CN105538173B - The ultrahard diamond emery wheel and its manufacture method of a kind of no bonding agent - Google Patents
The ultrahard diamond emery wheel and its manufacture method of a kind of no bonding agent Download PDFInfo
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- CN105538173B CN105538173B CN201510884320.2A CN201510884320A CN105538173B CN 105538173 B CN105538173 B CN 105538173B CN 201510884320 A CN201510884320 A CN 201510884320A CN 105538173 B CN105538173 B CN 105538173B
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- China
- Prior art keywords
- bonding agent
- emery wheel
- polycrystalline cvd
- ultrahard
- metallic matrix
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a kind of ultrahard diamond emery wheel of no bonding agent and its manufacture method.The ultrahard diamond emery wheel of the no bonding agent includes metallic matrix and the abrasive material being fixed on metallic matrix；The abrasive material is the polycrystalline CVD diamond piece without bonding agent, and abrasive particle and chip pocket are machined with the working face of the abrasive material.Thus, abrasive particle and chip pocket are processed by artificial, is fabricated to the hard grinding wheel without bonding agent, improve the intensity of emery wheel.The abrasive particle of emery wheel of the present invention is evenly distributed with chip pocket, is highly consistent, during grinding, can effectively reduce grinding force, reduce grinding temperature.
Description
Technical field
The present invention relates to a kind of ultrahard diamond emery wheel of no bonding agent and its manufacture method, belong to mechanical manufacturing field
The design and manufacture of new machining tool, designed primarily directed to high rigidity, high intensity, difficult processing and advanced composite material (ACM)
's.
Background technology
Grinding is one of widely used manufacturing process technology, and its feature depends greatly on work used
Tool --- emery wheel.Generally, the abrasive material of emery wheel is made up of abrasive particle, bonding agent and stomata, and hardness of grain influences the hardness of emery wheel,
But holding intensity of the bonding agent to abrasive particle is only the major influence factors of Wheel hardness.
In order to meet requirements at the higher level of the new material to its process tool intensity, diamond and cubic boron nitride superhard abrasive material
It is widely used, at the same time, from resinoid bond, vitrified bond, metallic bond to brazed abrasive wheel, bonding agent
Holding intensity to abrasive particle is also constantly being strengthened, but its structure still remains and is made up of abrasive material, bonding agent, stomata three parts,
The bulk strength of emery wheel is still limited by wellability between abrasive material and bonding agent.
The content of the invention
In order to further improve the intensity of emery wheel, the present invention is intended to provide a kind of ultrahard diamond emery wheel of no bonding agent,
The emery wheel by the way of Laser Micro-Machining, large-sized polycrystalline CVD diamond circular ring plate surface it is artificial process abrasive particle
With chip pocket, the hard grinding wheel without bonding agent is fabricated to, while provides the hard grinding wheel of a set of no bonding agent from being designed into
The technological process of manufacture, the intensity of emery wheel is improved, to realize adding for high rigidity, high intensity, difficult processing and advanced composite material (ACM)
Solid foundation has been established in work development.
To achieve these goals, the technical solution adopted in the present invention is：
A kind of ultrahard diamond emery wheel of no bonding agent, it is structurally characterized in that, including metallic matrix and is fixed on Metal Substrate
Abrasive material on body；The abrasive material is the polycrystalline CVD diamond piece without bonding agent, and mill is distributed with the working face of the abrasive material
Grain and the chip pocket between two neighboring abrasive particle.
Thus, abrasive particle and chip pocket are processed by artificial, is fabricated to the hard grinding wheel without bonding agent, improves sand
The intensity of wheel.
According to an embodiment of the invention, further optimization can also be made to the present invention, below the skill to be formed after optimization
Art scheme：
Preferably, the abrasive particle is raised pyramidal structure, and height of projection is 5-20 μm, and raised bottom width is 20-
60μm；The groove depth of the chip pocket is 5-20 μm, and the distance between two neighboring abrasive particle is 40 μm -80 μm.The projection of the present invention
Similar to the abrasive particle of traditional wheel face, grit size have it is a variety of, it is same convex depending on the requirement on machining accuracy of workpiece
Play height and depending on the ability integration of workpiece accuracy requirement and Laser Micro-Machining, the specific size of chip pocket can be according to work
Depending on the actual requirement of the machining accuracy of part.
As a kind of structure type, it is connected between the metallic matrix and abrasive material by ceramic substrate layers；The polycrystalline
Cvd diamond piece is grown on the top end face of ceramic substrate layers.
Preferably, the abrasive particle and chip pocket are process using laser processing technology.
As a kind of specific structure type, the metallic matrix is cup-shaped, and the polycrystalline CVD diamond piece is annular in shape simultaneously
It is fixed on the top of metallic matrix.
Preferably, the polycrystalline CVD diamond piece, which is glued, is fixed on metallic matrix（1）Top, and in polycrystalline CVD diamond
Piece and metallic matrix（1）Between be provided with welding hard alloy layer.
Preferably, the metallic matrix includes aluminum substrate；The abrasive material is welded on the top end face of a hard alloy, firmly
Matter alloy is glued on aluminum substrate；Or the abrasive material is grown directly upon on the top end face of ceramic substrate layers, and ceramic substrate layers
It is glued on the aluminum substrate.
Preferably, the thickness of the abrasive material is 1.5mm -3mm.
Based on same inventive concept, present invention also offers a kind of ultrahard diamond emery wheel without bonding agent as described above
Manufacture method, it comprises the following steps：
S1, the polycrystalline CVD diamond piece that Artificial Growth goes out cut into by required shape using laser cutting technique, or will
The polycrystalline CVD diamond piece being grown on the top end face of ceramic substrate layers cuts into required shape, and to polycrystalline CVD diamond
The surface of piece carries out planarization processing；
S2, the top that polycrystalline CVD diamond piece is fixed on to metallic matrix；
S3, using laser micro-structural process technology, abrasive particle is processed on the working face of polycrystalline CVD diamond piece and is considered to be worth doing with holding
Groove.
According to an embodiment of the invention, in step S2, the metallic matrix closes for the aluminum substrate of cup-shaped and the hard of ring-type
Gold；The aluminum substrate or ceramic substrate layers are glued on the aluminum substrate；The polycrystalline CVD diamond piece is grown directly upon ceramics
It is welded on the top end face of substrate layer or after cutting into annular shape on cemented carbide tip face.
The present invention has substantially comprised the content of two parts：Part I is to the design without binding agent ultra hard emery wheel.By
A diameter of 200mm can be grown into cvd diamond, thickness is 3mm large dimond piece, therefore can set hard grinding wheel
The shape of cup wheel is counted into, emery wheel is made up of metallic matrix and abrasive material, wherein, abrasive material is polycrystalline CVD diamond annulus
Piece, abrasive material are free of any bonding agent, and abrasive particle and chip pocket are formed through engineer and using Laser Micro-Machining.Part II
It is the manufacturing process flow of no binding agent ultra hard emery wheel.There are two schemes, scheme one in this part：First, using laser cutting skill
Art, it is cut to circle（Limited by the growing technology of current polycrystalline CVD diamond piece, the maximum gauge footpath of disk is reachable
150mm）, secondly, the CVD polycrystalline diamond flags that Artificial Growth goes out, surface microstructure is obvious, extremely coarse, it need to be carried out flat
Change processing, to ensure the roughness on its surface and flatness；Then, then with being laser-cut into annular（The size of internal diameter is outer
Footpath size subtracts abrasive material width）；Subsequently, need to be by its vacuum welding to carbide ring（Due to diamond and majority gold
The wellability of category is poor）, then be fixed on by way of splicing on metallic matrix；Finally, using laser micro-structural process technology,
Abrasive surface it is artificial process abrasive particle and chip pocket.Scheme two：By cvd diamond direct growth on a ceramic substrate（CVD
Thickness of diamond 1-3mm）, then by being laser-cut into circle, then polish, planarization process, be subsequently cut into annular,
Then be glued on metallic matrix, finally, using laser micro-structural process technology, abrasive surface it is artificial process abrasive particle
With chip pocket.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is based on to the abrasive surface after Laser Micro-Machining
Structure and the contrast of traditional grinding wheel structure, show that the grinding wheel has the structure similar to traditional emery wheel（Play shear action
Abrasive particle and chip pocket）, also, because the emery wheel is free of bonding agent, its bulk strength will greatly improve, about the 3- of brazed abrasive wheel
4 times.Further, since its Abrasive Grain is engineer, it is evenly distributed, is highly consistent, during grinding, can effectively reduces
Grinding force, reduce grinding temperature.
Below in conjunction with drawings and examples, the present invention is further elaborated.
Brief description of the drawings
Fig. 1 is the structural representation of emery wheel of the present invention, and wherein a is vertical section schematic diagram, and b is top view；
Fig. 2 is wheel face micro-structural schematic diagram of the present invention, wherein a）For involute shape abrasive particle and chip pocket, b）For
Criss-cross abrasive particle and chip pocket, c）For rhombus abrasive particle and chip pocket, d）For triangle abrasive particle and chip pocket；
Fig. 3 is emery wheel manufacturing process flow diagram of the present invention, a）For the flow chart of scheme one, b）For the flow of scheme two
Figure；
Fig. 4 is wheel face micro-structural geomorphologic map of the present invention；Wherein a）For the geomorphologic map under 50 μm of units；b）For
Geomorphologic map under 100 μm of units；c）Geomorphologic map under 30 μm of units；Wherein a）Clapped by super depth-of-field microscope is lower, it is to hindsight
It is very little shorter, and b）、c）By the picture clapped under ESEM, its control size is long, but does not affect the reality of object
Size；
Fig. 5 is the geomorphologic map on resin diamond grinding wheel surface；Wherein a）For the geomorphologic map under 500 μm of units；b）For 400 μm
Geomorphologic map under unit；c）Geomorphologic map under 30 μm of units.
In figure
1- metallic matrixes；2- abrasive materials；3- diamond film layers；4-CVD diamond layers；5- ceramic substrate layers； 11-
Aluminum substrate；12- hard alloy.
Embodiment
A kind of ultrahard diamond emery wheel of no bonding agent, as shown in figure 1, the grinding wheel structure of the present invention and cup wheel structure
Substantially it is similar, it is made up of matrix and abrasive material two parts.But because the wellability of diamond and metallic matrix is poor, therefore, need
The vacuum brazing of polycrystalline CVD diamond piece was changed to hard alloy before this, was then glued onto again on aluminum substrate.Mill shown in Fig. 1
The internal-and external diameter of the bed of material is respectively 30mm, 38mm, thickness 2mm.Fig. 2 is the schematic diagram of wheel face micro-structural, and 4 are given in figure
The abrasive material working face schematic diagram of kind structure type, respectively involute shape, criss-cross, rhombus and triangle.
The surface texture of no binding agent ultra hard skive and traditional emery wheel is contrasted below, and illustrating the structure can
Carry out grinding.
The present invention is so that surface micro-structure is criss-cross as an example, with reference to shown in Fig. 2, first, through laser cutting, by polycrystalline CVD
Diamond chip cuts into a diameter of 38mm disk；Secondly, it is planarized by the way of mechanical polishing, planarized
Afterwards, polycrystalline CVD diamond piece surface planarity can reach 0.01mm；Then, using laser cutting technique, after planarization
Disk cuts into a diameter of 30mm of inner circle, and outside diameter is 38mm circular ring plate, subsequently, by diamond circular ring plate vacuum brazing
It is glued onto hard alloy, and with aluminum substrate；Finally, using laser micro-machining technology, the micro- of criss-cross is gone out in its Surface Machining
Type groove.For micro-structural without binding agent ultra hard boart boart wheel surface as shown in figure 4, convex is square taper, bottom size is about 50
× 50 μm, the height of convex is about 10 μm, is the groove as chip pocket of taper, two neighboring projection between convex and convex
Between spacing（Chip pocket is wide）About 60 μm.During grinding, the edge of convex plays machining, and top surface has certain throwing
Light action, groove can accommodate certain chip.Contrast D35 resin diamond grinding wheel landforms（As shown in Figure 5）, wheel face
Abrasive particle random distribution, the protrusion height of abrasive particle can be controlled by crushing, typically about 1/3rd of grit size.Abrasive particle
Spacing can not determine that the comparatively dense of some local abrasive particle glomerocrysts, crying for some local agglomeration of abrasive particles is lax, abrasive particle it is convex
Go out highly inconsistent.
By to conclusions, illustrating that no its Abrasive Grain of binding agent ultra hard skive is evenly distributed, abrasive particle protrusion
It is highly consistent, it can effectively reduce grinding force during grinding, reduce the generation of grinding heat, and due to without bonding agent,
Wheel strength has diamond decision, and therefore, the hardness of more traditional emery wheel will height.
What deserves to be explained is for the Making programme of emery wheel, cvd diamond piece is first cut into circle, re-polishing and then again
Circular ring plate is cut into, is because the cvd diamond piece internal stress that grows is very big, if cutting twice is into annular, Ran Houzai
It is polished and is easy to cracking phenomenon, thus there are two kinds of improvement projects：The first scheme because annulus size it is larger,
During being welded with hard alloy, easily crushed because of internal stresses release, cost of manufacture is high, but this kind of method is because of its intensity
Height, application are wide；Cvd diamond direct growth on a ceramic substrate, is eliminated the work step of welding, cost by another scheme
It is corresponding to reduce, but its intensity is compared with the difference of scheme one.
In cutter making flow, cvd diamond and the matrix of cup type shape are splicing, are because of CVD Buddha's warrior attendants in scheme one
Stone film is once welded with hard alloy layer, and the secondary release of its internal stress such as occurs with matrix welding again, broken,
Thus selection is glued, and in order to ensure the intensity being glued, hard alloy bottom, matrix top are provided with the spline of mutual cooperation.And
In scheme two, ceramic substrate is welded extremely difficult thus same by the way of being glued with metallic matrix.In addition, cvd diamond
The notching construction on surface, surface groove width, microstructure size can determine according to the ability integration of work pieces process requirement and Laser Micro-Machining
It is fixed, it is not limited to the size given in legend.
The content that above-described embodiment illustrates should be understood to that these embodiments are only used for being illustrated more clearly that the present invention, without
For limiting the scope of the present invention, after the present invention has been read, the various equivalent form of values of the those skilled in the art to the present invention
Modification each fall within the application appended claims limited range.
Claims (10)
1. a kind of ultrahard diamond emery wheel of no bonding agent, it is characterised in that including metallic matrix（1）Be fixed on metallic matrix
（1）On abrasive material（2）；The abrasive material is the polycrystalline CVD diamond piece without bonding agent, is distributed on the working face of the abrasive material
There are abrasive particle and the chip pocket between two neighboring abrasive particle.
2. the ultrahard diamond emery wheel of no bonding agent according to claim 1, it is characterised in that the abrasive particle is raised
Pyramidal structure, height of projection are 5-20 μm, and raised bottom width is 20-60 μm；The groove depth of the chip pocket is 5-20 μm, phase
The distance between adjacent two abrasive particles are 40 μm -80 μm.
3. the ultrahard diamond emery wheel of no bonding agent according to claim 1, it is characterised in that the metallic matrix（1）
With abrasive material（2）Between pass through ceramic substrate layers（5）It is connected；The polycrystalline CVD diamond piece is grown in ceramic substrate layers（5）'s
On top end face.
4. the ultrahard diamond emery wheel of no bonding agent according to claim 1, it is characterised in that the abrasive particle and chip pocket
It is process using laser processing technology.
5. the ultrahard diamond emery wheel without bonding agent according to one of claim 1-4, it is characterised in that the Metal Substrate
Body（1）Cup-shaped, the polycrystalline CVD diamond piece is annular in shape and is fixed on metallic matrix（1）Top.
6. the ultrahard diamond emery wheel of no bonding agent according to claim 5, it is characterised in that the polycrystalline CVD Buddha's warrior attendants
Flag, which is glued, is fixed on metallic matrix（1）Top, and in polycrystalline CVD diamond piece and metallic matrix（1）Between be provided with welding
Hard alloy layer.
7. the ultrahard diamond emery wheel without bonding agent according to one of claim 1-4, it is characterised in that the Metal Substrate
Body（1）Including aluminum substrate（11）；The abrasive material（2）It is welded on a hard alloy（12）Top end face on, hard alloy（12）
It is glued to aluminum substrate（11）On；Or the abrasive material（2）It is grown directly upon ceramic substrate layers（5）Top end face on, and ceramic liner
Bottom（5）It is glued to the aluminum substrate（11）On.
8. the ultrahard diamond emery wheel without bonding agent according to one of claim 1-4, it is characterised in that the abrasive material
（2）Thickness be 1.5mm -3mm.
A kind of 9. manufacture method of ultrahard diamond emery wheel as described in one of claim 1-8 without bonding agent, it is characterised in that
Comprise the following steps：
S1, the polycrystalline CVD diamond piece that Artificial Growth goes out cut into by required shape using laser cutting technique, or will growth
In ceramic substrate layers（5）Top end face on polycrystalline CVD diamond piece cut into required shape, and to polycrystalline CVD diamond
The surface of piece carries out planarization processing；
S2, polycrystalline CVD diamond piece is fixed on metallic matrix（1）Top；
S3, using laser micro-structural process technology, process abrasive particle and chip pocket on the working face of polycrystalline CVD diamond piece.
10. the manufacture method of the ultrahard diamond emery wheel of no bonding agent according to claim 9, it is characterised in that step
In S2, the metallic matrix（1）For the aluminum substrate of cup-shaped（11）With the hard alloy of ring-type（12）；The aluminum substrate（11）Or pottery
Ceramic liner bottom（5）It is glued to the aluminum substrate（11）On；The polycrystalline CVD diamond piece is grown directly upon ceramic substrate layers（5）
Top end face on or be welded on hard alloy after cutting into annular shape（12）On top end face.
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105945737A (en) * | 2016-06-29 | 2016-09-21 | 北京沃尔德金刚石工具股份有限公司 | Brazing type diamond grinding wheel used for high-precision grinding and manufacturing method |
| CN107962510B (en) * | 2017-12-05 | 2019-04-23 | 长沙理工大学 | A kind of preparation method of the orderly microstructured cvd diamond grinding wheel in surface |
| CN108127802A (en) * | 2017-12-22 | 2018-06-08 | 郑州中南杰特超硬材料有限公司 | A kind of processing method of large scale polycrystalline diamond article |
| US11268570B2 (en) * | 2018-06-19 | 2022-03-08 | Us Synthetic Corporation | Bearing assemblies, related bearing apparatuses and related methods |
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| JP3210977B2 (en) * | 1999-05-12 | 2001-09-25 | 経済産業省産業技術総合研究所長 | Whetstone for diamond polishing, diamond polishing method and diamond-polished body |
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