CN105392283A - Process for realizing no carbon black on pattern in laser edge-milling - Google Patents
Process for realizing no carbon black on pattern in laser edge-milling Download PDFInfo
- Publication number
- CN105392283A CN105392283A CN201510676157.0A CN201510676157A CN105392283A CN 105392283 A CN105392283 A CN 105392283A CN 201510676157 A CN201510676157 A CN 201510676157A CN 105392283 A CN105392283 A CN 105392283A
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- China
- Prior art keywords
- carbon black
- laser
- diaphragm
- adhesive tape
- protective film
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laser Beam Processing (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The invention relates to a process for realizing no carbon black on a pattern in laser edge-milling. The process comprises the following steps of (1) manufacturing a to-be-manufactured board, namely manufacturing the to-be-manufactured board according to a normal manufacturing process of a PCB; (2) plastering a protective film, namely plastering the protective film on the surface of the to-be-manufactured board in a manner of no air bubbles between the protective film and the surface of the to-be-manufactured board; (3) laser edge-milling, namely performing profile cutting on the to-be-manufactured board on which the protective film is plastered by laser according to a designing file; and (4) removing the protective film, namely tearing the protective film on the board. The process of the invention has functions of realizing no adhesion of the carbon black on the pattern in a laser cutting process, preventing manual operation for removing the carbon black caused by laser, saving a large amount of manpower, and preventing non-thorough carbon black elimination. Therefore the process has advantages of improving quality of the PCB, improving manufacturing technology of the PCB, and improving development of products according to the process.
Description
Technical field
The present invention relates to printed circuit board (PCB) and manufacture field, particularly relate to a kind of process of Non-carbon black on figure when realizing laser milling limit.
Background technology
In PCB manufacturing industry, the application of laser is more and more extensive.Laser external form processing technology is due to its distinctive advantage, application is more and more, major advantage has: aligning accuracy is high, external form tolerance little (can +/-0.5mil be accomplished), can processing dimension less than the slotted eye of 1mm and external form, can working thickness less than the thin plate of 0.1mm, the product of processing polytetrafluoroethylregenerated (PTFE) class material does not have edges of boards Burr Problem.Therefore, laser external form processing technology, in PCB manufacturing industry, is particularly used more and more on the special material of PTFE class.
But laser cutting is actually a kind of mode of high-temperature machining, the position attacked can be carbonized, when adopting laser cutting, the position that laser directly cuts and the figure near laser cutting path, can adhere to the carbide (i.e. carbon black) produced in laser sintered process.
Carbon black after current laser cutting is very large to the puzzlement of laser external form processing technology, and the mode of wiping and liquid medicine cleaning that adopts is removed more, basic by completing manually, but can not ensure to remove the carbon black on figure completely.Especially run into size when only having several millimeters or the very thin situation of thickness of slab, operation easier increases severely, and can consume a large amount of manpower, and the problem such as easily cause that plate fractures when manual operation and scrapping.
Summary of the invention
Based on this, the object of the present invention is to provide a kind of process of Non-carbon black on figure when realizing laser milling limit, solve carbide in laser cutting process and adhere to the problem on figure, avoid follow-up a large amount of carbide removal work.
The concrete technical scheme realizing above-mentioned purpose is as follows:
The process of Non-carbon black on figure when realizing laser milling limit, comprises the following steps:
(1) plate to be produced is made: make plate to be produced by the normal Making programme of PCB;
(2) pasting protective film: at plate surface to be produced pasting protective film, can not bubble be had between the surface of diaphragm and plate to be produced;
(3) laser milling limit: carry out external form cutting by the plate to be produced of design document laser to coated with protective film;
(4) diaphragm is removed: tear the diaphragm on plate.
Wherein in some embodiments, described diaphragm is low viscosity diaphragm, and the viscosity of low viscosity diaphragm is 0.02KG/25mm ~ 0.1KG/25mm.
Wherein in some embodiments, the viscosity of described low viscosity diaphragm is 0.04KG/25mm ~ 0.06KG/25mm.
Wherein in some embodiments, described diaphragm is adhesive tape.
Wherein in some embodiments, described adhesive tape is blue adhesive tape.
Wherein in some embodiments, the material of described blue adhesive tape is polyvinyl chloride.
Wherein in some embodiments, the thickness of described blue adhesive tape is 0.05mm ~ 0.2mm.
The problem of difficulty is removed in order to solve behind laser milling limit carbon black on line pattern, inventors performed lot of experiments, repay and tried a large amount of diverse ways, through long-term experience accumulation, finally obtain the process of Non-carbon black on figure when realizing laser milling limit provided by the invention, the method before laser milling limit at plate to be produced surface pasting protective film, protection figure, again diaphragm is removed after cutting, owing to there being the protection of diaphragm, in laser cutting process, carbon black can not adhere on the figure of cutting near zone, avoid, in laser cutting process, figure adheres to carbide, also the work of follow-up removal carbide is just eliminated, thus the problem of difficulty removed by the carbon black solved in prior art behind laser milling limit on line pattern, especially the problem of difficulty removed by the carbon black solved on the figure of small size plate and thin plate, avoid the consumption of a large amount of manpower.
The preferred low viscous diaphragm of diaphragm, low viscous diaphragm can ensure there is certain adhesion between diaphragm and pcb board, and in laser milling crack approach, diaphragm does not have the situations such as slip, stripping; More easily manually remove after laser milling limit is terminated simultaneously, save manpower further.
Diaphragm is made with the blue adhesive tape of polyvinyl chloride material; in laser milling crack approach; blue adhesive tape can not shrink; and the surface of tying in plate to be produced can not be stained with because milling limit makes it dissolve, divest on rear protected plate to be produced and do not had any residue, and because blue adhesive tape is low viscosity adhesive tape; with blue adhesive tape as diaphragm; after milling limit is terminated, the diaphragm on plate is easy to tear, and saves manpower further.
Process of the present invention achieves carbon black in laser cutting process and can not stick on figure, avoid manual work of removing laser carbon black, thus avoid the incomplete situation appearance of artificial removal's carbon black, therefore improve the quality of PCB, improve the manufacturing technology of PCB, promote the exploitation having this type of deisgn product.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the process of Non-carbon black on figure when realizing laser milling limit;
Fig. 2 is the schematic flow sheet of the process on conventional laser milling limit (not pasting protective film).
Embodiment
Below in conjunction with drawings and the specific embodiments to of the present invention realize laser milling limit time figure on the process of Non-carbon black be described in further detail.
As shown in Figure 1, this execution mode realize laser milling limit time figure on the process of Non-carbon black, comprise the following steps:
Step 1: make plate to be produced.
Prepare plate 1a to be produced by the conventional Making programme of PCB and process, form the graphic file of PCB.That is, in the manufacturing process of PCB, the preparation process before milling profile and process and the material used are all identical with conventional.
Step 2: paste blue adhesive tape.
Before to plate milling profile to be produced, paste blue adhesive tape 1 (viscosity is 0.05KG/25mm) on plate surface to be produced, obtain the plate 1b to be produced protected with blue adhesive tape, in the process on laser milling limit, attach carbon black in order to avoid graphic file.In order to obtain good protected effect, between the plate face of blue adhesive tape and plate to be produced, bubble can not be had.
The material of blue adhesive tape is preferably polyvinyl chloride; Conveniently operate, the thickness of blue adhesive tape is preferably 0.05mm ~ 0.2mm, and too thin operation inconvenience, not easily cuts off during too thick laser milling limit.
Blue adhesive tape also can replace with other diaphragm in other embodiments, preferred low viscous diaphragm, the viscosity of low viscosity diaphragm is 0.02KG/25mm ~ 0.1KG/25mm, be more preferably 0.04KG/25mm ~ 0.06KG/25mm, low viscous diaphragm can ensure there is certain adhesion between diaphragm and pcb board, and in laser milling crack approach, diaphragm does not have the situations such as slip, stripping; More easily manually remove after laser milling limit is terminated simultaneously.
Step 3: laser milling limit.
To the plate laser milling profile to be produced posting blue adhesive tape, that is: by design document laser, external form cutting is carried out to the plate to be produced posting blue adhesive tape, obtain the plate 1c with blue adhesive tape behind laser milling limit.
Due to the mode that laser cutting is a kind of high-temperature machining; cut position and neighbouring meeting thereof are carbonized; the figure in the position that laser can be caused directly to cut and close laser cutting path adheres to the carbide (i.e. carbon black) produced in laser sintered process; due to the protective effect of blue adhesive tape in present embodiment, avoid graphic file in the process and attach carbon black.
In other embodiments, other diaphragm can play the effect avoiding graphic file to attach carbon black in the process equally.
Step 4: remove blue adhesive tape.
After milling profile step, after namely laser milling limit is terminated, the blue adhesive tape on plate is removed, because blue adhesive tape is low viscosity adhesive tape, be therefore easy to be torn.Namely obtain the plate 1d by the good profile of design document milling after removing blue adhesive tape, thus can go to the operation of next preparation PCB finished product, the old process that subsequent handling makes by PCB and process are carried out.
Due to the protective effect of blue adhesive tape in present embodiment, the figure of plate 1d and neighbouringly do not attach carbon black, therefore avoids the follow-up artificial removal to carbon black on figure work, saves a large amount of manpower, improve the quality of PCB.And due to blue adhesive tape be low viscosity adhesive tape, easily remove, thus save manpower further.In other embodiments, the especially low viscous diaphragm of other diaphragm can play identical beneficial effect equally.
The blue adhesive tape of preferred polyvinyl chloride material can not shrink in laser milling crack approach, also can not dissolve and be stained with the surface of tying in plate to be produced, after removing, protected plate to be produced has not had any residue.
As shown in Figure 2, the process on the conventional laser milling limit of contrast execution mode, the method does not have " pasting blue adhesive tape " and the step of " removing blue adhesive tape ", plate 2a to be produced is directly carried out to the operation on laser milling limit, obtain the plate 2d by the good profile of design document milling, the position that clearly this plate 2d middle distance cutting circuit is near creates carbon black 2, thus, follow-up needs carry out the operation removing carbon black, will at substantial manpower.
In prior art, the mode of carbon black many employings manual wipping that graphic file attaches in laser cutting process is removed, but can not ensure to remove the carbon black on figure completely, especially size is run into when only having several millimeters or the very thin situation of thickness of slab, operation easier increases severely, a large amount of manpower can be consumed, and the problem such as easily cause that plate fractures when manual operation and scrapping.The process of Non-carbon black on figure when realizing laser milling limit of the present invention; utilize PCB traditional machining processes and material; blue adhesive tape (or other diaphragm) is pasted by increasing; the operation that laser milling limit is removed after terminating again, achieves carbon black in laser cutting process and can not stick on figure, avoids manual work of removing laser carbon black; save a large amount of manpower; improve the quality of PCB, improve PCB manufacturing technology, promote the exploitation having this type of deisgn product.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (7)
1. the process of Non-carbon black on figure when realizing laser milling limit, comprises the following steps:
(1) plate to be produced is made: make plate to be produced by the normal Making programme of PCB;
(2) pasting protective film: at plate surface to be produced pasting protective film, can not bubble be had between diaphragm and plate surface to be produced;
(3) laser milling limit: carry out external form cutting by the plate to be produced of design document laser to coated with protective film;
(4) diaphragm is removed: tear the diaphragm on plate.
2. the process of Non-carbon black on figure when realizing laser milling limit according to claim 1, it is characterized in that, described diaphragm is low viscosity diaphragm, and the viscosity of low viscosity diaphragm is 0.02KG/25mm ~ 0.1KG/25mm.
3. the process of Non-carbon black on figure when realizing laser milling limit according to claim 2, it is characterized in that, the viscosity of described low viscosity diaphragm is 0.04KG/25mm ~ 0.06KG/25mm.
4. according to any one of claim 1-3 realize laser milling limit time figure on the process of Non-carbon black, it is characterized in that, described diaphragm is adhesive tape.
5. the process of Non-carbon black on figure when realizing laser milling limit according to claim 4, it is characterized in that, described adhesive tape is blue adhesive tape.
6. the process of Non-carbon black on figure when realizing laser milling limit according to claim 5, it is characterized in that, the material of described blue adhesive tape is polyvinyl chloride.
7. according to claim 5 or 6 realize laser milling limit time figure on the process of Non-carbon black, it is characterized in that, the thickness of described blue adhesive tape is 0.05mm ~ 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510676157.0A CN105392283B (en) | 2015-10-16 | 2015-10-16 | Realize laser milling side when figure on Non-carbon black process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510676157.0A CN105392283B (en) | 2015-10-16 | 2015-10-16 | Realize laser milling side when figure on Non-carbon black process |
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| CN105392283A true CN105392283A (en) | 2016-03-09 |
| CN105392283B CN105392283B (en) | 2018-09-04 |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106960826A (en) * | 2017-03-23 | 2017-07-18 | 深圳光韵达激光应用技术有限公司 | A kind of encapsulation chip and processing technology with ledge structure |
| CN107623982A (en) * | 2017-08-22 | 2018-01-23 | 瑞声科技(新加坡)有限公司 | Flexible PCB and its laser cutting method |
| CN107683031A (en) * | 2017-11-07 | 2018-02-09 | 珠海杰赛科技有限公司 | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film |
| CN107801305A (en) * | 2017-10-17 | 2018-03-13 | 珠海杰赛科技有限公司 | The die stamp method of PTFE material pcb boards |
| CN108966495A (en) * | 2017-05-18 | 2018-12-07 | 北大方正集团有限公司 | A kind of production method and circuit board of circuit board molding |
| CN109089381A (en) * | 2018-09-29 | 2018-12-25 | 珠海杰赛科技有限公司 | A kind of contour processing method of microsize pcb board |
| CN109526147A (en) * | 2018-12-11 | 2019-03-26 | 江门崇达电路技术有限公司 | A kind of method of taping of PCB production board |
| CN109848567A (en) * | 2019-01-30 | 2019-06-07 | 无锡深南电路有限公司 | A kind of radium-shine milling edge equipment and method of package substrate |
| CN112291935A (en) * | 2020-10-20 | 2021-01-29 | 深圳爱彼电路股份有限公司 | Manufacturing method of ultra-small and ultra-thin high-frequency circuit board |
| CN112570385A (en) * | 2020-12-01 | 2021-03-30 | 珠海杰赛科技有限公司 | Carbon black-free laser edge milling process for PCB |
| CN113873778A (en) * | 2021-08-30 | 2021-12-31 | 珠海杰赛科技有限公司 | Processing method of microwave circuit board and microwave circuit board manufactured by method |
| CN114029703A (en) * | 2021-11-08 | 2022-02-11 | 珠海杰赛科技有限公司 | Complementary shape processing technology of microwave board |
| CN114269079A (en) * | 2021-12-30 | 2022-04-01 | 珠海杰赛科技有限公司 | PCB processing method |
| CN115226317A (en) * | 2022-06-06 | 2022-10-21 | 嘉兴温良电子科技有限公司 | Process for preventing micro short circuit by windowing black protective film through laser cutting |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106960826A (en) * | 2017-03-23 | 2017-07-18 | 深圳光韵达激光应用技术有限公司 | A kind of encapsulation chip and processing technology with ledge structure |
| CN108966495A (en) * | 2017-05-18 | 2018-12-07 | 北大方正集团有限公司 | A kind of production method and circuit board of circuit board molding |
| CN107623982A (en) * | 2017-08-22 | 2018-01-23 | 瑞声科技(新加坡)有限公司 | Flexible PCB and its laser cutting method |
| CN107801305A (en) * | 2017-10-17 | 2018-03-13 | 珠海杰赛科技有限公司 | The die stamp method of PTFE material pcb boards |
| CN107683031A (en) * | 2017-11-07 | 2018-02-09 | 珠海杰赛科技有限公司 | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film |
| CN109089381A (en) * | 2018-09-29 | 2018-12-25 | 珠海杰赛科技有限公司 | A kind of contour processing method of microsize pcb board |
| CN109526147A (en) * | 2018-12-11 | 2019-03-26 | 江门崇达电路技术有限公司 | A kind of method of taping of PCB production board |
| CN109848567A (en) * | 2019-01-30 | 2019-06-07 | 无锡深南电路有限公司 | A kind of radium-shine milling edge equipment and method of package substrate |
| CN112291935A (en) * | 2020-10-20 | 2021-01-29 | 深圳爱彼电路股份有限公司 | Manufacturing method of ultra-small and ultra-thin high-frequency circuit board |
| CN112570385A (en) * | 2020-12-01 | 2021-03-30 | 珠海杰赛科技有限公司 | Carbon black-free laser edge milling process for PCB |
| CN113873778A (en) * | 2021-08-30 | 2021-12-31 | 珠海杰赛科技有限公司 | Processing method of microwave circuit board and microwave circuit board manufactured by method |
| CN114029703A (en) * | 2021-11-08 | 2022-02-11 | 珠海杰赛科技有限公司 | Complementary shape processing technology of microwave board |
| CN114029703B (en) * | 2021-11-08 | 2023-12-15 | 珠海杰赛科技有限公司 | Complementary shape processing technology of microwave board |
| CN114269079A (en) * | 2021-12-30 | 2022-04-01 | 珠海杰赛科技有限公司 | PCB processing method |
| CN115226317A (en) * | 2022-06-06 | 2022-10-21 | 嘉兴温良电子科技有限公司 | Process for preventing micro short circuit by windowing black protective film through laser cutting |
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