CN105437449A - Injection molding method of liquid silicone rubber and electronic device with display screen - Google Patents
Injection molding method of liquid silicone rubber and electronic device with display screen Download PDFInfo
- Publication number
- CN105437449A CN105437449A CN201410415541.0A CN201410415541A CN105437449A CN 105437449 A CN105437449 A CN 105437449A CN 201410415541 A CN201410415541 A CN 201410415541A CN 105437449 A CN105437449 A CN 105437449A
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- display screen
- low temperature
- glass cover
- silica gel
- injecting products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides an injection molding method of liquid silicone rubber and an electronic device with display screen. The method comprises the following steps: coating mould injection molding Overmolding glue on a product to be treated by injection molding; after curing molding of the glue, carrying out low temperature injection molding with liquid silicone rubber for the product to be treated by injection molding, wherein the low temperature is 25-80 DEG C. The electronic device with display screen comprises a device housing and a display module, the display module comprises a glass cover plate and a display screen, the display module is treated by low temperature injection molding with liquid silicone rubber, wherein the display screen and the glass cover plate are bonded, and the width of the glass cover plate is less than the width of the display screen; the edge of the display screen is fixed to the device housing. The width of the glass cover plate is less than the width of the display screen, the edge of the display screen is fixed by the device housing, and shielding regions do not need to be printed at the two sides of the glass cover plate; Low temperature injection molding with liquid silicone rubber is carried out for the electronic device at a low temperature environment, so that burning-out of the electronic device is prevented, and adhesion strength between the silicone rubber and the electronic device parts is guaranteed.
Description
Technical field
The present invention relates to field of terminal technology, particularly relate to the electronic equipment of a kind of liquid-state silicon gel injection moulding process and band display screen.
Background technology
At present, in terminal device manufacture process, the trial of the existing integrated injection molding to silica gel and glass.But, because the temperature of current silica gel injection moulding is generally 180 DEG C, can not for being afraid of the product of high temperature; In addition, silica gel curing rate comparatively slow (conventional at about 10 minutes), affects production capacity, and especially easily comes off, cause the problem such as assembly failure and apparent flaws.
Summary of the invention
The embodiment of the present invention proposes the electronic equipment of a kind of liquid-state silicon gel injection moulding process and band display screen, solves the problem that silica gel injection moulding in prior art cannot be used for being afraid of high-temperature product.
Embodiments provide a kind of liquid-state silicon gel injection moulding process, comprise the steps:
To treat that injecting products coats Overmolding glue;
After glue curing is shaping, treat that injecting products carries out the injection moulding of low temperature liquid silica gel to described, low temperature is 25 DEG C ~ 80 DEG C.
Beneficial effect is as follows:
The technical scheme that the embodiment of the present invention provides, carries out the injection moulding of low temperature liquid silica gel by treating injecting products, can realize the silica gel injection moulding to the product being afraid of high temperature.Under the environment of low temperature, both ensure that not burn out and treated injecting products, and in turn ensure that silica gel and treat the adhesion strength between injecting products parts, guarantee product quality and performance.
Embodiments provide a kind of electronic equipment of the band display screen utilizing above-mentioned liquid-state silicon gel injection moulding process to make, comprise apparatus casing and display module, display module comprises glass cover-plate and display screen, and this display module utilizes above-mentioned liquid-state silicon gel injection moulding process injection molded, wherein:
Display screen and glass cover-plate bond, and the width of glass cover-plate is less than the width of display screen;
The edge of display screen is fixed on apparatus casing.
Beneficial effect is as follows:
The technical scheme that the embodiment of the present invention provides, the width of the ratio display screen done by the width of glass cover-plate is little, the edge of fixing display screen is gone to by apparatus casing, abandon the mode of being removed fixing display screen in prior art by glass cover-plate, thus no longer need, at the both sides of glass cover-plate printing occlusion area, the viewing area of equipment to be narrowed to the outer peripheral distance in equipment both sides.
Accompanying drawing explanation
Below with reference to accompanying drawings specific embodiments of the invention are described, wherein:
Fig. 1 shows the schematic flow sheet that in the embodiment of the present invention, liquid-state silicon gel injection moulding process is implemented;
Fig. 2 shows liquid-state silicon gel injection moulding in the embodiment of the present invention and makes enforcement schematic diagram;
Fig. 3 shows liquid-state silicon gel injection moulding in the embodiment of the present invention and makes another schematic diagram implemented;
Fig. 4 shows liquid-state silicon gel injection moulding in the embodiment of the present invention and makes another schematic diagram implemented;
Fig. 5 shows the structural representation of the cross section of the electronic equipment with display screen in the embodiment of the present invention;
Fig. 6 shows the structure for amplifying schematic diagram of electronic equipment cross section in the embodiment of the present invention;
Fig. 7 shows electronic equipment in the embodiment of the present invention and makes enforcement schematic diagram;
Fig. 8 shows electronic equipment in the embodiment of the present invention and makes another schematic diagram implemented;
Fig. 9 shows electronic equipment in the embodiment of the present invention and makes another schematic diagram implemented;
Figure 10 shows electronic equipment in the embodiment of the present invention and to complete schematic diagram.
Detailed description of the invention
Clearly understand to make technical scheme of the present invention and advantage, below in conjunction with accompanying drawing, exemplary embodiment of the present invention is described in more detail, obviously, described embodiment is only a part of embodiment of the present invention, instead of all embodiments is exhaustive.And when not conflicting, the embodiment in this explanation and the feature in embodiment can be combined with each other.
Inventor notices in invention process:
For the display module (LCM, LiquidCrystalDisplayModule) of liquid crystal display, existing LCM can bearing temperature and when ensureing product quality, ordinary temperature is 80 degrees Celsius; And touch-screen (TP, TouchPanel) is at present also because there is circuit the inside, can not bear too high temperature.But current used silica gel injection temperature is generally 180 DEG C.Therefore, the silica gel injection molding manner that a kind of temperature is lower is badly in need of.
For above-mentioned deficiency, the embodiment of the present invention proposes a kind of liquid-state silicon gel injection moulding process, is described below.
Fig. 1 shows the schematic flow sheet that in the embodiment of the present invention, liquid-state silicon gel injection moulding process is implemented, and as shown in the figure, can comprise the steps:
Step 101, will treat that injecting products coats Overmolding glue;
Step 102, treat injecting products carry out the injection moulding of low temperature liquid silica gel after described glue curing is shaping, the temperature of low temperature is 25 DEG C ~ 80 DEG C.
Liquid-state silicon gel (LSR, LiquidSiliconeRubber) is a kind of flexible thermosetting material of nontoxic, heat-resisting, high restoration.Liquid-state silicon gel injection moulding process is generally: component A and B component fully mix with accurate 1: 1 ratio by the work of LSR feeder, again because part formulations is colored designs, so can be furnished with color pump group and color metering section.A+B component, additive, color etc. enter plasticizing system after fully mixing.This plasticized screw has the function of homogenizing, mixing simultaneously, is expelled in mold heat by screw rod by compound, the embodiment of the present invention at mould temperature 25 DEG C ~ 80 DEG C, silica gel generation curing reaction.Can adopt horizontal liquid silica gel formation system, also can adopt vertical liquid-state silicon gel shaping machine set, the present invention is not restricted this.
And for being with the product of circuit or category of glass, the mobile terminal etc. such as with glass cover-plate, for touch-screen, when adopting the LCM module of normal temperature silica gel press moulding mode to full laminating to carry out glue molding, has following shortcoming:
1) there is no elasticity, lose the characteristic of cover glass product and screen;
2) hardening time is oversize, about 12 ~ 24 hours, and normal production line is unallowed;
3) mold pressing precision is inadequate, has impact after assembling on outward appearance, also cannot reach the object of protection screen simultaneously.
Therefore, the embodiment of the present invention can also be adopted and be implemented with the following method.
In enforcement, low temperature can be 70 DEG C ~ 80 DEG C.
In enforcement, after carrying out the injection moulding of low temperature liquid silica gel, the thickness of silica gel can be 0.3mm ~ 0.4mm.
The embodiment of the present invention, in order to make silica gel and to treat that injecting products is combined better, can also adopt method below to implement.
In enforcement, this glue can be play active active glue at 70 DEG C ~ 80 DEG C.
The embodiment of the present invention by using active glue, when when injecting products is glass material, can activated glass section, to improve adhesive property.
In enforcement, can by treating that injecting products carries out ultraviolet (UV, UltravioletRays) illumination and penetrates solidified glue to what applied glue.
Owing to treating injecting products scribbles active glue, when temperature reaches 70 DEG C ~ about 80 DEG C, the activity of this active glue can excited, ensure the bonding force treated between injecting products and silica gel, ensure the quality and performance treating injecting products.
In enforcement, treat that injecting products can be the product of band circuit glass product, band display screen, band circuit plastic cement products etc., wherein, band circuit plastic cement products can be oolemma circuit plastic cement products further.
In force, because the said goods is relatively more conventional, main flow, be easy to it will be appreciated by those skilled in the art that so be only described for the said goods here; But, what the embodiment of the present invention provided treats that injecting products also can be the product of other types, such as PETG (PET, polyethyleneterephthalate) goods etc., the said goods only for instructing those skilled in the art specifically how to implement the present invention, but is not meaned and is only limitted to the said goods.
In enforcement, treat that injecting products can comprise the display module be bonded by display screen and glass cover-plate.
In enforcement, treating injecting products, to carry out the injection moulding of low temperature liquid silica gel can be that the display module being treated injecting products by mould carries out the injection moulding of low temperature liquid silica gel.
In enforcement, treat injecting products and carry out the injection moulding of low temperature liquid silica gel and can be, treat the display module of injecting products by mould and describedly treat that the apparatus casing of injecting products carries out the injection moulding of low temperature liquid silica gel.
Usually, in industrial production in order to injection moulding, blowing, extrude, various mould and instrument that the method such as die casting or forging forming, smelting, punching press obtains required product, be referred to as mould.In brief, mould is used to the instrument of formed article, and this instrument is made up of various part, and different moulds is made up of different parts.
In enforcement, the precision after the injection moulding of low temperature liquid silica gel can for being less than or equal to 0.1mm.
The low temperature liquid silica gel of the embodiment of the present invention adopts low temperature moulding just, thickness 0.3-0.4mm, just absorbs the laminating tolerance of screen and glass cover-plate after shaping completing, and ensures surface uniform gap after finishing assembly, meets normal production requirement.Therefore, the technical scheme that the embodiment of the present invention provides may be used for the terminal device that there are the requirements such as narrow frame, Rimless or waterproof, screen protection waterproof precision can be improved, thus realizes in very little scope, solve shatter-resistant protection problem.
Below to comprise the mobile phone of the display module be bonded by display screen and glass cover-plate, the injection moulding of liquid towards silica gel makes the process implemented and is described.
1) 70 DEG C of active glue are coated at outward flange one figure of display module, as shown in Figure 2;
2) after the UV illumination of 7 seconds is penetrated, glue curing, within then can placing 7 days (or being called 168 hours), shapingly within 7 days (or being called 168 hours) can activate glue performance, as shown in Figure 3;
3) below 70-80 Celsius DEG C environment, carry out silica gel injection moulding, ensure product quality and performance, as shown in Figure 4.
After mold injection, ensure the circuit not temperature influence of screen and touch-screen, simultaneously the elastic performance of also guarantee 30 degree of hardness silica gel, because there is the activity of glue to exist, the adhesion between silica gel and screen is also enough powerful, can not come off.
Embodiments provide a kind of low temperature (70 DEG C-80 DEG C) silica gel and band circuit glass plate, the combination of the glass such as silica gel and screen electronic devices and components, by technical scheme of the present invention, 80 DEG C of conditions can be reached shaping, can be applied on product such as band circuit and display screen etc., curing rate only has 5 minutes, and production capacity doubles.Because scribble active glue at display screen and glass cover-plate edge, when temperature reaches 70 DEG C ~ about 80 DEG C, it can be excited active, ensure the bonding force between category of glass product and silica gel.Both ensure that and do not burnt out screen and TP cabling, and in turn ensure that the adhesion strength between silica gel and glass cover-plate, TP simultaneously, guarantee product quality and performance.
Based on same inventive concept, embodiments provide a kind of electronic equipment of the band display screen utilizing above-mentioned liquid-state silicon gel injection moulding process to make, be described below.
Fig. 5 shows the structural representation of the cross section of the electronic equipment of embodiment of the present invention band display screen, Fig. 6 shows the enlarged diagram of this cross section, as shown in the figure, can comprise: apparatus casing 1 and display module, display module comprises glass cover-plate (also claiming face glass) 201 and display screen 202, display module utilizes above-mentioned low temperature liquid silica gel injection molded, wherein:
Display screen 202 and glass cover-plate 201 bond, and the width of glass cover-plate 201 is less than the width of display screen 202;
The edge of display screen 202 is fixed on apparatus casing 1.
In enforcement, may further include: the display screen fixed support (or being called backboard fixed support) 3 of fitting with display screen, display module is fixed on display screen fixed support 3.
Display screen fixed support alleged by the embodiment of the present invention can be one piece of corrosion resistant plate, and thickness can be 0.5 millimeter etc.
Adopt the modes such as corrosion resistant plate to be because which is relatively more conventional, main flow in force, be easy to those skilled in the art and use/understand, so here for corrosion resistant plate; But, other modes are adopted also to be fine in theory, as long as the object of fixing display screen can be realized, corrosion resistant plate is only for instructing those skilled in the art specifically how to implement the present invention, but do not mean and only can use corrosion resistant plate, can in conjunction with putting into practice needs to determine corresponding material and thickness etc. in implementation process.
In enforcement, display screen can be light emitting diode (LED, LightEmittingDiode) display screen, LCDs (LCD, or organic electric exciting light-emitting diode (OLED, OrganicLight-EmittingDiode) etc. LiquidCrystalDisplay).
For LCM display screen, what glass cover-plate did by the embodiment of the present invention shows module (LCM than liquid crystal display LCD, LCDModule) little, fixed the edge of display screen like this by apparatus casing, and do not adopt and conventional remove fixing display screen by glass cover-plate.Owing to going in the mode of fixing display screen in prior art with glass cover-plate, the side of display screen and glass cover-plate has the tolerance of 1mm at least, and glass cover-plate has the tolerance of 1.2mm to apparatus casing.Therefore, adopt this mode that the embodiment of the present invention provides, the one-sided width that can save 2.2mm, Whole Equipment just can save the width of 4.4mm, no longer need the printing in the both sides of glass cover-plate to block (black or white) region, the viewing area of equipment is narrowed to the outer peripheral distance in equipment both sides.Thus, the on-screen display (osd) area of electronic equipment can be allowed larger, or the electronic equipment of more giant-screen can be allowed narrower, grip feeling is better.
The embodiment of the present invention adopts Rimless technology, and the frame of indication refers at the occlusion area that the both sides of glass cover-plate are printed in prior art here, and in the embodiment of the present invention, glass cover-plate region is all viewing area.From the front of equipment, the left and right sides does not have frame in other words conj.or perhaps frame is very narrow.The circuit of display screen can be blocked by silica gel by the embodiment of the present invention, or by the extraction above or below of the line routing device (from front) of display screen, and block the left and right sides of electronic equipment without the need to frame, and then reach the object of Rimless or narrow frame.
The electronic equipment provided due to the embodiment of the present invention have employed above-mentioned liquid-state silicon gel injection moulding process, by low temperature liquid silica gel forming technique protection display screen, realizes the object of shatter-resistant, antistatic, waterproof.The embodiment of the present invention adopt low temperature liquid silica gel adopt low temperature moulding just and produce silica gel thickness at 0.3mm ~ 0.4mm (be also namely more than or equal to 0.3mm, be less than or equal to 0.4mm), after shaping completing, just absorb the laminating tolerance of screen and glass cover-plate, precision can ensure within 0.1mm.Ensure to show uniform gap after finishing assembly, meet normal production requirement.
In enforcement, electronic equipment can be the equipment such as mobile phone, panel computer or electronic watch.
For mobile phone, the embodiment of the present invention can realize mobile phone glass cover plate, display screen or the glass cover-plate of entirely fitting and display screen, with the combination of silica gel.Thus make glass cover-plate and display screen circuit carry out shaping in the temperature range that can bear, and absorb the assembling tolerance of display screen and glass cover-plate, assembly clearance is accomplished minimum, in 0.4mm, realize the test of protection screen antidetonation.
Embodiments provide two kinds are carried out liquid-state silicon gel injection moulding preparation method to electronic equipment:
One, glass cover-plate 201 and this entirety of display screen 202 (also namely showing module) are utilized liquid-state silicon gel injection mo(u)lding, around display module, carry out liquid-state silicon gel injection moulding;
Then can adopt common silica gel etc. between glass cover-plate 201 and display screen 202, or be exactly coherent when glass cover-plate 201 is usual and display screen 202 is provided by producer, the present invention is not restricted this
Two, glass cover-plate 201 and this entirety of display screen 202 (also namely showing module) and apparatus casing 1 can also utilize liquid-state silicon gel forming technique to fix by the embodiment of the present invention.
Certainly, in enforcement, above two kinds of modes can also be combined, also, after shaping to glass cover-plate 201 and this holistic surrounding liquid-state silicon gel of display screen 202, it is shaping display module and apparatus casing 1 to be carried out secondary liquid silica gel further again.
Be shaped to example to carry out liquid-state silicon gel to display module below, carry out making implementation.
1) by tool and mould, liquid-state silicon gel carries out to the display module that display screen 202 has bonded glass cover-plate 201 shaping, as shown in Figure 7;
2) back side of the shaping display module completed from apparatus casing 1 is loaded, as shown in Figure 8, set level, install;
3) back side of display screen fixed support 3 from apparatus casing 1 is loaded, as shown in Figure 9, the compacting of display module is also pasted and fixes;
4) after completing, from the design sketch viewed from equipment front as shown in Figure 10.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Claims (11)
1. a liquid-state silicon gel injection moulding process, is characterized in that, comprises the steps:
To treat that injecting products coats mold injection Overmolding glue;
After described glue curing is shaping, treat that injecting products carries out the injection moulding of low temperature liquid silica gel to described, described low temperature is 25 DEG C ~ 80 DEG C.
2. the method for claim 1, is characterized in that, described low temperature is 70 DEG C ~ 80 DEG C.
3. method as claimed in claim 1 or 2, it is characterized in that, the thickness of described silica gel is 0.3mm ~ 0.4mm.
4. method as claimed in claim 1 or 2, is characterized in that, described glue is play active active glue at 70 DEG C ~ 80 DEG C.
5. method as claimed in claim 4, is characterized in that, treat that injecting products curing molding carrys out curing molding by ultraviolet (UV) illumination injection water to described.
6. the method as described in claim 1,2 or 5, is characterized in that, described in treat that injecting products is band circuit glass product, the product of band display screen or band circuit plastic cement products.
7. the method as described in claim 1,2 or 5, is characterized in that, described in treat that injecting products comprises the display module be bonded by display screen and glass cover-plate.
8. method as claimed in claim 7, is characterized in that, treat that injecting products carries out the injection moulding of low temperature liquid silica gel and is specially, treat that the display module of injecting products carries out the injection moulding of low temperature liquid silica gel to described to described.
9. method as claimed in claim 7, is characterized in that, treat that injecting products carries out the injection moulding of low temperature liquid silica gel and is specially to described, the display module treating injecting products to described and describedly treat that the apparatus casing of injecting products carries out the injection moulding of low temperature liquid silica gel.
10. one kind utilizes the electronic equipment of the band display screen of described method making as arbitrary in claim 1 to 9, it is characterized in that, comprise apparatus casing and display module, described display module comprises glass cover-plate and display screen, described display module for utilize as arbitrary in claim 1 to 9 as described in method injection molded, wherein:
Described display screen and glass cover-plate bond, and the width of described glass cover-plate is less than the width of described display screen;
The edge of described display screen is fixed on described apparatus casing.
11. electronic equipments as claimed in claim 10, it is characterized in that, comprise further: the display screen fixed support of fitting with described display screen, described display module is fixed on display screen fixed support.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410415541.0A CN105437449B (en) | 2014-08-21 | 2014-08-21 | A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen |
| PCT/CN2015/086612 WO2016026398A1 (en) | 2014-08-21 | 2015-08-11 | Liquid silicone rubber injection molding method and electronic device with display screen |
| HK16110140.0A HK1221939A1 (en) | 2014-08-21 | 2016-08-25 | Injection molding method for liquid silicone and electronic device having display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410415541.0A CN105437449B (en) | 2014-08-21 | 2014-08-21 | A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105437449A true CN105437449A (en) | 2016-03-30 |
| CN105437449B CN105437449B (en) | 2018-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410415541.0A Active CN105437449B (en) | 2014-08-21 | 2014-08-21 | A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN105437449B (en) |
| HK (1) | HK1221939A1 (en) |
| WO (1) | WO2016026398A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106982272A (en) * | 2017-03-21 | 2017-07-25 | 广东欧珀移动通信有限公司 | The assembled fixture and assemble method of display screen component |
| CN109397614A (en) * | 2017-08-16 | 2019-03-01 | 深圳市利勇安硅橡胶制品有限公司 | A kind of waterproof case |
| CN110377185A (en) * | 2019-08-08 | 2019-10-25 | 业成科技（成都）有限公司 | The applying method of curved surface cover board and display panel, display screen and electronic equipment |
| CN112652254A (en) * | 2020-09-11 | 2021-04-13 | 和辉(深圳)液晶显示技术有限公司 | Anti-electromagnetic interference low-temperature-resistant liquid crystal display screen |
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| CN107364065B (en) * | 2017-08-14 | 2023-11-28 | 深圳市康利邦科技有限公司 | Integrated forming processing technology of curved glass screen protective film and protective film thereof |
| CN109429457A (en) * | 2017-08-22 | 2019-03-05 | 北京小米移动软件有限公司 | Electronic equipment and its screen adhesive bonding method |
| CN107861566B (en) * | 2017-10-31 | 2022-09-13 | 维沃移动通信有限公司 | Mobile terminal |
| CN111290668B (en) * | 2020-01-13 | 2024-01-26 | 广西中沛光电科技有限公司 | IML injection molding integrated capacitive touch screen |
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| CN106982272A (en) * | 2017-03-21 | 2017-07-25 | 广东欧珀移动通信有限公司 | The assembled fixture and assemble method of display screen component |
| CN109397614A (en) * | 2017-08-16 | 2019-03-01 | 深圳市利勇安硅橡胶制品有限公司 | A kind of waterproof case |
| CN110377185A (en) * | 2019-08-08 | 2019-10-25 | 业成科技（成都）有限公司 | The applying method of curved surface cover board and display panel, display screen and electronic equipment |
| CN112652254A (en) * | 2020-09-11 | 2021-04-13 | 和辉(深圳)液晶显示技术有限公司 | Anti-electromagnetic interference low-temperature-resistant liquid crystal display screen |
| CN112652254B (en) * | 2020-09-11 | 2022-09-20 | 和辉(深圳)液晶显示技术有限公司 | Anti-electromagnetic interference low-temperature-resistant liquid crystal display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016026398A1 (en) | 2016-02-25 |
| CN105437449B (en) | 2018-08-24 |
| HK1221939A1 (en) | 2017-06-16 |
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