CN105518594A - Method for manufacturing touch panel - Google Patents
Method for manufacturing touch panel Download PDFInfo
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- CN105518594A CN105518594A CN201480049457.XA CN201480049457A CN105518594A CN 105518594 A CN105518594 A CN 105518594A CN 201480049457 A CN201480049457 A CN 201480049457A CN 105518594 A CN105518594 A CN 105518594A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
Abstract
A method for manufacturing a touch panel comprising a metal film, an insulating film and a transparent electrode film, wherein: patterning of the metal film and the insulating film comprises steps (S4, S5, S10 and S11), in each of which a photoresist pattern is formed by printing with use of a mask for printing and steps (S6 and S12), in each of which patterning is carried out by wet etching that uses the photoresist pattern as a mask; and formation of the transparent electrode film comprises a step in which a patterned transparent electrode film is formed by sputtering with use of a mask for sputtering having an opening pattern that corresponds to a pattern to be formed. By forming a photoresist pattern by printing with use of a mask for printing and by forming a patterned film with use of a mask for sputtering, a photographic process can be eliminated, thereby enabling reduction in the equipment cost and the running cost.
Description
Technical field
The present invention relates to the manufacture method of touch panel, specifically, relate to the manufacture method of following touch panel, namely, want by using printing mask to utilize printing to form the pattern of photoresist, and use sputtering mask to carry out film forming to the film be patterned, thus manufacture is not simplified with needing exposure process and developing procedure, and do not reduce the cost of equipment with not needing exposure device and developing apparatus.
Background technology
Existing capacitance type touch panel is made up of metal film, dielectric film, ELD etc., detects the electrostatic capacitance of finger tip, thus is detected which position contacted in panel by X, Y-coordinate.The graphical of above-mentioned metal film, dielectric film and ELD is carried out as described below.Film forming is being carried out to each film and after be coated with photoresist on film, carrying out exposing and developing thus form the pattern of photoresist.This patterned photoresist is etched (for example, referring to patent documentation 1) as mask each film.
Patent documentation 1: Japanese Unexamined Patent Publication 2011-197754 publication
But the manufacture method of above-mentioned existing touch panel needs the stripping process to the coating operation of the film coating photoresist becoming patterned object, exposure process, developing procedure, etching work procedure and photoresist.Therefore, relative to metal film, dielectric film and ELD each other, need repeatedly to carry out numerous and diverse and that process number is many optical manufacturing.Further, owing to using the optics production line of exposure device and developing apparatus, so there is equipment investment and operating cost also becomes this problem greatly.
Summary of the invention
Therefore, corresponding to this problem points, problem to be solved by this invention is the manufacture method providing following touch panel, it utilizes printing to form the pattern of photoresist by using printing mask, and use sputtering mask to carry out film forming to the film be patterned, thus manufacture do not simplified with not needing exposure process and developing procedure, and do not reduce the cost of equipment with not needing exposure device and developing apparatus.
In order to solve above-mentioned problem, the manufacture method of touch panel of the present invention is the manufacture method of the touch panel comprising metal film, dielectric film and ELD, graphically comprising of above-mentioned metal film and above-mentioned dielectric film: use the printing of printing mask to form the operation of the pattern of photoresist; And the pattern of above-mentioned photoresist is carried out Wet-type etching thus patterned operation as mask, the formation of above-mentioned ELD comprises the operation using the sputtering mask with the patterns of openings corresponding with the pattern that should be formed the ELD be patterned to be carried out to spatter film forming.
In addition, above-mentioned printing mask possesses: mask matrix material, and it has and is formed at printing surface side and the printing groove pattern corresponding with the pattern that should print and run through the bottom surface of this printing groove pattern and the through hole that internal diameter is less compared with the bottom width of this printing groove pattern; And holding member, it is laminated in above-mentioned mask matrix material, and have via above-mentioned mask matrix material through hole be communicated with in above-mentioned printing groove pattern thus fill the patterns of openings of the photoresist as transfer materials, the neighboring area of above-mentioned printing groove pattern beyond above-mentioned through hole is connected.
Further, above-mentioned sputtering mask possesses the mask sheet with above-mentioned patterns of openings and the surrounding surrounding this mask sheet and opens the framework of establishing for this mask sheet.
And, above-mentioned mask sheet comprises any one in resin mask sheet, compound mask sheet and metal mask sheet, wherein, described resin mask sheet is formed with the resin molding of at least one above-mentioned patterns of openings at the metal film that resin molding is formed with above-mentioned patterns of openings, described compound mask sheet has the multiple through holes being arranged in parallel with slit-shaped, with the one side being laminated in this metal film in above-mentioned through hole, and described metal mask sheet is formed with above-mentioned patterns of openings at metal film.
According to the manufacture method of touch panel of the present invention, use the pattern of printing mask printing photoresist to carry out the graphical of metal film and dielectric film, and use sputtering mask carry out spatter film forming to the ELD be patterned thus carry out the formation of ELD.Thereby, it is possible to do not need exposure process and developing procedure and manufacture is simplified, and exposure device and developing apparatus can not be needed and reduce the cost of equipment.
Accompanying drawing explanation
Fig. 1 is the process chart of the embodiment of the manufacture method representing touch panel of the present invention.
Fig. 2 A represents the first operation in the manufacture method of touch panel of the present invention, and is the vertical view of the glass substrate being formed with MAM film.
Fig. 2 B is the amplification view of the X-X ' line along Fig. 2 A.
Fig. 3 A represents the second operation in the manufacture method of touch panel of the present invention, and is the vertical view of printing mask.
Fig. 3 B is the amplification view of the X-X ' line along Fig. 3 A.
Fig. 4 A represents the 3rd operation in the manufacture method of touch panel of the present invention, and is the vertical view of the printing mask in the coating of photoresist.
Fig. 4 B is the amplification view of the X-X ' line along Fig. 4 A.
Fig. 5 A represents the 4th operation in the manufacture method of touch panel of the present invention, and is the vertical view of Resist patterns.
Fig. 5 B is the amplification view of the X-X ' line along Fig. 5 A.
Fig. 6 is the stereographic map of the printing mask used in second, third operation.
A part of region in printing mask shown in Fig. 7 A Watch with magnifier diagram 6, and be the vertical view of compound mask.
Fig. 7 B is the amplification view of the Y1-Y1 ' line along Fig. 7 A.
Fig. 7 C is the amplification view of the Y2-Y2 ' line along Fig. 7 A.
Fig. 8 is the amplification view corresponding with Fig. 7 B when the printing mask shown in Fig. 6 being installed on printing equipment and being coated with photoresist.
Fig. 9 is the vertical view of other configuration examples of patterns of openings in the magnetic metal parts representing that the printing mask shown in Fig. 6 uses.
Figure 10 A represents the 5th operation in the manufacture method of touch panel of the present invention, and is the vertical view of Resist patterns.
Figure 10 B is the amplification view of the X-X ' line along Figure 10 A.
Figure 11 A represents the 6th operation in the manufacture method of touch panel of the present invention, and is the vertical view of Wiring pattern.
Figure 11 B is the amplification view of the X-X ' line along Figure 11 A.
Figure 12 A represents the 7th operation in the manufacture method of touch panel of the present invention, and is the vertical view being formed with dielectric film on Wiring pattern.
Figure 12 B is the amplification view of the X-X ' line along Figure 12 A.
Figure 13 A represents the 8th operation in the manufacture method of touch panel of the present invention, and is the vertical view of the printing mask in the coating of photoresist.
Figure 13 B is the amplification view of the X-X ' line along Figure 13 A.
Figure 14 A represents the 9th operation in the manufacture method of touch panel of the present invention, and is the vertical view of Resist patterns.
Figure 14 B is the amplification view of the X-X ' line along Figure 14 A.
Figure 15 A represents the tenth operation in the manufacture method of touch panel of the present invention, and is the vertical view of Resist patterns.
Figure 15 B is the amplification view of the X-X ' line along Figure 15 A.
Figure 16 A represents the 11 operation in the manufacture method of touch panel of the present invention, and is the vertical view of Wiring pattern and insulating film pattern.
Figure 16 B is the amplification view of the X-X ' line along Figure 16 A.
Figure 17 A represents the 12 operation in the manufacture method of touch panel of the present invention, and is the vertical view of sputtering mask.
Figure 17 B is the amplification view of the X-X ' line along Figure 17 A.
Figure 18 A represents the 13 operation in the manufacture method of touch panel of the present invention, and is the vertical view of Y-ITO film.
Figure 18 B is the amplification view of the X-X ' line along Figure 18 A.
Figure 19 A represents the 14 operation in the manufacture method of touch panel of the present invention, and is the vertical view of sputtering mask.
Figure 19 B is the amplification view of the X-X ' line along Figure 19 A.
Figure 20 A represents the 15 operation in the manufacture method of touch panel of the present invention, and is the vertical view of X-ITO film.
Figure 20 B is the amplification view of the X-X ' line along Figure 20 A.
Embodiment
Below, based on accompanying drawing, embodiments of the present invention are described.
Fig. 1 represents the embodiment of the manufacture method of touch panel of the present invention.The manufacture method of this touch panel comprises the pattern formation process (operation S16, S17) of the pattern formation process (operation S1 ~ S7) of metal film (metal), the pattern formation process (operation S8 ~ S13) of dielectric film, the pattern formation process (operation S14, S15) of ITO (IndiumTinOxide: tin indium oxide) film (Y-direction) and ito film (X-direction).
The pattern formation process of metal film and dielectric film is the pattern that uses printing mask to utilize to print and form photoresist respectively and the pattern of this photoresist is carried out Wet-type etching as mask to metal film and dielectric film thus forms the operation of pattern.In addition, ito film (Y-direction) and the pattern formation process of ito film (X-direction) are by using the sputtering mask with the patterns of openings corresponding with the pattern that should be formed to carry out spatter film forming thus the operation of ito film that is patterned of film forming respectively.
Next, above-mentioned each manufacturing process is described in detail.
[the pattern formation process of metal film]
First, cleaning transparency carrier such as cleans the surface of glass substrate, and is dropped into (operation S1) in sputter equipment.Then, carry out the spatter film forming of metal such as MAM (Mo/Al/Mo) on the glass substrate 10, as shown in Figure 2A and 2B, on the glass substrate 10 whole forms MAM film 11 (operation S2).
Next, as shown in Figure 3A and 3B, positioning printing mask 12 thus carry out arranging (operation S3) on MAM film 11.The pattern corresponding with the Wiring pattern that should print is formed at this printing mask 12.In this condition, as shown in Figure 4A and 4B, printing mask 12 utilizes scraper plate 13 to apply photoresist 14 to carry out printing (operation S4).As shown in Figure 5A and 5B, if peel off printing mask 12, then on MAM film 11, direct (can not expose and develop) forms Resist patterns (corresponding with Wiring pattern) 14a (operation S5).
Above-mentioned printing mask 12 is such as Fig. 6, Fig. 7 A, Fig. 7 B, Fig. 7 C, Fig. 8 and form as shown in Figure 9.That is, as shown in Figure 6, printing mask 12 is configured to possess compound mask 1 and metal frame (plate-making frame) 2.Compound mask 1 is located at the inner side of square metal frame 2 and is kept with the state being applied with tension force.
The region 100 representing utilize the dot-and-dash line of Fig. 6 to surround as amplified in Fig. 7 A, Fig. 7 B and Fig. 7 C, compound mask 1 becomes the compound structure of the resin molding 4 and holding member 3 be laminated with as the polyimide etc. of mask matrix material.The printing groove pattern 4a corresponding with the pattern that should print is formed in printing surface (lower surface) side of resin molding 4.In addition, through hole 4b is formed with in the bottom surface of printing groove pattern 4a.The thickness of this resin molding 4 is such as 12 μm ~ about 24 μm.In this example, the adjacent printing groove pattern 4a being configured with multiple linearity.
The upper surface side of the printing surface in above-mentioned resin molding 4 is provided with holding member 3, and this holding member 3 has the patterns of openings 3a of the slit-shaped configured with constant space at short side direction, and is made up of magnetic metal material with sheet.This holding member 3 is the parts for utilizing magnetic force to keep fixing compound mask 1 when printing, and the thickness utilizing magnetic force to keep is such as about 30 μm.The patterns of openings 3a of holding member 3 is communicated with printing groove pattern 4a via through hole 4b.The internal diameter of this through hole 4b is less than the internal diameter of the bottom width and patterns of openings 3a of printing groove pattern 4a, is communicated with between patterns of openings 3a with printing groove pattern 4a via one or more through hole 4b.
As seen in figure 7 c, above-mentioned compound mask 1 is connected by neighboring area (region between the adjacent through hole 4b) 4c beyond the through hole 4b that print bottom surface of groove pattern 4a in the region different from Fig. 7 B.That is, the through hole 4b of mask matrix material 4 plays following function: patterns of openings 3a is communicated with printing groove pattern 4a thus is filled in via through hole 4b from patterns of openings 3a by the ink being coated on holding member 3 to print in groove pattern 4a.In addition, be connected by the neighboring area 4c beyond through hole 4b, for suppressing the skew of adjacent printing groove pattern 4a, distortion plays a role.
When metal frame 2 is installed on the printing equipment of photoresist, at lower surface (contrary with printing surface) the side distributed magnet 6 (with reference to Fig. 8) of glass substrate 10, utilizes magnetic force attracting holding parts 3 and fix compound mask 1.In this condition, as shown in Figure 4 A, supply photoresist 14 to printing with the surface (surface of holding member 3) of mask 12 is upper, utilize the pressure of scraper plate 13 that compound mask 1 is pressed on printing surface, and make scraper plate 13 mobile coating photoresist 14 in the direction of the arrow.So as shown in Figure 8, the photoresist 14 being coated on the surface of holding member 3 is filled in printing groove pattern 4a from patterns of openings 3a via the through hole 4b of resin molding 4.Then, above-mentioned photoresist 14 is pushed out and is covered on MAM film 11 thus is transferred.And if peel off printing mask 12, then compound mask 1 is nondeforming stripped from glass substrate 10, as shown in Figure 5A and 5B, the photoresist 14 in printing groove pattern 4a to be needed on MAM film 11 thus to form Resist patterns 14a.
In addition, the patterns of openings 3a of holding member 3 is not limited to slit-shaped, and rectangular patterns of openings 3b also can be made as shown in Figure 9 to become along being arranged as rectangular configuration in length and breadth.In such patterns of openings 3b, owing to can be linked with the state reinforcement of frame-shaped portion 3c, 3d of the holding member 3 between adjacent patterns of openings 3b in length and breadth with edge, so compared with the patterns of openings 3a of the slit-shaped shown in Fig. 6, the skew of patterns of openings 3b can be reduced when utilizing scraper plate 13 to carry out the coating of photoresist 14.
In addition, although showing through hole 4b is circular example, as long as can photoresist 14 be filled and the printing groove pattern 4a neighboring area 4c is adjacent can be made to be connected in printing groove pattern 4a, be not limited to circle.
Then, as shown in Figure 10A and 10B, using Resist patterns 14a as mask, MAM film 11 is etched thus graphical (operation S6).And, peel off Resist patterns 14a (operation S7), as shown in Figure 11 A and Figure 11 B, form the Wiring pattern 11a of MAM film.
Then, clean, carry out the inspection of the Wiring pattern 11a formed.
[the pattern formation process of dielectric film]
Next, as shown in Figure 12 A and Figure 12 B, form dielectric film 15 whole coating, such as coating forms the organic insulating film (operation S8) of SOG (SpinonGlass: spin-coating glass) etc.And as shown in Figure 13 A and Figure 13 B, the printing mask 16 that dielectric film 15 is located photoresist carries out arranging (operation S9).At printing mask 16, foursquare patterns of openings 16a is configured to rectangular.For this printing mask 16, the printing mask shown in Fig. 6, Fig. 7 A, Fig. 7 B, Fig. 7 C, Fig. 8 and Fig. 9 can be used.In addition, isolate, so also the mask of general serigraphy can be used due to fairly simple between patterns of openings 16a.Then, use scraper plate 13 on printing mask 16, apply photoresist 17 to carry out printing (operation S10).If remove printing mask 16, then as shown in Figure 14 A and Figure 14 B, on dielectric film 15, form Resist patterns 17a (operation S11).
Then, as shown in Figure 15 A and Figure 15 B, Resist patterns 17a is carried out the Wet-type etching (operation S12) of dielectric film 15 as mask.And if peel off Resist patterns 17a (operation S13), then as shown in Figure 16 A and Figure 16 B, insulating film pattern 15a is retained the part getting off to cover Wiring pattern 11a.
Then, clean, carry out the inspection of the insulating film pattern 15a formed.
[the pattern formation process of ito film (Y)]
Next, as shown in Figure 17 A and Figure 17 B, as mentioned above, be formed with Wiring pattern 11a with on the glass substrate 10 of the insulating film pattern 15a of a part of this Wiring pattern of covering 11a, the sputtering mask 18 that location is formed with patterns of openings 18a is arranged, and spatter film forming ito film 19 (operation S14) around dielectric film 15a in patterns of openings 18a.Due to ito film 19 in the mode be patterned in patterns of openings 18a by film forming, to be electrically connected and longitudinally continuously and the Y-ITO film 19a (operation S15) of the position of regulation Y-direction so be formed through Wiring pattern 11a as shown in Figure 18 A and Figure 18 B.
Then, clean, carry out the inspection of the Y-ITO film 19a formed.
Here, because above-mentioned sputtering mask 18 is such as the mask that the resin mask sheet resin molding 18b at polyimide etc. being formed with patterns of openings 18a is located at the inner side of square metal frame 18c, so resin molding 18b is kept with the state being applied with tension force.Or also can will be arranged in parallel with the laminated resin film of metal film (magnetic metal parts) of multiple through holes of slit-shaped and the inner side that the compound mask sheet being formed with at least one patterns of openings in the through hole of metal film is located at square metal frame uses.If use this compound mask, then can utilize magnetic-adsorption fixed magnetic metal parts.Further, the inner side that also the metal mask sheet being formed with patterns of openings at metal film can be located at square metal frame uses.
[the pattern formation process of ito film (X)]
Next, as shown in Figure 19 A and Figure 19 B, on the glass substrate 10 being formed with Wiring pattern 11a, insulating film pattern 15a and Y-ITO film 19a, the sputtering mask 20 that location is formed with patterns of openings 20a is arranged, and dielectric film in patterns of openings 20a carries out spatter film forming (operation S16) to ito film 21.This sputtering mask 20 is essentially the structure identical with above-mentioned sputtering mask 18.Due to ito film 21 in the mode be patterned in patterns of openings 20a by film forming, so formed as shown in Figure 20 A and Figure 20 B transversely continuously and the X-ITO film 21a (operation S17) of the position of regulation X-direction.In the part that these X-ITO film 21a be patterned intersect with Y-ITO film 19a, be folded with insulating film pattern 15a, two ito film 21a, 19a are electrically isolated.
Then, clean, carry out the inspection of the X-ITO film 21a formed.
And on the glass substrate 10 whole forms dielectric film, this dielectric film arranges glass cover etc.
Here, sputtering mask 20 can use the mask of the structure (shape of patterns of openings 20a different) identical from the situation of Y-ITO film 19a being carried out to spatter film forming.
According to manufacture method as described above, when metal film, dielectric film, ELD are distinguished graphical, by using printing mask, printing is utilized to form the pattern of photoresist, and use sputtering mask to carry out film forming to the ELD be patterned, thus fully can get rid of optical manufacturing.Therefore, it is possible to manufacture do not simplified with needing exposure process and developing procedure, and reduce while exposure device and developing apparatus can not be needed cost and the operating cost of equipment.
In addition, by combination based on is formed graphical of the printing of photoresist pattern and the different pattern formation method of the spatter film forming of film that is patterned, can by be applicable to various material, pattern form method by metal film, dielectric film and transparency electrode etc. graphically.Further, just can form pattern because spatter film forming need not etch, so by combination two pattern formation process, exposure process and developing procedure can not only be omitted, manufacturing process's quantity of entirety when forming touch panel can also be reduced.
And, when being filled in printing groove pattern by scraper plate coating photoresist, be connected by the neighboring area of printing groove pattern beyond through hole, can suppress, because of by applied pressure during scraper plate extension photoresist, to make the position of the printing groove pattern being formed at mask matrix material offset, be out of shape.Therefore, even be closely configured with the pattern of long distribution, the position of the pattern of printed photoresist offsets, distortion is also less, can carry out the high printing of pattern accuracy.
In addition, in the above-described embodiment, although be illustrated for the manufacture method of capacitance type touch panel, the present invention is not limited to capacitance type, also can be applied to the manufacture method of other various touch panels.In addition, as an example of application pattern formation method of the present invention, although be illustrated the manufacture method of touch panel, naturally, the formation of other various patterns carrying out Wet-type etching, spatter film forming can be also applied to.
Description of reference numerals:
1 ... compound mask; 2 ... metal frame (plate-making frame); 3 ... holding member; 3a, 3b ... patterns of openings; 4 ... resin molding (mask matrix material); 4a ... printing groove pattern; 4b ... through hole; 4c ... neighboring area; 10 ... glass substrate (transparency carrier); 11 ... MAM film (metal film); 12,16 ... printing mask; 14,17 ... photoresist; 14a, 17a ... Resist patterns; 15 ... dielectric film; 15a ... insulating film pattern; 18,20 ... sputtering mask; 19,21 ... ito film.
Claims (4)
1. a manufacture method for touch panel, it is the manufacture method of the touch panel comprising metal film, dielectric film and ELD,
The feature of the manufacture method of described touch panel is,
Graphically comprising of described metal film and described dielectric film:
Printing mask printing is used to form the operation of the pattern of photoresist; And
The pattern of described photoresist is carried out Wet-type etching thus patterned operation as mask,
The formation of described ELD comprises the operation using the sputtering mask with the patterns of openings corresponding with the pattern that should be formed the ELD be patterned to be carried out to spatter film forming.
2. the manufacture method of touch panel according to claim 1, is characterized in that,
Described printing mask possesses: mask matrix material, and it has and is formed at printing surface side and the printing groove pattern corresponding with the pattern that should print and run through the bottom surface of this printing groove pattern and the through hole that internal diameter is less compared with the bottom width of this printing groove pattern; And holding member, it is laminated in described mask matrix material, and have via described mask matrix material through hole be communicated with in described printing groove pattern thus fill the patterns of openings of the photoresist as transfer materials, the neighboring area of described printing groove pattern beyond described through hole is connected.
3. the manufacture method of touch panel according to claim 1 and 2, is characterized in that,
Described sputtering mask possesses the mask sheet with described patterns of openings and the surrounding surrounding this mask sheet and opens the framework of establishing for this mask sheet.
4. the manufacture method of touch panel according to claim 3, is characterized in that,
Described mask sheet comprises any one in resin mask sheet, compound mask sheet and metal mask sheet, wherein, described resin mask sheet is formed with described patterns of openings at resin molding, described compound mask sheet have the multiple through holes being arranged in parallel with slit-shaped metal film, in described through hole, be formed with the resin molding of patterns of openings described at least one with the one side being laminated in this metal film, described metal mask sheet is formed with described patterns of openings at metal film.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013186255A JP2015052985A (en) | 2013-09-09 | 2013-09-09 | Method for manufacturing touch panel |
| JP2013-186255 | 2013-09-09 | ||
| PCT/JP2014/073738 WO2015034094A1 (en) | 2013-09-09 | 2014-09-09 | Method for manufacturing touch panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105518594A true CN105518594A (en) | 2016-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480049457.XA Pending CN105518594A (en) | 2013-09-09 | 2014-09-09 | Method for manufacturing touch panel |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2015052985A (en) |
| KR (1) | KR20160053909A (en) |
| CN (1) | CN105518594A (en) |
| TW (1) | TW201523378A (en) |
| WO (1) | WO2015034094A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109445632A (en) * | 2018-10-24 | 2019-03-08 | 信利光电股份有限公司 | A kind of metal grill touch screen manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104750347A (en) * | 2015-04-17 | 2015-07-01 | 合肥京东方光电科技有限公司 | Capacitive touch screen, production technology for same and touch display panel |
| JP2017008342A (en) * | 2015-06-17 | 2017-01-12 | 株式会社ブイ・テクノロジー | Film deposition mask and production method of film deposition mask |
| KR102376502B1 (en) | 2017-04-19 | 2022-03-22 | 삼성디스플레이 주식회사 | Touch sensor, display device having the same, and manufacturing method of touch sensor |
| CN111984138A (en) * | 2019-05-22 | 2020-11-24 | 英属维尔京群岛商天材创新材料科技股份有限公司 | Touch panel and manufacturing method thereof |
| CN113093944A (en) * | 2021-04-19 | 2021-07-09 | 江西展耀微电子有限公司 | Circuit, preparation method thereof and touch screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012079169A (en) * | 2010-10-04 | 2012-04-19 | Shin Etsu Polymer Co Ltd | Detection substrate and manufacturing method for the same |
| JP5979473B2 (en) * | 2012-01-24 | 2016-08-24 | 大日本印刷株式会社 | Conductive pattern substrate, touch panel sensor, method for manufacturing conductive pattern substrate, and method for manufacturing touch panel sensor |
-
2013
- 2013-09-09 JP JP2013186255A patent/JP2015052985A/en active Pending
-
2014
- 2014-09-09 CN CN201480049457.XA patent/CN105518594A/en active Pending
- 2014-09-09 WO PCT/JP2014/073738 patent/WO2015034094A1/en active Application Filing
- 2014-09-09 TW TW103130983A patent/TW201523378A/en unknown
- 2014-09-09 KR KR1020167002006A patent/KR20160053909A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109445632A (en) * | 2018-10-24 | 2019-03-08 | 信利光电股份有限公司 | A kind of metal grill touch screen manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015052985A (en) | 2015-03-19 |
| WO2015034094A1 (en) | 2015-03-12 |
| TW201523378A (en) | 2015-06-16 |
| KR20160053909A (en) | 2016-05-13 |
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