CN105413997B - Flexibility capacitance type micromachined ultrasonic transducer and preparation method thereof - Google Patents
Flexibility capacitance type micromachined ultrasonic transducer and preparation method thereof Download PDFInfo
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- CN105413997B CN105413997B CN201510907459.4A CN201510907459A CN105413997B CN 105413997 B CN105413997 B CN 105413997B CN 201510907459 A CN201510907459 A CN 201510907459A CN 105413997 B CN105413997 B CN 105413997B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
Abstract
The invention discloses flexibility capacitance type micromachined ultrasonic transducer, including flexible substrates, bottom electrode, etching sacrificial layer, organic polymer supporting layer, organic polymer vibration film, the Top electrode set gradually；The organic polymer supporting layer is provided with groove, the cavity of the groove and organic polymer vibration film formation ultrasonic transducer.The invention also discloses the preparation method of above-mentioned flexibility capacitance type micromachined ultrasonic transducer.The flexibility capacitance type micromachined ultrasonic transducer of the present invention, effectively reduce because couple it is bad and caused by ultrasonic wave loss, realize the ultrasonic transducer of flexibility, it is adaptable to the detecting object of any shape, epidermal tissue including animal, has effectively expanded CMUT application；The preparation method preparation technology of the present invention is simple, and cost is low.
Description
Technical field
The present invention relates to ultrasonic transducer field, more particularly to a kind of flexibility capacitance type micromachined ultrasonic transducer and its
Preparation method.
Background technology
Ultrasonic transducer and array probe are supersonic sounding and the critical component in ultrasonic imaging technique, are widely used in doctor
The technical fields such as Clinics and Practices, subsurface communication and detection, defect Non-Destructive Testing, ranging localization, remote sensing and remote control are learned, to improving
Population quality, ensure physical and mental health, Improving The Quality of Products, detection seabed resources, safeguard national security in terms of all with important
Meaning.Conventional piezoelectric ceramics (PZT) ultrasonic transducer have electromechanical conversion efficiency it is high, easily with Circuit Matching, performance be stable, Yi Jia
Work and low cost and other advantages, are a kind of current widely used acoustic-electric conversion elements.But it is due to that piezoceramic material is deposited
It is high in acoustic impedance, it is difficult the acoustic impedance match with human body soft tissue and water；Mechanical quality factor is high, narrow bandwidth；Fragility is big, anti-tensile
Low intensity, high density array element and ultra-thin the high-frequency transducer not defect such as easy processing, so as to increasingly restrict the space of its application.Phase
For, capacitance type micromachined ultrasonic transducer (CMUT) but has obvious advantage, such as bandwidth is more preferable, sensitivity is higher,
Noise is lower, easy making two-dimensional array etc., so as to make up many deficiencies of PZT PZT (piezoelectric transducer)s, CMUT will medical science detection, can
The technical fields such as wearable device, Non-Destructive Testing play a significant role.
Ultrasonic wave can both be converted into electric signal by CMUT, can also convert the electrical signal to ultrasonic wave.When in film and base
When applying DC voltage between i.e. two electrodes between body, film is pulled to matrix by strong electrostatic field, is then applied again in two interpolars and is handed over
Voltage is flowed, film will vibrate and produce ultrasonic wave；On the contrary, apply between two electrodes after appropriate DC offset voltage, it is thin
Film vibrates under ul-trasonic irradiation, and the electric capacity between two battery lead plates changes, by detecting that ultrasonic wave is realized in this change
Reception.
Current capacitance type micromachined ultrasonic transducer (CMUT) matrix is generally silicon materials, and vibration film material is also silicon
Class compound, its manufacture craft is compatible with si-substrate integrated circuit, easily integrated with transmitting and receiving circuit, realizes high-density integrated
Ultrasonic plane array is popped one's head in.But substrate is made using silicon single crystal material, it is impossible to make flexible array, it is impossible to closely connect with detected object surface
Touch, especially the detected object coupling efficiency of surface irregularity will be substantially reduced, while there are very big bandwidth restrictions.
The content of the invention
In order to overcome the disadvantages mentioned above and deficiency of prior art, it is an object of the invention to provide a kind of flexibility condenser type
Micro-machined ultrasonic transducer, effectively reduce because couple it is bad and caused by ultrasonic wave loss.
It is an object of the invention to provide the preparation method of above-mentioned flexibility capacitance type micromachined ultrasonic transducer, work is prepared
Skill is simple, and cost is low.
The purpose of the present invention is achieved through the following technical solutions：
Flexibility capacitance type micromachined ultrasonic transducer, including set gradually flexible substrates, bottom electrode, etches sacrificial
Layer, organic polymer supporting layer, organic polymer vibration film, Top electrode；The organic polymer supporting layer is provided with groove, institute
State the cavity of groove and organic polymer vibration film formation ultrasonic transducer.
The depth of the groove is 2.0~4.0 μm, and basal diameter is 20~200 μm.
The groove is multiple.
The thickness of the organic polymer vibration film is 0.5~2.5 μm.
The organic polymer vibration film is rubber film or polyvinyl chloride plastic film.
The flexible substrates are flexible PCB.
The Top electrode is aluminium film or silverskin.
The bottom electrode is copper film.
When flexibility capacitance type micromachined ultrasonic transducer, apply DC voltage, strong electrostatic field between upper/lower electrode
Organic polymer vibration film is pulled into flexible substrates, is then applying alternating voltage between the upper and lower again, vibration film vibrates
And produce ultrasonic wave；
When property softening capacitance type micromachined ultrasonic transducer is used as ultrasonic receiver, apply direct current between upper/lower electrode
Bias voltage, organic polymer vibration film vibrates under ul-trasonic irradiation, and the electric capacity between two battery lead plates changes, and leads to
The reception of ultrasonic wave is realized in the change for crossing detection electric capacity.
The preparation method of described flexibility capacitance type micromachined ultrasonic transducer, comprises the following steps：
(1) projection is etched on silicon chip using photoetching technique, obtains the impressing mould for forming cavity；
(2) the spin coating organic polymer material on the metal level laid on a flexible substrate；
(3) stamping technique is used, the impressing mould obtained using step (1) is on the organic polymer material of step (2)
Groove is imprinted out, formation sets reeded organic polymer supporting layer and etching sacrificial layer；
(4) one layer of organic polymer diaphragm materials of spin coating are used as vibration film on aluminum flake surface；
(5) vibration film of step (4) and the organic polymer supporting layer of step (3) are glued using heat cure bonding techniques
Close, form the cavity of ultrasonic transducer；
(6) aluminium flake on erosion removal vibration film surface；
(7) layer of metal film is deposited on the surface of vibration film, and etching forms Top electrode.
Compared with prior art, the present invention has advantages below and beneficial effect：
(1) flexibility capacitance type micromachined ultrasonic transducer of the invention, using flexible substrates, overcomes silicon substrate CMUT's
Shortcoming and defect, effectively reduce because couple it is bad and caused by ultrasonic wave loss.On the other hand, using organic polymer as shaking
Dynamic film, overcomes the bandwidth restrictions of silicon class compound, improves frequency bandwidth, the coefficient of coup, sensitivity and anti-interference energy
Power.
(2) flexibility capacitance type micromachined ultrasonic transducer of the invention, realizes the ultrasonic transducer of flexibility, is applicable
In the epidermal tissue of the detecting object of any shape, including animal, CMUT application has effectively been expanded.
(3) flexibility capacitance type micromachined ultrasonic transducer of the invention, using organic polymer as material, greatly
Technique manufacturing cost is reduced, is easy to a wide range of popularization and application.
(4) flexibility capacitance type micromachined ultrasonic transducer of the invention, improves frequency bandwidth, the coefficient of coup, sensitive
Degree and antijamming capability.
(5) preparation method of flexibility capacitance type micromachined ultrasonic transducer of the invention, preparation technology is simple, cost
It is low.
Brief description of the drawings
Fig. 1 is the flexibility capacitance type micromachined ultrasonic transducer architecture side view of embodiments of the invention.
Fig. 2 is the silicon materials impressing mould schematic diagram of embodiments of the invention.
Fig. 3 is spin coating organic polymer material schematic diagram on substrate in the step 2 of embodiments of the invention.
Fig. 4 is the organic polymer effect signal on the impressing mould and substrate in the step 3.3 of embodiments of the invention
Figure.
Fig. 5 is the final step of stamping technique in the step 3.4 of embodiments of the invention, the schematic diagram after the demoulding
Fig. 6 for embodiments of the invention step 4 on aluminum slice spin coating diaphragm materials schematic diagram.
The schematic diagram that Fig. 7 bonds for diaphragm materials in the step 5 of embodiments of the invention with support layer material.
Fig. 8 is erodes the schematic diagram of top-level metallic in the step 6 of embodiments of the invention.
Fig. 9 is the schematic diagram after the completion of electrode etch in the step 8 of embodiments of the invention.
Figure 10 is the top view of the 3*3 unit top section electrodes of embodiments of the invention.
Embodiment
With reference to embodiment, the present invention is described in further detail, but the implementation of the present invention is not limited to this.
Embodiment
The flexibility capacitance type micromachined ultrasonic transducer of the present embodiment, including set gradually flexible PCB substrate 1,
Bottom electrode 2, etching sacrificial layer 3, organic polymer supporting layer 4, organic polymer vibration film 5, Top electrode 6；It is described organic poly-
Compound supporting layer 4 is provided with groove 41, the cavity of the groove 41 and the formation ultrasonic transducer of organic polymer vibration film 5.
The groove is that depth is 2.0~4.0 μm, and basal diameter is 20~200 μm of cylindrical groove.
The thickness of the organic polymer vibration film is 0.5~2.5 μm, using rubber or igelite.
The Top electrode is aluminium film or silverskin, and bottom electrode is copper film.
When flexibility capacitance type micromachined ultrasonic transducer, apply DC voltage, strong electrostatic field between upper/lower electrode
Vibration film is pulled into flexible substrates, is then applying alternating voltage between the upper and lower again, vibration film occurs to vibrate and produce ultrasound
Ripple；
When flexibility capacitance type micromachined ultrasonic transducer is used as ultrasonic receiver, apply direct current between upper/lower electrode
Bias voltage, vibration film vibrates under ul-trasonic irradiation, and the electric capacity between two battery lead plates changes, by detecting electric capacity
Change realize the reception of ultrasonic wave.
The preparation method of the flexibility capacitance type micromachined ultrasonic transducer of the present embodiment, comprises the following steps：
Step 1：The projection of 3*3 units is etched on silicon chip using photoetching technique, for forming cavity impressing mould, is such as schemed
Shown in 2.
Wherein, the preparation process of impressing mould：
Step 1.1：Spin coating is carried out to the silicon chip for having cleaned, having dried, and carries out front baking processing；
Step 1.2：Processing is exposed using mask plate to the silicon chip after front baking, makes pattern transfer to photoresist
Face；
Step 1.3：Development and rear baking are carried out to the silicon chip after exposure, photoresist is binded with silicon chip firm；
Step 1.4：The rear silicon chip treated that dries is corroded, the pattern on lithography mask version is exactly transferred to crystalline substance
First surface；
Step 1.5：Photoresist is removed, impressing mould figure is formed, as shown in Figure 2.
Step 2：The organic polymer of one layer of 2.0~5.0 μ m-thick of spin coating on the Cu films for applying Cu flexible PCBs substrate (FPC)
Film layer, as shown in Figure 3.
Step 3：Using stamping technique, the organic material in flexible PCB is imprinted into out groove using impressing mould, produced
Etching sacrificial layer and the supporting layer for setting groove, wherein etching sacrificial layer thickness are 0.1~0.5 μm, and cavity diameter is 20~200
μm；
Wherein, the manufacturing process for imprinting the supporting layer for forming generation etching sacrificial layer and setting groove is as follows：
Step 3.1：The substrate that organic polymer thin film layer is deposited on Cu films is fixed on heating platform, is warming up to organic
The glassy state softening temperature of polymeric material；
Step 3.2：The impressing mould made is pressed on organic polymer thin film layer, and applies appropriate pressure,
Ensure that polymer thickness is bigger than mould cavity thickness, as shown in figure 4, the cavity in organic polymer filling mould, forms support
Layer and etching stop layer；
Step 3.3：After molding terminates, temperature is reduced, solidifies organic polymer material, and with the figure overlapped with mould
Shape；
Step 3.4：Mould is removed, being not filled by region will be as cavity groove, as shown in Figure 5.
Step 4：The diaphragm materials of 0.5~2.5 μm of spin coating one layer are as vibration film 5 on the ultra-thin surface of aluminum slice 7,
As shown in Figure 6.
Step 5：Diaphragm materials are bonded together with support layer material using heat cure bonding techniques, micro-structural are formed empty
Chamber, as shown in Figure 7；
Wherein, micro-structural cavity manufacturing process：
Step 5.1：Temperature is increased to glass transition temperature of diaphragm materials or so；
Step 5.2：Certain ambient pressure by applying, is in close contact the bonding surface that softening is soaked；
Step 5.3：Intermolecular formation active force, realizes the Direct Bonding of diaphragm materials and support layer material；
Step 6：The aluminium film on vibration film surface is corroded using certain density solution and diaphragm surface is cleaned, such as
Shown in Fig. 8；
Step 7：The thick aluminium films or silverskin of one layer of 100~200nm is deposited on the surface of vibration film, and etches to be formed
Top electrode, as shown in Figure 9, Figure 10.
Above-described embodiment is preferably embodiment, but embodiments of the present invention are not by the embodiment of the invention
Limitation, other any Spirit Essences without departing from the present invention and the change made under principle, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (10)
1. flexibility capacitance type micromachined ultrasonic transducer, it is characterised in that including the flexible substrates set gradually, bottom electrode,
Etching sacrificial layer, organic polymer supporting layer, organic polymer vibration film, Top electrode；The organic polymer supporting layer is set
It is fluted, the cavity of the groove and organic polymer vibration film formation ultrasonic transducer；The metal covered in flexible substrates
Film directly serves as bottom electrode.
2. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, it is characterised in that the depth of the groove
Spend for 2.0~4.0 μm, basal diameter is 20~200 μm.
3. flexibility capacitance type micromachined ultrasonic transducer according to claim 1 or 2, it is characterised in that the groove
To be multiple.
4. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, it is characterised in that the organic polymer
The thickness of thing vibration film is 0.5~2.5 μm.
5. the flexibility capacitance type micromachined ultrasonic transducer according to claim 1 or 4, it is characterised in that described organic
Polymer vibration film is rubber film or polyvinyl chloride plastic film.
6. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, it is characterised in that the flexible substrates
For flexible PCB.
7. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, it is characterised in that the Top electrode is
Aluminium film or silverskin.
8. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, it is characterised in that the bottom electrode is
Copper film.
9. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, it is characterised in that
When flexibility capacitance type micromachined ultrasonic transducer, apply DC voltage between upper/lower electrode, strong electrostatic field will have
Machine polymer vibration film pulls to flexible substrates, is then applying alternating voltage between the upper and lower again, vibration film occurs to vibrate and produce
Raw ultrasonic wave；
When flexibility capacitance type micromachined ultrasonic transducer is used as ultrasonic receiver, apply direct current biasing between upper/lower electrode
Voltage, organic polymer vibration film vibrates under ul-trasonic irradiation, and the electric capacity between two battery lead plates changes, and passes through inspection
The reception of ultrasonic wave is realized in the change for surveying electric capacity.
10. the preparation method of the flexibility capacitance type micromachined ultrasonic transducer according to any one of claim 1~9, its
It is characterised by, comprises the following steps：
(1) projection is etched on silicon chip using photoetching technique, obtains the impressing mould for forming cavity；
(2) the spin coating organic polymer material on the metal level laid on a flexible substrate；
(3) stamping technique is used, the impressing mould obtained using step (1) is imprinted on the organic polymer material of step (2)
Go out groove, stamping technique is carried out in the glass point humidity province of organic polymer material, and formation sets reeded organic polymer branch
Support layer and etching sacrificial layer；
(4) one layer of organic polymer diaphragm materials of spin coating are used as vibration film on aluminum flake surface；
(5) vibration film of step (4) and the organic polymer supporting layer of step (3) are bonded using heat cure bonding techniques,
Form the cavity of ultrasonic transducer；
(6) aluminium flake on erosion removal vibration film surface；
(7) layer of metal film is deposited on the surface of vibration film, and etching forms Top electrode.
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106925496A (en) * | 2017-01-06 | 2017-07-07 | 中北大学 | Microelectromechanical ultrasound is popped one's head in and circuit |
| CN106951887B (en) * | 2017-04-25 | 2020-07-03 | 太原科技大学 | Micro-capacitance ultrasonic transducer linear array device for identification |
| EP3482835A1 (en) * | 2017-11-14 | 2019-05-15 | Koninklijke Philips N.V. | Capacitive micro-machined ultrasound transducer (cmut) devices and control methods |
| KR20200100112A (en) | 2017-12-19 | 2020-08-25 | 더 유니버시티 오브 브리티쉬 콜롬비아 | Layered structure and method of manufacturing the same |
| CN108918662B (en) * | 2018-05-16 | 2020-10-27 | 西安交通大学 | CMUTs fluid density sensor and preparation method thereof |
| CN108722837A (en) * | 2018-05-22 | 2018-11-02 | 清华大学 | A kind of capacitive ultrasound transducer and its manufacturing method |
| CN109068245A (en) * | 2018-08-01 | 2018-12-21 | 京东方科技集团股份有限公司 | Screen sounding device, singing display screen and its manufacturing method and screen sonification system |
| CN109433571B (en) * | 2018-09-25 | 2020-10-20 | 中国科学院电工研究所 | Flexible photoinduced ultrasonic film transducer and preparation method thereof |
| CN109301061A (en) * | 2018-09-28 | 2019-02-01 | 天津大学 | Flexible miniature piezoelectric ultrasonic transducer, array and forming method thereof |
| CN111039251B (en) * | 2018-10-15 | 2023-05-02 | 中国科学院上海微***与信息技术研究所 | Piezoelectric miniature ultrasonic transducer and preparation method thereof |
| CN109561876A (en) * | 2018-10-24 | 2019-04-02 | 深圳市汇顶科技股份有限公司 | Ultrasonic transducer and its manufacturing method |
| CN109909140B (en) * | 2019-03-06 | 2021-06-04 | 中国工程物理研究院电子工程研究所 | Piezoelectric micromechanical ultrasonic transducer and preparation method thereof |
| CN111024213B (en) * | 2019-12-27 | 2021-03-30 | 安徽芯淮电子有限公司 | Flexible capacitive vibration sensor and manufacturing method thereof |
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| CN205199868U (en) * | 2015-12-09 | 2016-05-04 | 华南理工大学 | Flexibility capacitanc microfabrication ultrasonic transducer |
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| US7438823B2 (en) * | 2003-12-11 | 2008-10-21 | Industrial Technology Research Institute | Imprint method for manufacturing micro capacitive ultrasonic transducer |
| TWI280633B (en) * | 2005-10-21 | 2007-05-01 | Ind Tech Res Inst | Method of fabricating flexible micro-capacitive ultrasonic transducer by the use of imprinting and transfer printing techniques |
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| CN104984890A (en) * | 2015-06-06 | 2015-10-21 | 中国科学院合肥物质科学研究院 | Flexible focusing MEMS ultrasonic generator and preparation method thereof |
| CN105032749A (en) * | 2015-07-09 | 2015-11-11 | 深圳市理邦精密仪器股份有限公司 | Multi-layer lamination ultrasonic transducer and manufacturing method thereof |
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