CN105397231A - Soldering tin preheating principle and application - Google Patents
Soldering tin preheating principle and application Download PDFInfo
- Publication number
- CN105397231A CN105397231A CN201510832634.8A CN201510832634A CN105397231A CN 105397231 A CN105397231 A CN 105397231A CN 201510832634 A CN201510832634 A CN 201510832634A CN 105397231 A CN105397231 A CN 105397231A
- Authority
- CN
- China
- Prior art keywords
- solder
- preheating
- tin
- scolding tin
- scaling powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 238000005476 soldering Methods 0.000 title claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 157
- 239000000843 powder Substances 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000003466 welding Methods 0.000 claims abstract description 20
- 239000007787 solid Substances 0.000 claims abstract description 17
- 238000004880 explosion Methods 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 49
- 210000004243 sweat Anatomy 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 15
- 230000006378 damage Effects 0.000 claims description 3
- 230000001771 impaired effect Effects 0.000 claims description 3
- 230000006698 induction Effects 0.000 claims description 3
- 238000012986 modification Methods 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 3
- 238000011017 operating method Methods 0.000 claims description 3
- GSJBKPNSLRKRNR-UHFFFAOYSA-N $l^{2}-stannanylidenetin Chemical compound [Sn].[Sn] GSJBKPNSLRKRNR-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 14
- 230000009286 beneficial effect Effects 0.000 description 2
- 235000015111 chews Nutrition 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a soldering tin preheating principle and application. According to the invention, a bonding wire comprises a solder layer and scaling powder arranged in the solder layer, the soldering tin preheating principle is applied to carry out preheating treatment on solder before soldering iron is used for welding tin at a high temperature, and enables the solder to become the soft state after preheating from the solid state before preheating; after the solder layer and the scaling powder arranged in the solder layer are preheated, the solder layer is enabled to become soft from the solid state, and during the high-temperature welding process, the soft solder layer relieves the sharp expansive force of the scaling powder, weakens the power of welding spot explosion caused by instantaneous, rapid and sharp heated expansion of the scaling powder during the welding process, and reduces the phenomenon that welding spot explosion generates tin balls, and the tin balls splash to the surfaces of electronic elements to cause a short circuit. The preheating time, the temperature, the supply current and the power-on or power-off states can be intelligently controlled according to the production demands, the intelligent operation degree is high, the tin ball splashing quantity during welding spot explosion can be controlled and greatly reduced, the operation is very safe, the yield of the electronic elements is high, the quality effect is excellent, and the production cost is lowered.
Description
Technical field
Before the present invention is applied in high temperature flatiron scolding tin, solder is carried out to the technical field of the pre-heat treatment, particularly relate to a kind of scolding tin preheating principle and characteristics.
Background technology
Traditional soldering tin technique is because solder is containing fluxing agent, solder is in scolding tin process, scaling powder can carry out the weldering of high-temperature quick fusing point to solder instantaneously, when scaling powder is in the state of Fast Heating, scaling powder easily produces bubble, easily expand after bubble Fast Heating and the power of solder joint blast occurs, and the tin sweat(ing) that solder joint blast produces is splashed to electronical elements surface and easily causes electronic component short circuit.Therefore, the deficiency of above-mentioned technical problem is there is for traditional soldering tin technique, the solder layer that the applicant researches and develops a kind of scaling powder and containing scaling powder by being positioned at solder inside forms, it carries out the pre-heat treatment to solder before being applied in high temperature flatiron scolding tin, solder is made to become the software state after preheating by the solid state before preheating, after the scaling powder preheating of solder layer and its inside, solder layer becomes software state by solid state, in high-temperature soldering process, soft solder layer alleviates the sharply expansive force of scaling powder, reduce the moment heated fast of scaling powder in welding process sharply to expand the power of solder joint blast occurs, decrease solder joint blast generation tin sweat(ing) be splashed to electronical elements surface and cause the phenomenon of short circuit, the time of its preheating, temperature, supply current and opening or closing of power supply all can need intelligentized control method according to what produce, intellectualized operation degree is high, and can greatly control and the splashing amount reducing solder joint explosion time tin sweat(ing), operation is fool proof, the yield rate of electronic component is high, mass effect is good, reduce production cost, a kind of scolding tin preheating principle and characteristics easy to use really belongs to necessary.
Summary of the invention
The solder layer that the technical problem to be solved in the present invention is to provide a kind of scaling powder and containing scaling powder by being positioned at solder inside forms, it carries out the pre-heat treatment to solder before being applied in high temperature flatiron scolding tin, solder is made to become the software state after preheating by the solid state before preheating, after the scaling powder preheating of solder layer and its inside, solder layer becomes software state by solid state, in high-temperature soldering process, soft solder layer alleviates the sharply expansive force of scaling powder, reduce the moment heated fast of scaling powder in welding process sharply to expand the power of solder joint blast occurs, decrease solder joint blast generation tin sweat(ing) be splashed to electronical elements surface and cause the phenomenon of short circuit, the time of its preheating, temperature, supply current and opening or closing of power supply all can need intelligentized control method according to what produce, intellectualized operation degree is high, and can greatly control and the splashing amount reducing solder joint explosion time tin sweat(ing), operation is fool proof, the yield rate of electronic component is high, mass effect is good, reduce production cost, scolding tin preheating principle and characteristics easy to use.The present invention is achieved through the following technical solutions:
A kind of scolding tin preheating principle and characteristics, this solder is made up of the solder layer of the scaling powder and containing scaling powder that are positioned at solder inside, this scolding tin preheating principle carries out the pre-heat treatment to solder before being applied in high temperature flatiron scolding tin, solder is made to become the software state after preheating by the solid state before preheating, after the scaling powder preheating of solder layer and its inside, solder layer becomes software state by solid state, in high-temperature soldering process, soft solder layer alleviates the sharply expansive force of scaling powder, reduce the moment heated fast of scaling powder in welding process sharply to expand the power of solder joint blast occurs, decrease solder joint blast generation tin sweat(ing) and be splashed to the phenomenon that electronical elements surface causes short circuit, operation is fool proof, the speed of its preheating is directly proportional to the speed of scolding tin, this time needed for scolding tin preheating is≤10 minutes, the modification scope of this scolding tin preheat temperature is: 30 DEG C-100 DEG C, the temperature adjusting scope that software solder after the pre-heat treatment carries out high temperature flatiron scolding tin is: 300 DEG C-500 DEG C.
As preferably, solder layer before preheating, first can carry out sealing to solder layer and destroy process, solder after preheating is in welding process, scaling powder can emit from the impaired expansion of solder layer is outer, alleviate the sharply expansive force of scaling powder to a certain extent, thus reduce scaling powder in welding process moment heated fast sharply expand and solder joint brisance occur, decrease solder joint blast produce tin sweat(ing) splash phenomenon.
As preferably, employing diameter is that the solder of 0.8mm makes the pre-heat treatment, first sealing is carried out to solder layer and destroy process, when carrying out the pre-heat treatment to solder, the time of required preheating is 2 minutes, the temperature of solder preheating is set to 65 DEG C, the temperature that software solder after the pre-heat treatment carries out high temperature flatiron scolding tin is 380 DEG C, and the generation of tin tin sweat(ing) is less than 5%.
As preferably, the operating procedure of this scolding tin preheating principle and characteristics is:
Step one, described solder are alternative before preheating carries out the process of sealing destruction, to reduce the splashing amount of solder joint explosion time tin sweat(ing) to solder layer.
Step 2, sealing is destroyed the bonding wire after having processed be sent to and have in the heater of insulating properties.
Step 3, to arrange according to the needs produced there is preheat temperature and the preheating time of the heater of insulating properties.
Step 4, startup power supply, temperature sensing device induction is positioned over the heating-up temperature of the solder had in the heater of insulating properties, and controls the supply current size of power supply and control opening or closing of power supply, makes solder can reach the preheat temperature of scolding tin needs fast.
Step 5, solder become software state after the pre-heat treatment, for high temperature flatiron scolding tin.
Bonding wire of the present invention comprises solder layer, and be arranged on the scaling powder of solder layer inside, it carries out the pre-heat treatment to solder before being applied in high temperature flatiron scolding tin, solder can be made to become the software state after preheating by the solid state before preheating, its beneficial effect is: after the scaling powder preheating of solder layer and its inside, solder layer becomes software state by solid state, in high-temperature soldering process, soft solder layer alleviates the sharply expansive force of scaling powder, reduce the moment heated fast of scaling powder in welding process sharply to expand the power of solder joint blast occurs, decrease solder joint blast generation tin sweat(ing) be splashed to electronical elements surface and cause the phenomenon of short circuit, the time of its preheating, temperature, supply current and opening or closing of power supply all can need intelligentized control method according to what produce, intellectualized operation degree is high, and can greatly control and the splashing amount reducing solder joint explosion time tin sweat(ing), operation is fool proof, the yield rate of electronic component is high, mass effect is good, reduce production cost, easy to use.
Accompanying drawing explanation
For ease of illustrating, the present invention is described in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is the stereogram of a kind of scolding tin preheating principle and characteristics of the present invention at heater.
Fig. 2 is the sectional view of a kind of scolding tin preheating principle and characteristics of the present invention at heater.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Better embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make to disclosure of the present invention understand more thorough comprehensively.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe concrete embodiment, is not intended to be restriction the present invention.
In the present embodiment, a kind of scolding tin preheating principle and characteristics of the present invention, this solder is made up of the solder layer of the scaling powder and containing scaling powder that are positioned at solder inside, this scolding tin preheating principle carries out the pre-heat treatment to solder before being applied in high temperature flatiron scolding tin, solder is made to become the software state after preheating by the solid state before preheating, after the scaling powder preheating of solder layer and its inside, solder layer becomes software state by solid state, in high-temperature soldering process, soft solder layer alleviates the sharply expansive force of scaling powder, reduce the moment heated fast of scaling powder in welding process sharply to expand the power of solder joint blast occurs, decrease solder joint blast generation tin sweat(ing) and be splashed to the phenomenon that electronical elements surface causes short circuit, operation is fool proof, the speed of its preheating is directly proportional to the speed of scolding tin, this time needed for scolding tin preheating is≤10 minutes, the modification scope of this scolding tin preheat temperature is: 30 DEG C-100 DEG C, the temperature adjusting scope that software solder after the pre-heat treatment carries out high temperature flatiron scolding tin is: 300 DEG C-500 DEG C.
Wherein, solder layer before preheating, first can carry out sealing to solder layer and destroy process, solder after preheating is in welding process, scaling powder can emit from the impaired expansion of solder layer is outer, alleviate the sharply expansive force of scaling powder to a certain extent, thus reduce scaling powder in welding process moment heated fast sharply expand and solder joint brisance occur, decrease solder joint blast produce tin sweat(ing) splash phenomenon.
Embodiment one, be that the solder of 0.8mm makes the pre-heat treatment to diameter, first carry out sealing before the preheating of solder layer and destroy process, solder does not set preheat temperature, and the temperature arranged when solder carries out high temperature flatiron scolding tin is 380 DEG C, and the generation of tin sweat(ing) is less than 60%.
Embodiment two, be that the solder of 0.8mm makes the pre-heat treatment to diameter, do not carry out sealing before the preheating of solder layer and destroy process, the set of time of solder preheating is 2 minutes, the temperature of solder preheating is set to 65 DEG C, the temperature that software solder after the pre-heat treatment carries out high temperature flatiron scolding tin is 380 DEG C, and the generation of tin sweat(ing) is less than 15%.
Embodiment three, be that the solder of 0.8mm makes the pre-heat treatment to diameter, first carry out sealing before the preheating of solder layer and destroy process, the set of time of solder preheating is 2 minutes, the temperature of solder preheating is set to 65 DEG C, the temperature that software solder after the pre-heat treatment carries out high temperature flatiron scolding tin is 380 DEG C, and the generation of tin sweat(ing) is less than 5%.As can be seen here, first solder carries out sealing to solder layer before making the pre-heat treatment and destroys process, the Best Times of solder preheating is chosen for 2 minutes, the optimum temperature of solder preheating is 65 DEG C, when the optimum temperature that software solder after the pre-heat treatment carries out high temperature flatiron scolding tin is chosen for 380 DEG C, with this understanding, it not only makes the generation of tin sweat(ing) be greatly reduced, also alleviate the sharply expansive force of scaling powder, reduce the moment heated fast of scaling powder in welding process sharply to expand the power of solder joint blast occurs, operation is fool proof.
The operating procedure of this scolding tin preheating principle and characteristics is:
Step one, described solder are alternative before preheating carries out the process of sealing destruction, to reduce the splashing amount of solder joint explosion time tin sweat(ing) to solder layer.
Step 2, sealing is destroyed the bonding wire after having processed be sent to and have in the heater of insulating properties.
Step 3, to arrange according to the needs produced there is preheat temperature and the preheating time of the heater of insulating properties.
Step 4, startup power supply, temperature sensing device induction is positioned over the heating-up temperature of the solder had in the heater of insulating properties, and controls the supply current size of power supply and control opening or closing of power supply, makes solder can reach the preheat temperature of scolding tin needs fast.
Step 5, solder become software state after the pre-heat treatment, for high temperature flatiron scolding tin.
In another embodiment of the invention, shown in Fig. 2, principle of the present invention and a scolding tin pre-heating system are applied and uses, this scolding tin pre-heating system comprises outer containment vessel 1, be connected with one end of described outer containment vessel 1 and chew 2 into tin, be connected with out tin with the other end of described outer containment vessel 1 and chew 3, extenal fixation part 4 is provided with near entering the appearance cover that tin chews the described outer containment vessel 1 of 2 one end, install with described extenal fixation part 4 and be provided with thermocouple sensor 5, ceramic heating tube 6 is provided with in described outer containment vessel 1, described thermocouple sensor 5 is connected with ceramic heating tube 6 and arranges, described ceramic heating tube 6 upper end is provided with ceramic heating tube power line 61, described ceramic heating tube power line 61 is provided with positive pole and negative pole, described enter tin chew 2 and to be communicated with one end of ceramic heating tube 6 and to arrange, described go out tin chew 3 and to be communicated with the other end of ceramic heating tube 6 and to arrange.
Its operating process is: when solder from enter tin chew 2 transmission enter in ceramic heating tube 6 time, externally fed connects positive pole and the negative pole of ceramic heating tube power line 61, ceramic heating tube 6 starts heating after connecting ceramic heating tube power line 61 energising, thermocouple sensor 5 can respond to the temperature of ceramic heating tube 6, it can change the electric current of externally fed according to the temperature of setting, thus change the temperature of ceramic heating tube 6 heating, the temperature that ceramic heating tube 6 is heated reaches the numerical value of setting, when becoming software by solid after solder heating, the bubble produced during scaling powder heating automatically outer emitting departs from solder, prevent bubble from occurring expanding or the phenomenon of blast, finally, solder passes through tin and chews 3 and send, for high temperature flatiron scolding tin is prepared.
Bonding wire of the present invention comprises solder layer, and be arranged on the scaling powder of solder layer inside, it carries out the pre-heat treatment to solder before being applied in high temperature flatiron scolding tin, solder can be made to become the software state after preheating by the solid state before preheating, its beneficial effect is: after the scaling powder preheating of solder layer and its inside, solder layer becomes software state by solid state, in high-temperature soldering process, soft solder layer alleviates the sharply expansive force of scaling powder, reduce the moment heated fast of scaling powder in welding process sharply to expand the power of solder joint blast occurs, decrease solder joint blast generation tin sweat(ing) be splashed to electronical elements surface and cause the phenomenon of short circuit, the time of its preheating, temperature, supply current and opening or closing of power supply all can need intelligentized control method according to what produce, intellectualized operation degree is high, and can greatly control and the splashing amount reducing solder joint explosion time tin sweat(ing), operation is fool proof, the yield rate of electronic component is high, mass effect is good, reduce production cost, easy to use.
Above-described embodiment, just an example of the present invention, be not for limiting enforcement of the present invention and interest field, all technical schemes identical or equivalent with content described in the claims in the present invention, all should be included in scope.
Claims (4)
1. a scolding tin preheating principle and characteristics, it is characterized in that: this solder is made up of the solder layer of the scaling powder and containing scaling powder that are positioned at solder inside, this scolding tin preheating principle carries out the pre-heat treatment to solder before being applied in high temperature flatiron scolding tin, solder is made to become the software state after preheating by the solid state before preheating, after the scaling powder preheating of solder layer and its inside, solder layer becomes software state by solid state, in high-temperature soldering process, soft solder layer alleviates the sharply expansive force of scaling powder, reduce the moment heated fast of scaling powder in welding process sharply to expand the power of solder joint blast occurs, decrease solder joint blast generation tin sweat(ing) and be splashed to the phenomenon that electronical elements surface causes short circuit, operation is fool proof, the speed of its preheating is directly proportional to the speed of scolding tin, this time needed for scolding tin preheating is≤10 minutes, the modification scope of this scolding tin preheat temperature is: 30 DEG C-100 DEG C, the temperature adjusting scope that software solder after the pre-heat treatment carries out high temperature flatiron scolding tin is: 300 DEG C-500 DEG C.
2. a kind of scolding tin preheating principle and characteristics according to claim 1, it is characterized in that: solder layer before preheating, first can carry out sealing to solder layer and destroy process, solder after preheating is in welding process, scaling powder can emit from the impaired expansion of solder layer is outer, alleviate the sharply expansive force of scaling powder to a certain extent, thus reduce scaling powder in welding process moment heated fast sharply expand and solder joint brisance occur, decrease solder joint blast produce tin sweat(ing) splash phenomenon.
3. a kind of scolding tin preheating principle and characteristics according to claim 1, it is characterized in that: employing diameter is that the described solder of 0.8mm makes the pre-heat treatment, first sealing is carried out to solder layer and destroy process, when carrying out the pre-heat treatment to solder, the time of required preheating is 2 minutes, the temperature of solder preheating is set to 65 DEG C, the temperature that software solder after the pre-heat treatment carries out high temperature flatiron scolding tin is 380 DEG C, and the generation of tin tin sweat(ing) is less than 5%.
4. a kind of scolding tin preheating principle and characteristics according to any one of claims 1 to 3, is characterized in that: the operating procedure of this scolding tin preheating principle and characteristics is:
Step one, described solder are alternative before preheating carries out the process of sealing destruction, to reduce the splashing amount of solder joint explosion time tin sweat(ing) to solder layer;
Step 2, sealing is destroyed the bonding wire after having processed be sent to and have in the heater of insulating properties;
Step 3, to arrange according to the needs produced there is preheat temperature and the preheating time of the heater of insulating properties;
Step 4, startup power supply, temperature sensing device induction is positioned over the heating-up temperature of the solder had in the heater of insulating properties, and controls the supply current size of power supply and control opening or closing of power supply, makes solder can reach the preheat temperature of scolding tin needs fast;
Step 5, solder become software state after the pre-heat treatment, for high temperature flatiron scolding tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510832634.8A CN105397231B (en) | 2015-11-26 | 2015-11-26 | A kind of scolding tin pre-heating mean |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510832634.8A CN105397231B (en) | 2015-11-26 | 2015-11-26 | A kind of scolding tin pre-heating mean |
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| Publication Number | Publication Date |
|---|---|
| CN105397231A true CN105397231A (en) | 2016-03-16 |
| CN105397231B CN105397231B (en) | 2018-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510832634.8A Active CN105397231B (en) | 2015-11-26 | 2015-11-26 | A kind of scolding tin pre-heating mean |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513893A (en) * | 2016-12-30 | 2017-03-22 | 中源智人科技（深圳）股份有限公司 | Laser tin soldering mechanism with preheating device and process with tin soldering mechanism |
| CN111438415A (en) * | 2020-05-18 | 2020-07-24 | 郑州机械研究所有限公司 | Wire feeding device and method thereof |
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| CN103433640A (en) * | 2013-08-24 | 2013-12-11 | 昆山市宏嘉焊锡制造有限公司 | Anti-spattering soldering tin wire structure |
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| JPH07251264A (en) * | 1994-03-11 | 1995-10-03 | Japan Unix:Kk | Method for soldering and device therefor |
| CN201023172Y (en) * | 2007-03-16 | 2008-02-20 | 王承鑫 | Side-opening type splash-proof tin wire |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513893A (en) * | 2016-12-30 | 2017-03-22 | 中源智人科技（深圳）股份有限公司 | Laser tin soldering mechanism with preheating device and process with tin soldering mechanism |
| CN111438415A (en) * | 2020-05-18 | 2020-07-24 | 郑州机械研究所有限公司 | Wire feeding device and method thereof |
| CN111438415B (en) * | 2020-05-18 | 2024-02-06 | 郑州机械研究所有限公司 | Wire feeding device and method thereof |
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| Publication number | Publication date |
|---|---|
| CN105397231B (en) | 2018-11-02 |
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Effective date of registration: 20180919 Address after: 523000 5 building, Lianyi Industrial Park, 383 Wen Tang Road, Dongcheng Street, Dongguan, Guangdong. Applicant after: Dongguan Okata Electronic & Technology Co., Ltd. Address before: 523000 2, 5, Lianyi Industrial Park, 383 Road, Wen Tang Road, Dongcheng District, Dongguan, Guangdong. Applicant before: Wu Shuiyu |
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Address after: 523000 Building 1, No. 7, jinyuling Road, Dongcheng Street, Dongguan City, Guangdong Province Patentee after: Guangdong gangtian Intelligent Technology Co., Ltd Address before: 523000 5 building, Lianyi Industrial Park, 383 Wen Tang Road, Dongcheng Street, Dongguan, Guangdong. Patentee before: Dongguan Okata Electronic & Technology Co.,Ltd. |