CN105430905B - Flexible circuit board and mobile terminal - Google Patents
Flexible circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105430905B CN105430905B CN201511026768.7A CN201511026768A CN105430905B CN 105430905 B CN105430905 B CN 105430905B CN 201511026768 A CN201511026768 A CN 201511026768A CN 105430905 B CN105430905 B CN 105430905B
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- CN
- China
- Prior art keywords
- opening
- edge
- electronic device
- flexible circuit
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a kind of flexible circuit boards, including copper foil base material layer, cover film and electronic device, cover film is covered on copper foil base material layer, cover film setting opening, the multiple grooves of the edge of opening, electronic device is welded in copper foil base material layer and exposes in the position of opening, and the scolding tin of electronic device is covered in the edge of opening.Flexible circuit board provided in an embodiment of the present invention is arranged multiple grooves by the edge in opening and the edge of opening is made to form rough shape, scolding tin on the pin of electronic device is covered with and forms preferable grasp with the edge of opening when on the edge of opening, to ensure that the bonding strength of electronic device Yu copper foil base material layer.The present invention also provides a kind of mobile terminals.
Description
Technical field
The present invention relates to field of circuit boards more particularly to a kind of flexible circuit boards and mobile terminal.
Background technique
Flexible circuit board mainly includes copper foil base material layer and the cover film that is covered on copper foil base material layer.Cover film corresponds to copper
Route on paper tinsel base material layer opens a window to form pad, and pad with electronic component to weld.
The opening of cover film in the prior art is rectangle, when electronic device is welded on pad, the scolding tin of electronic device
It is covered on the edge of opening.Inventor has found that the electronic device of the prior art is easy to fall off from the edge of opening, stable degree
It is poor.
Summary of the invention
The purpose of the present invention is to provide a kind of preferable flexible circuit board of stable degree and mobile terminals.
In order to solve the above-mentioned technical problem, the embodiment of the invention provides a kind of flexible circuit board, including copper foil base material layer,
Cover film and electronic device, the cover film are covered on the copper foil base material layer, the cover film setting opening, the opening
The multiple grooves of edge, the electronic device is welded in the copper foil base material layer and exposes in the position of the opening, described
The scolding tin of electronic device is covered in the edge of the opening.
Wherein, the edge of the opening is arc.
Wherein, the opening includes at least three sides.
Wherein, the opening includes four sides.
Wherein, the multiple groove is opened at least one side.
Wherein, four sides all offer the multiple groove.
Wherein, the gap between the two neighboring groove is different.
Wherein, the groove is V-arrangement；Alternatively,
The groove is circle；Alternatively,
The groove is rectangle.
The embodiment of the invention also provides a kind of mobile terminals, including flexible circuit board.
Flexible circuit board and mobile terminal provided in an embodiment of the present invention are made by the way that multiple grooves are arranged at the edge of opening
The edge that must be open forms rough shape, so that the scolding tin on the pin of electronic device is covered with when on the edge of opening
Preferable grasp can be formed with the edge of opening, to ensure that the bonding strength of electronic device Yu copper foil base material layer.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of schematic diagram of flexible circuit board provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of another angle for the flexible circuit board that Fig. 1 is provided；
Fig. 3 is the schematic diagram of another flexible circuit board provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.
The present embodiments relate to mobile terminal can be any equipment for having communication and store function, such as: it is flat
Plate computer, mobile phone, electronic reader, remote controler, personal computer (Personal Computer, PC), laptop, vehicle
Carry the smart machine with network function such as equipment, Web TV, wearable device.
It is flexible referring to Figure 1 to Fig. 2, a kind of mobile terminal provided in an embodiment of the present invention, including flexible circuit board 100
Circuit board 100 includes copper foil base material layer 1, cover film 2 and electronic device 3, and the cover film 2 is covered in the copper foil base material layer 1
On, the setting of cover film 2 opening 21, the multiple groove 211a of edge of the opening 21, the electronic device 3 is welded in
The copper foil base material layer 1 exposes in the position of the opening 21, and the scolding tin of the electronic device 3 is covered in the side of the opening 21
Edge.
The edge of opening 21 is made to form rough shape by the way that multiple groove 211a are arranged at the edge of opening 21,
Enable the scolding tin on the pin of electronic device 3 be covered in be open 21 edge on when formed preferably with the edge of opening 21
Grasp, to ensure that the bonding strength of electronic device 3 Yu copper foil base material layer 1.
In the present embodiment, copper foil base material layer 1 includes substrate 11 and the copper foil layer 12 being set on substrate 11, copper foil layer 12
Line layer is formed by etching, to realize that the signal of flexible circuit board 100 transmits.
In the present embodiment, cover film 2 is covered on copper foil base material layer 1, to provide protection.Cover film 2 is needing to weld
The position setting opening 21 of electronic device 3, is electrically connected with line layer convenient for electronic device 3, realizes signal interconnection.That is copper foil base material
The position of the corresponding opening 21 of layer 1 is substantially pad 12a.Multiple groove 211a are arranged in the edge of the opening 21 of cover film 2, so that
The edge of opening 21 forms rough shape, and when electronic device 3 is welded on pad 12a, scolding tin can overflow to opening 21
Edge on, and due to opening 21 edge be rough shape, opening 21 edges scolding tin distribution position do not exist
On same straight line, pad 12a can be preferably firmly grasped, to guarantee the bonding strength of electronic device 3 Yu pad 12a.
For further improvement, the opening 21 includes at least three sides 211.
In the present embodiment, in order to be easier to open up opening 21, the opening 21 includes four sides 211.Specifically, opening
The edge of mouth 21 is rectangle.Opening 21 the multiple groove 211a of edge so that opening 21 edge formed it is rough
Shape, when electronic device 3 is welded on pad 12a, scolding tin can overflow to the edge of opening 21, and due to the edge of opening 21
For rough shape, the position of the scolding tin distribution for 21 edges that are open on the same line, can not firmly grasp preferably and weld
Disk 12a, to guarantee the bonding strength of electronic device 3 Yu pad 12a.Certainly, in other embodiments, opening 21 can also be
Triangle or pentagon.
In order to further improve, the multiple groove 211a is opened at least one side 211.
In the present embodiment, in order to further enhance the bonding strength of electronic device 3 Yu pad 12a, four sides
211 all offer the multiple groove 211a.Preferably, the gap between the two neighboring groove 211a is different.By into
One step limits the gap of the two neighboring groove 211a, and the position that scolding tin is distributed is distributed at various locations, is subtracted
The concentrated stress of small pad 12a, avoids fractureing.Certainly, in other embodiments, multiple groove 211a can also be only arranged
On a side 211.
In order to further improve, the groove 211a is V-arrangement；Alternatively, the groove 211a is circle；Alternatively, institute
Stating groove 211a is rectangle.
In the present embodiment, groove 211a is V-arrangement, and multiple groove 211a are opened on four sides 211 of opening 21 i.e.
Form the shape of sawtooth like shape.The eight pawl structures for forming similar octopus, can preferably hold the pin of electronic device 3,
To further enhance the bonding strength of electronic device 3 and pad 12a.Certainly, in other embodiments, the groove 211a
For circle, i.e. the edge of opening 21 forms wavy；The groove 211a is rectangle, i.e. the edge of opening 21 forms great-wall shaped.
When flexible circuit board 100 starts assembly, first by the corresponding required pad 12a opening 21 of cover film 2, the opening
21 shape is arranged multiple groove 211a and forms zigzag；Electronic device 3 is welded on pad 12a again, scolding tin is covered with opening
21 edge.
Flexible circuit board 100 and mobile terminal provided in an embodiment of the present invention are multiple recessed by being arranged at the edge of opening 21
Slot 211a makes the edge of opening 21 form rough shape, so that the scolding tin on the pin of electronic device 3 is covered in opening
Preferable grasp can be formed with the edge of opening 21 when on the edge of mouth 21, to ensure that electronic device 3 and copper foil base
The bonding strength of material layer 1.
Flexible circuit board 100 and mobile terminal provided in an embodiment of the present invention four sides 211 also by all opening
Equipped with the multiple groove 211a, the bonding strength of electronic device 3 Yu pad 12a is further enhanced.
Fig. 3 is referred to, a kind of mobile terminal provided in an embodiment of the present invention, mobile terminal includes flexible circuit board 200, soft
Property circuit board 200 include copper foil base material layer 5, cover film 6 and electronic device 7, the cover film 6 is covered in the copper foil base material layer
On 5, the setting of cover film 6 opening 61, the multiple groove 61a of edge of the opening 61, the electronic device 7 is welded in
The copper foil base material layer 5 exposes in the position of the opening 61, and the scolding tin of the electronic device 7 is covered in the side of the opening 61
Edge.
The edge of opening 61 is made to form rough shape by the way that multiple groove 61a are arranged at the edge of opening 61,
Enable the scolding tin on the pin of electronic device 7 be covered in be open 61 edge on when formed preferably with the edge of opening 61
Grasp, to ensure that the bonding strength of electronic device 7 Yu copper foil base material layer 5.
In the present embodiment, copper foil base material layer 5 includes substrate 51 and the copper foil layer 52 being set on substrate 51, copper foil layer 52
Line layer is formed by etching, to realize that the signal of flexible circuit board 200 transmits.
In the present embodiment, cover film 6 is covered on copper foil base material layer 5, to provide protection.Cover film 6 is needing to weld
The position setting opening 61 of electronic device 7, is electrically connected with line layer convenient for electronic device 7, realizes signal interconnection.That is copper foil base material
The position of the corresponding opening 61 of layer 5 is substantially pad 52a.Multiple groove 61a are arranged in the edge of the opening 61 of cover film 6, so that
The edge of opening 61 forms rough shape, and when electronic device 7 is welded on pad 52a, scolding tin can overflow to opening 61
Edge on, and due to opening 61 edge be rough shape, opening 61 edges scolding tin distribution position do not exist
On same straight line, pad 52a can be preferably firmly grasped, to guarantee the bonding strength of electronic device 7 Yu pad 52a.
For further improvement, the edge of the opening 61 is arc.
In the present embodiment, be open 61 edge for circle.The multiple groove 61a of edge of opening 61, so that opening
61 edge forms rough shape, and when electronic device 7 is welded on pad 52a, scolding tin can overflow to the side of opening 61
On edge, and since the edge of opening 61 is rough shape, the position of the scolding tin distribution of 61 edges of opening is not same
On straight line, pad 52a can be preferably firmly grasped, to guarantee the bonding strength of electronic device 7 Yu pad 52a.Certainly, other
In embodiment, opening 61 can also be ellipse or semicircle.
In order to further improve, the gap between the two neighboring groove 61a is different.
In the present embodiment, two neighboring described in order to further enhance the bonding strength of electronic device 7 Yu pad 52a
Gap between groove 61a is different.By further limiting the gap of the two neighboring groove 61a, and scolding tin is distributed
Position can be distributed at various locations, reduce pad 52a concentrated stress, avoid fractureing.
In order to further improve, the groove 61a is V-arrangement；Alternatively, the groove 61a is circle；Alternatively, described
Groove 61a is rectangle.
In the present embodiment, groove 61a is V-arrangement, and multiple groove 61a, which are opened on the edge of opening 61, forms similar saw
The shape of tooth form.The eight pawl structures for forming similar octopus, can preferably hold the pin of electronic device 7, thus further
Enhancing electronic device 7 and pad 52a bonding strength.Certainly, in other embodiments, the groove 61a is circle, that is, is opened
The edge of mouth 61 forms wavy；The groove 61a is rectangle, i.e. the edge of opening 61 forms great-wall shaped.
When flexible circuit board 200 starts assembly, first by the corresponding required pad 52a opening 61 of cover film 6, the opening
61 shape is arranged multiple groove 61a and forms zigzag；Electronic device 7 is welded on pad 52a again, scolding tin is covered with opening 61
Edge.
Flexible circuit board 200 and mobile terminal provided in an embodiment of the present invention are multiple recessed by being arranged at the edge of opening 61
Slot 61a makes the edge of opening 61 form rough shape, so that the scolding tin on the pin of electronic device 7 is covered in opening
Preferable grasp can be formed with the edge of opening 61 when on 61 edge, to ensure that electronic device 7 and copper foil base material
The bonding strength of layer 5.
The module or unit of the embodiment of the present invention can be combined or be split according to actual needs.
The above is the embodiment of the embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the principles of the embodiments of the present invention, several improvements and modifications can also be made, these are improved and profit
Decorations are also considered as protection scope of the present invention.
Claims (9)
1. a kind of flexible circuit board, which is characterized in that including copper foil base material layer, cover film and electronic device, the copper foil base material
Layer includes line layer and pad, and the pad is electrically connected the line layer, and the cover film is covered on the copper foil base material layer,
The cover film setting is open, pad described in the opening face, so that the regional area of the pad exposes, the opening
The multiple grooves of edge, so that the edge of the opening forms rough shape, the electronic device is welded in described
Pad exposes the position of the opening, so that the electronic device is electrically connected the line layer, the scolding tin cloth of the electronic device
Completely in the edge of the opening, the multiple groove is for increasing grabbing between the scolding tin of the electronic device and the cover film
Clamp force.
2. flexible circuit board according to claim 1, which is characterized in that the edge of the opening is arc.
3. flexible circuit board according to claim 1, which is characterized in that the opening includes at least three sides.
4. flexible circuit board according to claim 3, which is characterized in that the opening includes four sides.
5. flexible circuit board according to claim 4, which is characterized in that the multiple groove is opened in described at least one
On side.
6. flexible circuit board according to claim 5, which is characterized in that four sides all offer the multiple recessed
Slot.
7. flexible circuit board described in any one according to claim 1~6, which is characterized in that the two neighboring groove it
Between gap it is different.
8. flexible circuit board according to claim 7, which is characterized in that the groove is V-arrangement；Alternatively,
The groove is circle；Alternatively,
The groove is rectangle.
9. a kind of mobile terminal, which is characterized in that including the flexible circuit board as described in claim 1~8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026768.7A CN105430905B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026768.7A CN105430905B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105430905A CN105430905A (en) | 2016-03-23 |
| CN105430905B true CN105430905B (en) | 2018-12-11 |
Family
ID=55508752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511026768.7A Active CN105430905B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430905B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871319A (en) * | 1988-12-21 | 1989-10-03 | Amp Incorporated | Molded circuit board for ribbon cable connector |
| CN203057696U (en) * | 2012-12-31 | 2013-07-10 | 广东欧珀移动通信有限公司 | Flexible circuit board |
| CN203942697U (en) * | 2014-06-05 | 2014-11-12 | 嘉兴职业技术学院 | Flexible printed wiring board |
| CN104797082A (en) * | 2015-05-14 | 2015-07-22 | 昆山意力电路世界有限公司 | Intensive-bonding-pad high-density board and windowing method thereof |
-
2015
- 2015-12-29 CN CN201511026768.7A patent/CN105430905B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871319A (en) * | 1988-12-21 | 1989-10-03 | Amp Incorporated | Molded circuit board for ribbon cable connector |
| CN203057696U (en) * | 2012-12-31 | 2013-07-10 | 广东欧珀移动通信有限公司 | Flexible circuit board |
| CN203942697U (en) * | 2014-06-05 | 2014-11-12 | 嘉兴职业技术学院 | Flexible printed wiring board |
| CN104797082A (en) * | 2015-05-14 | 2015-07-22 | 昆山意力电路世界有限公司 | Intensive-bonding-pad high-density board and windowing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105430905A (en) | 2016-03-23 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |