CN105415436A - Production process of glue retraction reinforced sheet - Google Patents

Production process of glue retraction reinforced sheet Download PDF

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Publication number
CN105415436A
CN105415436A CN201510918938.6A CN201510918938A CN105415436A CN 105415436 A CN105415436 A CN 105415436A CN 201510918938 A CN201510918938 A CN 201510918938A CN 105415436 A CN105415436 A CN 105415436A
Authority
CN
China
Prior art keywords
steel band
glue
adhesive tape
die
cutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510918938.6A
Other languages
Chinese (zh)
Inventor
王中飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Midas Precision Electronic Co Ltd
Original Assignee
Suzhou Midas Precision Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Midas Precision Electronic Co Ltd filed Critical Suzhou Midas Precision Electronic Co Ltd
Priority to CN201510918938.6A priority Critical patent/CN105415436A/en
Publication of CN105415436A publication Critical patent/CN105415436A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00Shaping by press-cutting; Perforating
    • B21D28/24Perforating, i.e. punching holes
    • B21D28/26Perforating, i.e. punching holes in sheets or flat parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/44Joining a heated non plastics element to a plastics element

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

The invention discloses a production process of a glue retraction reinforced sheet, and relates to the technical field of processing of flexible printed circuit boards. The production process comprises the following steps: an adhesive tape 1, which is conveyed continuously, is punched by a first cutter 2 to form a die cutting glue shape and an adhesive tape positioning hole, and after a waste material is removed through a receiving mechanism, the adhesive tape 1 is conveyed to a sticking unit; and after a steel tape 5, which is conveyed continuously, is punched by a second cutter 6 to form a positioning hole, the steel tape 5 is conveyed to the sticking unit.

Description

A kind of glue inside contracts the production technology of reinforcing chip
Technical field
The present invention relates to flexible PCB processing technique field, particularly a kind of glue inside contracts the production technology of reinforcing chip.
Background technology
The raw manufacturer of flexible PCB is for the glue stain consideration reduced because the glue that overflows produces, need reinforcing chip to become and entirely inside contract glue or locally inside contract plastic structure, but the manufacture craft of such reinforcing chip all quite poor efficiency at present, when glue and steel disc laminating, once can only cover the reinforcing chip of glue some, glue can not be covered continuously, and need drop into more manpower go make.Thus need a kind of can raising efficiency and guaranteed quality cover glue continuously inside contract reinforcement steel disc production method.
Summary of the invention
The technical problem to be solved in the present invention is: glue inside contracts the not high problem of reinforcing chip production efficiency at present.
For solving the problems of the technologies described above, the invention provides the production technology that a kind of glue inside contracts reinforcing chip, the production equipment adopted comprises: the die-cut unit of cross cutting glue, the die-cut unit of steel band, laminating unit and the die-cut unit of product;
The die-cut unit of described cross cutting glue is provided with the first cutter of hole forming for adhesive tape and gum forming, and for removing the receiving mechanism of waste material, described adhesive tape continuously passes through described first cutter; The die-cut unit of described steel band is provided with the second cutter of the hole forming for steel band, and described steel band continuously passes through described second cutter;
Described laminating unit comprises heating platen, photoelectric sensor and is provided with the base plate of lift pin, described steel band and adhesive tape are between described heating platen and base plate, described photoelectric sensor aims at described steel band, when aliging with the hole of described steel band in the hole of described adhesive tape, described photoelectric sensor controls in described lift pin patchhole, and controlling described heating platen pressing, described adhesive tape and described steel band are formed and cover glue steel band; Described lift pin realizes rising by the spring being located at bottom, realizes shrinking by belt pulley;
The die-cut unit of described product is provided with the 3rd cutter for punching products profile and the second lead, described in cover glue steel band through the die-cut unit of described product, complete die-cut;
This technique comprises the following steps:
Step one, the adhesive tape of lasting conveying the first cutter is punched out cross cutting glue profile and adhesive tape locating hole, after waste material removes waste material by receiving mechanism, adhesive tape is delivered to laminating unit;
Step 2, the steel band of lasting conveying punched out locating hole with the second cutter after, steel band is delivered to laminating unit;
The photoelectric sensor of step 3, laminating unit judges: whether the locating hole of steel band and adhesive tape aligns, if alignd, by steel band and adhesive tape gluing, is formed and covers glue steel band, and be delivered to the die-cut unit of product;
The die-cut unit of step 4, product the second lead carries out correcting to covering glue steel band, and the 3rd cutter punches out product design, forms product material volume;
The waste material that step 5, removal are covered on glue steel band, obtains glue and inside contracts reinforcing chip winding.
This production equipment can inside contract reinforcing chip by continuous production glue, and without the need to dropping into a large amount of manpower, production efficiency significantly improves; And unit of fitting adopts the mode of optoelectronic induction that steel band can be made to align more exactly with the hole of adhesive tape, improves the quality of products.
Accompanying drawing explanation
Fig. 1 is the structural representation that glue of the present invention inside contracts reinforcing chip production equipment.
Fig. 2 is the die-cut unit of cross cutting glue of production equipment, the enlarged diagram of the die-cut unit of steel band in Fig. 1.
Fig. 3 is the enlarged diagram of the laminating unit of production equipment in Fig. 1.
Fig. 4 is the enlarged diagram of the die-cut unit of product of production equipment in Fig. 1.
Detailed description of the invention
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Glue as shown in Figures 1 to 4 inside contracts the automatic producing device of reinforcing chip, comprising: the die-cut unit of cross cutting glue, the die-cut unit of steel band, laminating unit and the die-cut unit of product.
The die-cut unit of cross cutting glue is provided with the first cutter 2 of hole forming for adhesive tape 1 and gum forming, and for removing the receiving mechanism of waste material.First cutter 2 is specially hobboing cutter, and adhesive tape 1 continuously passes through the first cutter 2, goes out blob of viscose and the locating hole of requirement shape through the first cutter 2 punch forming.Receiving mechanism comprises nip rolls 3 and material receiving roller 4, and after nip rolls 3 is positioned at the first cutter 2, and push down adhesive tape 1, material receiving roller 3 continues the waste material of coiled adhesive tape 1.
The die-cut unit of steel band is provided with the second cutter 6 of the hole forming for steel band 5, and steel band 5 continuously passes through the second cutter 6, and punches out locating hole.
Laminating unit comprises heating platen 7, photoelectric sensor 8 and is provided with the base plate of lift pin 13, steel band 5 and adhesive tape 1 are between heating platen 7 and base plate 13, photoelectric sensor 8 aims at steel band 5, when the locating hole of adhesive tape 1 aligns with the locating hole of steel band 5, photoelectric sensor 8 controls in lift pin 13 patchhole, and controlling heating platen 7 pressing, adhesive tape 1 and steel band 5 are formed and cover glue steel band 9.
The structure of lift pin 13 is specially: bottom is provided with the spring 1301 being in compressive state, and thimble 13 and belt pulley 1302 link, and belt pulley 1302 rotates forward, and makes thimble 13 increase, and direction is rotated and then made thimble 13 decline.Whether photoelectric sensor 8 aligns according to locating hole, controls the rotation direction of belt pulley 1302, if alignd, then belt pulley 1302 of leaving rotates forward under the effect of spring 1301, and lift pin rises from; If unjustified, then control belt pulley 1302 and rotate backward, lift pin declines, until the tractive force of belt pulley 1302 is identical with the bounce of spring 1301.
The die-cut unit of product is provided with the 3rd cutter 10 and the second lead 11 for punching products profile, and cover glue steel band 9 and continuously pass through the die-cut unit of product, insert correcting position in locating hole by the second lead 11, then the 3rd cutter 10 punches out product design.
First cutter 2, the 3rd cutter 10 and the second lead 11 need Aided design, namely the position of the gum forming cutter of the first cutter 2 need with its hole forming cutter for positioning datum, and the position of the 3rd cutter 10 need with the second lead 11 for positioning datum, when reality is fitted, these two positioning datums can overlap.In addition, the die-cut profile of the 3rd cutter 10 should be greater than the die-cut profile of the first cutter 2, the 3rd cutter 10 not so can be made to be die-cut to cross cutting glue, do not reach the effect that glue inside contracts.
The production stage of this production equipment is:
Step one, the adhesive tape 1 of lasting conveying the first cutter 2 is punched out cross cutting glue profile and adhesive tape locating hole, after waste material removes waste material by receiving mechanism, adhesive tape 1 is delivered to laminating unit;
Step 2, the steel band 5 of lasting conveying punched out locating hole with the second cutter 6 after, steel band 5 is delivered to laminating unit;
The photoelectric sensor 8 of step 3, laminating unit judges: whether the locating hole of steel band 5 and adhesive tape 1 aligns, if alignd, steel band 5 and adhesive tape 1 is fitted, and is formed and covers glue steel band 9, and be delivered to the die-cut unit of product;
The die-cut unit of step 4, product the second lead 11 carries out correcting to covering glue steel band 9, and the 3rd cutter 10 punches out product design, forms product material volume 12;
The waste material that step 5, removal are covered on glue steel band 9, obtains glue and inside contracts reinforcing chip winding.
This production equipment can inside contract reinforcing chip by continuous production glue, and without the need to dropping into a large amount of manpower, production efficiency significantly improves; And unit of fitting adopts the mode of optoelectronic induction that steel band can be made to align more exactly with the hole of adhesive tape, improves the quality of products.
Above embodiment is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.

Claims (1)

1. glue inside contracts a production technology for reinforcing chip, and the production equipment adopted comprises: the die-cut unit of cross cutting glue, the die-cut unit of steel band, laminating unit and the die-cut unit of product;
The die-cut unit of described cross cutting glue is provided with the first cutter of hole forming for adhesive tape and gum forming, and for removing the receiving mechanism of waste material, described adhesive tape continuously passes through described first cutter; The die-cut unit of described steel band is provided with the second cutter of the hole forming for steel band, and described steel band continuously passes through described second cutter;
Described laminating unit comprises heating platen, photoelectric sensor and is provided with the base plate of lift pin, described steel band and adhesive tape are between described heating platen and base plate, described photoelectric sensor aims at described steel band, when aliging with the hole of described steel band in the hole of described adhesive tape, described photoelectric sensor controls in described lift pin patchhole, and controlling described heating platen pressing, described adhesive tape and described steel band are formed and cover glue steel band; Described lift pin realizes rising by the spring being located at bottom, realizes shrinking by belt pulley;
The die-cut unit of described product is provided with the 3rd cutter for punching products profile and the second lead, described in cover glue steel band through the die-cut unit of described product, complete die-cut;
It is characterized in that, comprise the following steps:
Step one, the adhesive tape of lasting conveying the first cutter is punched out cross cutting glue profile and adhesive tape locating hole, after waste material removes waste material by receiving mechanism, adhesive tape is delivered to laminating unit;
Step 2, the steel band of lasting conveying punched out locating hole with the second cutter after, steel band is delivered to laminating unit;
The photoelectric sensor of step 3, laminating unit judges: whether the locating hole of steel band and adhesive tape aligns, if alignd, by steel band and adhesive tape gluing, is formed and covers glue steel band, and be delivered to the die-cut unit of product;
The die-cut unit of step 4, product the second lead carries out correcting to covering glue steel band, and the 3rd cutter punches out product design, forms product material volume;
The waste material that step 5, removal are covered on glue steel band, obtains glue and inside contracts reinforcing chip winding.
CN201510918938.6A 2015-12-11 2015-12-11 Production process of glue retraction reinforced sheet Pending CN105415436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510918938.6A CN105415436A (en) 2015-12-11 2015-12-11 Production process of glue retraction reinforced sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510918938.6A CN105415436A (en) 2015-12-11 2015-12-11 Production process of glue retraction reinforced sheet

Publications (1)

Publication Number Publication Date
CN105415436A true CN105415436A (en) 2016-03-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510918938.6A Pending CN105415436A (en) 2015-12-11 2015-12-11 Production process of glue retraction reinforced sheet

Country Status (1)

Country Link
CN (1) CN105415436A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207183A (en) * 2020-08-27 2021-01-12 苏州市吴中区伟良电子有限公司 Production process of three-dimensional reinforced automatic punching and pasting coil

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797465A (en) * 1993-08-05 1995-04-11 Mitsui Toatsu Chem Inc Prepreg and laminated structure
JP2004034161A (en) * 2002-06-28 2004-02-05 Uht Corp Method for cutting flexible printed wiring board
CN101720169A (en) * 2009-12-09 2010-06-02 厦门弘信电子科技有限公司 Flexible printed circuit board steel disc reinforcing hot-pressing making process
CN103747620A (en) * 2013-12-31 2014-04-23 苏州米达思精密电子有限公司 Preparation method of local binderless reinforce panel
CN104470217A (en) * 2014-11-28 2015-03-25 苏州米达思精密电子有限公司 False sticking equipment
CN204272504U (en) * 2014-11-28 2015-04-15 苏州米达思精密电子有限公司 A kind of glue inside contracts the production equipment of reinforcing chip

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797465A (en) * 1993-08-05 1995-04-11 Mitsui Toatsu Chem Inc Prepreg and laminated structure
JP2004034161A (en) * 2002-06-28 2004-02-05 Uht Corp Method for cutting flexible printed wiring board
CN101720169A (en) * 2009-12-09 2010-06-02 厦门弘信电子科技有限公司 Flexible printed circuit board steel disc reinforcing hot-pressing making process
CN103747620A (en) * 2013-12-31 2014-04-23 苏州米达思精密电子有限公司 Preparation method of local binderless reinforce panel
CN104470217A (en) * 2014-11-28 2015-03-25 苏州米达思精密电子有限公司 False sticking equipment
CN204272504U (en) * 2014-11-28 2015-04-15 苏州米达思精密电子有限公司 A kind of glue inside contracts the production equipment of reinforcing chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207183A (en) * 2020-08-27 2021-01-12 苏州市吴中区伟良电子有限公司 Production process of three-dimensional reinforced automatic punching and pasting coil

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Application publication date: 20160323