape groove through hole 14 on anterior-posterior horizontal direction is provided with in the strain rectangular block 2 be made up of beryllium-bronze material.
Voice coil motor of the present invention is under the control of industrial computer, and the mover of voice coil motor moves downward, and by apical grafting transducer installation sleeve 9, drives wire bonding ultrasonic transducer to move downward, makes chopper 11 complete welding action.Move downward in process at transducer installation sleeve 9, the right-hand member that transducer installation sleeve 9 draws strain rectangular block 2 moves downward, the I-groove 14 in strain rectangular block 2 is made to produce distortion, cause strain rectangular block 2 pairs of transducer installation sleeves 9 to produce tractive effort upwards, achieve the stable output of slight pressure; Transducer installation sleeve 9 moves downward and drives position measurement portal frame 13 to move downward simultaneously, position transducer 8 records the downward displacement of position measurement portal frame 13 and sends industrial computer to, industrial computer is by judging that the size of displacement is to realize controlling and reporting to the police, strain rectangular block 2 is adopted to add the design of voice coil motor, voice coil motor design in dynamometry foremost, the transmission link of reduced force.
" work " font groove is opened in the inside of described strain rectangular block 2, effectively enhances the elastic performance on its above-below direction.Its material is beryllium-bronze, and beryllium-bronze is precipitation hardenable alloy, and have very high intensity, hardness, elastic limit and fatigue limit after fixation rates, elastic hysteresis is little, and has corrosion-resistance characteristics.These characteristics well improve the elastic performance of leaf spring, restorability energy and stability, effectively extend its working life.
Described voice coil motor is a kind of direct-driving motor, except avoid transmission link the same as linear electric motors exists except the deficiencies such as gap, there is unlimited resolution in theory, also stablize with or without delayed, high response, high speed, high acceleration, force characteristic and control the advantages such as convenient, being more suitable for the small power output mechanism driving frequent start-stop.Described voice coil motor meets the small power output area of lead-in wire wedge bonding and controls at 5-150gf(gram force), the requirement of Stress control resolution ± 3gf, and in whole pressure stroke, Stress control is reliable and stable, and reproducible.
A method of work for the small power output mechanism of the wedge bonding that goes between, comprises the following steps:
The first step, the I shape groove through hole 14 of horizontal direction is set in the strain rectangular block 2 be made up of beryllium-bronze material, strain rectangular block 2 arranges the voice coil motor passing hole 3 of vertically vertical direction, at the left end of strain rectangular block 2, left-hand thread hole 4 is set, at the right-hand member of strain rectangular block 2, right-hand thread hole 5 is set, voice coil motor stator 6 is inverted and is fixedly hanging connected on the lower surface of small power actuator mounting panel 1, the lower surface of the left end of strain rectangular block 2 with small power actuator mounting panel 1 is connected by the left-hand thread hole 4 that left connecting bolt is arranged by the left end of strain rectangular block 2, the right-hand member of strain rectangular block 2 is fixedly connected with transducer installation sleeve 9 by the bolt in right-hand thread hole 5, wire bonding ultrasonic transducer is provided with in transducer installation sleeve 9, strain rectangular block 2 in the voice coil motor passing hole 3 of the vertically vertical direction arranged be provided with voice coil motor stator 6, the top end face of voice coil motor mover 7 is together with the top end face apical grafting of transducer installation sleeve 9, the right side of transducer installation sleeve 9 is provided with position measurement portal frame 13, position measurement portal frame 13 is fixed together by portal frame connecting bolt 12 and transducer installation sleeve 9, small power actuator mounting panel 1 below the back timber of position measurement portal frame 13 is provided with position transducer 8, piezoelectric ceramic 10, voice coil motor and position transducer 8 are electrically connected with industrial computer respectively,
Second step, industrial computer send enabled instruction to voice coil motor, voice coil motor mover 7 stretches out downwards, transducer installation sleeve 9 is driven to move downward, dynamic transducer installation sleeve 9 drives the right-hand member of strain rectangular block 2 to move downward, the I-groove 14 in strain rectangular block 2 is made to produce distortion, strain rectangular block 2 pairs of transducer installation sleeves 9 produce a tractive effort upwards, the pressure being subject to voice coil motor mover 7 downward with transducer installation sleeve 9 reaches balance, achieves the precise and stable output of small power;
3rd step, move downward simultaneously at transducer installation sleeve 9, position transducer 8 records the downward displacement of position measurement portal frame 13 and sends industrial computer to, if this displacement exceedes the threshold value preset, then industrial computer sends alarm signal.
The applying measure of wire bonding pressure of the present invention has come mainly through the moment controlling voice coil motor.Its detailed process is, first utilizing height finder system that vertical direction is touched needs to execute stressed object, and the moment then by controlling voice coil motor increases or reduces to realize the control of the small power output of lead-in wire wedge bonding.In welding process, chopper 11 realizes the output of slight pressure by small displacement downwards, and the value of position transducer 8 is changed to H2 from H1 in this process.Δ H=H1-H2 not only show the micro-displacement of chopper vertical direction, also reflects the size of each solder joint amount of plastic deformation simultaneously.Described position transducer 8 is a kind of high-resolution transducers having integrated temperature and compensate, and achieves the sensitive feedback of bonding pressure.Adopt Output pressure close-loop control mode simultaneously, effectively improve stability and the accuracy of bonding pressure.Guarantee the plastic deformation amount consistency of welding quality and each solder joint.
Described voice coil motor has without delayed, high response, high speed, high acceleration, force characteristic are stable and control the advantages such as convenient, voice coil motor adopts larger electric constant, can control little force (5-150gf) output by big current very much, be suitable for the small power output mechanism driving frequent start-stop.Make the small power output area of lead-in wire wedge bonding control at 5-150gf, Stress control resolution ± 3gf, and in whole pressure stroke, Stress control is reliable and stable, reproducible.
Claims (2)
1. the small power output mechanism of lead-in wire wedge bonding, comprise small power actuator mounting panel (1), voice coil motor, Industrial Control Computer and wire bonding ultrasonic transducer, the right-hand member of wire bonding ultrasonic transducer is provided with piezoelectric ceramic (10), chopper (11) is connected with at the left end of wire bonding ultrasonic transducer, it is characterized in that, strain rectangular block (2) is provided with the voice coil motor passing hole (3) in upper and lower vertical direction, the left end of strain rectangular block (2) is provided with left-hand thread hole (4), the right-hand member of strain rectangular block (2) is provided with right-hand thread hole (5), voice coil motor stator (6) is upside down fixedly hanging connected on the lower surface of small power actuator mounting panel (1), the left end of strain rectangular block (2) and small power actuator mounting panel (1) link together by the left-hand thread hole (4) that left connecting bolt is arranged by the left end of strain rectangular block (2), the right-hand member of strain rectangular block (2) is fixed together by the right connecting bolt in right-hand thread hole (5) and transducer installation sleeve (9), wire bonding ultrasonic transducer is provided with in transducer installation sleeve (9), voice coil motor stator (6) is provided with in the upper voice coil motor passing hole (3) arranged of strain rectangular block (2), the top end face of voice coil motor mover (7) is together with the top end face apical grafting of transducer installation sleeve (9), the right-hand member of transducer installation sleeve (9) is provided with position measurement portal frame (13), position measurement portal frame (13) is fixed together by portal frame connecting bolt (12) and transducer installation sleeve (9), small power actuator mounting panel (1) below the back timber of position measurement portal frame (13) is provided with position transducer (8), piezoelectric ceramic (10), voice coil motor and position transducer (8) are electrically connected with Industrial Control Computer respectively.
2. the small power output mechanism of one lead-in wire wedge bonding according to claim 1, is characterized in that, be provided with the I shape groove through hole (14) on anterior-posterior horizontal direction in the strain rectangular block (2) be made up of beryllium-bronze material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510950555.7A CN105552002A (en) | 2015-12-18 | 2015-12-18 | Lead wedge bonding micro force output mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510950555.7A CN105552002A (en) | 2015-12-18 | 2015-12-18 | Lead wedge bonding micro force output mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105552002A true CN105552002A (en) | 2016-05-04 |
Family
ID=55831107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510950555.7A Pending CN105552002A (en) | 2015-12-18 | 2015-12-18 | Lead wedge bonding micro force output mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105552002A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246778A (en) * | 2019-03-05 | 2019-09-17 | 大连佳峰自动化股份有限公司 | A kind of pivot angle is separable and binds the adjustable binding mechanism of power |
| CN114619580A (en) * | 2022-05-11 | 2022-06-14 | 河北圣昊光电科技有限公司 | Gram weight adjusting structure, cutter adjusting component and splitting machine with cutter adjusting component |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
| US5950903A (en) * | 1997-03-13 | 1999-09-14 | F & K Delvotec Bondtechnik Gmbh | Bonding head |
| US6439448B1 (en) * | 1999-11-05 | 2002-08-27 | Orthodyne Electronics Corporation | Large wire bonder head |
| CN102945813A (en) * | 2012-10-25 | 2013-02-27 | 广东工业大学 | Bonding head device applied to full-automatic wire bonding device |
-
2015
- 2015-12-18 CN CN201510950555.7A patent/CN105552002A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
| US5950903A (en) * | 1997-03-13 | 1999-09-14 | F & K Delvotec Bondtechnik Gmbh | Bonding head |
| US6439448B1 (en) * | 1999-11-05 | 2002-08-27 | Orthodyne Electronics Corporation | Large wire bonder head |
| CN102945813A (en) * | 2012-10-25 | 2013-02-27 | 广东工业大学 | Bonding head device applied to full-automatic wire bonding device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246778A (en) * | 2019-03-05 | 2019-09-17 | 大连佳峰自动化股份有限公司 | A kind of pivot angle is separable and binds the adjustable binding mechanism of power |
| CN110246778B (en) * | 2019-03-05 | 2021-03-09 | 大连佳峰自动化股份有限公司 | Binding mechanism with separable swing angle and adjustable binding force |
| CN114619580A (en) * | 2022-05-11 | 2022-06-14 | 河北圣昊光电科技有限公司 | Gram weight adjusting structure, cutter adjusting component and splitting machine with cutter adjusting component |
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Application publication date: 20160504 |
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