CN105506728B - The device of precipitating metal ion from electrochemical polish liquid - Google Patents
The device of precipitating metal ion from electrochemical polish liquid Download PDFInfo
- Publication number
- CN105506728B CN105506728B CN201410512977.1A CN201410512977A CN105506728B CN 105506728 B CN105506728 B CN 105506728B CN 201410512977 A CN201410512977 A CN 201410512977A CN 105506728 B CN105506728 B CN 105506728B
- Authority
- CN
- China
- Prior art keywords
- filter bag
- electrolytic cell
- solution
- liquid
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
The present invention relates to the metal ion recovery systems in electrochemical polish field more particularly to polishing fluid.The device of the invention discloses a kind of from electrochemical polish liquid precipitating metal ion, including liquid bath and power supply, wherein the liquid bath is divided into run-off and electrolytic cell, the run-off is connected with the electrolytic cell by dredging pipeline, therebetween it is additionally provided with circulating pump, circulates the solution in liquid bath between run-off and electrolytic cell；The anode plate and cathode plate that insertion is connected with DC power supply in electrolytic cell, anode plate and cathode plate are respectively connected to the anode and cathode of DC power supply, the evolution reaction of solid matter occur after DC power supply power supply at cathode plate；Recycling filter bag is provided in electrolytic cell, which allows ion contained in solution and solution to pass freely through, and stops passing through for the solid matter, and solid matter is filtered and is detained in recycling filter bag.It is more uniform, abundant that a whole set of recyclable device can be such that cell reaction carries out, and the problem of well solved metallic particles foul solution, has progressive effect outstanding.
Description
Technical field
The present invention relates to manufacturing industry recycling and recycle in field more particularly to semiconductor electrochemistry polishing field from electricity
The device of precipitating metal ion in chemical polishing solution.
Background technique
Low-carbon environment-friendly, repeats the hot spot for recycling and recycling be at present and high-level technology is pursued.As 21 century
One of highest innovation industry of wisdom integrated level, the practitioner in semicon industry also pays unremitting effort thus.
It is polished specific to semiconductor electrochemistry, which will be mixed with the polishing fluid pair of other compositions using phosphoric acid etc.
The metal layer of semiconductor wafer surface is polished, and process needs are beaten what polishing fluid continued in wafer surface by pumping, and is passed through
Polishing fluid contacts energization electrolysis with metal surface, and usually copper, electrobrightening go out flat surface.And the polishing after being reacted with copper
There will necessarily be a large amount of copper ion in liquid, if such solution is recycled without processing, not only result in tight
The pollution of weight, it is economically also uneconomical.
Recycling to metal ion, more traditional way are to make metal ion obtain electronics in cathode using electrolysis principle to turn
Become metal simple-substance precipitation.As shown in fig. 1, device used in this method includes the liquid bath 101 for being contained with solution 105, directly
Galvanic electricity source 104 and the anode plate 102 and cathode plate 103 for being separately connected the positive and negative the two poles of the earth of DC power supply 104.Although this method
It is feasible, but technical staff often consider in operation it is very not thorough, have ignored it is many it is possible influence subsequent technique yields because
Element.For example, due to solution concentration and reflection rate, will cause the local distribution of solution concentration not in electrolytic process
Uniformly, the concentration of metal ions consumption near cathode plate 103 is too fast, concentration decline, and the gold of 102 near zone of anode plate
Belong to ion and not necessarily add to cathode zone in time, causes electrolysis incomplete.
For another example, metal simple-substance can have a large amount of metal simple-substances in the solution around cathode surface and cathode after being precipitated
Material grains, constitute the particulate matter 106 and deposit 107 of metal simple-substance.Although these particulate matters 106 and deposit 107
It is difficult to be discovered by naked eyes, but when reaction terminates to take out electrode, can spread or be trapped in solution 105, pollute electrolyte.
It is especially fatal for this point semicon industry high to processing request.Because if solution 105 is polishing fluid, passing through
After recovery process processing, polishing fluid, which would generally reuse, to continue to send back to polishing machine platform and goes to grind other chips, and contains these
Metallic copper can be brought into crystal column surface, will cause chip in the future by the unpurified polishing fluid of copper simple substance particulate matter and deposit
The improper short circuit of regional area, lead to scrapping for chip.
Above-mentioned two problems directly influence the process yields of electrochemical polish.
Summary of the invention
Applicant of the present invention is energetically explored and has been attempted in view of the above technical problems, is finally given feasible
A kind of technical solution, the device of the precipitating metal ion from electrochemical polish liquid of successful design, utilizes circulating pump and liquid level difference
Solves the equilibrium problem of ion concentration, and fully considered copper simple substance impurity thing filters out mechanism, to significantly improve
The feasibility and superiority of electrochemical polishing process.
In order to achieve the above object, technical solution of the present invention can be declared publicly are as follows:
A kind of device of the precipitating metal ion from electrochemical polish liquid, including liquid bath and DC power supply, the liquid bath point
For run-off and electrolytic cell, the run-off is connected with electrolytic cell by unclog the pipe, the run-off and the electrolytic cell
Between be provided with circulating pump, it is dynamic which pumps the solution circulation flow in the liquid bath；In the electrolytic cell insertion with it is described
The anode plate and cathode plate that DC power supply is connected, the anode plate and the cathode plate are respectively connected to the DC power supply
The evolution reaction of solid matter occurs at the cathode plate after the DC power supply power supply for anode and cathode；The electrolytic cell
It is inside provided with recycling filter bag, the recycling filter bag allows ion contained in the solution and solution to pass freely through, and stops institute
Passing through for solid matter is stated, the solid matter is filtered and is detained in the recycling filter bag.
Further, anode plate and cathode plate described in the recycling filter bag mask, or only cathode plate described in mask is at least
Partial outer face.
Preferably, there is support rack, the recycling filter bag is strutted by the support rack in the recycling filter bag.
Further, the solid matter includes the particulate matter for the metal simple-substance being suspended in solution and is attached to described
The deposit of the metal simple-substance of cathode plate surface.
Further, it is provided with beam mouthpart at the aperture position of the recycling filter bag, the beam mouthpart and the recycling are filtered
Bag is linked together, and the beam mouthpart can be opened or be tightened to seif-citing rate, and the beam mouthpart can seal the opening in tightening
It closes and fixes the position limitation of the recycling filter bag.
Preferably, the beam mouthpart is smooth and corrosion resistant elastic clip.
Further, recycling filter bag opening upwards when in use, with allow anode from the DC power supply and
The conducting wire of cathode is connected to the anode plate and the cathode plate by the opening of the recycling filter bag respectively, wherein the anode
Plate and the cathode plate and the liquid bath are separable.
Further, the cathode plate is fixed on the liquid bath, and the cathode of the DC power supply is outside the liquid bath
Portion is electrically connected to the cathode plate after the cell wall of the liquid bath.
Preferably, the recycling filter bag is made of acid resisting material.
Further, it is formed with liquid level difference between the run-off and the electrolytic cell, wherein the circulating pump is by dredging
It threads a pipe and is pumped into solution in the higher pond of liquid level by the lower pond of liquid level, and the solution is overflow by the higher pond of liquid level
Out into the lower pond of liquid level, solution in the liquid bath reciprocation cycle between the run-off and the electrolytic cell.
The device of precipitating metal ion, can not only make the gold in solution in slave electrochemical polish liquid proposed by the invention
Belong to ion fully to be restored, also further ensure that the degree of purity of solution, to commercial recovery especially semi-conductor industry
In metal ion recycling it is of great advantage.
Detailed description of the invention
Fig. 1 is to generate the deposit of foul solution and the schematic diagram of particulate matter when recycling metal ion using the prior art；
Fig. 2 is the structural schematic diagram of recyclable device first embodiment of the present invention；
Fig. 3 is the structural schematic diagram of recyclable device second embodiment of the present invention；
Fig. 4 is the structural schematic diagram of recyclable device 3rd embodiment of the present invention；
Fig. 5 is the structural schematic diagram of recyclable device fourth embodiment of the present invention.
Specific embodiment
Technical solution mentioned by the present invention is put up with below and makes specific exemplary demonstration, so that reader knows and contains in week
Profound meaning in the invention is purely:
Existing recyclable device and system shown in attached drawing 1 are compared, it can be found that the first embodiment of the present invention (Fig. 2 institute
Show) totally different therewith: recyclable device shown in the embodiment includes liquid bath 201 and DC power supply 210, and wherein liquid bath 201 is again into one
Step includes be close together, one low one high 203 two ponds of run-off 202 and electrolytic cell.From embodiment shown in Fig. 2
As can be seen that electrolytic cell 203 is higher than run-off 202.A circulating pump is provided between electrolytic cell 203 and run-off 202
209, and penetrated through by a unclog the pipe 208, between two ponds fluid exchange can be carried out by this unclog the pipe 208.
Since the present inventor mainly contaminates in semicon industry, so tending in a particular embodiment with electrochemical polish work
Skill citing.When being recycled using the recyclable device to the solution after electrochemical polish, the electrolytic cell 203 of the device is usual
Solution namely polishing fluid 205 to be processed can be filled；Meanwhile a certain amount of polishing fluid will be also filled in run-off 202
205, but the liquid level of polishing fluid is lower than the height of electrolytic cell 203 in run-off 202.Since the height of electrolytic cell 203 is wanted
Higher than run-off 202, after polishing fluid 205 has filled electrolytic cell 203, if continuing there is polishing fluid 205 to pour in, due to
The effect of gravitional force, the polishing fluid 205 in electrolytic cell 203 can be overflowed naturally and be flowed into run-off 202.It is same with this
When, due to the lasting pumping of circulating pump 209, the polishing fluid 205 in the lower run-off 202 of liquid level can also pass through unclog the pipe
208 are continuously pumped into electrolytic cell 203, persistently follow so that the polishing fluid 205 in entire liquid bath 201 be made to be in one
The dynamic balance state of ring, is adequately handled by electrolysis.
On the other hand, in electrochemical polish, it is necessary to metal ion (such as the Cu in polishing fluid 2052+) returned
It receives, and what removal process utilized is electrolysis principle, is connected so needing to be inserted into two in electrolytic cell 203 with DC power supply 210
Pole plate, wherein the pole plate being connected with the anode of DC power supply 210 be anode plate 206, it is corresponding, connect DC power supply
The pole plate of 210 cathode is cathode plate 207.After the connection of DC power supply 210, sense of current is by just to negative namely electronics by bearing
Pole is moved to positive extreme direction, and a large amount of electronics will collect at cathode plate 207.And the Cu in polishing fluid2+Oxidisability is stronger, can
Capture is located at the electronics on cathode plate 207, and the precipitation of Cu simple substance is formed on cathode plate 207 by reacting.The reaction can use side
Formula indicates are as follows: Cu2++ 2e-==Cu.If without the design of run-off 202 and circulating pump 209, due in polishing fluid 205
Cu around cathode plate 2072+It is constantly reduced and is precipitated, and be located at the Cu in 205 other regions of polishing fluid2+Diffusion
Behavior be it is random, not necessarily fill up at the first time, so proceeding to after a certain period of time in electrolysis, polishing fluid
Cu in 2052+Concentration will appear low, the anode plate 206 high non-uniform phenomenon, and cathode plate 207 nearby nearby of cathode plate 207
The Cu of surrounding2+Also due to concentration is too low and no longer reacts, cause the recycling of polishing fluid 205 incomplete.And the present invention is logical
The design for crossing run-off 202 and circulating pump 209 makes polishing fluid 205 be in a kind of dynamic of reciprocation cycle always in liquid bath 201
Cu among balance, in polishing fluid 2052+Can free loopy moving, it can be ensured that polishing fluid 205 was recycled entirely
Concentration is kept uniformly in journey, to substantially completely recycle the Cu in polishing fluid 2052+。
In background technique and attached drawing 1, in by the agency of electrolytic process, the metal simple-substance of generation, in this embodiment
Specially Cu can be partially suspended in polishing fluid 205, especially in the peripheral region of cathode plate 207 with small particle shape.
In addition, some Cu simple substance can be attached at 207 surface of cathode plate, under static condition, these Cu in the form of deposit
The deposit of simple substance is not fallen out usually in polishing fluid 205；But after removal process, need to take out electrode, at this moment
Due to the effect of external force, it is more likely that fall the deposit of part Cu simple substance and polluted into polishing fluid 205 to it.No matter on
The Cu simple substance stated is particulate matter or deposit, also no matter its be it is macroscopic or sightless, if these impurity components
It is also present in after recovery processing in polishing fluid 205, and removes wafer polishing again with such polishing fluid 205, these impurity
Copper is just likely to be attached at crystal column surface, causes the improper conducting in the partial region of wafer and short circuit when in use, causes
Wafer loss.It can be seen that indiffusion recycle the importance of Cu.
In order to solve this problem, the present invention has several moneys to recycle filter bag specifically for the recyclable device design in embodiment.
As in this first embodiment, as shown in Fig. 2, entire electrolytic cell 203 is entangled by an open recycling filter bag 204, that is, return
Filter bag 204 is received to be located on the polishing fluid 205 in anode plate 206, cathode plate 207 and electrolytic cell 203.The recycling filter bag
204 have an opening 211, thus cathode plate 207 and anode plate 206 are inserted in.Recycling filter bag 204 has selection filterability, energy
Polishing fluid 205 and the various ions being dissolved in polishing fluid 205 is enough allowed freely to pass through, but the Cu that can generate reaction is mono-
Matter is blocked within recycling filter bag 204, and so that it will not diffuse to the region other than recycling filter bag 204.Because reacting the Cu generated
Simple substance especially its particulate matter, although meeting very little, or even naked eyes can not be seen, it is still to exist with the physical form of solid phase
In solution, the radius of particle is greater than the hole of recycling filter bag 204, so cannot pass through.
When using filter bag 204 is recycled, cathode plate 207 and anode plate 206 need to be only put into recycling filter bag 204, then will return
Filter bag 204 is received to be put into electrolytic cell 203 and pour into polishing fluid 205.The opening 211 of the recycling filter bag 204 upwards, is taken out also very
It is convenient, it proposes recycling filter bag 204, the Cu simple substance being recovered in two pole plates and bag can be taken away together.Moreover, opening
211 it is upward when, do not need to stay special through-hole on recycling filter bag 204 so that conducting wire passes through, conducting wire can be straight via opening 211
It connects and is connected with two electrodes.
Fig. 3 is the structural schematic diagram of second embodiment of the invention.Recyclable device in the embodiment equally includes liquid bath
301 and DC power supply 310, wherein liquid bath 301 is divided to for one high and one low 303 two ponds of run-off 302 and electrolytic cell, electrolytic cell
303 are preferably close together with run-off 302, and solution is facilitated to be flowed into the lower pond of liquid level by the higher pond of liquid level.
Meanwhile it is different from first embodiment institute, the height of run-off 302 is higher than electrolytic cell 303 in the present embodiment, and in run-off
A spilling slot is provided on 302, the height of the spilling slot is also above electrolytic cell 303.In this way, when the solution liquid in run-off 302
Position reach or more than overflow slot height after, will be overflowed and be flowed into electrolytic cell 303 by spilling slot, and do not have to until liquid level it is complete
Electrolytic cell 303 is just flowed into after covering run-off 302 entirely.Correspondingly, since the solution in liquid bath 301 is by the higher overflow of liquid level
Pond 302 flows to the lower electrolytic cell 303 of liquid level, so the pumping direction of circulating pump 309 has been changed to by the lower electricity of liquid level at this time
Pond 303 is solved to pump to the higher run-off 302 of liquid level.
Specifically, solution used in second embodiment is polishing fluid 305.Since unclog the pipe 308 has been connected to liquid bath
301 run-off 302 and electrolytic cell 303, and circulating pump 309 is installed between, therefore the overflow of run-off 302 is made
With the lasting pumping for adding circulating pump 309, it ensure that the polishing fluid 305 in liquid bath 301 is continual in run-off 302 and electricity
Solution is recycled and is sprung up between pond 303, so as to guarantee the concentration everywhere of polishing fluid 305 in liquid bath 301 and be adequately electrolysed
Reaction.
In addition, for the considerations of saving material, recycling filter bag 304 in a second embodiment design it is smaller, and only
The only at least partly outer surface of mask cathode plate 307, but be equally reached filtering and recycle the purpose of Cu simple substance.This is mainly
Because what Cu simple substance was mainly generated by the electrolysis of cathode plate 307, and Cu simple substance will not be generated around anode plate 306, as long as therefore
In the whereabouts for controlling Cu simple substance as the region near source cathode plate 307, the solution being just enough to ensure that in entire liquid bath 301
It will not be contaminated.
Additionally, it is contemplated that the recycling filter bag 204 in first embodiment also needs to be scraped manually by staff after taking-up
Cathode plate 207 is taken, it is both inconvenient or dangerous in this way, because the polishing fluid 205 of complex chemical composition can be speckled on pole plate.Therefore
It, can be with one beam mouthpart of additional designs at the opening 311 of recycling filter bag 304 in a second embodiment.The beam mouthpart is preferred
It with certain elasticity, is tightened under normal conditions by the tension of itself, for closing the opening 311 of recycling filter bag 304.It is covering
After entering cathode plate 307, beam mouthpart is capable of the opening of seif-citing rate, keeps the size of opening 311 suitable with cathode plate 307, and by tension
Effect is fastened on cathode plate 307, and thus also limitation secures the entire scope of activities for recycling filter bag 304, will not be floated with liquid stream
It moves.It is highly preferred that the beam mouthpart can be a kind of elastic clip 312, it is linked together with recycling filter bag 304, shape regards cathode
Depending on the shape of plate 307.In addition, recycling filter bag 304 can also design for connect the conducting wire of DC power supply 310 pass through it is logical
Hole does not indicate in figure.
Further, which can be made by metal with a certain toughness, and should be put down enough
It is sliding, so that the metal simple-substance for being attached to 307 surface of cathode plate can be scraped along cathode plate 307 when removing recycling filter bag 304
Deposit, and fall and taken away in bag.Since polishing fluid 305 belongs to industrial chemical medicament, comparison of ingredients is complicated, so bullet
Property intermediate plate 312 should be made of corrosion-resistant material.
Due to using the design of beam mouthpart, which can cover from top to down in cathode plate when in use
On 307, and opening 311 is tightened with beam mouthpart, then pouring into polishing fluid 305, the opening 311 for recycling filter bag 304 is downward.This
Sample, which is done, to be advantageous in that, if two pole plates can be fixed in electrolytic cell 303 by the recyclable device using frequently, is not had to every
Electrode is all put into or taken out when secondary use and scrapes off deposit.
In the present invention, the quality for recycling filter bag can be using acid resistance chemistry fabric, such as can be polypropylene fabric
Or chemical fabric, belonging to woven dacron or Polypropylene again in chemical fabric is more suitable for, can be using plain weave is knitted, twill weave or bilayer are knitted
The methods of be formed by weaving.Recycling filter bag can guarantee that the ion in solution and solution freely passes through recycling filter bag, and stop simultaneously
Filter out the metal simple-substance in solution.
Fig. 4 gives the structural schematic diagram of third embodiment of the invention.Its liquid bath 401, circulating pump 409 and DC power supply
410 design scheme is similar with first embodiment, is divided liquid bath 401 for run-off 402 and electrolytic cell 403, electricity
Anode plate 406 and cathode plate 407 are inserted in solution pond 403, two ponds are connected to by a unclog the pipe 408, and run-off 402
Height be lower than electrolytic cell 403.Correspondingly, after polishing fluid 405 fills electrolytic cell 403, it can be spilled over to run-off naturally
402, in addition circulating pump 409 maintains in liquid bath 401 constantly by the polishing pump in run-off 402 to electrolytic cell 403
The dynamic equilibrium of polishing fluid 405 and circulation is sprung up.
And recycling 404 overall structure of filter bag used in 3rd embodiment is similar in second embodiment, has
Selective penetrated property allows liquid by that can be trapped in solid matter in recycling filter bag 404.Similarly, in the recycling filter bag
There are an openings 411 for 404 one end, and are open 411 also downwards, and thus cathode plate 407 is open 411 is inserted in.Meanwhile it being open
Beam mouthpart, more specifically an elastic clip 412 are provided at 411 position, for fixed and closing recycling filter bag
404；In addition, the metal deposit for being attached to 407 surface of cathode plate can also be scraped when taking out and recycling filter bag 404.
Unlike the recycling filter bag 304 in second embodiment, a supporting network is additionally provided in the recycling filter bag 404
Frame 413 more specifically can be a titanium basket, which is a netted support frame, preferably by Titanium system
It forms, the invention is not limited thereto certainly, can strut recycling filter bag 404, make recycling filter bag 404 that will not be attached to cathode plate
407 surfaces influence the progress of cell reaction.And the reason of selecting titanium, is that the chemical property of titanium is more stable, it usually will not be with
Other chemical agents react, durable not to be afraid of corrosion.In addition, the height of titanium basket 413 should not be beyond elastic clip 412
Position, namely the position of opening 411, otherwise recycling filter bag 404 can not close.
Fig. 5 gives the schematic diagram of fourth embodiment.Except similarly, having liquid bath 501 and straight as other embodiments
Galvanic electricity source 510, liquid bath 501 divide for run-off 502 and electrolytic cell 503, are marked with polishing fluid 505 in two ponds and by circulating pump
509 continue pump cycle by unclog the pipe 508.Wherein, anode plate 506 and cathode plate 507 are inserted in electrolytic cell 503, yin
Recycling filter bag 504 is cased on pole plate 507, the opening 511 of the recycling filter bag 504 downward, is provided with beam mouthpart at opening 511
512, beam mouthpart 512 can close sack and recycling filter bag 511 is fixed near cathode plate 507.The embodiment mainly changes
Into being, cathode plate 507 is inserted and fixed in the bottom of liquid bath 501, and the cathode of DC power supply 510 has a plug 514,
It can be inserted into liquid bath 501 from outside, and be connected to cathode plate 507.Certainly, anode plate 506 and DC power supply 510 anode is connected to
Mode is see also the method.This have the advantage that since electrode plate is fixed on liquid bath 501 and can by plug 514
Realize the circulation of electric current, which can be dedicated for the metal ion in recycling polishing fluid 505, without will every time
Electrode, which is brought, takes away, eliminates many troubles；Simultaneously as opening 511 is downwards, filter bag will can be directly recycled after recycling
504 carry away, and the beam mouthpart 512 at opening 511 can easily scrape the metal deposit on cathode plate 507；It is prior
It is that such design can also save the interference of conducting wire, otherwise not only considers the corrosion resistance of conducting wire, it is also necessary to considers for leading
The sealing problem at lead to the hole site that line passes through.
The device of the precipitating metal ion of the present invention from electrochemical polish liquid, in addition in semiconductor technology
It filters outside the copper ion in polishing fluid, can also recycle other metal ions in the solution with similarity, such as can be with
It is Ag-, it is translated into corresponding metal simple-substance.
The foregoing is merely present pre-ferred embodiments, protection scope of the present invention is not limited with above embodiments, but
All those of ordinary skill in the art revealed technical solution is done according to the present invention equivalent modification or transformation, should all be included in power
Within the protection scope recorded in sharp claim.
Claims (8)
1. a kind of device of the precipitating metal ion from electrochemical polish liquid, including liquid bath and DC power supply, which is characterized in that institute
It states liquid bath and is divided into run-off and electrolytic cell, the run-off is connected with electrolytic cell by unclog the pipe, the run-off and institute
It states and is provided with circulating pump between electrolytic cell, it is dynamic which pumps the solution circulation flow in the liquid bath；The electrolytic cell interpolation
Enter the anode plate and cathode plate being connected with the DC power supply, the anode plate and the cathode plate are respectively connected to described straight
The evolution reaction of solid matter occurs at the cathode plate after the DC power supply power supply for the anode and cathode in galvanic electricity source；Institute
It states and is provided with recycling filter bag in electrolytic cell, the recycling filter bag allows ion contained in the solution and solution to pass freely through,
And stopping passing through for the solid matter, the solid matter is filtered and is detained in the recycling filter bag, and the recycling is filtered
It is provided with beam mouthpart at the aperture position of bag, the beam mouthpart is linked together with the recycling filter bag, and the beam mouthpart can be certainly
It opens or tightens to stress, the beam mouthpart can be limited in tightening by the closure of openings and by the position of the recycling filter bag
Fixed, the beam mouthpart is smooth and corrosion resistant elastic clip.
2. the device of the precipitating metal ion according to claim 1 from electrochemical polish liquid, which is characterized in that described time
Receive anode plate and cathode plate described in filter bag mask, or the only at least partly outer surface of cathode plate described in mask.
3. the device of the precipitating metal ion according to claim 1 from electrochemical polish liquid, which is characterized in that described time
Receiving in filter bag has support rack, and the recycling filter bag is strutted by the support rack.
4. the device of the precipitating metal ion according to claim 1 from electrochemical polish liquid, which is characterized in that described solid
State substance includes the particulate matter for the metal simple-substance being suspended in solution and the metal simple-substance for being attached to the cathode plate surface
Deposit.
5. the device of the precipitating metal ion according to claim 1 from electrochemical polish liquid, which is characterized in that described time
Filter bag opening upwards when in use are received, to allow the conducting wire of anode and cathode from the DC power supply to pass through described return respectively
The opening for receiving filter bag is connected to the anode plate and the cathode plate, wherein the anode plate and the cathode plate and the liquid bath
It is separable.
6. the device of the precipitating metal ion according to claim 1 from electrochemical polish liquid, which is characterized in that the yin
Pole plate is fixed on the liquid bath, the cathode of DC power supply electricity after the cell wall that the outside of the liquid bath passes through the liquid bath
Property is connected to the cathode plate.
7. the device of the precipitating metal ion according to claim 1 from electrochemical polish liquid, which is characterized in that described time
Filter bag is received to be made of acid resisting material.
8. the device of the precipitating metal ion according to claim 1 from electrochemical polish liquid, which is characterized in that described to overflow
It is formed with liquid level difference between stream pond and the electrolytic cell, wherein the circulating pump is lower by liquid level by solution by unclog the pipe
Pond is pumped into the higher pond of liquid level, and the solution is spilled over in the lower pond of liquid level by the higher pond of liquid level, described
Solution in the liquid bath reciprocation cycle between the run-off and the electrolytic cell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410512977.1A CN105506728B (en) | 2014-09-29 | 2014-09-29 | The device of precipitating metal ion from electrochemical polish liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410512977.1A CN105506728B (en) | 2014-09-29 | 2014-09-29 | The device of precipitating metal ion from electrochemical polish liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105506728A CN105506728A (en) | 2016-04-20 |
| CN105506728B true CN105506728B (en) | 2019-10-15 |
Family
ID=55715016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410512977.1A Active CN105506728B (en) | 2014-09-29 | 2014-09-29 | The device of precipitating metal ion from electrochemical polish liquid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105506728B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109423688B (en) * | 2017-08-31 | 2022-03-22 | 深圳市水佳鑫科技有限公司 | Electrochemical treatment fluid circulation system and equipment |
| WO2021021786A1 (en) * | 2019-08-01 | 2021-02-04 | Aqua Metals Inc. | Metal recovery from lead containing electrolytes |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1415785A (en) * | 2002-10-22 | 2003-05-07 | 郴州金旺实业有限公司 | Technique for electrolyzing slurry of fluosilicic acid in bismuth mine |
| CN1637174A (en) * | 2003-12-26 | 2005-07-13 | 新光电气工业株式会社 | Electrolytic stripping method |
| CN101492186A (en) * | 2009-03-05 | 2009-07-29 | 陈飙 | Method and device for circulation and regeneration of acidic waste etching liquid |
| CN202359203U (en) * | 2011-10-31 | 2012-08-01 | 湖南万容科技股份有限公司 | Micro-etching fluid regeneration recovery system |
| CN102725086A (en) * | 2010-01-29 | 2012-10-10 | 奥图泰有限公司 | Method and arrangement for producing metal powder |
| CN202492580U (en) * | 2012-02-03 | 2012-10-17 | 昆山市洁驰环保科技发展有限公司 | Acid etching liquid recycling device of PCB (Printed Circuit Board) |
| CN103014778A (en) * | 2012-12-11 | 2013-04-03 | 北京矿冶研究总院 | Ore pulp electrolysis device |
| CN103757664A (en) * | 2013-12-13 | 2014-04-30 | 陶克（苏州）机械设备有限公司 | Electrolytic tank, etching liquid regeneration equipment using same and regeneration method |
| CN103820821A (en) * | 2014-02-28 | 2014-05-28 | 金川集团股份有限公司 | Liquid level adjusting device for nickel electrolytic tank |
| CN203653712U (en) * | 2014-01-13 | 2014-06-18 | 广东台盛环保科技有限公司 | Micro-etching liquid recycling equipment |
-
2014
- 2014-09-29 CN CN201410512977.1A patent/CN105506728B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1415785A (en) * | 2002-10-22 | 2003-05-07 | 郴州金旺实业有限公司 | Technique for electrolyzing slurry of fluosilicic acid in bismuth mine |
| CN1637174A (en) * | 2003-12-26 | 2005-07-13 | 新光电气工业株式会社 | Electrolytic stripping method |
| CN101492186A (en) * | 2009-03-05 | 2009-07-29 | 陈飙 | Method and device for circulation and regeneration of acidic waste etching liquid |
| CN102725086A (en) * | 2010-01-29 | 2012-10-10 | 奥图泰有限公司 | Method and arrangement for producing metal powder |
| CN202359203U (en) * | 2011-10-31 | 2012-08-01 | 湖南万容科技股份有限公司 | Micro-etching fluid regeneration recovery system |
| CN202492580U (en) * | 2012-02-03 | 2012-10-17 | 昆山市洁驰环保科技发展有限公司 | Acid etching liquid recycling device of PCB (Printed Circuit Board) |
| CN103014778A (en) * | 2012-12-11 | 2013-04-03 | 北京矿冶研究总院 | Ore pulp electrolysis device |
| CN103757664A (en) * | 2013-12-13 | 2014-04-30 | 陶克（苏州）机械设备有限公司 | Electrolytic tank, etching liquid regeneration equipment using same and regeneration method |
| CN203741421U (en) * | 2013-12-13 | 2014-07-30 | 陶克（苏州）机械设备有限公司 | Equipment capable of regenerating acidic etching solution |
| CN203653712U (en) * | 2014-01-13 | 2014-06-18 | 广东台盛环保科技有限公司 | Micro-etching liquid recycling equipment |
| CN103820821A (en) * | 2014-02-28 | 2014-05-28 | 金川集团股份有限公司 | Liquid level adjusting device for nickel electrolytic tank |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105506728A (en) | 2016-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104250046B (en) | A kind of nickel-contained wastewater treatment device and its processing method | |
| CN104498992B (en) | Method for separating and recovering metal compound waste materials | |
| CN102725086A (en) | Method and arrangement for producing metal powder | |
| CN104451784A (en) | Rotational flow electrolyzing device for separating and recycling metal composite waste material | |
| MX2013011323A (en) | System and process for the continuous recovery of metals. | |
| CN103334123A (en) | Copper electrolysis system and running method | |
| KR20100018900A (en) | Electrolyzer for withdrawing valuable metal which having more contact specific surface area | |
| CN105506728B (en) | The device of precipitating metal ion from electrochemical polish liquid | |
| CN202519343U (en) | System for recovering copper from waste circuit board | |
| CN108452611A (en) | A kind of purification method of the tail gas of gas containing hydrogen chloride and magnesium chloride dust | |
| CN102108531A (en) | Impurity removing method for nickel electroplating solution and impurity removing equipment thereof | |
| CN106868543A (en) | A kind of bullion content blister copper electrorefining system and method high | |
| CN205077165U (en) | Continuous purifying and removing impurity system of electrolyte | |
| CN203904040U (en) | System for recycling manganese containing wastewater | |
| CN203440460U (en) | Environmental-friendly electrolytic nickel or electrolytic cobalt continuous stable production process device | |
| CN207537590U (en) | Electroplanting device | |
| CN109574272A (en) | A kind of multistage concentration reuse technology of Treating Electroplate Wastewater Containing Nickel | |
| CN102560537A (en) | Silver recovery device for silver-containing waste liquor | |
| CN102230170A (en) | Efficient cyclic purification and phosphorization device | |
| CN109208032A (en) | A method of gallium is recycled from electrodeposition in alkaline solution containing gallium | |
| CN206768256U (en) | A kind of nickel plating apparatus | |
| CN103409771A (en) | Environment-friendly process unit and process for continuous stable production of electrolytic nickel or electrolytic cobalt | |
| CN204529999U (en) | A kind of swirl electrolysis device of Separation and Recovery metal composite waste | |
| CN208694343U (en) | A kind of filter device of magnesium air cell reaction product | |
| CN204803427U (en) | Electroplate device with primary and secondary groove |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Patentee after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. fourth 1690 Patentee before: ACM (SHANGHAI) Inc. |