CN105428460A - Electric packaging method for photoelectric device - Google Patents
Electric packaging method for photoelectric device Download PDFInfo
- Publication number
- CN105428460A CN105428460A CN201510951618.0A CN201510951618A CN105428460A CN 105428460 A CN105428460 A CN 105428460A CN 201510951618 A CN201510951618 A CN 201510951618A CN 105428460 A CN105428460 A CN 105428460A
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- China
- Prior art keywords
- ceramic substrate
- lead
- internal components
- packing
- photoelectric device
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- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 230000003287 optical effect Effects 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 5
- 238000012856 packing Methods 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000004891 communication Methods 0.000 abstract description 2
- 230000010354 integration Effects 0.000 abstract 1
- 238000001914 filtration Methods 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 235000011449 Rosa Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to the technical field of optical communication, and particularly relates to an electric packaging method for a photoelectric device. An optical device comprises a shell and an internal device, wherein a ceramic substrate is arranged on the side surface of the shell; the internal device is formed by combining and packaging the shell and the ceramic substrate; the ceramic substrate is connected with an electrode of the internal device through a thrusting needle or a lead, and simultaneously external pins are led out; and the thrusting needle or the lead is welded or fixed with glue outside the packaged shell. The electric packaging method solves the design problem that the lead needs to be manufactured on the side surface of the device after the integration level of a sealed long axis-shaped or long strip-shaped packaging device is gradually improved, packaging and lead requirements are carried out in a limited space range for specific requirements of micro device modules, and modularized mass production can be met, so that the production efficiency is greatly improved, and the production cost is reduced; and according to the electric packaging method, the assembly difficulty is greatly reduced, and the efficiency and reliability are improved.
Description
Technical field
The invention belongs to technical field of photo communication, be specifically related to the electric method for packing of a kind of photoelectric device.
Background technology
More and more compacter along with device architecture, this trend that integrated level and complexity are but more and more higher, the mode of original multiple devices superpositions gradually replace by the mini encapsulating structure of integral type.
A kind of phenomenon is just contained: original coaxial type device or two-period form, syllogic and multisection type device in this trend, such as a large amount of coaxial packaging device used, because comprise more polyelectron control element thus need more circuit interface or lead-in wire, and this kind of device has often had fixing lead-in wire or electrical interface at top and bottom, thus such integrated device has needed the interface doing electrical lead from the side.
Such as shown in Figure 1 and Figure 2, have circuit connection or other lines as light path etc., have the circuit connection such as contact pin or flexible circuit board in bottom at the top of coaxial packaging device, mid portion needs circuit lead, and it can not be drawn from top or bottom.
Such as: adjustable reception photoelectric subassembly, such as adjustable ROSA TOSA etc., needing to draw at the bottom of original coaxial packaging axle on the mode basis of PIN needle increases more PIN needle or circuit lead.
Traditional OSA device electrical interface all comes from TO base, and the design of the location arrangements of the electrical lead that current adjustable OSA device increases, obviously this to structural design and technological operation all with serving new requirement.
The reason of design, first traditional coaxial OSA device is difficult in bottom increase more PIN needle, the situation that the tolerance especially connected up to other in high speed TO device reduces greatly.Secondly top is generally optical inlet, and the optical texture in current main-stream and low cost solution is generally free space type, and therefore PIN needle or lead-in wire directly can be drawn out to beyond package tube with this.So under the design not changing coaxial packaging, only do conductor leading design in side.
Summary of the invention
The object of the invention is the design problem needing to make from the side lead-in wire for solving hermetic type major axis shape or strip packaging device after integrated level improves gradually, there is provided a kind of and can realize product encapsulation requirement and electrical attachment requirements in limited short space, meet can mass production simultaneously, the electric method for packing of a kind of photoelectric device of production cost of enhancing productivity, reduce.
Technical solution of the present invention is: the electric method for packing of a kind of photoelectric device, described optical device comprises housing, internal components, in the side of housing, ceramic substrate is set, internal components is formed by housing and ceramic substrate assembled package, ceramic substrate is by contact pin or lead-in wire and being electrically connected of internal components, draw external pin, described contact pin or lead-in wire carry out welding or glue fixing operation outside encapsulating housing simultaneously.
Described ceramic substrate and the assembling mode of internal components are that pin terminal coordinates and becomes bayonet fashion.
Further, the assembling mode of described ceramic substrate and internal components draws contact pin at internal components, and terminal made by external ceramic substrate, and both become bayonet fashion at cooperation.
Further, described housing and ceramic substrate assembled package mode are at internal components leading-out terminal, and contact pin made by external ceramic substrate, and both become bayonet fashion at cooperation.
The assembling mode of described ceramic substrate and internal components is that the lead-in wire on internal components carries out outside weldings on ceramic substrate.
Described ceramic substrate is welded with plated-through hole, plain conductor, for the electrical connection of contact pin or lead-in wire, external pin.
The invention has the beneficial effects as follows: this electric method for packing solves certainly hermetic type major axis shape or strip packaging device after integrated level improves gradually needs to make from the side the design problem of lead-in wire, simultaneously for the particular demands of micro element module, the encapsulation implemented in limited spatial dimension and lead-in wire requirement, meet simultaneously and can modularization produce in batches, greatly enhance productivity, reduce production cost; This electric method for packing changes the connected mode of external pin and internal electrode, adopts the assembling mode of lead-in wire outside weldings or contact pin socket, greatly reduces assembling difficulty, raises the efficiency and reliability; Lead-in wire on ceramic cover plate can change flexibly, can change the electric connecting relation with external pin.
Accompanying drawing explanation
Fig. 1 is coaxial component figure.
Fig. 2 is another kind of coaxial component figure.
Fig. 3 is the electric method for packing schematic diagram of a kind of photoelectric device.
Fig. 4 is lead-in wire outside weldings conceptual scheme.
Fig. 5 is pin terminal assembling conceptual scheme.
Fig. 6 is another kind of pin terminal assembling conceptual scheme.
Fig. 7 is the front elevation of ceramic substrate.
Fig. 8 is the reverse side figure of ceramic substrate.
Fig. 9 is that the inventive method is suitable for device figure.
Figure 10 is that another the inventive method is suitable for device figure.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described further.
Embodiment 1 receives secondary module for a kind of tunable optical, is described further the electric method for packing of this photoelectric device.
As shown in Figure 3, the electric method for packing of a kind of photoelectric device, described optical device comprises housing, internal components, and described internal components comprises adjustable filtering piece, adjustable filtering piece posts heating resistor 1; Heating resistor 1 is welded with contact pin or lead-in wire 2, in the side of housing, ceramic substrate 3 is set, internal components is formed by housing and ceramic substrate 3 assembled package, ceramic substrate 3 is connected with the electrode of internal components by contact pin or lead-in wire 2, draw external pin 4, described contact pin or lead-in wire 2 carry out welding or glue fixing operation outside encapsulating housing simultaneously.
Contact pin in the present embodiment or lead-in wire scheme can carry out welding or glue fixing operation outside encapsulating housing, to instead of in traditional handicraft bonding wire in housing and then directly draw the method for external pin, effectively solve bonding force weak, easily come off, and the little problem being not easy to weld in built-in function space.
If Fig. 4 is lead-in wire outside weldings scheme, 5 places in Fig. 4 are outside weldings point.
Be pin terminal/socket assembling scheme as shown in Figure 5, Figure 6, ceramic substrate 3 and the assembling mode of internal components are that pin terminal coordinates and becomes bayonet fashion, mainly contain two kinds, a kind of as Fig. 5 be internal components extraction contact pin 6, terminal 7 made by external ceramic substrate 3, and both become bayonet fashion at cooperation; Another is internal components leading-out terminal 7, and contact pin 6 made by external ceramic substrate 3, and both become bayonet fashion at cooperation.
The positive and negative figure of ceramic substrate 3 as shown in Figure 7, Figure 8, ceramic substrate 3 is welded with plated-through hole 8, plain conductor 9, for the electrical connection of contact pin or lead-in wire 2, external pin 4; On ceramic substrate 3, circuit distribution, can change flexibly according to control overflow.
Embodiment 2: as shown in Figure 9, Figure 10, the inventive method also can be used for photoimpact tester, photo counter, comprises the photodiode with optoelectronic switch; Or Polarization Detection instrument, comprises full polarization state power detector, optical channel polarization state detector; Adjustable filtering part is replaced by switch or adjustable attenuator; By adjustable filtering, switch and any combination of two of adjustable damping function, or three's combination; Specific two end device, intermediate demand adds electricity and adjusts parts, as switch, attenuator, tunable filter.
Fig. 9, Tu10Zhong, 10-optical interface or speculum; 11-optoelectronic switch, or electric adjustment member, as micro-electromechanical switch, heating resistor, driving member, electrooptic modulator etc., or electroluminescent rotatory polarization sheet, or shutterMEMS chip; 12-photodiode and electrical interface.
Be described above embodiments of the invention, be understandable that, above-described embodiment is exemplary, limitation of the present invention can not be interpreted as, those of ordinary skill in the art can change above-described embodiment within the scope of the invention when not departing from principle of the present invention and aim, revising, replacing and modification, and does not affect every claim of the present invention.
Claims (6)
1. the electric method for packing of photoelectric device, described optical device comprises housing, internal components, it is characterized in that: in the side of housing, ceramic substrate is set, internal components is formed by housing and ceramic substrate assembled package, ceramic substrate is by contact pin or lead-in wire and being electrically connected of internal components, draw external pin, described contact pin or lead-in wire carry out welding or glue fixing operation outside encapsulating housing simultaneously.
2. the electric method for packing of a kind of photoelectric device according to claim 1, is characterized in that described ceramic substrate and the assembling mode of internal components are that pin terminal coordinates and becomes bayonet fashion.
3. the electric method for packing of a kind of photoelectric device according to claim 2, it is characterized in that the assembling mode of described ceramic substrate and internal components draws contact pin at internal components, terminal made by external ceramic substrate, and both become bayonet fashion at cooperation.
4. the electric method for packing of a kind of photoelectric device according to claim 2, it is characterized in that described housing and ceramic substrate assembled package mode are at internal components leading-out terminal, contact pin made by external ceramic substrate, and both become bayonet fashion at cooperation.
5. the electric method for packing of a kind of photoelectric device according to claim 1, is characterized in that the assembling mode of described ceramic substrate and internal components is that lead-in wire on internal components carries out outside weldings on ceramic substrate.
6. the electric method for packing of a kind of photoelectric device according to claim 1, is characterized in that being welded with plated-through hole, plain conductor on described ceramic substrate, for the electrical connection of contact pin or lead-in wire, external pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510951618.0A CN105428460B (en) | 2015-12-17 | 2015-12-17 | A kind of electric method for packing of photoelectric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510951618.0A CN105428460B (en) | 2015-12-17 | 2015-12-17 | A kind of electric method for packing of photoelectric device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105428460A true CN105428460A (en) | 2016-03-23 |
| CN105428460B CN105428460B (en) | 2017-05-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510951618.0A Active CN105428460B (en) | 2015-12-17 | 2015-12-17 | A kind of electric method for packing of photoelectric device |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113690677A (en) * | 2021-08-27 | 2021-11-23 | 中国电子科技集团公司第十四研究所 | Hybrid integrated power module capable of being plugged and unplugged quickly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030193095A1 (en) * | 2002-04-15 | 2003-10-16 | Opnext Japan, Inc. | Optical module equipped with a wiring plate |
| CN102570293A (en) * | 2012-02-13 | 2012-07-11 | 苏州华必大激光有限公司 | High thermal load large power semiconductor laser |
| JP2015088641A (en) * | 2013-10-31 | 2015-05-07 | 三菱電機株式会社 | Optical module |
-
2015
- 2015-12-17 CN CN201510951618.0A patent/CN105428460B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030193095A1 (en) * | 2002-04-15 | 2003-10-16 | Opnext Japan, Inc. | Optical module equipped with a wiring plate |
| CN102570293A (en) * | 2012-02-13 | 2012-07-11 | 苏州华必大激光有限公司 | High thermal load large power semiconductor laser |
| JP2015088641A (en) * | 2013-10-31 | 2015-05-07 | 三菱電機株式会社 | Optical module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113690677A (en) * | 2021-08-27 | 2021-11-23 | 中国电子科技集团公司第十四研究所 | Hybrid integrated power module capable of being plugged and unplugged quickly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105428460B (en) | 2017-05-31 |
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