CN105463247B - One kind binding target alloy and its preparation method and application - Google Patents
One kind binding target alloy and its preparation method and application Download PDFInfo
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- CN105463247B CN105463247B CN201510876644.1A CN201510876644A CN105463247B CN 105463247 B CN105463247 B CN 105463247B CN 201510876644 A CN201510876644 A CN 201510876644A CN 105463247 B CN105463247 B CN 105463247B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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Abstract
The present invention relates to one kind binding target alloy and its preparation method and application, belong to field of material technology.Its formula rate is by weight, including 50 85 parts of tin, 5 30 parts of indium, 13 parts of zinc, 0.2 5 parts of gallium, 0.5 5 parts of aluminium, 0.5 3 parts of silver, 0.1 2 parts of neodymium, is prepared by fusing, the fusing of indium and gallium and the casting of tin slab fusing, aluminum shot fusing, neodymium fusing, silver and spelter and binds target alloy, uses it for binding target and backboard.The alloy that the present invention is prepared is not oxidizable, and below 2%, this alloy can be reclaimed and used after target is finished for binding loss every time；Adhesion is bound with this alloy by force, and it is neither too hard, nor too soft, and plasticity is good, can change with the shape when target varies with temperature contraction or expansion, also will not cross ambassador's ceramic target cracking because of stress；This alloy wellability, spreadability are good, and viscosity is high, are especially suitable for binding technique.
Description
Technical field
The present invention relates to one kind binding target alloy and its preparation method and application, belong to field of material technology.
Background technology
Many ceramic target fragility are very big, are used directly to magnetron sputtering and are easily caused cracking, cause target to scrap, and this is just needed
This production process is bound, target is adhered to titanium or copper coin（Or pipe）Above.To prevent target from coming off, the bonding plane of target
Product will reach more than 95%, it is desirable to which binding material has good wellability, spreadability, also to there is appropriate fusing point.It is bonded simultaneously
Layer needs good conduction, heat conductivility, and otherwise target will be unable to sputtering, or cause target to ftracture because cooling effect is bad
Even come off.At present, conventional adhesives is indium metal, and the function admirable of indium, the performance that can meet binding material therefor is wanted
Ask.But, reserves are rare on earth for indium, expensive, and indium is easily aoxidized after being melted down, can be caused in binding procedure
The loss of 5-15%, this just makes the cost of binding very high.
The content of the invention
The purpose of patent of the present invention is to overcome the deficiencies in the prior art, there is provided a kind of target binding is with alloy come generation
For indium, its is with low cost, and abundant raw material is nontoxic to human body, and binds excellent effect, can effectively improve target binding
Yield rate, reduces cost.
According to the technical scheme that the present invention is provided, one kind binding target alloy, formula rate is by weight：Tin 50-
It is 85 parts, indium 5-30 parts, zinc 1-3 parts, gallium 0.2-5 parts, aluminium 0.5-5 parts, silver-colored 0.5-3 parts, neodymium 0.1-2 parts.
It is described to bind 180-330 DEG C of target alloy melting point, resistivity 5-12.6 μ Ω cm, thermal conductivity 73.2-
200W/ (mK), surface tension 3-8 × 10-2N/m, thermal coefficient of expansion 10-20 × 10-6/℃。
The binding target alloy, formula rate is by weight：Tin 60-65 parts, indium 28-30 parts, zinc 2-3 parts, gallium
It is 0.8-1 parts, aluminium 0.5-0.8 parts, silver-colored 0.3-0.6 parts, neodymium 0.7-0.8 parts.
The performance of alloy：180-200 DEG C of fusing point, resistivity 7-9.5 μ Ω cm ,-the 90W/ of thermal conductivity 75 (mK),
Surface tension 5.6-7.0 × 10-2N/m, thermal coefficient of expansion 13-16 × 10-6/℃。
The binding target alloy, formula rate is by weight：Tin 68-71 parts, indium 22-25 parts, zinc 2-3 parts, gallium
It is 0.8-1 parts, aluminium 0.5-0.8 parts, silver-colored 0.3-0.6 parts, neodymium 0.7-0.8 parts.
The performance of alloy：200-220 DEG C of fusing point, resistivity 8-12.6 μ Ω cm ,-the 92W/ of thermal conductivity 75 (mK),
Surface tension 4-7.2 × 10-2N/m, thermal coefficient of expansion 12-16 × 10-6/℃。
The binding target alloy, formula rate is by weight：Tin 75-78 parts, indium 15-17 parts, zinc 1-1.5 parts,
It is gallium 0.5-0.6 parts, aluminium 0.9-1.1 parts, silver-colored 2.5-3 parts, neodymium 0.9-1.0 parts.
The performance of alloy：250-270 DEG C of fusing point, resistivity 4-9 μ Ω cm, thermal conductivity 90-110W/ (mK), table
Face tension force 5-7.8 × 10-2N/m, thermal coefficient of expansion 12-18 × 10-6/℃。
The binding target alloy, formula rate is by weight：Tin 80-85 parts, indium 10-13 parts, zinc 1-1.2 parts,
It is gallium 0.2-0.3 parts, aluminium 2-3 parts, silver-colored 1-1.2 parts, neodymium 1.1-1.5 parts.
The performance of alloy：300-330 DEG C of fusing point, resistivity 6-11 μ Ω cm, thermal conductivity 80-110W/ (mK), table
Face tension force 6.2-8.0 × 10-2N/m, thermal coefficient of expansion 13-18 × 10-6/℃。
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To being put into load weighted tin slab 60-65 parts in crucible, tin slab is melted with the power of 20-40kw
Liquation is obtained, fusion temperature is controlled to 280-300 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Step is added by load weighted aluminum shot 0.5-5 parts（1）In gained liquation, with the work(of 40-70kw
Rate is rapidly heated, and is warming up to 600 DEG C, and aluminum shot is completely melt, cools to 350 DEG C with the power of 5-15kw afterwards；
（3）Neodymium melts：Load weighted neodymium 0.1-2 parts is wrapped up with tinfoil, step is pressed in graphite cover（2）Gained liquation
In, with 340-360 DEG C of stabilization of power keeping temperature of 5-15kw, by 4-6min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：By load weighted silver-colored 0.5-3 parts and spelter 1-3 parts addition step（3）Gained liquation,
All melted with the power of 40-70kw, control temperature is not higher than 400 DEG C, and 330-350 DEG C is reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）28-30 parts and gallium 0.2-5 parts of indium is added in gained liquation, 30-50kw is used
Power stir and melt, control temperature be no more than 450 DEG C, after 4-6min stop heating；Afterwards molten surface is pulled out with spoon
Slag；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The application of the binding target alloy, step is：
（1）Fusing：It is first turned on binding the temperature control instrument of platform, temperature is set as 230-360 DEG C, starts to warm up,
Target and backboard to be heated is placed on heating platform, heats it；After reaching said temperature, into keeping warm mode, tying up
Targeting timber-used solder is placed on above target and backboard, because the effect binding target solder of temperature can gradually melt
Change, or binding target is cut into small pieces with solder；
（2）Smear：Step（1）The binding target solder of fusing is uniformly coated in the upper table of target and backboard
Face, is shaken with ultrasonic pen and smeared；After solder is coated, the one side that target and backboard have binding target solder is fitted in
Together, it is compacted with briquetting, by 80-100 DEG C of the desired temperature reduction of temperature control instrument, while taking the fast prompt drop of mode of blowing
Temperature so that binding target is solidified with solder, and target and backboard are firmly bonded；The target bound is removed, is carried out
Next round is operated.
Beneficial effects of the present invention：The alloy that the present invention is prepared is not oxidizable, and binding every time is lost below 2%, target
This alloy can be reclaimed and used after timber-used is complete；Bind that adhesion is strong and neither too hard, nor too soft with this alloy, plasticity is good, target with
Can with the shape change during temperature change contraction or expansion, also will not cross ambassador's ceramic target cracking because of stress；This alloy infiltrates
Property, spreadability are good, and viscosity is high, is especially suitable for binding technique.
Specific embodiment
Embodiment 1
Alloy formula ratio by mass part meter：60 parts of tin, 30 parts of indium, 2 parts of zinc, 2.5 parts of gallium, 4 parts of aluminium, 0.8 part of silver, neodymium
0.7 part.
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To load weighted tin slab is put into crucible, tin slab is melted with the power of 20kw obtains liquation,
Fusion temperature is controlled to 280 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Load weighted aluminum shot is added into step（1）In gained liquation, it is rapidly heated with the power of 40kw,
600 DEG C are warming up to, aluminum shot is completely melt, cool to 350 DEG C with the power of 5kw afterwards；
（3）Neodymium melts：Load weighted neodymium is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, 5kw is used
340 DEG C of stabilizations of power keeping temperature, by 4min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：Load weighted silver and spelter are added into step（3）Gained liquation, with the power of 40kw
All fusings, control temperature is not higher than 400 DEG C, and 330 DEG C are reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）Indium and gallium are added in gained liquation, are stirred and is melted with the power of 30kw,
Control temperature is no more than 450 DEG C, and heating is stopped after 4min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The performance of alloy：180 DEG C of fusing point, μ Ω cm, thermal conductivity 135W/ (mK) of resistivity 7, surface tension 5.6
×10-2N/m, thermal coefficient of expansion 12 × 10-6/℃。
Embodiment 2
Alloy formula ratio by mass part meter：65 parts of tin, 28 parts of indium, 3 parts of zinc, 1.1 parts of gallium, 1.6 parts of aluminium, 0.5 part of silver, neodymium
0.8 part.
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To load weighted tin slab is put into crucible, tin slab is melted with the power of 40kw obtains liquation,
Fusion temperature is controlled to 300 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Load weighted aluminum shot is added into step（1）In gained liquation, it is rapidly heated with the power of 70kw,
600 DEG C are warming up to, aluminum shot is completely melt, cool to 350 DEG C with the power of 15kw afterwards；
（3）Neodymium melts：Load weighted neodymium is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, 15kw is used
360 DEG C of stabilizations of power keeping temperature, by 6min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：Load weighted silver and spelter are added into step（3）Gained liquation, with the power of 70kw
All fusings, control temperature is not higher than 400 DEG C, and 350 DEG C are reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）Indium and gallium are added in gained liquation, are stirred and is melted with the power of 50kw,
Control temperature is no more than 450 DEG C, and heating is stopped after 6min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The performance of alloy：200 DEG C of fusing point, μ Ω cm, thermal conductivity 125W/ (mK) of resistivity 7.5, surface tension
4.0×10-2N/m, thermal coefficient of expansion 13 × 10-6/℃。
Embodiment 3
Alloy formula ratio by mass part meter：68 parts of tin, 25 parts of indium, 2 parts of zinc, 0.8 part of gallium, 2.5 parts of aluminium, 1.0 parts of silver,
0.7 part of neodymium.
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To load weighted tin slab is put into crucible, tin slab is melted with the power of 30kw obtains liquation,
Fusion temperature is controlled to 290 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Load weighted aluminum shot is added into step（1）In gained liquation, quickly risen with the power of 40-70kw
Temperature, is warming up to 600 DEG C, and aluminum shot is completely melt, cools to 350 DEG C with the power of 10kw afterwards；
（3）Neodymium melts：Load weighted neodymium is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, 10kw is used
340-360 DEG C of stabilization of power keeping temperature, by 5min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：Load weighted silver and spelter are added into step（3）Gained liquation, with the power of 50kw
All fusings, control temperature is not higher than 400 DEG C, and 340 DEG C are reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）Indium and gallium are added in gained liquation, are stirred and is melted with the power of 40kw,
Control temperature is no more than 450 DEG C, and heating is stopped after 5min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The performance of alloy：210 DEG C of fusing point, μ Ω cm, thermal conductivity 140W/ (mK) of resistivity 6.8, surface tension 5.3
×10-2N/m, thermal coefficient of expansion 14 × 10-6/℃。
Embodiment 4
Alloy formula ratio by mass part meter：71 parts of tin, 22 parts of indium, 1.0 parts of zinc, 0.3 part of gallium, 4 parts of aluminium, 0.9 part of silver,
0.8 part of neodymium.
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To load weighted tin slab is put into crucible, tin slab is melted with the power of 25kw obtains liquation,
Fusion temperature is controlled to 285 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Load weighted aluminum shot is added into step（1）In gained liquation, it is rapidly heated with the power of 60kw,
600 DEG C are warming up to, aluminum shot is completely melt, cool to 350 DEG C with the power of 8kw afterwards；
（3）Neodymium melts：Load weighted neodymium is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, 8kw is used
345 DEG C of stabilizations of power keeping temperature, by 5min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：Load weighted silver and spelter are added into step（3）Gained liquation, with the power of 45kw
All fusings, control temperature is not higher than 400 DEG C, and 335 DEG C are reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）Indium and gallium are added in gained liquation, are stirred and is melted with the power of 35kw,
Control temperature is no more than 450 DEG C, and heating is stopped after 5min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The performance of alloy：220 DEG C of fusing point, μ Ω cm, thermal conductivity 110W/ (mK) of resistivity 6.9, surface tension 6.8
×10-2N/m, thermal coefficient of expansion 16 × 10-6/℃。
Embodiment 5
Alloy formula ratio by mass part meter：75 parts of tin, 17 parts of indium, 1.1 parts of zinc, 0.5 part of gallium, 4 parts of aluminium, 1.5 parts of silver,
0.9 part of neodymium.
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To load weighted tin slab is put into crucible, tin slab is melted with the power of 35kw obtains liquation,
Fusion temperature is controlled to 295 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Load weighted aluminum shot is added into step（1）In gained liquation, quickly risen with the power of 40-70kw
Temperature, is warming up to 600 DEG C, and aluminum shot is completely melt, cools to 350 DEG C with the power of 12kw afterwards；
（3）Neodymium melts：Load weighted neodymium is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, 12kw is used
355 DEG C of stabilizations of power keeping temperature, by 6min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：Load weighted silver and spelter are added into step（3）Gained liquation, with the power of 65kw
All fusings, control temperature is not higher than 400 DEG C, and 345 DEG C are reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）Indium and gallium are added in gained liquation, are stirred and is melted with the power of 45kw,
Control temperature is no more than 450 DEG C, and heating is stopped after 6min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The performance of alloy：250 DEG C of fusing point, μ Ω cm, thermal conductivity 120W/ (mK) of resistivity 6.5, surface tension
7.2×10-2N/m, thermal coefficient of expansion 16.5 × 10-6/℃。
Embodiment 6
Alloy formula ratio by mass part meter：78 parts of tin, 14 parts of indium, 1 part of zinc, 0.5 part of gallium, 3.5 parts of aluminium, 2 parts of silver, neodymium
1.0 parts.
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To load weighted tin slab is put into crucible, tin slab is melted with the power of 20kw obtains liquation,
Fusion temperature is controlled to 300 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Load weighted aluminum shot is added into step（1）In gained liquation, it is rapidly heated with the power of 70kw,
600 DEG C are warming up to, aluminum shot is completely melt, cool to 350 DEG C with the power of 5kw afterwards；
（3）Neodymium melts：Load weighted neodymium is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, 15kw is used
340 DEG C of stabilizations of power keeping temperature, by 6min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：Load weighted silver and spelter are added into step（3）Gained liquation, with the power of 40kw
All fusings, control temperature is not higher than 400 DEG C, and 350 DEG C are reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）Indium and gallium are added in gained liquation, are stirred and is melted with the power of 45kw,
Control temperature is no more than 450 DEG C, and heating is stopped after 6min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The performance of alloy：260 DEG C of fusing point, μ Ω cm, thermal conductivity 115W/ (mK) of resistivity 6.4, surface tension 7.8
×10-2N/m, thermal coefficient of expansion 16 × 10-6/℃。
Embodiment 7
Alloy formula ratio by mass part meter：81 parts of tin, 10 parts of indium, 1 part of zinc, 0.2 part of gallium, 4.5 parts of aluminium, 2.2 parts of silver,
1.1 parts of neodymium.
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To load weighted tin slab is put into crucible, tin slab is melted with the power of 40kw obtains liquation,
Fusion temperature is controlled to 280 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Load weighted aluminum shot is added into step（1）In gained liquation, it is rapidly heated with the power of 70kw,
600 DEG C are warming up to, aluminum shot is completely melt, cool to 350 DEG C with the power of 5kw afterwards；
（3）Neodymium melts：Load weighted neodymium is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, 5kw is used
360 DEG C of stabilizations of power keeping temperature, by 6min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：Load weighted silver and spelter are added into step（3）Gained liquation, with the power of 70kw
All fusings, control temperature is not higher than 400 DEG C, and 330 DEG C are reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）Indium and gallium are added in gained liquation, are stirred and is melted with the power of 35kw,
Control temperature is no more than 450 DEG C, and heating is stopped after 6min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The performance of alloy：300 DEG C of fusing point, μ Ω cm, thermal conductivity 120W/ (mK) of resistivity 6, surface tension 7.8
×10-2N/m, thermal coefficient of expansion 15.5 × 10-6/℃。
Embodiment 8
Alloy formula ratio by mass part meter：85 parts of tin, 8 parts of indium, 1.2 parts of zinc, 0.2 part of gallium, 1.3 parts of aluminium, 2.8 parts of silver,
1.5 parts of neodymium.
The preparation method of the binding target alloy, step is：
（1）Tin slab melts：To load weighted tin slab is put into crucible, tin slab is melted with the power of 35kw obtains liquation,
Fusion temperature is controlled to 285 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Load weighted aluminum shot is added into step（1）In gained liquation, it is rapidly heated with the power of 70kw,
600 DEG C are warming up to, aluminum shot is completely melt, cool to 350 DEG C with the power of 5kw afterwards；
（3）Neodymium melts：Load weighted neodymium is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, 15kw is used
340 DEG C of stabilizations of power keeping temperature, by 6min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：Load weighted silver and spelter are added into step（3）Gained liquation, with the power of 68kw
All fusings, control temperature is not higher than 400 DEG C, and 335 DEG C are reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）Indium and gallium are added in gained liquation, are stirred and is melted with the power of 38kw,
Control temperature is no more than 450 DEG C, and heating is stopped after 6min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification.
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*
100mm。
The performance of alloy：330 DEG C of fusing point, μ Ω cm, thermal conductivity 110W/ (mK) of resistivity 5.8, surface tension 8.0
×10-2N/m, thermal coefficient of expansion 16 × 10-6/℃。
Application Example
Embodiment 1-8 gained alloy pigs are used to bind target, are comprised the following steps that：
（1）Fusing：It is first turned on binding the temperature control instrument of platform, temperature is set as 230-360 DEG C, starts to warm up,
Target and backboard to be heated is placed on heating platform, heats it；After reaching said temperature, into keeping warm mode, tying up
Targeting timber-used solder is placed on above target and backboard, because the effect binding target solder of temperature can gradually melt
Change, or binding target is cut into small pieces with solder；
（2）Smear：Step（1）The binding target solder of fusing is uniformly coated in the upper table of target and backboard
Face, is shaken with ultrasonic pen and smeared；After solder is coated, the one side that target and backboard have binding target solder is fitted in
Together, it is compacted with briquetting, by 80-100 DEG C of the desired temperature reduction of temperature control instrument, while taking the fast prompt drop of mode of blowing
Temperature so that binding target is solidified with solder, and target and backboard are firmly bonded；The target bound is removed, is carried out
Next round is operated.
Claims (6)
1. it is a kind of to bind target alloy, it is characterized in that formula rate is by weight：Tin 50-85 parts, indium 5-30 parts, zinc 1-3
Part, it is gallium 0.2-5 parts, aluminium 0.5-5 parts, silver-colored 0.5-3 parts, neodymium 0.1-2 parts；By tin slab melt, aluminum shot melt, neodymium melt, silver and
Fusing, the fusing of indium and gallium and the casting of spelter prepare binding target alloy, use it for binding target and backboard；
It is described to bind 180-330 DEG C of target alloy melting point, resistivity 5-12.6 μ Ω cm, thermal conductivity 73.2-200W/
(mK), surface tension 3-8 × 10-2N/m, thermal coefficient of expansion 10-20 × 10-6/℃。
2. target alloy is bound as claimed in claim 1, it is characterized in that formula rate is by weight：Tin 60-65 parts, indium
It is 28-30 parts, zinc 2-3 parts, gallium 0.8-1 parts, aluminium 0.5-0.8 parts, silver-colored 0.3-0.6 parts, neodymium 0.7-0.8 parts；By tin slab fusing, aluminium
Fusing, the fusing of indium and gallium and the casting of grain fusing, neodymium fusing, silver and spelter prepare binding target alloy, are used
In binding target and backboard.
3. target alloy is bound as claimed in claim 1, it is characterized in that formula rate is by weight：Tin 68-71 parts, indium
It is 22-25 parts, zinc 2-3 parts, gallium 0.8-1 parts, aluminium 0.5-0.8 parts, silver-colored 0.3-0.6 parts, neodymium 0.7-0.8 parts；By tin slab fusing, aluminium
Fusing, the fusing of indium and gallium and the casting of grain fusing, neodymium fusing, silver and spelter prepare binding target alloy, are used
In binding target and backboard.
4. target alloy is bound as claimed in claim 1, it is characterized in that formula rate is by weight：Tin 75-78 parts, indium
It is 15-17 parts, zinc 1-1.5 parts, gallium 0.5-0.6 parts, aluminium 0.9-1.1 parts, silver-colored 2.5-3 parts, neodymium 0.9-1.0 parts；Melted by tin slab,
Fusing, the fusing of indium and gallium and the casting of aluminum shot fusing, neodymium fusing, silver and spelter prepare binding target alloy, by it
For binding target and backboard.
5. target alloy is bound as claimed in claim 1, it is characterized in that formula rate is by weight：Tin 80-85 parts, indium
It is 10-13 parts, zinc 1-1.2 parts, gallium 0.2-0.3 parts, aluminium 2-3 parts, silver-colored 1-1.2 parts, neodymium 1.1-1.5 parts；By tin slab fusing, aluminum shot
Fusing, the fusing of indium and gallium and the casting of fusing, neodymium fusing, silver and spelter prepare binding target alloy, use it for
Binding target and backboard.
6. the preparation method of target alloy is bound described in claim 1, it is characterized in that step is：
（1）Tin slab melts：To being put into load weighted tin slab 60-65 parts in crucible, tin slab is melted with the power of 20-40kW is obtained
Liquation, fusion temperature is controlled to 280-300 DEG C, and fusing time is 3min；
（2）Aluminum shot melts：Step is added by load weighted aluminum shot 0.5-5 parts（1）In gained liquation, the power with 40-70kW is fast
Speed is heated up, and is warming up to 600 DEG C, and aluminum shot is completely melt, cools to 350 DEG C with the power of 5-15kW afterwards；
（3）Neodymium melts：Load weighted neodymium 0.1-2 parts is wrapped up with tinfoil, step is pressed in graphite cover（2）In gained liquation, use
340-360 DEG C of stabilization of power keeping temperature of 5-15kW, by 4-6min, neodymium takes out graphite cover after all melting；
（4）The fusing of silver and spelter：By load weighted silver-colored 0.5-3 parts and spelter 1-3 parts addition step（3）Gained liquation, uses 40-
The power of 70kW all melts, and control temperature is not higher than 400 DEG C, and 330-350 DEG C is reduced the temperature to afterwards；
（5）The fusing of indium and gallium：In step（4）28-30 parts and gallium 0.2-5 parts of indium is added in gained liquation, with the work(of 30-50kW
Rate is stirred and melted, and control temperature is no more than 450 DEG C, and heating is stopped after 4-6min；Pull the slag of molten surface out with spoon afterwards；
（6）Casting：By step（5）Gained liquation is cast into alloy pig up to specification；
Step（2）The aluminum shot diameter 1mm, length 10mm；Step（6）The alloy pig specification is 20mm*20mm*100mm.
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| CN101341266A (en) * | 2005-08-30 | 2009-01-07 | 美国铟泰公司 | Technique for increasing the compliance of tin-indium solders |
| CN101351297A (en) * | 2005-09-26 | 2009-01-21 | 美国铟泰公司 | Low melting temperature compliant solders |
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| DE102006047764A1 (en) * | 2006-10-06 | 2008-04-10 | W.C. Heraeus Gmbh | Lead-free soft solder with improved properties at temperatures> 150 ° C |
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| CN101245427B (en) * | 2008-03-26 | 2010-06-16 | 戴国水 | Leadless metal spraying material added with alloy element |
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