CN105458701A

CN105458701A - Metal shell assembly mould for electronic packaging

Info

Publication number: CN105458701A
Application number: CN201610019378.5A
Authority: CN
Inventors: 王炜
Original assignee: YIXINGCITY JITAI ELECTRONICS CO Ltd
Current assignee: YIXINGCITY JITAI ELECTRONICS CO Ltd
Priority date: 2016-01-13
Filing date: 2016-01-13
Publication date: 2016-04-06

Abstract

The invention relates to a mould which is suitable for assembling a lead wire and a glass insulator of a metal shell, in particular to a metal shell assembly mould for electronic packaging. The metal shell assembly mould comprises a first screening needle mould, a second screening needle mould, a first screening ball mould, a second screening ball mould and a sintering mould, wherein holes for perpendicularly placing the lead wire are formed in the first screening needle mould; assembly ball holes are formed in the second screening needle mould; needle mould holes are formed below the assembly ball holes, and the needle mould holes are sealed by a supporting plate; ball holes are formed in the first screening ball mould, and the second screening ball mould is provided with channels which are corresponding to the ball holes of the first screening ball mould; and the sintering mould is provided with a mould cavity for placing the lead wire and the glass insulator. The metal shell assembly mould for electronic packaging can be used for assembling required parts on the whole sintering mould once, so that the assembly time is shortened, and the production efficiency is improved; and meanwhile, the parts are limited by the mould, so that dropping and slipping phenomena during assembly are avoided.

Description

A kind of metal shell for electronic packaging assembling mould

Technical field

The present invention relates to a kind of mould, be applicable to the lead-in wire of metal shell and the mould of glass insulator assembling, be specially a kind of metal shell for electronic packaging assembling mould.

Background technology

Existing metal shell for electronic packaging assembling mode is by metal shell, glass insulator and lead-in wire being arranged on piecemeal on corresponding sintering mould manually.Existing assembling mode, parts are all assembled one by one by manual, and spended time is longer, and production efficiency is low; Element size is less, with inconvenient during tweezers gripping, easily slip out of the hand and drops.

Summary of the invention

For above-mentioned technical problem, the invention provides a kind of metal shell for electronic packaging assembling mould, save installation time, enhance productivity.Concrete technical scheme is:

A kind of metal shell for electronic packaging assembling mould, comprises the first sieve needle mould, the second sieve needle mould, the first sieve pearl mould, the second sieve pearl mould and sintering mould; The hole for vertically placing lead-in wire is had in the first described sieve needle mould; Have the assembling hole of bead in second sieve needle mould, assembling is needle mould hole below the hole of bead, and needle mould hole is sealed by supporting plate; Described first sieve pearl mould has the hole of bead, the passage that the second sieve pearl mould has the hole of bead of sieving pearl mould with first corresponding; Sintering mould has the die cavity for placing lead-in wire and glass insulator.

Coordinated with Sewing box by first sieve needle mould, then turn, lead-in wire drops in the hole of the first sieve needle mould; Remove Sewing box, supporting plate, the second sieve needle mould, the first sieve needle mould are closely cooperated successively from top to bottom, then integrated overturn is come, lead-in wire falls in the needle mould hole of the second sieve needle mould; Meanwhile, will store up pearl box and first and sieve pearl mould and coordinate, the first sieve pearl mould and second sieves pearl mould and staggers and place, and is sieved by glass insulator in the hole of bead of the first sieve pearl mould; Remove storage pearl box, be filled to below the second sieve pearl mould by the second sieve needle mould, mobile first sieve pearl mould makes glass insulator fall into the assembling hole of bead of the second sieve needle mould through the second sieve pearl mould; Remove the first sieve pearl mould and the second sieve pearl mould, be arranged on by sintering mould on the second sieve needle mould, upset makes lead-in wire and glass insulator fall in the die cavity of sintering mould simultaneously.

Parts required on whole sintering mould disposablely can be assembled, shorten installation time, enhance productivity by a kind of metal shell for electronic packaging assembling mould provided by the invention; Parts are all spacing by mould simultaneously, can not slip out of the hand during assembling, the phenomenon of landing.

Accompanying drawing explanation

Fig. 1 is that the present invention first sieves needle mould structural representation;

Fig. 2 is that the present invention first sieves needle mould and the second sieve needle mould assembly structure schematic diagram;

Fig. 3 is the first sieve pearl mould of the present invention and the second sieve pearl mould assembly structure schematic diagram;

Fig. 4 is the first sieve pearl mould of the present invention, the second sieve pearl mode structure and the second sieve needle mould assembly structure schematic diagram;

Fig. 5 is the second sieve needle mould and sintering mould assembly structure schematic diagram.

Detailed description of the invention

Accompanying drawings the specific embodiment of the present invention.

As shown in Fig. 1 to Fig. 5, a kind of metal shell for electronic packaging assembling mould, comprises the first sieve needle mould 2, second and sieves needle mould 3, first sieve pearl mould 6, second sieve pearl mould 7 and sintering mould 8; The hole 21 for vertically placing lead-in wire is had in the first described sieve needle mould 2; Have the assembling hole of bead 32 in second sieve needle mould 3, assembling is needle mould hole 31 below the hole of bead 32, and needle mould hole 31 is sealed by supporting plate 4; The passage 71 that described first sieve pearl mould 6 has the hole of bead 61, second to sieve pearl mould 7 to have the hole of bead 61 of sieving pearl mould 6 with first corresponding; Sintering mould 8 has the die cavity 81 for placing lead-in wire and glass insulator.

(1) as Fig. 1, the first sieve needle mould 2 is closely cooperated by pin hole with Sewing box 1, then turn and utilize the Action of Gravity Field of lead-in wire self that lead-in wire is dropped to make the face of taking the lead of lead-in wire all upward in the hole 21 of the first sieve needle mould 2;

(2) as Fig. 2, remove Sewing box 1, successively supporting plate 4, second is sieved needle mould 3, first from top to bottom and sieve needle mould 2 and closely cooperate, then in the integrated overturn needle mould hole 31 of coming that lead-in wire is taken the lead and face down to fall to the second sieve needle mould 3;

(3) as Fig. 3, storage pearl box 5 and first are sieved pearl mould 6 and closely cooperates, the first sieve pearl mould 6 and second sieves pearl mould 7 and staggers and place, and is sieved by glass insulator in the hole of bead 61 of the first sieve pearl mould 6;

(4) as Fig. 4, remove storage pearl box 5, be filled to below the second sieve pearl mould 7 by the second sieve needle mould 3, mobile first sieve pearl mould 6 makes glass insulator fall into the assembling hole of bead 32 of the second sieve needle mould 3 through the second sieve pearl mould 7;

(5) as Fig. 5, remove the first sieve pearl mould 6 and the second sieve pearl mould 7, sintering mould 8 is installed above the second sieve needle mould 3, then integrated overturn makes lead-in wire and glass insulator fall in the die cavity 81 of sintering mould 8 simultaneously.

Claims

1. a metal shell for electronic packaging assembling mould, is characterized in that, comprises the first sieve needle mould (2), the second sieve needle mould (3), the first sieve pearl mould (6), the second sieve pearl mould (7) and sintering mould (8); The hole (21) for vertically placing lead-in wire is had in the first described sieve needle mould (2); Have the assembling hole of bead (32) in second sieve needle mould (3), the assembling hole of bead (32) below is needle mould hole (31), and needle mould hole (31) are sealed by supporting plate (4); Described first sieve pearl mould (6) has the hole of bead (61), the passage (71) that the second sieve pearl mould (7) has the hole of bead (61) of sieving pearl mould (6) with first corresponding; Sintering mould (8) has the die cavity (81) for placing lead-in wire and glass insulator.