CN105517424A - Anti-failure heat pipe temperature equilibrium and heat dissipation device and method for substrate of bidirectional compensation electronic device - Google Patents
Anti-failure heat pipe temperature equilibrium and heat dissipation device and method for substrate of bidirectional compensation electronic device Download PDFInfo
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- CN105517424A CN105517424A CN201610059356.1A CN201610059356A CN105517424A CN 105517424 A CN105517424 A CN 105517424A CN 201610059356 A CN201610059356 A CN 201610059356A CN 105517424 A CN105517424 A CN 105517424A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Abstract
The invention discloses an anti-failure heat pipe temperature equilibrium and heat dissipation device and method for a substrate of a bidirectional compensation electronic device. The anti-failure heat pipe temperature equilibrium and heat dissipation device comprises condensation section heat dissipation fins, a heat dissipation substrate entity, a first heat pipe set and a second heat pipe set. According to the anti-failure heat pipe temperature equilibrium and heat dissipation device and method, surface heat sources which are distributed uniformly or non-uniformly can be loaded by an upper heat dissipation surface arrangement area and a lower heat dissipation surface arrangement area of the heat dissipation substrate, the heat pipe sets of bidirectional compensation structures are utilized, heat dissipation failure can be prevented under the variable working condition that different included angles are formed between nonuniform heat flow and the substrate as well as between the nonuniform heat flow and gravity, and temperature equilibrium control over the whole heat dissipation substrate is achieved; a condensation section is connected with the heat dissipation fins, heat can be dissipated through heat convection, overtemperature is prevented, and normal work of the electronic device is guaranteed.
Description
Technical field
The present invention relates to a kind of two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device, belong to Cooling Technology of Electronic Device field under specific condition.
Background technology
The volume of the high frequency of electronic device, high speed and integrated circuit is more and more less, the electronic component caloric value of unit volume is sharply increased, and the rate of breakdown of electronic device is that exponentially relation increases with the raising of working temperature, electronic device runs to make mistakes and 55% all to cause due to overheated, for ensureing job stability and increasing the service life, the maximum temperature of chip must not more than 85 DEG C.
There is various features in current dissipation from electronic devices, it lacks enough heat-dissipating spaces near heating sources; Thermal source skewness, needs effectively to dispel the heat from multiple thermal source; For preventing the infringement to electronic device such as dust, corrosive gas, rainwater in external environment, need dispel the heat in airtight space; Want cube little and quality is light.
In addition, all be in a suitable temperature range for keeping the different electronic device of heating power, sometimes need to adopt different temperature control measures, the thermal conduction characteristic utilizing heat pipe excellent effectively can keep the uniform temperature of electronic device, improves this system level and reliability to simplify thermal control system.
The heat radiation of electronic device under variable working condition condition is one of factor of current constraint information, electronics and aeronautical and space technology development.Traditional single heat pipe and flat-plate heat pipe structure can not adapt to the heat radiation under variable working condition condition well, need to ensure that electronic device normally runs not overtemperature by other rational heat dissipation.
Summary of the invention
The present invention seeks to ensure that electronic device normally works under normal running (operation) conditions, the problems such as inefficacys cause substrate temperature to distribute obviously inequality to prevent heat pipe in variable working condition conditional electronic device substrate from occurring, local temperature is too high and jeopardize electronic device and normally work.
For achieving the above object, the present invention is by the following technical solutions:
A kind of two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device comprises condensation segment radiating fin, heat-radiating substrate entity, heat pipe heat, No. two heat pipe heat; In a heat pipe heat, No. two heat pipe heat partial insertion heat-radiating substrate entities, a described heat pipe heat, No. two heat pipe heat include condensation segment, adiabatic section and evaporation section, wherein evaporation section is insert the part in heat-radiating substrate entity, adiabatic section is provided with heat insulating coating, condensation segment radiating fin is welded on condensation segment, the side surface of heat-radiating substrate entity carries out insulation, heat-radiating substrate lower surface and upper surface loading end thermal source, and plane heat source is attached to heat-radiating substrate surface thermal source and arranges district.
Heat-radiating substrate adopts the metal material that aluminium alloy isodensity is less, the shape of substrate positive and negative can be the centrosymmetric structures such as rectangle, regular hexagon, octagon, the two sided perforate that substrate is relative, the perforate degree of depth can according to insert heat pipe evaporator section need select, sheet material to adopt at 20 DEG C conductive coefficient at the material of more than 150W/ (m*K).
A described heat pipe heat, No. two heat pipe heat are in a center of symmetry about heat-radiating substrate entity center of gravity, the fill gaps heat-conducting glue of heat pipe heat, No. two heat pipe heat and a heat-radiating substrate entity.In a described heat pipe heat, No. two heat pipe heat, working medium is acetone, ethanol or heptane, and working range is at 0 DEG C ~ 150 DEG C, and filling amount 5% ~ 15%, is full of liquid-sucking core.
In a described heat pipe heat or No. two heat pipe heat, heat pipe quantity is one or more.Described heat-radiating substrate entity can offer aperture, fillet, groove.
Uniform or non-uniform plane heat source, as the layout area of plane heat source, can be arranged in described heat-radiating substrate tow sides region.Heat-radiating substrate side and the both sides of stretching out are adiabatic section, are condensation segment more at a distance, for improving convection transfer rate, adopt fin extended surface.
Evaporation section utilizes highly heat-conductive material and heat-radiating substrate internal face to fit tightly, to reduce contact heat resistance.Heat pipe need be selected to be had higher capillary attraction and compared with the liquid sucting core structure of low flow resistance or composite construction, specifically preferentially can choose according to heat load and variable working condition situation.The heat that plane heat source puts on heat-radiating substrate is passed to condensation segment by heat pipe to both sides, and condensation segment adopts heat convection mode to take away heat, tube wall is arranged a plurality of expansion fin surface.Consider that start-up course prevents condensation segment liquid from solidifying, heat-pipe working medium selects acetone, ethanol, heptane, and working range is at 0 DEG C ~ 150 DEG C, and the liquid compatible with heat resistant material, hydraulic fluid is full of liquid-sucking core.
By the enforcement of technique scheme, the present invention is compared to single heat pipe and flat-plate heat pipe technology, because employing the heat pipe combination of two-way complementation, decrease the thermal conduction resistance of heat-radiating substrate, under making specific condition, the conductive coefficient of whole heat-radiating substrate improves a lot, the temperature field trend making heat-radiating substrate evenly, ensure that the even temperature effect of heat-radiating substrate, prevents the situation of local overheating.Utilize the heat pipe combination of two-way complementation, make variable working condition condition as heat-radiating substrate plane and horizontal sextant angle change time, heat-sinking capability is unlikely to completely lose, even if one end is against gravity, still has one end to be along gravitational conditions, improves the reliability of substrate heat radiation.Do not use the structure such as loop circuit heat pipe and reservoir, it is relatively convenient to process, and cost is low.
Accompanying drawing explanation
Fig. 1 is the structural representation of two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device;
Fig. 2 is the schematic side view of dissipation from electronic devices substrate;
Fig. 3 is the vertical view that dissipation from electronic devices real estate thermal source arranges district;
In figure: condensation segment radiating fin 1, condensation segment 2, adiabatic section 3, the adiabatic side 4 of heat-radiating substrate, heat-radiating substrate entity 5, evaporation section 6, heat pipe heat 7, heat-radiating substrate lower surface 8, heat-radiating substrate upper surface 9, No. two heat pipe heat 10, heat-radiating substrate surface thermal source arrange district 11.
Embodiment
As shown in Figure 1, 2, 3, two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device comprises condensation segment radiating fin 1, heat-radiating substrate entity 5, heat pipe heat 7, No. two heat pipe heat 10; In a heat pipe heat 7, No. two heat pipe heat 10 partial insertion heat-radiating substrate entities 5, a described heat pipe heat 7, No. two heat pipe heat 10 include condensation segment 2, adiabatic section 3 and evaporation section 6, wherein evaporation section 6 is insert the part in heat-radiating substrate entity 5, adiabatic section 3 is provided with heat insulating coating, condensation segment radiating fin 1 is welded on condensation segment 2, the side surface 4 of heat-radiating substrate entity 5 carries out insulation, heat-radiating substrate lower surface 8 and upper surface 9 loading end thermal source, plane heat source is attached to heat-radiating substrate surface thermal source and arranges district 11.
Heat-radiating substrate lower surface 8 and upper surface 9 can loading end thermals source, plane heat source can utilize the uniform or non-heat-radiating substrate surface thermal source that is distributed on of the methods such as paster to arrange district 11, for reducing contact heat resistance during laminating, laminating should be tried one's best closely, and the material that heat-conducting silicone grease etc. can be utilized to have high thermal conductivity connects or fills.Heat-radiating substrate entity 5 agent structure should be Central Symmetry, and positive and negative is the structure such as rectangle, regular hexagon, allows the existence of the process structures such as aperture, fillet, groove, but can not affect main body.Sheet material should adopt the metal material with better conductive coefficient, and density is relatively low simultaneously, with alleviator weight.A heat pipe heat 7 of two or two groups band liquid-sucking cores and No. two heat pipe heat 10 are arranged to Central Symmetry and insert in heat-radiating substrate 5, ensure heat pipe evaporator section outer surface and heat-radiating substrate inner surface good contact, interference fit can be adopted, fill highly heat-conductive material or integral processing method.The liquid sucting core structure that a heat pipe heat 7 and No. two heat pipe heat 10 are selected can adopt plough groove type liquid-sucking core, sintering metal powder formula liquid-sucking core, screen type liquid-sucking core, fiber type liquid-sucking core or arterial highway liquid-sucking core, preferentially chooses according to heat load and variable working condition situation.Heat pipe selects metal material as copper, consider that compatibility and the start-up course of metal material prevent condensation segment liquid from solidifying, heat-pipe working medium selects the working ranges such as acetone, ethanol, heptane at 0 DEG C ~ 150 DEG C, the fluid good with tube material compatibility, filling amount 5% ~ 15%, guarantees to be full of liquid-sucking core.Heat-radiating substrate side surface 4 should have heat insulating coating etc. to carry out insulation, prevents the heat of heat-radiating substrate from distributing to the space that should not transmit.Insulation is also carried out in adiabatic section 3, heat is concentrated and transmits to condensation segment.Condensation segment 2 outside wall surface is provided with a plurality of radiating fin 1, and the radiating fin 1 on each heat pipe is evenly distributed on tube outer wall face, for making radiating fin 1 contact excellent with condensation segment 2, can adopt the method for metal solder or the method for integration processing.Condensation segment 2 is positioned among heat-dissipating space and dispels the heat.
The following describes the specific works process of the two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device that can be used for variable working condition: electronic device plane heat source is arranged in heat-radiating substrate surface thermal source and arranges district 11, pass to heat-radiating substrate entity 5 by heat conducting mode, the heat in heat-radiating substrate entity 5 diffuses to other regions in the evaporation section 6 of a heat pipe heat 7 and No. two heat pipe heat 10 and substrate by heat conduction.Liquid working substance evaporative phase-change on liquid-sucking core meniscus in a heat pipe heat 7 and No. two heat pipe heat 10, absorb amount of heat, condensation segment 2 is arrived by steam channel, steam condensation heat release, condensation segment wall and fin 1 are by Convective heat tranfer cooling, complete to function of environment heat emission, liquid is got back to evaporation section 6 by capillary force and possible gravity booster action and is worked on.Because latent heat of phase change is huge compared with sensible heat, the thermal resistance of a heat pipe heat 7 and No. two heat pipe heat 10 is relatively low, and conductive coefficient is therefore very high.The mean coefficient of heat conductivity of heat-radiating substrate entity 5 is improved, also improves the uniform temperature of heat-radiating substrate.The thermal resistance of a heat pipe heat 7 and No. two heat pipe heat 10 is very low, and heat is effectively delivered to condensation segment 2 by heat pipe, is taken away by the mode of heat convection, makes heat-radiating substrate 5 and heat-radiating substrate surface thermal source arrange district 11 not overtemperature.
Under variable working condition condition, heat-radiating substrate surface thermal source arranges that in district 11, hot-fluid difference can be very large, but two of two-way complementation heat pipes cover most regions of heat-radiating substrate 5, lower thermal resistance guides the flow direction of heat effectively, make the hot-fluid in substrate trend towards heat pipe evaporator section 6, and then make heat-radiating substrate 5 still keep good even temperature effect.When variable working condition be heat-radiating substrate plane carry out the rotation of all directions around center of gravity time, without the need to paying close attention to the plane being normal direction with gravitational field direction, only need to pay close attention to the plane being parallel to gravitational field direction, a heat pipe heat 7 and No. two heat pipe heat 10 of at this moment two-way complementation will present a situation about running along the inverse gravity of gravity one, the heat pipe wherein run against gravity hinders capillary force due to gravity, service behaviour declines, but another then receives the booster action of gravity, service behaviour will strengthen, and the effect that compensate for another declines.Put on heat-radiating substrate surface thermal source and arrange that the heat in district 11 is unlikely to have nowhere to go, therefore heat can not gather in heat-radiating substrate entity 5, so still can prevent electronic device overtemperature, guarantees its reliability service.
Claims (7)
1. a two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device, is characterized in that comprising condensation segment radiating fin (1), heat-radiating substrate entity (5), a heat pipe heat (7), No. two heat pipe heat (10), a heat pipe heat (7), in No. two heat pipe heat (10) partial insertion heat-radiating substrate entity (5), a described heat pipe heat (7), No. two heat pipe heat (10) include condensation segment (2), adiabatic section (3) and evaporation section (6), wherein evaporation section (6) is insert the part in heat-radiating substrate entity (5), (3) are provided with heat insulating coating in adiabatic section, condensation segment radiating fin (1) is welded on condensation segment (2), the side surface (4) of heat-radiating substrate entity (5) carries out insulation, heat-radiating substrate lower surface (8) and upper surface (9) loading end thermal source, plane heat source is attached to heat-radiating substrate surface thermal source and arranges district (11).
2. one according to claim 1 two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device, to it is characterized in that centered by described heat-radiating substrate entity (5) agent structure symmetrical, heat-radiating substrate entity (5) sheet material to adopt at 20 DEG C conductive coefficient at the material of more than 150W/ (m*K).
3. one according to claim 1 two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device, it is characterized in that a described heat pipe heat (7), No. two heat pipe heat (10) are in a center of symmetry about heat-radiating substrate entity (5) entity center of gravity, the fill gaps heat-conducting glue of heat pipe heat (7), No. two heat pipe heat (10) and heat-radiating substrate entity (5).
4. one according to claim 1 two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device, it is characterized in that a described heat pipe heat (7), No. two interior working medium of heat pipe heat (10) are acetone, ethanol or heptane, working range is at 0 DEG C ~ 150 DEG C, filling amount 5% ~ 15%, is full of liquid-sucking core.
5. one according to claim 1 two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device, is characterized in that in a described heat pipe heat (7) or No. two heat pipe heat (10), heat pipe quantity is one or more.
6. one according to claim 1 two-way complementary electronic device substrate anti-inefficacy heat pipe temperature uniforming heat radiation device, is characterized in that described heat-radiating substrate entity (5) offers aperture, fillet, groove.
7. the heat dissipating method of a device as claimed in claim 1, it is characterized in that: electronic device plane heat source is arranged in heat-radiating substrate surface thermal source and arranges in district (11), heat passes to heat-radiating substrate entity (5) by heat conducting mode, and the heat in heat-radiating substrate entity (5) diffuses to other region in the evaporation section 6 of a heat pipe heat (7) and No. two heat pipe heat (10) and substrate by heat conduction;
A heat pipe heat (7) and No. two interior liquid working substances of heat pipe heat (10) evaporative phase-change on liquid-sucking core meniscus, absorb heat, condensation segment (2) is arrived by steam channel, steam condensation heat release, condensation segment wall and fin (1) are by Convective heat tranfer cooling, complete to function of environment heat emission, liquid is got back to evaporation section (6) by capillary force and gravity booster action and is worked on;
When variable working condition be heat-radiating substrate plane carry out the rotation of all directions around center of gravity time, the situation that a heat pipe heat (7) of two-way complementation and No. two heat pipe heat (10) will present a heat pipe heat and run against gravity along gravity heat pipe heat, the heat pipe heat wherein run against gravity hinders capillary force due to gravity, service behaviour declines, but another heat pipe heat then receives the booster action of gravity, service behaviour will strengthen, the effect that compensate for another heat pipe heat declines, put on heat-radiating substrate surface thermal source and arrange that the heat in district (11) can not gather in heat-radiating substrate entity (5), guarantee reliability service.
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Cited By (5)
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| CN107504847A (en) * | 2017-09-14 | 2017-12-22 | 济南大学 | A kind of heat-pipe elements of two-way heat transfer |
| CN107613731A (en) * | 2017-09-22 | 2018-01-19 | 浙江大学 | Suitable for the on-plane surface flat hot pipe radiator structure of aero-space electronic equipment |
| CN107687784A (en) * | 2017-09-25 | 2018-02-13 | 济南大学 | A kind of two-way long heat pipe of energy translation-angle |
| CN109588015A (en) * | 2018-12-21 | 2019-04-05 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of distribution heat reservoir |
| CN110131796A (en) * | 2019-05-20 | 2019-08-16 | 广东美的暖通设备有限公司 | Radiator, air conditioner and its control method, computer readable storage medium |
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|---|---|
| CN105517424B (en) | 2019-01-18 |
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