CN105468212B - Panel structure and manufacturing method thereof - Google Patents
Panel structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN105468212B CN105468212B CN201410429632.XA CN201410429632A CN105468212B CN 105468212 B CN105468212 B CN 105468212B CN 201410429632 A CN201410429632 A CN 201410429632A CN 105468212 B CN105468212 B CN 105468212B
- Authority
- CN
- China
- Prior art keywords
- conductive
- layer
- lead
- conductive lead
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention relates to the technical field of flat panel display, in particular to a panel structure. The panel structure includes at least: a substrate having at least a first surface; a set of conductive leads formed on the first surface of the substrate, the set of conductive leads including at least one conductive lead; the conductive lead comprises a first conductive lead layer, at least part of the conductive lead further comprises a second conductive lead layer, and the second conductive lead layer is formed on the first conductive lead layer and at least partially or completely covers the first conductive lead layer in the length direction. In addition, the invention also relates to a panel structure manufacturing method.
Description
Technical Field
The invention relates to the technical field of flat panel display, in particular to a panel structure and a manufacturing method thereof.
Background
The integrated capacitive touch screen (OGS, on Glass Solution) has the advantage of being light and thin, and only adopts a substrate, and the mask layer, the decorative pattern, the sensing electrode layer and the corresponding circuit are all manufactured on the same surface of the substrate, however, in the prior art, the integrated capacitive touch screen generally adopts a multi-layer electrode design, and the mask layer, the multi-layer electrode and the corresponding circuit are manufactured on the back surface of the substrate at the same time, which further increases the complexity of the manufacturing process.
Compared with the multi-layer electrode design, the sensing electrode layer of the single-layer electrode design is manufactured by only one layer of transparent conducting film, and the manufacturing process is simpler. Capacitive touch screens with a single layer design sense electrode layer typically include an electrode, an electrode lead electrically connecting the electrode to the first conductive pad, and a first conductive pad to which a flexible circuit board is then pressed to connect the electrode to the processor.
However, the capacitive touch screen with such a structure has a large number of electrodes and a large number of corresponding electrode lead lines, and the lengths of the electrode lead lines connected to the same first conductive pad or different first conductive pads are uneven, so that the impedance difference between the electrodes is large, which is not beneficial to the overall touch effect of the capacitive touch screen.
Disclosure of Invention
In view of this, the present invention provides a panel structure that is advantageous for reducing the impedance difference.
In addition, it is necessary to provide a method for manufacturing the panel structure.
The panel structure provided by the invention at least comprises: a substrate having at least a first surface; a set of conductive leads formed on the first surface of the substrate, the set of conductive leads including at least one conductive lead; the conductive lead comprises a first conductive lead layer, at least part of the conductive lead further comprises a second conductive lead layer, and the second conductive lead layer is formed on the first conductive lead layer and at least partially or completely covers the first conductive lead layer in the length direction.
In the panel structure provided by the invention, the second conductive lead layer partially covers the first conductive lead layer in the length direction, and the impedance of the conductive lead covered with the second conductive lead layer is the same as or similar to the impedance of the conductive lead not covered with the second conductive lead layer.
In the panel structure provided by the invention, the panel structure further comprises a functional layer and at least one first conductive pad, at least part of the functional layer is connected to the first conductive pad through the conductive lead, the functional layer is a touch layer and at least comprises a plurality of first electrode serials arranged along a first direction, and the first electrode serials comprise a plurality of first electrode units arranged at intervals.
In the panel structure provided by the invention, at least one conductive lead is provided with a first lead part and a second lead part, the first lead part and the second lead part are positioned on two opposite sides of the same first conductive pad and are respectively and electrically connected with the first conductive pad, the first lead part and the second lead part are respectively connected to two first electrode units in the same first electrode serial, and the second conductive lead layer covers part of the first conductive lead layer in the first lead part of the conductive lead and does not cover the first conductive lead layer in the second lead part, and the impedance of the first lead part and the impedance of the second lead part are the same or are close.
In the panel structure provided by the invention, the length of the first lead part is longer than that of the second lead part, and the impedance of the second conductive lead layer is smaller than that of the first conductive lead layer.
In the panel structure provided by the invention, the first surface at least comprises a first area and a second area, the second area is at least positioned on one side of the first area and is adjacent to the first area, the functional layer is formed on the first surface where the first area is positioned, the conductive lead is formed on the first surface where the first area and the second area are positioned, the second conductive lead layer is formed on the conductive lead where the first lead part is positioned, and the span of the second conductive lead layer is smaller than or equal to the span of the first conductive lead layer, or the second conductive lead layer completely covers the first conductive lead layer.
In the panel structure provided by the invention, the panel structure further comprises a plurality of second conductive pads formed on the second area, the touch layer further comprises a plurality of second electrode serials, each second electrode serials are arranged continuously and along a second direction, each second electrode serials are connected to one second conductive pad, and a plurality of first electrode units in the same first electrode serials and one second electrode serials are mutually embedded and arranged in an insulating manner.
A panel structure manufacturing method at least comprises the following steps: providing a substrate with at least one first surface; at least one conductive lead group is formed on the first surface of the substrate, the conductive lead group at least comprises one conductive lead, the conductive lead comprises a first conductive lead layer, at least part of the conductive leads further comprise a second conductive lead layer, and the second conductive lead layer is formed on the first conductive lead layer and at least partially or completely covers the first conductive lead layer in the length direction.
In the method for manufacturing the panel structure provided by the invention, the step further comprises the step of forming a functional layer on the first surface, wherein the first conductive lead layer and the functional layer are manufactured together in the same process, the material for manufacturing the first conductive lead layer is the same as the material for manufacturing the functional layer, and the conductive lead group and the functional layer are manufactured in the same yellow light process or laser process.
In the method for manufacturing the panel structure provided by the invention, the functional layer is a touch layer, the touch layer comprises a plurality of first electrode serials arranged along a first direction and a plurality of second electrode serials arranged along a second direction, the first electrode serials comprise a plurality of first electrode units arranged at intervals, and a plurality of first electrode units and a plurality of second electrode serials in the same first electrode serials are mutually embedded and are arranged in an insulating way.
In the panel structure and the manufacturing method thereof provided by the invention, as the conductive lead comprises the first conductive lead layer and at least part of the conductive lead further comprises the second conductive lead layer formed on the first conductive lead layer, the impedance of the conductive lead can be reduced, the impedance difference can be reduced, and the overall touch effect can be improved.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic diagram of a panel structure 200 according to a preferred embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the panel structure 200 of FIG. 1 along the direction A-A;
FIG. 3 is a schematic cross-sectional view of the panel structure 200 shown in FIG. 1 along the direction B-B;
fig. 4 is a flow chart of a method for manufacturing the panel structure shown in fig. 1.
Detailed Description
The panel structure and the manufacturing method thereof provided by the invention are explained in detail below with reference to the drawings and the text.
Referring to fig. 1, a schematic structure diagram of a panel structure 200 according to a preferred embodiment of the present invention is shown, wherein the panel structure 200 is a capacitive touch screen. The capacitive touch screen 200 at least includes a substrate 201, a functional layer, a conductive lead set 211, a first conductive pad 212 and a second conductive pad 222. The functional layer includes a plurality of the first electrode serials 210 and a plurality of the second electrode serials 220. In other embodiments, the panel structure may also be a resistive touch screen or a display screen, and the functional layer may also be a display layer.
The substrate 201 has at least a first surface 201a, in this embodiment, the first surface 201a is a plane, and in other embodiments, the first surface may be a curved surface or an irregular surface. The substrate 201 may be made of glass or a flexible material. The first surface 201a includes at least a first area 201aa and a second area 201ab, and the second area 201ab is located at one side of the first area 101 aa. In other embodiments, the first surface may also have third, fourth and fifth regions that together comprise a peripheral region of the substrate.
A plurality of first electrode serials 210 and a plurality of second electrode serials 220 are formed on the first surface 201a where the first area 201aa is located, the first electrode serials 210 are disposed along a first direction, and each first electrode serials 210 includes a plurality of first electrode units 210a disposed at intervals, and each second electrode serials 220 are disposed continuously and along a second direction. The first electrode units 210a in the same first electrode string 210 and the second electrode string 220 are embedded and insulated from each other. In this embodiment, the first electrode unit 210a has a triangular shape, and the second electrode string 220 is a series of triangular electrodes. In other embodiments, the first electrode unit and the second electrode string may have different shapes, such as a trapezoid, a rectangle, or a line. In this embodiment, the first direction and the second direction are perpendicular, and in other embodiments, the first direction and the second direction may be set in other manners. The first electrode unit 210a, the second electrode serials 220, and the electrode leads 211 are all made of a transparent conductive material such as indium tin oxide, graphene, and the like.
The first conductive pads 212 and the second conductive pads 222 are formed on the conductive leads on the second region 201ab and electrically connected to the conductive leads. The functional layer is connected to the first conductive pad 212 through the conductive lead. Specifically, each of the second electrode serials 220 is connected to one of the second conductive pads 222, and the first electrode unit is connected to the first conductive pad 212.
The conductive lead group 211 is formed on the first surface 201a where the first area 201aa and the second area 201ab are located, and the conductive lead group 211 includes a plurality of conductive leads 21, and in other embodiments, the conductive lead group may be located only on the first surface where the second area is located. The conductive lead 21 includes a first conductive lead layer 21a, and at least a portion of the conductive lead 21 further includes a second conductive lead layer 21b, and the second conductive lead layer 21b at least partially or entirely covers the first conductive lead layer 21a in the length direction. The material of the first conductive lead layer 21a is the same as the material of the first electrode series 210 and the second electrode series 220, and the material of the second conductive lead layer 21b is metal, metal alloy, metal mixture or graphene, conductive polymer, etc.
In this embodiment, at least one of the conductive leads 21 has a first lead portion 21' and a second lead portion 21", the first lead portion 21' and the second lead portion 21" are located on opposite sides of the same first conductive pad 212 and are electrically connected to the first conductive pad 212, respectively, and the first lead portion 21' and the second lead portion 21 "are connected to two first electrode units 210a in the same first electrode string 210, respectively. As shown in fig. 2 and 3, which are schematic cross-sectional views of the panel structure 200 of fig. 1 along the directions A-A and B-B, respectively. The second conductive lead layer 21b covers the first conductive lead layer 21a in the first lead portion 21 'of the conductive lead 21 and does not cover the first conductive lead layer 21a in the second lead portion 21", the impedance of the first lead portion 21' and the second lead portion 21" being the same or close. In this embodiment, the first lead portion 21' and the second lead portion 21″ are defined as portions of the conductive lead 21 located in the second region 201 ab. In this embodiment, since the conductive lead includes a first conductive lead layer and at least a portion of the conductive lead further includes a second conductive lead layer formed on the first conductive lead layer, on one hand, the impedance of the conductive lead can be reduced, on the other hand, the impedance difference can be reduced, and the overall touch effect can be improved.
Specifically, the length of the first lead portion 21 'is greater than the length of the second lead portion 21", and the first lead portion 21' includes a first conductive lead layer 21a and a second conductive lead layer 21b formed over the first conductive lead layer 21a. The second lead portion 21 "includes only the first conductive lead layer 21a, and since the length of the first lead portion 21 'is greater than the length of the second lead portion 21", the impedance of the first conductive lead layer of the first lead portion 21' is greater than the impedance of the first conductive lead layer 21a of the second lead portion 21", and thus, the second conductive lead layer 21b is formed on the first conductive lead layer 21a of the first lead portion 21', the impedance difference caused by the different lengths of the first conductive lead layer 21a in the first lead portion 21' and the second lead portion 21" can be balanced, thereby improving the overall touch effect of the capacitive touch screen.
In another embodiment, the second conductive lead layer has a span that is less than the span of the first conductive lead layer, such that air bubbles are advantageously removed when a planar layer (OC) is subsequently applied over the panel structure; or the span of the second conductive lead layer is equal to the span of the first conductive lead layer, and the second conductive lead layer and the first conductive lead layer can be manufactured together in the same yellow light process or laser process; or the second conductive lead layer entirely covers the first conductive lead layer, i.e., such that the first conductive lead layer is not exposed at the first surface, the impedance of the conductive lead may be further reduced.
Fig. 4 is a schematic flow chart of a method for manufacturing the panel structure shown in fig. 1, where the manufacturing method at least includes the following steps:
step S01: providing a substrate with at least one first surface;
step S02: and forming a conductive lead group on the first surface of the substrate, wherein the conductive lead group at least comprises one conductive lead, the conductive lead comprises a first conductive lead layer, at least part of the conductive leads further comprise a second conductive lead layer, and the second conductive lead layer is formed on the first conductive lead layer and at least partially or completely covers the first conductive lead layer.
Between the steps S01 and S02, a step (not shown) of forming a functional layer on the first surface is further included, and the first conductive lead layer and the functional layer are manufactured together in the same process. The conductive lead group is connected with the functional layer, the material for manufacturing the conductive lead group is the same as the material for manufacturing the functional layer, and the conductive lead group and the functional layer are manufactured in the same yellow light process or laser process.
Specifically, the functional layer is a touch layer, and the touch layer at least comprises a plurality of first electrode serials and a plurality of second electrode serials, and the first electrode serials, the second electrode serials and the first conductive lead layer are manufactured together in the same process.
The above preferred embodiments of the capacitive touch panel and the method for manufacturing the same are not to be construed as limiting the scope of the invention, and those skilled in the art should understand that various modifications and substitutions can be made without departing from the spirit of the invention, and all such modifications and substitutions should be within the scope of the invention, i.e. the scope of the invention shall be defined by the appended claims.
Claims (8)
1. A panel structure, comprising at least:
a substrate having at least a first surface;
a set of conductive leads formed on the first surface of the substrate, the set of conductive leads including at least one conductive lead;
the conductive lead comprises a first conductive lead layer, at least part of the conductive lead further comprises a second conductive lead layer, and the second conductive lead layer is formed on the first conductive lead layer and at least partially or completely covers the first conductive lead layer in the length direction;
the panel structure also comprises a functional layer and at least one first conductive pad, wherein at least part of the functional layer is connected to the first conductive pad through the conductive lead, the functional layer is a touch layer and at least comprises a plurality of first electrode serials, the first electrode serials are arranged along a first direction, and the first electrode serials comprise a plurality of first electrode units which are arranged at intervals;
at least one of the conductive leads has a first lead portion and a second lead portion, the first lead portion and the second lead portion are located on opposite sides of the same first conductive pad and are respectively electrically connected with the first conductive pad, the first lead portion and the second lead portion are respectively connected to two of the first electrode units in the same first electrode series, the second conductive lead layer covers part of the first conductive lead layer in the first lead portion of the conductive lead and does not cover the first conductive lead layer in the second lead portion, and the impedance of the first lead portion and the impedance of the second lead portion are the same or are close to each other.
2. The panel structure of claim 1, wherein: the second conductive lead layer partially covers the first conductive lead layer in the length direction, and the impedance of the conductive lead of the part covered with the second conductive lead layer is the same as or similar to the impedance of the conductive lead of the part not covered with the second conductive lead layer.
3. The panel structure of claim 1, wherein: the length of the first lead portion is greater than the length of the second lead portion, and the impedance of the second conductive lead layer is less than the impedance of the first conductive lead layer.
4. The panel structure of claim 1, wherein: the first surface at least comprises a first area and a second area, the second area is at least positioned on one side of the first area and is adjacent to the first area, the functional layer is formed on the first surface where the first area is positioned, the conductive leads are formed on the first surface where the first area and the second area are positioned, the second conductive lead layer is formed on the conductive leads where the first lead part is positioned on the second area, and the span of the second conductive lead layer is smaller than or equal to the span of the first conductive lead layer, or the second conductive lead layer completely covers the first conductive lead layer.
5. The panel structure of claim 4, wherein: the panel structure further comprises a plurality of second conductive pads formed on the second area, the touch layer further comprises a plurality of second electrode serials, each second electrode serials are arranged continuously and along a second direction, each second electrode serial is connected to one second conductive pad, and a plurality of first electrode units in the same first electrode serials and one second electrode serials are mutually embedded and arranged in an insulating mode.
6. A panel structure manufacturing method at least comprises the following steps:
providing a substrate with at least one first surface;
forming at least one conductive lead group on the first surface of the substrate, wherein the conductive lead group at least comprises one conductive lead, the conductive lead comprises a first conductive lead layer, at least part of the conductive leads further comprise a second conductive lead layer, and the second conductive lead layer is formed on the first conductive lead layer and at least partially or completely covers the first conductive lead layer in the length direction;
the panel structure also comprises a functional layer and at least one first conductive pad, wherein at least part of the functional layer is connected to the first conductive pad through the conductive lead, the functional layer is a touch layer and at least comprises a plurality of first electrode serials, the first electrode serials are arranged along a first direction, and the first electrode serials comprise a plurality of first electrode units which are arranged at intervals;
at least one of the conductive leads has a first lead portion and a second lead portion, the first lead portion and the second lead portion are located on opposite sides of the same first conductive pad and are respectively electrically connected with the first conductive pad, the first lead portion and the second lead portion are respectively connected to two of the first electrode units in the same first electrode series, the second conductive lead layer covers part of the first conductive lead layer in the first lead portion of the conductive lead and does not cover the first conductive lead layer in the second lead portion, and the impedance of the first lead portion and the impedance of the second lead portion are the same or are close to each other.
7. The method of manufacturing a panel structure of claim 6, wherein: the method comprises the steps of forming a functional layer on the first surface, wherein the first conductive lead layer and the functional layer are manufactured together in the same process, the material for manufacturing the first conductive lead layer is the same as the material for manufacturing the functional layer, and the conductive lead group and the functional layer are manufactured in the same yellow light process or laser process.
8. The method of making a panel structure of claim 7, wherein: the functional layer is a touch layer, the touch layer comprises a plurality of first electrode serials arranged along a first direction and a plurality of second electrode serials arranged along a second direction, the first electrode serials comprise a plurality of first electrode units arranged at intervals, and a plurality of first electrode units in the same first electrode serials and one second electrode serials are mutually inlaid and arranged in an insulating manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410429632.XA CN105468212B (en) | 2014-08-28 | 2014-08-28 | Panel structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410429632.XA CN105468212B (en) | 2014-08-28 | 2014-08-28 | Panel structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105468212A CN105468212A (en) | 2016-04-06 |
| CN105468212B true CN105468212B (en) | 2023-05-09 |
Family
ID=55605985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410429632.XA Active CN105468212B (en) | 2014-08-28 | 2014-08-28 | Panel structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105468212B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106055171B (en) * | 2016-08-08 | 2019-02-12 | 京东方科技集团股份有限公司 | A kind of array substrate and its manufacturing method and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833405A (en) * | 2009-02-11 | 2010-09-15 | 统宝光电股份有限公司 | Capacitive touch sensor and manufacture method, display module and use its device |
| JP2012146134A (en) * | 2011-01-12 | 2012-08-02 | Dainippon Printing Co Ltd | Touch panel sensor and manufacturing method of touch panel sensor |
| CN102799327A (en) * | 2012-03-28 | 2012-11-28 | 友达光电股份有限公司 | Touch panel and manufacturing method thereof |
| CN103383612A (en) * | 2012-05-02 | 2013-11-06 | 香港商灿芯半导体有限公司 | Self capacitive type touch control device and operation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI489335B (en) * | 2012-08-09 | 2015-06-21 | Wistron Corp | Conductive substrate and touch panel |
-
2014
- 2014-08-28 CN CN201410429632.XA patent/CN105468212B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833405A (en) * | 2009-02-11 | 2010-09-15 | 统宝光电股份有限公司 | Capacitive touch sensor and manufacture method, display module and use its device |
| JP2012146134A (en) * | 2011-01-12 | 2012-08-02 | Dainippon Printing Co Ltd | Touch panel sensor and manufacturing method of touch panel sensor |
| CN102799327A (en) * | 2012-03-28 | 2012-11-28 | 友达光电股份有限公司 | Touch panel and manufacturing method thereof |
| CN103383612A (en) * | 2012-05-02 | 2013-11-06 | 香港商灿芯半导体有限公司 | Self capacitive type touch control device and operation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105468212A (en) | 2016-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10318055B2 (en) | Touch control panel and fabricating method for the same, touch control display screen | |
| TWI476656B (en) | Touch panel and manufacturing method thereof | |
| US9134828B2 (en) | Touch panel having a shielding structure and method of manufacturing the same | |
| US20160162070A1 (en) | Capacitive touch panel and display device | |
| US9268449B2 (en) | Touch panel | |
| CN104503617A (en) | Frame structure for touch screens, manufacturing method thereof, touch screen and display device | |
| TWI550483B (en) | Anti-static touch panel | |
| TW201102702A (en) | Capacitive touch panel | |
| KR102175699B1 (en) | Touch panel | |
| US8947399B2 (en) | Dual-substrate capacitive touch panel | |
| TWI585644B (en) | Touch panel and fabrication method thereof | |
| US20140225869A1 (en) | Touch panel | |
| US10039181B2 (en) | Touch-sensing electrode structure and method of manufacturing the same | |
| US20150060253A1 (en) | Decorative substrate and touch panel | |
| TW201519031A (en) | Touch panel and touch display panel | |
| KR20170064139A (en) | Touch panel | |
| TW201445390A (en) | Touch panel | |
| TW201445389A (en) | Transparent conductive film | |
| US20180188841A1 (en) | Touch screen and touch sensing assembly thereof | |
| KR20150045312A (en) | Touch panel | |
| US20130069892A1 (en) | Touch-sensitive device and touch-sensitive display device | |
| US9351400B1 (en) | Electrical connections between conductive contacts | |
| TWI597633B (en) | Touch panel capable of reducing exposure of etching wires | |
| CN105468212B (en) | Panel structure and manufacturing method thereof | |
| WO2016095609A1 (en) | Touch panel and manufacturing method therefor, and touch display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |