CN105469915A - Metal oxide varistors (MOV) component structure fixed by fastening element - Google Patents
Metal oxide varistors (MOV) component structure fixed by fastening element Download PDFInfo
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- CN105469915A CN105469915A CN201510752049.7A CN201510752049A CN105469915A CN 105469915 A CN105469915 A CN 105469915A CN 201510752049 A CN201510752049 A CN 201510752049A CN 105469915 A CN105469915 A CN 105469915A
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Abstract
The invention provides a metal oxide varistors (MOV) component structure fixed by a fastening element. The MOV component structure comprises an upper electrode clamping plate, a lower electrode clamping plate, at least one MOV chip and at least one extraction electrode, wherein the at least MOV chip and the at least one extraction electrode are arranged between the upper electrode clamping plate and the lower electrode clamping plate, and the upper electrode clamping plate and the lower electrode clamping plate are fixed by the fastening element. In the MOV component structure, a high-temperature welding process of the extraction electrode is not needed, and high-temperature invisible damage to the chip is avoided; the upper electrode clamping plate, the lower electrode clamping plate and the extraction electrode are taken as heat sinks of the chip, the pulse through-flow endurance ability and small-current and multi-frequency impact resistant ability of the MOV chip are improved, the temporary overvoltage resistant capability of an MOV is also improved, and time is won for timely withdrawing from running; and the chip performance is utilized maximum, and resources are saved. The MOV component structure fixed by the fastening element, provided by the invention, has the advantages of simplicity in manufacturing process, soldering flux free, cleaning agent free, no environmental pollution, low cost composition, and convenient and rapidness in subsequent processing.
Description
Technical field
The present invention relates to metal oxide piezo-resistance technical field, particularly a kind of MOV component structure fixing by securing member.
Background technology
Zinc oxide varistor (MetalOxideVaristors) has special nonlinear current-voltage; the environment of application meets with thunderbolt, the interference of electromagnetic field; mains switch frequent movement, power system failure; make voltage spikes on circuit; exceed the conducting voltage of varistor; conducting district will be entered; due to the nonlinear characteristic of MOV; its impedance meeting step-down; only there is several ohm; make overvoltage form burst current to flow out, use electronic product or expensive electronic building brick that protection connects.
When unusual service condition, it is excessive that MOV constant conduction can cause chip to generate heat, and cause thermal runaway, it is out of service and accidents caused that unexpected thermal runaway can make it have little time.
Existing MOV device, after its ceramic chip is made, through soldering copper leading foot, epoxy encapsulating solidification need be implemented and waits back segment high temperature process operation, so not only profit of making troubles is made to the rear operation of chip, and high-temperature technology causes stealthy damage to be also very important to chip.
Summary of the invention
For the deficiency that above-mentioned prior art exists, technical problem to be solved by this invention be to provide a kind of without high-temperature damage, overvoltage tolerance is strong, cost is low, the MOV component structure fixing by securing member of easy processing.
In order to solve the problems of the technologies described above, the technical solution used in the present invention is:
The invention provides a kind of MOV component structure fixing by securing member, it is characterized in that: comprise top electrode clamping plate, bottom electrode clamping plate and at least one MOV chip of being disposed alternately between upper/lower electrode clamping plate and at least one extraction electrode, described top electrode clamping plate, bottom electrode clamping plate are fixed by securing member.
Described MOV chip 2 is also known as valve block, and the position of described upper/lower electrode clamping plate 1,4 can exchange.Extraction electrode 3 and electrode clamping plate 1,4, the installation according to Surge Protector SPD needs special-shapedly to extend.
Further, be arranged alternately two MOV chips and an extraction electrode between upper/lower electrode clamping plate, equivalent electric circuit is two and di-electrode structure.
Further, be arranged alternately two MOV chips and three extraction electrodes between upper/lower electrode clamping plate, equivalent electric circuit is two three electrode common mode configuration.
Further, respectively and be arranged alternately two MOV chips and an extraction electrode between the bottom electrode clamping plate of centre, equivalent electric circuit is four two-in-parallel three-electrode structures to the two panels top electrode clamping plate at two ends.
Further, comprise many groups and be disposed alternately at least one MOV chip between upper/lower electrode clamping plate and at least one extraction electrode, between the extraction electrode of two adjacent groups, be provided with isolated plate.
Further, the surface area of described upper/lower electrode clamping plate is greater than the surface area of MOV chip, described top electrode clamping plate are provided with top electrode clamping plate and protrude limit, described bottom electrode clamping plate are provided with bottom electrode clamping plate and protrude limit, described top electrode clamping plate protrude on limit and bottom electrode clamping plate protrusion limit and are provided with through hole or screwed hole.
Further, described securing member is metal or nonmetallic rivet or screw, and the length of described securing member is not less than the thickness of described top electrode clamping plate to bottom electrode clamping plate.
Further, the surface area of described extraction electrode is greater than the surface area of MOV chip, and described extraction electrode leads at least one leading foot, described leading foot axial lead or radial extraction.
Further, described MOV chip is arranged to different shapes as required.
Further, the MOV components and parts that securing member is fixing, can apply insulating barrier process.
Further, described electrode clamping plate are alclad, copper clamping plate or aluminium alloy clamping plate, copper alloy clamping plate.
The product that described MOV component structure is formed loads in Surge Protector SPD cavity block; wherein extraction electrode can connect dropout shell fragment; electrode clamping plate connect terminals can form SPD module; or the extraction electrode of described MOV component structure formation product can connect temperature safety element or low-temperature alloy fuse, forms Thermal protection type piezo-resistance TMOV device.
Beneficial effect of the present invention is:
(1) the present invention fixes MOV chip, extraction electrode by securing member, without the need to adopting extraction electrode to weld high-temperature technology, avoids causing high temperature stealth damage to chip;
(2) the present invention utilizes upper/lower electrode clamping plate and extraction electrode as chip cooling sheet, improve the impact tolerance of the through-flow tolerance of pulse of MOV chip and small area analysis multifrequency time, also improving the temporary overvoltage tolerance of MOV, out of servicely having won the time for departing from time; Chip performance is maximized the use, economizes on resources;
(3) the MOV component structure manufacturing procedure fixing by securing member of the present invention simple, exempt from scaling powder, No clean agent, non-environmental-pollution, cost structure are low, following process is convenient and swift.
Accompanying drawing explanation
Fig. 1-1 is the explosive view of MOV component structure in embodiment 1;
Fig. 1-2 is the constitutional diagram of MOV component structure in embodiment 1;
Fig. 1-3 is constitutional diagrams of the another kind of structure of MOV component structure in embodiment 1;
Fig. 1-4 is isoboleses of MOV component structure in embodiment 1;
Fig. 2-1 is the explosive view of MOV component structure in embodiment 2;
Fig. 2-2 is constitutional diagrams of MOV component structure in embodiment 2;
Fig. 2-3 is isoboleses of MOV component structure in embodiment 2;
Fig. 3-1 is the explosive view of MOV component structure in embodiment 3;
Fig. 3-2 is constitutional diagrams of MOV component structure in embodiment 3;
Fig. 3-3 is constitutional diagrams of the another kind of structure of MOV component structure in embodiment 3;
Fig. 3-4 is isoboleses of MOV component structure in embodiment 3;
Fig. 4-1 is the explosive view of MOV component structure in embodiment 4;
Fig. 4-2 is isoboleses of MOV component structure in embodiment 4;
Fig. 5-1 is the explosive view of the first structure of MOV component structure in embodiment 5;
Fig. 5-2 is constitutional diagrams of the first structure of MOV component structure in embodiment 5;
Fig. 5-3 is explosive views of the second structure of MOV component structure in embodiment 5;
Fig. 5-4 is constitutional diagrams of the second structure of MOV component structure in embodiment 5;
Fig. 5-5 is isoboleses of MOV component structure in embodiment 5;
Fig. 6-1 is the explosive view of MOV component structure in embodiment 6;
Fig. 6-2 is isoboleses of MOV component structure in embodiment 6;
Fig. 7-1 is the explosive view of MOV component structure in embodiment 7;
Fig. 7-2 is isoboleses of MOV component structure in embodiment 7.
Embodiment
Specifically illustrate embodiments of the present invention below in conjunction with accompanying drawing, accompanying drawing is only for reference and use is described, does not form the restriction to scope of patent protection of the present invention.
embodiment 1
As shown in Fig. 1-1 to 1-4, the present embodiment provides a kind of MOV component structure fixing by securing member, comprise top electrode clamping plate 1, MOV chip 2, extraction electrode 3, bottom electrode clamping plate 4, described top electrode clamping plate 1, bottom electrode clamping plate 4 are fixed by securing member 5, described MOV chip 2 and extraction electrode 3 are disposed alternately between described top electrode clamping plate 1 and described bottom electrode clamping plate 4, described upper/lower electrode clamping plate 1, the surface area of 4 is greater than the surface area of MOV chip 2, in all standing state, described top electrode clamping plate 1 are provided with two top electrode clamping plate and protrude limit 11, described bottom electrode clamping plate 4 are provided with two bottom electrode clamping plate and protrude limit 41, described top electrode clamping plate are provided with through hole 12, described bottom electrode clamping plate 4 are provided with screwed hole 42, described extraction electrode 3 is provided with extraction electrode leading foot 31.
Described MOV chip 2 is also known as valve block, and the position of described upper/lower electrode clamping plate 1,4 can exchange.Extraction electrode 3 and electrode clamping plate 1,4, the installation according to Surge Protector SPD needs special-shapedly to extend.
In the present embodiment, between upper/lower electrode clamping plate, be arranged alternately a MOV chip 2 and an extraction electrode 3, as Figure 1-4, equivalent electric circuit is monolithic two electrode structure, the leading foot 31 of extraction electrode 3 is held for positive pole L, and upper/lower electrode clamping plate 1,4 are held for negative pole N.Positive pole L holds, negative pole N holds can jointing temp protection mechanism, as hot detachment mechanism or Thermal Cutoffs etc.
In the present embodiment, described securing member 5 is nonmetal screw, as nylon screw or other insulated screw.The length of screw is more than or equal to the thickness of upper/lower electrode clamping plate 1,4, the thickness of clamped MOV chip 2, the summation of extraction electrode 3 thickness.Described securing member 5 can also be nonmetallic rivet, screw.
In the present embodiment, the surface area of extraction electrode 3 is greater than the surface area of MOV chip 2, in all standing state, described extraction electrode 3 leads to one to two leading foot, leading foot is line style or flap-type leading foot, as shown in Fig. 1-2,1-3, and described leading foot axial lead or radial extraction.The leading foot of extraction electrode 3 provides large area of dissipation, convenient draw or connects trip gear, and extraction electrode 3 material is aluminium or copper or the conductivity such as aluminium alloy or copper alloy, and the metal material that thermal conductivity is good is made, and its thickness is 0.3 ~ 1.5mm.
Described MOV chip is arranged to different shapes as required, and as being arranged to circle, rectangle or abnormity (irregularly shaped) etc., the MOV components and parts that securing member is fixing, can apply insulating barrier process.
embodiment 2
The difference of the present embodiment and embodiment 1 is: as shown in Fig. 2-1 to 2-3, two MOV chips 2 and an extraction electrode 3 has been arranged alternately between upper/lower electrode clamping plate, extraction electrode 3 is arranged in the middle of two MOV chips 2, clamp with upper/lower electrode clamping plate, nonmetal screw 5 protrudes the through hole 12 in limit 11 through top electrode clamping plate 1, be anchored in screwed hole 42 that bottom electrode clamping plate 4 protrude in limit 41, form biplate parallel way, after access SPD trip gear, form single dropout, bipolar electrode mounting means.As Figure 2-3, equivalent electric circuit is two and di-electrode structure.The leading foot 31 of extraction electrode 3 is held for positive pole L, and upper/lower electrode clamping plate 1,4 are held for negative pole N.
embodiment 3
The difference of the present embodiment and embodiment 1 is: as shown in Fig. 3-1 to 3-4, two MOV chips 2 and three extraction electrodes 3 have been arranged alternately between upper/lower electrode clamping plate, described MOV chip 2 biplate is stacked, middle and both sides arrange three extraction electrodes 3 altogether, with upper/lower electrode clamping plate 1, 4 clampings, nonmetal non-screw 5 protrudes the through hole 12 in limit 11 through top electrode clamping plate, be anchored on bottom electrode clamping plate 41 and protrude screwed hole 42 in limit, biplate three leading foots form L-PE-N tri-electrodes, form single-phase common mode protected mode over the ground, if the extraction electrode leading foot 31 on both sides to be accessed the trip gear of SPD, form two single-phase common mode protection module of three electrodes of threading off, if add a components and parts by demand at PE end more can form the single-phase full mould protected mode of Y connection, wherein, as Fig. 3-2, shown in 3-3, the leading foot 31 of extraction electrode 3 can axial lead or radial extraction.As shown in Figure 3-4, equivalent electric circuit is two three electrode common mode configuration, and the leading foot 31 of middle extraction electrode 3 is held for ground connection PE, and the leading foot 31 of the extraction electrode 3 of both sides is respectively positive pole L end and negative pole N holds.
embodiment 4
The difference of the present embodiment and embodiment 1 is: as Fig. 4-1, shown in 4-2, at upper/lower electrode clamping plate 1, three MOV chips 2 and two extraction electrodes 3 have been arranged alternately between 4, described MOV chip 2 three is stacked, two extraction electrodes 3 are set between three MOV chips, with upper/lower electrode clamping plate 1, 4 clampings, non-screw 5 protrudes the through hole 12 in limit 11 through top electrode clamping plate, be anchored in the screwed hole 42 in bottom electrode clamping plate protrusion limit 41, the triangle protective circuit of three chips, three exits is formed by electrode clamping plate one end and two leading foots, three exits are positive pole L and hold, if extraction electrode leading foot 31 to be accessed the trip gear of SPD, form two three electrode dihedral connection protection modules of threading off.
embodiment 5
The difference of the present embodiment and embodiment 1 is: as Fig. 5-1, shown in 5-2, the two panels top electrode clamping plate 1 at two ends respectively and be arranged alternately two MOV chips 2 and an extraction electrode 3 between the bottom electrode clamping plate 4 of centre, an extraction electrode 3 is set between two MOV chips 2 and forms one group of combining structure, between two groups of combining structures, bottom electrode clamping plate 4 are set, two groups of MOV chips 2 are clamped with two pieces of top electrode clamping plate 1, each top electrode clamping plate 1 with the non-screw 5 of two or more in mode wrong mutually through the through hole 12 top electrode clamping plate protruded in limit 11, being anchored on the bottom electrode clamping plate put among two groups of combining structures protrudes in the screwed hole 42 in limit 41, four chips 2 are formed in parallel with this, the structure of three extraction electrodes 3, L in place in circuit can be obtained, N is to the common mode configuration of PE, also can two extraction electrode L ends and N be held via inner or parallel connection outside, form the full paralleling model of four chips.
As shown in Fig. 5-3,5-4, be provided with another at bottom electrode clamping plate side and protrude limit 40, this protrusion limit 40 is provided with another screwed hole 400, arranges another through hole at the correspondence position of two top electrode clamping plate 1, by another screw through described through hole and screwed hole 400, thus make fastening effect better.
As illustrated in fig. 5-5, equivalent electric circuit is four two-in-parallel three-electrode structures.
embodiment 6
The difference of the present embodiment and embodiment 1 is: as shown in Fig. 6-1 to 6-2, MOV combined mechanism of the present invention comprises two groups and is disposed alternately at least one MOV chip between upper/lower electrode clamping plate and at least one extraction electrode, is provided with isolated plate between the extraction electrode of two adjacent groups.In the present embodiment, in first group, be provided with two MOV chips and two extraction electrodes, in second group, be provided with a MOV chip and an extraction electrode.By MOV chip, extraction electrode, MOV chip, extraction electrode, isolated plate, extraction electrode, MOV chip is stacked successively, use upper/lower electrode clamping plate 1 again, 4 clampings, nonmetal screw 5 protrudes the through hole 12 in limit 11 through top electrode clamping plate, be anchored in the screwed hole 42 in bottom electrode clamping plate protrusion limit 41, three five electrode structures are formed by electrode clamping plate two end and three leading foots, connect one, three extraction electrode leading foots, single-phase full mould or three-phase half module protected mode can be formed, if by one, the trip gear of three extraction electrode leading foot access SPD, form the two single-phase full guard of five electrodes or three-phase half protection module of threading off.
embodiment 7
The difference of the present embodiment and embodiment 6 is: as shown in Fig. 7-1 to 7-2, MOV combined mechanism of the present invention comprises two groups and is disposed alternately at least one MOV chip between upper/lower electrode clamping plate and at least one extraction electrode, is provided with isolated plate between the extraction electrode of two adjacent groups.In the present embodiment, two MOV chips and an extraction electrode is provided with in first group and second group, extraction electrode 3 is settled in the middle of two MOV chips, clamp with electrode clamping plate 1 and bottom electrode clamping plate 4, nonmetal screw 5 is through the through hole 12 top electrode clamping plate protruded in limit 11, tighten in the screwed hole 42 protruded on bottom electrode clamping plate in limit 41, extraction electrode leading foot 3 in the middle of connecting two groups, form the N electrode in place in circuit, upper/lower electrode clamping plate 1, 4 and isolated plate 6 both sides extraction electrode leading foot formed L1, L2, L3 and PE tetra-electrodes, it is the four module protection circuit of allusion quotation shape.By the trip gear of two groups of middle extraction electrode leading foot access SPD, form the two tripping-mode of L1, L2, L3, N, PE tetra-five electrodes.To increase through-current capacity, also by reconnecting electrode lead-out pins, being formed and often organizing two or Dan Zusi sheet paralleling model.
The product that described MOV component structure is formed loads in Surge Protector SPD cavity block; wherein extraction electrode can connect dropout shell fragment; electrode clamping plate connect terminals can form SPD module; or the extraction electrode of described MOV component structure formation product can connect temperature safety element or low-temperature alloy fuse, forms Thermal protection type piezo-resistance TMOV device.
Above disclosedly be only preferred embodiment of the present invention, the scope of the present invention can not be limited with this, therefore according to the equivalent variations that the present patent application the scope of the claims is done, still belong to the scope that the present invention is contained.
Claims (10)
1. the MOV component structure fixed by securing member, it is characterized in that: comprise top electrode clamping plate, bottom electrode clamping plate and at least one MOV chip of being disposed alternately between upper/lower electrode clamping plate and at least one extraction electrode, described top electrode clamping plate, bottom electrode clamping plate are fixed by securing member.
2. a kind of MOV component structure fixing by securing member according to claim 1, it is characterized in that: between upper/lower electrode clamping plate, be arranged alternately two MOV chips and an extraction electrode, equivalent electric circuit is two and di-electrode structure.
3. a kind of MOV component structure fixing by securing member according to claim 1, it is characterized in that: between upper/lower electrode clamping plate, be arranged alternately two MOV chips and three extraction electrodes, equivalent electric circuit is two three electrode common mode configuration.
4. a kind of MOV component structure fixing by securing member according to claim 1, it is characterized in that: respectively and be arranged alternately two MOV chips and an extraction electrode between the bottom electrode clamping plate of centre, equivalent electric circuit is four two-in-parallel three-electrode structures to the two panels top electrode clamping plate at two ends.
5. a kind of MOV component structure fixing by securing member according to claim 1, it is characterized in that: comprise many groups and be disposed alternately at least one MOV chip between upper/lower electrode clamping plate and at least one extraction electrode, between the extraction electrode of two adjacent groups, be provided with isolated plate.
6. a kind of MOV component structure fixing by securing member according to any one of claim 1-5, it is characterized in that: the surface area of described upper/lower electrode clamping plate is greater than the surface area of MOV chip, described top electrode clamping plate are provided with top electrode clamping plate and protrude limit, described bottom electrode clamping plate are provided with bottom electrode clamping plate and protrude limit, described top electrode clamping plate protrude on limit and bottom electrode clamping plate protrusion limit and are provided with through hole or screwed hole.
7. a kind of MOV component structure fixing by securing member according to any one of claim 1-5, it is characterized in that: described securing member is metal or nonmetallic rivet or screw, and the length of described securing member is not less than the thickness of described top electrode clamping plate to bottom electrode clamping plate.
8. a kind of MOV component structure fixing by securing member according to any one of claim 1-5, it is characterized in that: the surface area of described extraction electrode is greater than the surface area of MOV chip, described extraction electrode leads at least one leading foot, described leading foot axial lead or radial extraction.
9. the MOV component structure fixing by securing member according to claim 1, is characterized in that: described MOV chip is arranged to different shapes as required.
10. the MOV component structure fixing by securing member according to claim 1, is characterized in that: described electrode clamping plate are alclad, copper clamping plate or aluminium alloy clamping plate, copper alloy clamping plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510752049.7A CN105469915A (en) | 2015-11-05 | 2015-11-05 | Metal oxide varistors (MOV) component structure fixed by fastening element |
| PCT/CN2015/094163 WO2017075842A1 (en) | 2015-11-05 | 2015-11-10 | Mov device structure fixed by means of a fastener |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510752049.7A CN105469915A (en) | 2015-11-05 | 2015-11-05 | Metal oxide varistors (MOV) component structure fixed by fastening element |
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| CN105469915A true CN105469915A (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510752049.7A Pending CN105469915A (en) | 2015-11-05 | 2015-11-05 | Metal oxide varistors (MOV) component structure fixed by fastening element |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304243A (en) * | 2015-11-12 | 2016-02-03 | 郑品章 | Voltage dependent resistor (VDR) |
| CN107068312A (en) * | 2017-03-07 | 2017-08-18 | 隆科电子(惠阳)有限公司 | A kind of integrated box-packed FDMOV composite component with atmospherical discharges structure |
| CN107342145A (en) * | 2017-07-10 | 2017-11-10 | 隆科电子(惠阳)有限公司 | A kind of compound MOV for inserting GDT |
| CN107424692A (en) * | 2016-10-14 | 2017-12-01 | 隆科电子(惠阳)有限公司 | A kind of MOV components with insulation carrying plate structure |
| CN112489909A (en) * | 2020-12-01 | 2021-03-12 | 辰硕电子(九江)有限公司 | MOV assembly with insulating bearing plate assembling structure |
| CN113205933A (en) * | 2021-04-30 | 2021-08-03 | 良科电子(重庆)有限公司 | Central shaft MOV subassembly of multipurpose |
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| CN101017718A (en) * | 2007-02-15 | 2007-08-15 | 广东省佛山科星电子有限公司 | High-throughput voltage limit power surge protector |
| CN103563014A (en) * | 2012-04-04 | 2014-02-05 | 音羽电机工业株式会社 | Nonlinear resistive element |
| CN205451957U (en) * | 2015-11-05 | 2016-08-10 | 隆科电子(惠阳)有限公司 | Through fixed device structure of MOV unit of fastener |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004006519A (en) * | 2002-05-31 | 2004-01-08 | Otowa Denki Kogyo Kk | Multi-terminal varistor |
| CN101017718A (en) * | 2007-02-15 | 2007-08-15 | 广东省佛山科星电子有限公司 | High-throughput voltage limit power surge protector |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304243A (en) * | 2015-11-12 | 2016-02-03 | 郑品章 | Voltage dependent resistor (VDR) |
| CN107424692A (en) * | 2016-10-14 | 2017-12-01 | 隆科电子(惠阳)有限公司 | A kind of MOV components with insulation carrying plate structure |
| CN107068312A (en) * | 2017-03-07 | 2017-08-18 | 隆科电子(惠阳)有限公司 | A kind of integrated box-packed FDMOV composite component with atmospherical discharges structure |
| CN107068312B (en) * | 2017-03-07 | 2020-02-21 | 隆科电子(惠阳)有限公司 | Integrated box-packed FDMOV composite assembly with air discharge structure |
| CN107342145A (en) * | 2017-07-10 | 2017-11-10 | 隆科电子(惠阳)有限公司 | A kind of compound MOV for inserting GDT |
| CN112489909A (en) * | 2020-12-01 | 2021-03-12 | 辰硕电子(九江)有限公司 | MOV assembly with insulating bearing plate assembling structure |
| CN113205933A (en) * | 2021-04-30 | 2021-08-03 | 良科电子(重庆)有限公司 | Central shaft MOV subassembly of multipurpose |
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Application publication date: 20160406 |
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