CN105491794B - A kind of production method of pcb board - Google Patents
A kind of production method of pcb board Download PDFInfo
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- CN105491794B CN105491794B CN201410469324.XA CN201410469324A CN105491794B CN 105491794 B CN105491794 B CN 105491794B CN 201410469324 A CN201410469324 A CN 201410469324A CN 105491794 B CN105491794 B CN 105491794B
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- pcb board
- hole
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- annular
- blind slot
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Abstract
The embodiment of the invention discloses a kind of PCB production methods, for avoiding power shovel from usually damaging the notch of annular annular groove, to guarantee the service performance of pcb board.The method comprise the steps that the upper surface in pcb board opens up through-hole, the through-hole projects not in the Metal Substrate in the view field of the upper surface of the pcb board the upper surface of the pcb board, annular blind slot is milled out from the upper surface of the pcb board, boss structure is formed among the annular blind slot, megohmite insulant is filled in the through-hole, the upper surface of the pcb board is evened out, by the boss structure mill off to form power amplifier slot.
Description
Technical field
The present invention relates to technical field of PCB board more particularly to a kind of production methods of pcb board.
Background technique
Printed circuit board (Printed Circuit Board, hereinafter referred to as PCB) is the important component of electronics industry
One of, for electronic component to be electrical connected.The use scope of PCB is extensive, nearly all to include the electronics such as integrated circuit member
The electronic equipment of device will use pcb board.In electronic product, the level of design and the manufacture of pcb board is to determine its product water
Flat basic reason designs and manufactures quality and cost that quality directly determines product.
In existing Metal Substrate pcb board manufacturing process, in order to avoid the process of multiple electroplated metal layer, disposably by PCB
The hole and power amplifier slot that heavy copper plating is needed on plate all process, then by the pcb board hole and slot is unified is electroplated, then
The process of filling holes with resin is carried out again, and removal spilling is then evened out in the resin of circuit board surface, to reach reduction using machinery
The purpose of electroplated metal layer process.
However, carrying out power shovel usually in existing pcb board production process, it is be easy to cause the notch shovel wound to power amplifier slot,
Influence pcb board service performance.
Summary of the invention
The embodiment of the invention provides a kind of printed wire board manufacturing methods, and annular ring can be usually damaged to avoid power shovel
The notch of slot, to guarantee the service performance of pcb board.
The embodiment of the invention provides a kind of printed wire board manufacturing methods, comprising:
Through-hole, throwing of the through-hole in the upper surface of the pcb board are opened up in the upper surface for the pcb board for being embedded with Metal Substrate
Shadow is not in the Metal Substrate in the view field of the upper surface of the pcb board；
Annular blind slot is milled out from the upper surface of the pcb board, forms boss structure among the annular blind slot；
Megohmite insulant is filled in the through-hole；
The upper surface PCB is evened out；
By the boss structure mill off to form power amplifier slot.
The upper surface from the pcb board mills out annular blind slot further include:
View field of the Metal Substrate in the pcb board upper surface from described from the upper surface of the pcb board mills out
The annular blind slot, the bottom of the annular blind slot is in the upper surface of the Metal Substrate.
Inner wall and the annular blind slot after milling out annular blind slot from the upper surface of the pcb board, in the through-hole
Side wall on metal cladding.
Metal cladding includes: on the inner wall in the through-hole and the inner wall of the annular blind slot
By heavy copper plating in the annular side wall of blind slot and the inner wall metal cladding of the through-hole.
The metal layer is layers of copper.
The Metal Substrate is copper-based.
The annular groove cross section is rectangle, and the rectangular width dimensions range is 1-20mm.
The cross section of the power amplifier slot is rectangle, and the rectangular length dimension range is 10-40mm, width dimensions
Range is 5-30mm.
The pcb board is multi-layer PCB board.
The embodiment of the present invention has the advantages that
Through-hole is opened up in the upper surface of pcb board, annular blind slot is milled out from the pcb board upper surface, among the annular blind slot
Boss structure is formed, which can usually play the role of supporting power shovel in power shovel, can play and avoid machinery
The notch of annular annular groove is damaged in the abrasive band of shovel, to guarantee the service performance of pcb board.
Detailed description of the invention
Fig. 1 is a kind of one embodiment schematic diagram of PCB plate production method in the embodiment of the present invention；
Fig. 2 is a kind of another embodiment schematic diagram of PCB plate production method in the embodiment of the present invention；
Fig. 3 a is an a kind of the schematic diagram of the section structure of pcb board in the embodiment of the present invention；
Fig. 3 b is an a kind of the schematic diagram of the section structure of pcb board in the embodiment of the present invention；
Fig. 3 c is an a kind of the schematic diagram of the section structure of pcb board in the embodiment of the present invention；
Fig. 3 d is an a kind of the schematic diagram of the section structure of pcb board in the embodiment of the present invention；
Fig. 3 e is an a kind of the schematic diagram of the section structure of pcb board in the embodiment of the present invention.
Specific embodiment
The embodiment of the invention provides a kind of PCB production methods, for avoiding power shovel from usually damaging the slot of annular annular groove
Mouthful, guarantee the service performance of pcb board.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those skilled in the art's every other implementation obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
Referring to Fig. 1, a kind of one embodiment of PCB plate production method includes: in the embodiment of the present invention
101, through-hole is opened up in the upper surface of pcb board；
By control deep drilling equipment the upper surface of pcb board from top to bottom, certain depth is got into, then again in pcb board
The corresponding position in lower surface is worked into after certain depth, by the processing of the upper surface and the lower surface in pcb board 301,
Through-hole is opened up out on the pcb board.
102, annular blind slot is milled out from the upper surface of pcb board；
After the upper surface of pcb board opens up through-hole, annular blind slot is milled out from the upper surface of the pcb board, the annular blind slot
Intermediate form boss structure.
103, megohmite insulant is filled in through-hole；
After milling out annular blind slot on pcb board, megohmite insulant is filled in through-hole, which can prevent from welding
Scolding tin is leaked by through-hole when component, so as to cause pcb board the short circuit that occurs of another side, exposure in addition can be prevented aobvious
When shadow, prevents developer water to be flowed into the layers of copper of the hole wall of through-hole and corrode layers of copper.
104, the upper surface of pcb board is evened out；
After filling megohmite insulant in through-hole, there is the megohmite insulant for being higher by pcb board upper surface, need to be higher by
The megohmite insulant of the upper surface of pcb board carries out evening processing out.
105, by boss structure mill off to form power amplifier slot；
After being evened out the upper surface of pcb board, it will be formed when processing annular blind slot by controlled depth milling equipment convex
Platform structure mill off, to form power amplifier slot.
In the embodiment of the present invention, through-hole is opened up by the upper surface in pcb board, mills out annular from the pcb board upper surface
Blind slot, forms boss structure among annular blind slot, which can usually play the work of support power shovel in power shovel
With the notch for avoiding the abrasive band of power shovel from damaging annular annular groove can be played, to guarantee the service performance of pcb board.
Annular blind slot is milled out from the upper surface of pcb board in above example, forms boss structure among the annular blind slot,
In practical application, Metal Substrate is embedded in the pcb board, and from the Metal Substrate in the pcb board of the upper surface of the pcb board at this
The view field of pcb board upper surface mills out the annular blind slot, and the bottom of the annular blind slot is the upper surface of the Metal Substrate or is somebody's turn to do
The bottom of annular blind slot is embedded in the inside of the Metal Substrate, below with reference to Fig. 2 to a kind of PCB plate production method of the embodiment of the present invention
Another embodiment be described, specifically include:
201, through-hole is opened up in the upper surface for being embedded with copper-based pcb board；
It is embedded in advance on pcb board copper-based, projection of the through-hole in the upper surface of the pcb board does not exist in the Metal Substrate
In the view field of the upper surface of the pcb board.
It should be noted that the Metal Substrate being embedded in pcb board in the embodiment of the present invention be it is copper-based, in practical applications, also
It can be aluminium base or other Metal Substrates, provide the heat spreading function of pcb board as long as can play, this is not construed as limiting.
202, back-shaped blind slot is milled out from the upper surface of pcb board；
After the upper surface for being embedded with copper-based pcb board opens up through-hole, by controlled depth milling equipment from the upper table of the pcb board
Facing cut goes out back-shaped blind slot, and the width of the back-shaped slot is 1 to 20mm, and the intermediate of the back-shaped blind slot forms boss structure, the back-shaped slot
Cross section is rectangle.
It should be noted that the annular blind slot can be back-shaped blind slot or circular ring shape blind slot, the specific shape of the annular blind slot
The component profile matching that shape is laid as needed, is not construed as limiting herein.
203, the copper plate on the inner wall of through-hole and the side wall of back-shaped blind slot；
After opening up through-hole and annular blind slot, the copper plate on the inner wall of through-hole and the side wall of back-shaped blind slot, Ke Yili
Solution, in the embodiment of the present invention, the copper plate on the inner wall of through-hole and the side wall of back-shaped blind slot in practical applications can be with
Aluminium coated or other metal layers are not construed as limiting herein as long as can play the role of being electrically connected each layer of the pcb board.
204, epoxy resin is filled in through-hole；
After milling out blind slot on PCB, epoxy resin is filled in through-hole, which can prevent welding component
When scolding tin by through-hole leak, so as to cause pcb board another side occur short circuit, when in addition can prevent exposure development, prevent
Only developer water, which is flowed into the layers of copper of the hole wall of through-hole, corrodes layers of copper.It is understood that being filled in through-hole in the present invention
Epoxy resin can also fill other kinds of megohmite insulant in practical applications, as long as insulating effect can be played, this
Place is not construed as limiting.
205, the upper surface of pcb board is evened out；
After filling epoxy resin in through-hole, there is the epoxy resin overflowed in the upper surface of pcb board, and logical in processing
When hole and blind slot, there is burr or batch cutting edge of a knife or a sword in through-hole edge, carries out the upper surface of pcb board by controlled depth milling equipment to even processing out.
206, by boss structure mill off to form power amplifier slot；
After being evened out the upper surface of pcb board, it will be formed when processing annular blind slot by controlled depth milling equipment convex
Platform structure mill off, to form power amplifier slot, the cross section of the power amplifier slot is rectangle, and the size of the length direction of the power amplifier slot is
10mm to 40mm, the size range of width direction are 5mm to 30mm, which is multi-layer board.
In the embodiment of the present invention, from the Metal Substrate in the pcb board of the upper surface of the pcb board in the pcb board upper surface
View field mill out back-shaped blind slot, the bottom of the back-shaped blind slot is the upper surface of the Metal Substrate, thus in electroplated metal layer
When, it is electroplated without the bottom in blind slot, so as to save plated material, in addition after forming power amplifier slot, when first device
When part is put into the power amplifier slot, component is directly contacted with Metal Substrate, and radiating efficiency can be improved, and the metal layer being in addition electroplated is copper
Layer, can promote conductivity, selected Metal Substrate be it is copper-based, heat transfer efficiency can be promoted.
For ease of understanding, printed wiring board described in above-described embodiment is made below with reference to a practical application scene
Method is described in detail, and please refers to Fig. 3 a to Fig. 3 e, another implementation of printed wire board manufacturing method in the embodiment of the present invention
Example include:
301, copper-based 303 are embedded in pcb board 301；
Fig. 3 a is please referred to, blind slot 302 is opened up on the lower surface of pcb board by controlled depth milling equipment (not shown), is led to
Crossing pressing will be in copper-based 303 insertion pcb board.
302, through-hole 304 and back-shaped slot 305 are opened up on pcb board 301；
It please refers to Fig. 3 b and opens up through-hole 304 on pcb board 301 by controlling deep drilling equipment (not shown), and exist simultaneously
The upper surface location of copper-based 303 corresponding pcb board 301, opens up back-shaped slot 305, and the depth of back-shaped slot 305 is equal to pcb board 301
Upper surface is to the distance of copper-based 303 upper surface, therefore the bottom of back-shaped slot 305 is made of copper-based 303 upper surface, the back-shaped slot
305 intermediate formation boss structure 311.
303, the back-shaped slot 305 of 304 base of through-hole metallizes；
Fig. 3 c is please referred to, through heavy copper plating on the side wall 306 in the through-hole 304 of pcb board 301 and back-shaped slot 305
Interior side wall 307, copper electroplating layer on side wall 308.
304, epoxy resin 310 is filled；
Fig. 3 d is please referred to, after 306 copper electroplating layer of side wall in through-hole 304, fills epoxy resin in through-hole 304
310, to play the role of insulation, prevent short circuit.
305, pcb board 301 is surface-treated；
Fig. 3 d is please referred to, when due to filling epoxy resin 310 in the through-hole 304 of pcb board, epoxy resin 310 has portion
It is higher by the upper surface of pcb board 301, in addition when drilling, Xiyanping injection form through-hole 304 and back-shaped slot 305 on pcb board,
There are burr or batch cutting edges of a knife or a sword at the edge of the bore edges of through-hole 304 and back-shaped slot 305, and the surface progress machinery of pcb board 301 is evened out and is added
Work processing, since boss structure 311 can withstand perching knife, prevents shovel to hurt the slot of back-shaped slot 305 when progress machinery evens processing out
Mouthful.
306, by 311 mill off of boss structure；
Fig. 3 d and Fig. 3 e is please referred to, is milled from the surface of boss structure 311 to copper-based 303 upper table by controlled depth milling equipment
Face, to form power amplifier slot 312.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed system, device and method can be with
It realizes by another way.For example, the apparatus embodiments described above are merely exemplary, for example, the unit
It divides, only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components
It can be combined or can be integrated into another system, or some features can be ignored or not executed.Another point, it is shown or
The mutual coupling, direct-coupling or communication connection discussed can be through some interfaces, the indirect coupling of device or unit
It closes or communicates to connect, can be electrical property, mechanical or other forms.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple
In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme
's.
It, can also be in addition, the functional units in various embodiments of the present invention may be integrated into one processing unit
It is that each unit physically exists alone, can also be integrated in one unit with two or more units.Above-mentioned integrated list
Member both can take the form of hardware realization, can also realize in the form of software functional units.
If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product
When, it can store in a computer readable storage medium.Based on this understanding, technical solution of the present invention is substantially
The all or part of the part that contributes to existing technology or the technical solution can be in the form of software products in other words
It embodies, which is stored in a storage medium, including some instructions are used so that a computer
Equipment (can be personal computer, server or the network equipment etc.) executes the complete of each embodiment the method for the present invention
Portion or part steps.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only
Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can store journey
The medium of sequence code.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (7)
1. a kind of PCB plate production method characterized by comprising
Through-hole is opened up in the upper surface of pcb board, the pcb board has been embedded in Metal Substrate, upper table of the through-hole in the pcb board
The projection in face is not in the Metal Substrate in the view field of the upper surface of the pcb board；
Annular blind slot is milled out from the upper surface of the pcb board, forms boss structure among the annular blind slot, the annular groove is horizontal
Section is rectangle, and the rectangular width dimensions range is 1-20mm；
The upper surface from the pcb board mills out annular blind slot further include:
It is blind that view field from the Metal Substrate of the upper surface of the pcb board in the pcb board upper surface mills out the annular
Slot, the bottom of the annular blind slot are the upper surface of the Metal Substrate or the inside of the insertion Metal Substrate；
Megohmite insulant is filled in the through-hole；
The upper surface of the pcb board is evened out；
By the boss structure mill off to form power amplifier slot.
2. the method according to claim 1, wherein the Metal Substrate is copper-based.
3. the method according to claim 1, wherein from the upper surface of the pcb board mill out annular blind slot it
Afterwards, the metal cladding on the inner wall of the through-hole and the side wall of the annular blind slot.
4. according to the method described in claim 3, it is characterized in that, the inner wall in the through-hole and the annular blind slot
Metal cladding includes: on inner wall
By heavy copper plating in the annular side wall of blind slot and the inner wall metal cladding of the through-hole.
5. according to the method described in claim 4, it is characterized in that, the metal layer is layers of copper.
6. method described in method according to claim 1 to 4, which is characterized in that the cross of the power amplifier slot
Section is rectangle, and the rectangular length dimension range is 10-40mm, and width dimensions range is 5-30mm.
7. method according to claim 1 to 4, which is characterized in that the pcb board is multi-layer PCB board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410469324.XA CN105491794B (en) | 2014-09-15 | 2014-09-15 | A kind of production method of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410469324.XA CN105491794B (en) | 2014-09-15 | 2014-09-15 | A kind of production method of pcb board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105491794A CN105491794A (en) | 2016-04-13 |
| CN105491794B true CN105491794B (en) | 2019-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410469324.XA Active CN105491794B (en) | 2014-09-15 | 2014-09-15 | A kind of production method of pcb board |
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| Country | Link |
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| CN (1) | CN105491794B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115802595B (en) * | 2023-01-29 | 2023-05-30 | 惠州威尔高电子有限公司 | Thick copper PCB and processing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002353592A (en) * | 2001-05-30 | 2002-12-06 | Nippon Mektron Ltd | Method for producing double-sided flexible circuit board |
| CN103781273A (en) * | 2012-10-19 | 2014-05-07 | 深南电路有限公司 | Embedded metal-base PCB and processing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10270829A (en) * | 1997-03-28 | 1998-10-09 | Hitachi Chem Co Ltd | Manufacture of wiring board |
-
2014
- 2014-09-15 CN CN201410469324.XA patent/CN105491794B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002353592A (en) * | 2001-05-30 | 2002-12-06 | Nippon Mektron Ltd | Method for producing double-sided flexible circuit board |
| CN103781273A (en) * | 2012-10-19 | 2014-05-07 | 深南电路有限公司 | Embedded metal-base PCB and processing method thereof |
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| Publication number | Publication date |
|---|---|
| CN105491794A (en) | 2016-04-13 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |