CN105504830A - Single-component addition type heat conduction organic silicon rubber and preparation method thereof - Google Patents
Single-component addition type heat conduction organic silicon rubber and preparation method thereof Download PDFInfo
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- CN105504830A CN105504830A CN201511008047.3A CN201511008047A CN105504830A CN 105504830 A CN105504830 A CN 105504830A CN 201511008047 A CN201511008047 A CN 201511008047A CN 105504830 A CN105504830 A CN 105504830A
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- component addition
- thermal conductive
- silicone rubber
- addition thermal
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a single-component addition type heat conduction organic silicon rubber. The single-component addition type heat conduction organic silicon rubber comprises the following components in parts by weight: 100 parts of vinyl-terminated silicone oil, 10 to 20 parts of hydrogen-containing silicone oil, 80 to 100 parts of aluminum oxide, 80 to 100 parts of zinc oxide, 0.2 to 5 parts of coupler, 0.1 to 2 parts of inhibitor, and 0.1 to 1 parts of catalyst. The single-component addition type heat conduction organic silicon rubber has the advantages that the hardness is higher, the heat conduction coefficient is realized, and the certain flame-retardant capability is realized.
Description
Technical field
The present invention relates to a kind of organo-silicone rubber and preparation method thereof, particularly relate to a kind of single-component addition thermal conductive organo-silicone rubber and preparation method thereof.
Background technology
In recent years, in field of electronics, due to developing rapidly of integrated technology and package technique, electronic component, logical circuit is to light, thin, little future development, and thermal value also increases thereupon, thus needs the insulating material of high heat conduction, the heat that effective removal electronics produces, this is related to the work-ing life of product and the reliability of quality.The method of traditional solution electronic equipment dissipating heat, be pad between heating element and radiator one deck insulation medium as thermally conductive material, as mica, tetrafluoroethylene and beryllium oxide ceramics etc., this method has certain effect, but there is heat conductivility difference, the shortcomings such as mechanical property is low, price is high.At present, solving electronic equipment dissipating heat is solved by various forms of scatterer a bit, but great majority must be solved by thermally conductive material.
Summary of the invention
For above-mentioned the deficiencies in the prior art, the object of this invention is to provide a kind of single-component addition thermal conductive organo-silicone rubber with higher hardness and thermal conductivity and preparation method thereof.
Technical scheme of the present invention is such: a kind of single-component addition thermal conductive organo-silicone rubber, be made up of the component of following parts by weight: vinyl-terminated silicone fluid 100 parts, containing hydrogen silicone oil 10-20 part, aluminum oxide 80-100 part, zinc oxide 80-100 part, coupling agent 0.2-5 part, inhibitor 0.1-2 part and catalyzer 0.1-1 part.
Preferably, the contents of ethylene of described vinyl-terminated silicone fluid is at 0.4-2.1%, and viscosity is at 100-2000Pas.
Preferably, described containing hydrogen silicone oil be silicon hydrogen richness at 0.1-1.6%, viscosity is at 50-1500Pas.
Preferably, described aluminum oxide median size 1-3000 μm, purity is more than 98%.
Preferably, described zinc oxide median size 1-2000 μm, purity is more than 90%.
Preferably, described coupling agent is the polydimethylsiloxane containing silicon hydrogen and epoxy group(ing).
Preferably, described inhibitor is vinyl ring body, alkynol, ether compound or fumaric acid lipoid substance.
Preferably, described catalyzer is the chloroplatinic acid catalyst of platinum content at 2000-6000ppm.
A kind of its preparation method of single-component addition thermal conductive organo-silicone rubber, be included in planet dispersator and add vinyl-terminated silicone fluid, containing hydrogen silicone oil, aluminum oxide and zinc oxide, 120 DEG C are warming up to after dispersion stirs, and pass into nitrogen, keep-1 ~ 0.7MPa vacuum state, cool in encloses container after stirring 1-2h; Add coupling agent, inhibitor and catalyzer after being cooled to room temperature and pass into nitrogen, keeping-1 ~ 0.7MPa vacuum state, mixing rear decompression row bubble.
Preferably, described nitrogen passes into flow is 2-8m
3/ h.
The beneficial effect of technical scheme provided by the present invention is: single-component addition thermal conductive organo-silicone rubber prepared by the present invention has higher hardness, thermal conductivity, also has certain fire retardancy simultaneously.Single-component addition thermal conductive organo-silicone rubber of the present invention can be widely used as in cpu heat, thyristor, heat radiation between wafer and radiator element, and iron plate dispels the heat, and the heat conduction of transformer and electronic component are fixed and filled.
Embodiment
Below in conjunction with embodiment, the invention will be further described, but not as a limitation of the invention.
Embodiment 1:
Contents of ethylene 1% is added, the vinyl-terminated silicone fluid of viscosity 500pa.s 100 parts, silicon hydrogen richness 0.8% in planet dispersator, the containing hydrogen silicone oil of viscosity 100pas 10 parts, 80 parts, the aluminum oxide that median size is 2000 μm, 80 parts, median size 1500 μm of zinc oxide, dispersion stirs.Above mixture is made to rise to 120 DEG C again, and with 2-8m
3/ h flow passes into nitrogen, under maintenance vacuum state (-1 ~ 0.7MPa), is placed in encloses container to be cooled, obtains base-material after stirring 1-2h.Add in the base-material being cooled to room temperature the polydimethylsiloxane 0.3 part containing silicon hydrogen and epoxy group(ing), alkynyl hexalin 0.2 part, content 2000ppm chloroplatinic acid catalyst 0.1 part and with and with 2-8m
3/ h flow passes into nitrogen, under maintenance vacuum state (-1 ~ 0.7MPa), mixes rear decompression row and steeps.
Embodiment 2:
In the present embodiment, the parts by weight of aluminum oxide are 95 parts, and containing hydrogen silicone oil is 15 parts, and all the other are all with the description to embodiment 1.
Embodiment 3:
In the present embodiment, the polydimethylsiloxane containing silicon hydrogen and epoxy group(ing) is 0.3 part, and inhibitor fumaric acid diethyl fat, all the other are all with the description to embodiment 1.
Embodiment 4:
In the present embodiment, the parts by weight of zinc oxide are 95 parts, catalyzer be platinum content at 4000ppm chloroplatinic acid catalyst, all the other are all with the description to embodiment 1.
Embodiment 5:
In the present embodiment, the contents of ethylene of vinyl-terminated silicone fluid is 1.2%, and the silicon hydrogen content of containing hydrogen silicone oil is 1.5%, and all the other are all with the description to embodiment 1.
Embodiment 6:
In the present embodiment, inhibitor isopropyl ether, catalyzer be platinum content at 5000ppm chloroplatinic acid catalyst, all the other are all with the description to embodiment 1.
Single-component addition thermal conductive organo-silicone rubber prepared by aforesaid method, tests its surface drying time by GB/T-13477; Extrudability test (air pressure of 0.3MPA, 3mm Jiao Zui, the quality that record 15S extrudes); UL-94 standard testing flame retardant rating; 23 ± 2 DEG C and 50 ± 5% condition under sulfuration 7 days, use conductometer test thermal conductivity; Carry out tensile strength test by GB/T528-1988, result is by shown in following table:
Claims (10)
1. a single-component addition thermal conductive organo-silicone rubber, is characterized in that, is made up of the component of following parts by weight: vinyl-terminated silicone fluid 100 parts, containing hydrogen silicone oil 10-20 part, aluminum oxide 80-100 part, zinc oxide 80-100 part, coupling agent 0.2-5 part, inhibitor 0.1-2 part and catalyzer 0.1-1 part.
2. single-component addition thermal conductive organo-silicone rubber according to claim 1, is characterized in that: the contents of ethylene of described vinyl-terminated silicone fluid is at 0.4-2.1%, and viscosity is at 100-2000Pas.
3. single-component addition thermal conductive organo-silicone rubber according to claim 1, is characterized in that: described containing hydrogen silicone oil be silicon hydrogen richness at 0.1-1.6%, viscosity is at 50-1500Pas.
4. single-component addition thermal conductive organo-silicone rubber according to claim 1, is characterized in that: described aluminum oxide median size 1-3000 μm, purity is more than 98%.
5. single-component addition thermal conductive organo-silicone rubber according to claim 1, is characterized in that: described zinc oxide median size 1-2000 μm, purity is more than 90%.
6. single-component addition thermal conductive organo-silicone rubber according to claim 1, is characterized in that: described coupling agent is the polydimethylsiloxane containing silicon hydrogen and epoxy group(ing).
7. single-component addition thermal conductive organo-silicone rubber according to claim 1, is characterized in that: described inhibitor is vinyl ring body, alkynol, ether compound or fumaric acid lipoid substance.
8. single-component addition thermal conductive organo-silicone rubber according to claim 1, is characterized in that: described catalyzer is the chloroplatinic acid catalyst of platinum content at 2000-6000ppm.
9. the preparation method of a single-component addition thermal conductive organo-silicone rubber as claimed in any of claims 1 to 8, it is characterized in that, comprise the following steps: in planet dispersator, add vinyl-terminated silicone fluid, containing hydrogen silicone oil, aluminum oxide and zinc oxide, 120 DEG C are warming up to after dispersion stirs, and pass into nitrogen, keep-1 ~ 0.7MPa vacuum state, cool in encloses container after stirring 1-2h; Add coupling agent, inhibitor and catalyzer after being cooled to room temperature and pass into nitrogen, keeping-1 ~ 0.7MPa vacuum state, mixing rear decompression row bubble.
10. a preparation method for single-component addition thermal conductive organo-silicone rubber according to claim 9, is characterized in that: it is 2-8m that described nitrogen passes into flow
3/ h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511008047.3A CN105504830A (en) | 2015-12-29 | 2015-12-29 | Single-component addition type heat conduction organic silicon rubber and preparation method thereof |
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| CN201511008047.3A CN105504830A (en) | 2015-12-29 | 2015-12-29 | Single-component addition type heat conduction organic silicon rubber and preparation method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105949791A (en) * | 2016-07-14 | 2016-09-21 | 东莞市兆科电子材料科技有限公司 | Thermal-conductive silica gel sheet material and preparation method thereof |
| CN109401732A (en) * | 2018-10-31 | 2019-03-01 | 深圳联腾达科技有限公司 | Hypotonic oil heat conductive silica gel gasket and preparation method thereof |
| CN109401322A (en) * | 2018-10-19 | 2019-03-01 | 歌尔股份有限公司 | The preparation method and electronic product of silastic material |
| CN109705801A (en) * | 2018-12-30 | 2019-05-03 | 苏州桐力光电股份有限公司 | A kind of addition-type silicon rubber |
| CN109796928A (en) * | 2019-01-11 | 2019-05-24 | 北京天山新材料技术有限公司 | The application of organosilicon sealant, the device and the sealant that are sealed using the sealant |
| CN111065689A (en) * | 2017-12-01 | 2020-04-24 | 瓦克化学股份公司 | Polysiloxane composition |
| CN111186187A (en) * | 2020-01-19 | 2020-05-22 | 深圳德邦界面材料有限公司 | Polyimide-based composite heat-conducting insulating sheet and preparation method thereof |
| CN113122003A (en) * | 2019-12-31 | 2021-07-16 | 广东美的白色家电技术创新中心有限公司 | Flexible heat-conducting insulating material and preparation method and application thereof |
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| CN101942197A (en) * | 2009-07-09 | 2011-01-12 | 昆山伟翰电子有限公司 | Heat-conducting silicon rubber composite material and preparing method thereof |
| CN102942896A (en) * | 2012-11-21 | 2013-02-27 | 江苏创景科技有限公司 | Single-component addition type high adhesion organic silicon rubber |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105949791A (en) * | 2016-07-14 | 2016-09-21 | 东莞市兆科电子材料科技有限公司 | Thermal-conductive silica gel sheet material and preparation method thereof |
| CN111065689A (en) * | 2017-12-01 | 2020-04-24 | 瓦克化学股份公司 | Polysiloxane composition |
| CN111065689B (en) * | 2017-12-01 | 2022-05-31 | 瓦克化学股份公司 | Polysiloxane composition |
| CN109401322A (en) * | 2018-10-19 | 2019-03-01 | 歌尔股份有限公司 | The preparation method and electronic product of silastic material |
| CN109401732A (en) * | 2018-10-31 | 2019-03-01 | 深圳联腾达科技有限公司 | Hypotonic oil heat conductive silica gel gasket and preparation method thereof |
| CN109705801A (en) * | 2018-12-30 | 2019-05-03 | 苏州桐力光电股份有限公司 | A kind of addition-type silicon rubber |
| CN109796928A (en) * | 2019-01-11 | 2019-05-24 | 北京天山新材料技术有限公司 | The application of organosilicon sealant, the device and the sealant that are sealed using the sealant |
| CN113122003A (en) * | 2019-12-31 | 2021-07-16 | 广东美的白色家电技术创新中心有限公司 | Flexible heat-conducting insulating material and preparation method and application thereof |
| CN113122003B (en) * | 2019-12-31 | 2023-10-20 | 广东美的白色家电技术创新中心有限公司 | Flexible heat-conducting insulating material and preparation method and application thereof |
| CN111186187A (en) * | 2020-01-19 | 2020-05-22 | 深圳德邦界面材料有限公司 | Polyimide-based composite heat-conducting insulating sheet and preparation method thereof |
| CN111186187B (en) * | 2020-01-19 | 2022-04-15 | 深圳德邦界面材料有限公司 | Polyimide-based composite heat-conducting insulating sheet and preparation method thereof |
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Application publication date: 20160420 |