CN105430876A - Method for increasing binding force of wall of insulating slot of metal substrate - Google Patents
Method for increasing binding force of wall of insulating slot of metal substrate Download PDFInfo
- Publication number
- CN105430876A CN105430876A CN201511024783.8A CN201511024783A CN105430876A CN 105430876 A CN105430876 A CN 105430876A CN 201511024783 A CN201511024783 A CN 201511024783A CN 105430876 A CN105430876 A CN 105430876A
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- hole wall
- wall
- hole
- shrinkage pool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention relates to a method for increasing the binding force of the wall of the insulating slot of a metal substrate. According to the method, a plurality of recessed holes are formed at the wall of the insulating slot of the metal substrate, resin plugged in the insulating slot contacts with the portions of the wall in the insulating slot which are not provided with recessed holes, and also enters the recessed holes and contacts with the walls of the recessed holes, and therefore, the contact area of the resin and the wall of the insulating slot can be improved, and the binding force of the resin and the wall of the insulating slot can be improved. With the method adopted, a flow can be simplified, production efficiency can be improved, production cost can be reduced, and the binding force between the wall of the insulating slot and the slot-plugging resin can be effectively increased.
Description
Technical field
The invention belongs to metal-base printed wiring board (abbreviation metal substrate) manufacture technology field, be specifically related to a kind of method increasing metal substrate insulated slotted hole hole wall adhesion.
Background technology
Metal substrate is widely used in because of the heat sinking function of its excellence in LED and the high-power product of power supply class.Metal substrate structurally can divide conductting layer, insulating barrier and Metal Substrate heat-conducting layer.Because metal-based layer has good electric conductivity, the hole of not carrying out special process does not possess insulation property.But in the metal substrate of part special applications, need to do plug-in unit technique in the hole of plate, this just requires that hole wall has good insulation property, in addition hole wall insulating especially Metal Substrate battenboard make key point.There are insulation property, the insulated hole technique just life therefrom of so-called metal substrate for what realize penetrating metal base in metal substrate.And in operation process, because the coefficient of expansion of plug socket resin and metal substrate is different, occur expanding with heat and contract with cold, as resin and hole wall adhesion not then can cause resin to be separated with slotted eye hole wall after high temperature spray tin.For above-mentioned abnormal conditions, we generally adopt the mode alligatoring slotted eye hole wall of vertical cleaning groove alkaline etching to increase the adhesion of hole wall and resin.But this kind of mode flow process is complicated, cost drops into high, and production efficiency is low, and resin and slotted eye larger, adhesion effect is poorer.
Summary of the invention
For the deficiency of above-mentioned prior art, the invention provides one can simple flow, enhances productivity, and reduces production cost, and effectively can increase the method for adhesion between insulation tank slotted eye hole wall and plug socket resin.
Object of the present invention is achieved by the following technical programs:
A kind of method increasing metal substrate insulated slotted hole hole wall adhesion, the method is on the hole wall of metal substrate insulated slotted hole, offer some shrinkage pools, make to fill in resin in described insulated slotted hole except except not establishing the hole wall of shrinkage pool in insulated slotted hole hole wall and contacting, also enter in described shrinkage pool and contact with shrinkage pool hole wall, and then increase the contact area of resin and insulated slotted hole hole wall, the adhesion of resin and insulated slotted hole hole wall is improved.
Further, the degree of depth of described shrinkage pool is 0.7 ~ 0.9mm.
As a kind of execution mode, described shrinkage pool semicircular in shape.
As another kind of execution mode, described shrinkage pool undulate.
As another execution mode, described shrinkage pool indention.
Compared with prior art, tool of the present invention has the following advantages:
1, can simple flow, enhance productivity;
2, production cost can be reduced;
3, the adhesion between insulation tank slotted eye hole wall and plug socket resin can effectively be increased.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of metal substrate insulated slotted hole hole wall in the present invention.
Fig. 2 is the another kind of structural representation of metal substrate insulated slotted hole hole wall in the present invention.
Fig. 3 is another structural representation of metal substrate insulated slotted hole hole wall in the present invention.
Embodiment
The embodiment provided below in conjunction with accompanying drawing is described in further detail the present invention.
As shown in Figure 1 to Figure 3, a kind of method increasing metal substrate insulated slotted hole hole wall adhesion, the method is on the hole wall of metal substrate 1 insulated slotted hole 2, offer some shrinkage pools 3, make to fill in resin 4 in described insulated slotted hole 2 except except not establishing the hole wall of shrinkage pool in insulated slotted hole 2 hole wall and contacting, also enter in described shrinkage pool 3 and contact with shrinkage pool hole wall, and then increase the contact area of resin and insulated slotted hole hole wall, the adhesion of resin and insulated slotted hole hole wall is improved.
For increasing adhesion, described shrinkage pool 3 should ensure certain depth.Preferably, the degree of depth A of described shrinkage pool 3 is 0.7 ~ 0.9mm.
As shown in Figure 1, as a kind of execution mode, described shrinkage pool 3 semicircular in shape.
As shown in Figure 2, as another kind of execution mode, described shrinkage pool 3 undulate.
As shown in Figure 3, as another execution mode, described shrinkage pool 3 indention.
As described above, be only preferred embodiment of the present invention, when not limiting scope of the invention process with this, the simple equivalence namely generally done according to the present patent application the scope of the claims and invention description content changes and modifies, and all still remains within the scope of the patent.
Claims (5)
1. one kind increases the method for metal substrate insulated slotted hole hole wall adhesion, it is characterized in that: the method is on the hole wall of metal substrate insulated slotted hole, offer some shrinkage pools, make to fill in resin in described insulated slotted hole except except not establishing the hole wall of shrinkage pool in insulated slotted hole hole wall and contacting, also enter in described shrinkage pool and contact with shrinkage pool hole wall, and then increase the contact area of resin and insulated slotted hole hole wall, the adhesion of resin and insulated slotted hole hole wall is improved.
2. a kind of method increasing metal substrate insulated slotted hole hole wall adhesion according to claim 1, is characterized in that: the degree of depth of described shrinkage pool is 0.7 ~ 0.9mm.
3. a kind of method increasing metal substrate insulated slotted hole hole wall adhesion according to claim 1 or 2, is characterized in that: described shrinkage pool semicircular in shape.
4. a kind of method increasing metal substrate insulated slotted hole hole wall adhesion according to claim 1 or 2, is characterized in that: described shrinkage pool undulate.
5. a kind of method increasing metal substrate insulated slotted hole hole wall adhesion according to claim 1 or 2, is characterized in that: described shrinkage pool indention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511024783.8A CN105430876A (en) | 2015-12-29 | 2015-12-29 | Method for increasing binding force of wall of insulating slot of metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511024783.8A CN105430876A (en) | 2015-12-29 | 2015-12-29 | Method for increasing binding force of wall of insulating slot of metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105430876A true CN105430876A (en) | 2016-03-23 |
Family
ID=55508723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511024783.8A Pending CN105430876A (en) | 2015-12-29 | 2015-12-29 | Method for increasing binding force of wall of insulating slot of metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430876A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115884509A (en) * | 2021-09-27 | 2023-03-31 | 荣耀终端有限公司 | Flexible circuit board, circuit board assembly and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3558441A (en) * | 1968-11-01 | 1971-01-26 | Int Electronic Res Corp | Method of making a metal core printed circuit board |
| US6512186B1 (en) * | 1998-06-26 | 2003-01-28 | Ibiden Co., Ltd. | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof |
| WO2006101134A1 (en) * | 2005-03-24 | 2006-09-28 | Ibiden Co., Ltd. | Multi-layer printed circuit board |
| US20090154131A1 (en) * | 1998-12-16 | 2009-06-18 | Ibiden Co., Ltd. | Conductive connecting pin and package substrate |
-
2015
- 2015-12-29 CN CN201511024783.8A patent/CN105430876A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3558441A (en) * | 1968-11-01 | 1971-01-26 | Int Electronic Res Corp | Method of making a metal core printed circuit board |
| US6512186B1 (en) * | 1998-06-26 | 2003-01-28 | Ibiden Co., Ltd. | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof |
| US20090154131A1 (en) * | 1998-12-16 | 2009-06-18 | Ibiden Co., Ltd. | Conductive connecting pin and package substrate |
| WO2006101134A1 (en) * | 2005-03-24 | 2006-09-28 | Ibiden Co., Ltd. | Multi-layer printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115884509A (en) * | 2021-09-27 | 2023-03-31 | 荣耀终端有限公司 | Flexible circuit board, circuit board assembly and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160323 |
|
| RJ01 | Rejection of invention patent application after publication |