CN105388707B - Drawing apparatus - Google Patents
Drawing apparatus Download PDFInfo
- Publication number
- CN105388707B CN105388707B CN201510354272.6A CN201510354272A CN105388707B CN 105388707 B CN105388707 B CN 105388707B CN 201510354272 A CN201510354272 A CN 201510354272A CN 105388707 B CN105388707 B CN 105388707B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- substrate
- label
- drawing desk
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides drawing apparatus, which includes drawing desk, loads substrate;Exposure plotting portion is relatively moved with above-mentioned drawing desk, and by pattern plotter on the substrate on the drawing desk, in the drawing apparatus, the location error for the alignment mark being formed on substrate is small and the plane precision of substrate will not be made impaired.Drawing apparatus, which is equipped with multiple reference marks and is determined on above-mentioned drawing desk, forms unit relative to multiple labels of the position of above-mentioned each reference mark, above-mentioned multiple reference marks are used to set the position reference relative to above-mentioned exposure plotting portion, and above-mentioned multiple labels form unit and are formed in alignment mark on the reverse side for the substrate being placed on the drawing desk.
Description
Technical field
The present invention relates in the positive and negative of the planar substrates such as electronic circuit board, LCD glass substrate, PDP glass substrate
The drawing apparatus of depicting pattern on two sides.
Background technique
In recent years, direct exposure device (drawing apparatus) has been risen on the market, (describes dress in the direct exposure device
Set) in, transfer mask is not used, but the description light of positional relationship has mutually been determined to the tow sides direct irradiation of substrate
Depicting pattern.In the case where the double-sided exposure, when carrying out pattern exposure to positive (the 1st face) (or before exposure), anti-
(formation) multiple alignment marks are exposed on face (the 2nd face), in the pattern exposure to the 2nd face that the positive and negative overturning by substrate carries out
When, pattern exposure position (patent document 1,2) is determined on the basis of the alignment mark being formed on the 2nd face.Specifically, right
Fiducial mark note uses the indexs such as circular pattern, cross less than φ 2mm, and under normal circumstances, alignment mark is in the base to be exposed
The corner of plate is set as that the picture from colour rendering of photoresist is utilized optically (from colour developing picture).
Patent document 1: Japanese Unexamined Patent Publication 2009-294337 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2013-213852 bulletin
It movably marks to be formed relative to the drawing desk of mounting substrate however, the drawing apparatus of patent document 1 and 2 has
Unit (alignment mark forms unit, label exposure device), makes label form unit relative to the drawing desk (base of mounting on it
Plate) it moves and forms alignment mark on substrate back side.Accordingly, it is possible to which the nothing of the mobile mechanism of unit can be formed due to marking
Machine error that method avoids and include alignment mark location error.If the forming position of alignment mark is there are error, the 2nd
The depicting pattern in face cannot be matched correctly with the depicting pattern in the 1st face.In addition, waiting scalings correction implementing the flexible of description face
When, cause to implement and stretch different corrections from actual substrate.
In addition, the label that existing apparatus must be provided with that position adjusting can be carried out relative to drawing desk forms unit, therefore
The enlargement of device entirety is not can avoid.It is mobile in order to make label form unit in addition, in patent document 2, drawing desk just
Face is provided with the backoff portion (groove portion) that label forms unit.It therefore, can not supporting substrates reverse side at the backoff portion, it is possible to right
The description precision (plane precision of substrate) of pattern causes adverse effect.
Summary of the invention
Therefore, small and will not it is an object of the invention to obtain a kind of location error of alignment mark being formed on substrate
The drawing apparatus for keeping the plane precision of substrate impaired.
The present invention is conceived to following situations and completes: having determined in existing drawing apparatus, label forms unit
It is the reason of generating the error of alignment mark forming position, as long as describing that movement can be carried out relative to the drawing desk of mounting substrate
The formation unit that alignment mark is directly formed on the substrate back side being placed on the drawing desk is set in platform, it will be able to prevent from missing
The generation of difference.
That is, drawing apparatus of the invention includes drawing desk, substrate is loaded;And exposure plotting portion, with above-mentioned description
Platform is relatively moved, and by pattern plotter on the substrate on the drawing desk, above-mentioned drawing apparatus is characterized in that, above-mentioned
On drawing desk, formed equipped with multiple reference marks and being determined relative to multiple labels of the position of above-mentioned each reference mark
Unit, above-mentioned multiple reference marks are used to set the position reference relative to above-mentioned exposure plotting portion, above-mentioned multiple label formation
Alignment mark is formed on the reverse side for the substrate being placed on the drawing desk by unit.
Above-mentioned drawing desk is for example made of platform main body and the cover board in this main body, and above-mentioned label forms unit can
It is made of following part: through at least one through hole being arranged on above-mentioned cover board;And the mark by above-mentioned body abutment
Note forms light source, and above-mentioned label forms light source and forms light from above-mentioned through hole injection label.
It can be on above-mentioned cover board through the multiple above-mentioned through holes for forming above-mentioned labels and forming unit of setting, above-mentioned master
Body can have label and form light source, and above-mentioned label forms the through hole that is selected of the light source into above-mentioned multiple through holes and projects mark
Note forms light.
Specifically, said reference label and label, which form unit, can be located at the substrate being positioned on above-mentioned drawing desk
Peripheral part opposite both sides, and be each provided with a pair.
Above-mentioned exposure plotting portion can have the camera unit shot to said reference label and alignment mark.And
And the reference mark position information according to captured by above-mentioned camera unit can be utilized and the coordinate system that sets, it executes to above-mentioned
The pattern plotter of substrate front side can utilize the alignment mark location information according to captured by above-mentioned camera unit and the seat that sets
Mark system, executes the pattern plotter to substrate back side that will be carried out after the positive and negative overturning of aforesaid substrate.
In one embodiment, said reference label is the spot mark from visible light source.
In the present invention, the drawing desk for loading substrate has the label that alignment mark is formed on substrate back side and forms list
Member, therefore, alignment mark forming position will not generate mechanical error component (displacement error etc. that label forms unit).According to
The present invention can be accurately proceed the position alignment for the pattern described in substrate front and back sides in simple structure.In addition, energy
Enough ensure that drawing desk is positive smooth, until peripheral portion, can keep contained with same uniform high flatness absorption
The substrate set.
Detailed description of the invention
Fig. 1 is the integrally-built perspective view for showing drawing apparatus of the invention.
Fig. 2 is the exploded perspective view for showing an embodiment of drawing desk for the drawing apparatus of Fig. 1.
Fig. 3 is the top view of the drawing desk.
Fig. 4 is the cross-sectional view along the IV-IV line of Fig. 3.
Fig. 5 is the schematic plan when being described on the front (the 1st face) of substrate.
Fig. 6 is the schematic plan when being described on the reverse side (the 2nd face) of substrate.
Label declaration
100: drawing apparatus;11: pedestal;15: drawing desk;15c: aspiration connector;15r: recess portion;15v: suction hole;
15P: cover board;15Q: platform main body;17: substrate casting die;18: control device;19: vacuum source;20: light source portion;30: exposure plotting
Portion;41: reference mark;41h: reference mark hole;41j: reference mark forms light source;41k: reflecting element;42: label forms single
Member;42h: alignment mark hole;42j: alignment mark forms light source;43: circuit substrate;AC: aligned with camera (camera unit);
AM: alignment mark;W: substrate.
Specific embodiment
Fig. 1 is the whole structuring concept figure of drawing apparatus 100 of the invention.Drawing apparatus 100 has pedestal 11, from pedestal
The exposure plotting portion 30 that 11 both sides are erect the door 12 of setting and are supported on this 12.
Drawing desk 15 is configured on pedestal 11, drawing desk 15, which has been loaded, is coated with the substrate W of photosensitive material in front and back sides.
The drawing desk 15 can for example be moved in the X direction by linear motor mobile unit along guide rail 14.In the following, by water
The direction vertical with X-direction is set as Y-direction in plane, and direction vertical with X-direction in vertical plane is set as Z-direction.
Be provided in the front surface in exposure plotting portion 30 along Y-direction extend sliding part 13, on sliding part 13, with
The mode separated in Y-direction is provided with a pair of of aligned with camera (camera unit) AC.Sliding part 13 by linear motor drive or
Aligned with camera AC, is moved to any position of Y-direction by stepper motor driving.
Exposure plotting portion 30 has light source portion 20.Light source portion 20 is by 2 light source portion 20a and light with identical inner structure
Source portion 20b is constituted.Since light source portion 20a and light source portion 20b is identical structure, said using light source portion 20a as representative
It is bright.
Light source portion 20a by UV lamp 21, the 1st total reflection mirror 22, collector lens 23, the 2nd total reflection mirror 24, fly's-eye lens 25 and
Aperture (aperture) is (not shown) to be constituted.Light source portion 20a has UV lamp 21, from UV lamp 21 injection be mixed 365nm to
The ultraviolet light of the various wavelength of 440nm.
The ultraviolet light projected from UV lamp 21 is irradiated by 26 heavenwards direction of oval shape mirror (+Z-direction), and direction is complete by the 1st
Reflecting mirror 22 changes into horizontal direction, and after being assembled by collector lens 23, ground is changed by the 2nd total reflection mirror 24 in direction
Face direction (- Z-direction).The ultraviolet light for changing direction becomes the light beam for being divided into 4 tunnels by fly's-eye lens 25 and aperture.
Light beam further via 8 the 1st projecting lens 33 and 8 reflecting mirrors 34, is incident to 8 DMD (Digital Micro-mirror
Device: Digital Micromirror Device) element 36, thus become the light beam after being controlled.The light beam after being controlled passes through the 2nd projection
Thus lens group 37 is adjusted the multiplying power for the exposure plotting to be projected and exposes to substrate W.That is, drawing apparatus 100 according to
Describing the data for desired exposure picture is pre-saved, the ultraviolet light of light source portion 20a and light source portion 20b are controlled.
Drawing desk 15 has the cover board 15P on platform main body (lower stage) 15Q and this main body 15Q.Fig. 2 to Fig. 4 is shown
The details of drawing desk 15.The rectangular-shape that drawing desk 15 extends in outer surface along three vertical plane directions of XYZ.Platform
Main body 15Q is identical as size of the cover board 15P in x-direction and y-direction, and the thickness of cover board 15P in z-direction is than platform main body 15Q
It is thin.Platform main body 15Q and cover board 15P can be decomposed as schematically shown in Fig. 2, such as using (not shown) fixed
Position device and adsorbent equipment, are fixed on normal position and constitute drawing desk 15 (Fig. 1, Fig. 3 and Fig. 4).
The quadrangle in the substrate-placing face of the drawing desk 15 of rectangle be respectively equipped with a reference mark 41 and formed with it is each
The label of the corresponding alignment mark of reference mark 41 forms unit 42.That is, on drawing desk 15 be equipped with multiple reference marks 41 with
And multiple labels corresponding with each reference mark 41 form unit 42.
Each reference mark 41 is by reference mark hole (through hole) 41h being formed on cover board 15P and is supported on platform
Reference mark on main body 15Q forms light source 41j and is formed.Label forms unit 42 multiple (is being schemed by be formed on cover board 15P
It is 4 in the embodiment shown) alignment mark hole (through hole) 42h and platform is accordingly supported on each alignment mark hole 42h
4 alignment marks on main body 15Q form light source 42j and are formed.Reference mark forms light source 41j by red (visible light) LED structure
At the light after being reflected from reflecting element 41k is projected from reference mark hole 41h to Z-direction (direction aligned with camera AC).Alignment
Label forms light source 42j and is made of ultraviolet LED, and light is directly projected to Z-direction from alignment mark hole 42h.Reference mark is formed
Light source 41j and alignment mark form light source 42j and are fixed on circuit substrate 43 (Fig. 4), the circuit substrate 43 and reflecting element
41k is disposed in the recess portion 15r formed on platform main body 15Q.
(alignment mark is formed by 1 reference mark hole 41h (reference mark forms light source 41j) and 4 alignment mark hole 42h
Light source 42j) it is formed with forming a line in the X direction, it makes it easy to utilize the same alignment being mounted in exposure plotting portion 30
Video camera AC is shot.As shown in Figure 3, Figure 4, in the example in the figures, label forms each alignment mark hole 42h of unit 42
Interval it is identical, reference mark 41 and these labels form unit 42 and have been separated by the interval of alignment mark hole 42h to each other or more
Distance.
The positional relationship that 1 reference mark 41 and 4 label is formed between unit 42 is fixed, phase on drawing desk 15
Mutual positional relationship (coordinate system on X/Y plane) can be identified strictly and (has been identified).Therefore, aligned with camera AC
Shot mark formed unit 42 (reference mark 41) come find out mark position be equal to find out reference mark 41 (by label is formed singly
Member 42 formed alignment marks) position.
In addition, the reference mark 41 of the quadrangle on drawing desk 15 is configured to form unit 42 in the outer part than label, substrate pressure
Part 17 is located at reference mark 41 and label is formed between unit 42.Substrate casting die 17 supports the substrate being positioned on drawing desk 15
The edge (the two sides edge of X-direction) of W can at least move on 15 positive direction (Z-direction) of drawing desk approaching, leaving.
The planar dimension for the substrate W being positioned on drawing desk 15 is various sizes, therefore preferably makes substrate casting die 17
It can also move in the X direction.However, substrate W does not exceed substrate casting die 17 and prominent to 41 direction of reference mark.That is, no matter
The size for the substrate W being positioned on drawing desk 15 be it is how many, reference mark 41 will not all be blocked by substrate W.In contrast, nothing
Size by substrate W be it is how many, label formed unit 42 4 alignment mark hole 42h (at least one of) all can be by substrate W
It blocks.
On the surface of the cover board 15P of drawing desk 15, as schematically shown in Fig. 2, offer well known several
Suction hole 15v, these suction holes 15v are via the aspiration connector 15c being arranged on platform main body 15Q, with control device 18 and true
Empty source 19 connects.
Pattern is carried out using the drawing apparatus 100 of above structure, such as according to front and back sides of the following step to substrate W
Describe.For convenience's sake (for easy understanding), as the pattern described using drawing apparatus 100 in the front and back sides of substrate W
(such as circuit pattern) is set as following pattern: describing the character L of " P " shown in fig. 5 in the front of substrate W, substrate W's
Reverse side describes framework F shown in fig. 6.In addition, platform main body 15Q and cover board 15P are fixed according to regular positional relationship in advance, and
It is supported on pedestal 11 (guide rail 14) as drawing desk 15.
Step 1 is rapid
Substrate W is loaded on the cover board 15P of drawing desk 15.When the feelings for loading substrate W using conveying device (not shown)
Under condition, mounting has carried out the substrate W of prealignment (pre-determined bit) in advance, so substrate has been carried out determining roughly at the time point
Position.In the case that operating personnel sets substrate W with hand shovelling, positioned using the positioning identifier being arranged on cover board 15P.For
The case where reply is arranged with hand, can also be arranged the folder of substrate positioning on drawing desk 15 (cover board 15P or platform main body 15Q)
Tool.The fixture of substrate positioning is for example, by using the line or positioning pin etc. being drawn on cover board 15P.XY coordinate system for substrate W is
Unit is formed using the label at the position and 4 of reference mark 41 at 4 on drawing desk 15 captured by aligned with camera AC
42 are formed by the position of alignment mark to determine, therefore, there is no need to carry out stringent position of the substrate W on cover board 15P
Alignment.
Second step
Vacuum suction is carried out to the substrate W being positioned on cover board 15P using suction hole 15v, control device 18, vacuum source 19
It is attached, and substrate W is clamped using substrate casting die 17.Substrate casting die 17 is moved at the position indicated in advance, and substrate W is pressed into
Cover board 15P.
Third step
Mobile drawing desk 15 and sliding part 13, make aligned with camera AC to the picture of reference mark 41 at 4 on drawing desk 15
(spot mark) is shot (aligned with camera AC is relatively moved to each 41 top of reference mark).That is, coming from reference mark
Formed light source 41j red LED light by reflecting element 41k reflection after from reference mark hole 41h project, aligned with camera AC with
Drawing desk 15 X-direction it is mobile, identify 4 reference marks 41 (Fig. 5).By 4 fiducial marks captured by aligned with camera AC
The location information of note 41 is sent to positioning device, to determine the XY coordinate system based on reference mark 41 on drawing desk 15.
Step 4 is rapid
Label formed unit 42 4 alignment marks formed light source 42j in any one to substrate W reverse side the (the 2nd
Face) irradiating ultraviolet light, the colour developing certainly of alignment mark hole 42h shape is formed as (alignment mark AM (Fig. 6)).Use multiple label shapes
It is predetermined according to substrate size (service manual (recipe) etc.) for being irradiated at which of unit 42.Institute
The light source 42j that the label of selection is formed other than unit 42 is not lit.In one example, irradiation time is about 10 seconds.In addition, should
Step 4 can concurrently carry out suddenly with other steps, or can also carry out before starting third step.
Step 5 is rapid
Positioning device determines pair based on substrate back side according to the XY coordinate system on the drawing desk 15 based on reference mark 41
The XY coordinate system of fiducial mark note AM.Although the XY coordinate system based on reference mark 41 also can be used, it is in base due to describing
It is carried out on plate W, it is advantageous to use the XY coordinate system based on the alignment mark AM on substrate W.Then, according to the substrate back side
Alignment mark AM forming position, opposite position alignment is carried out to pattern plotter position and substrate position.The opposite position
Setting alignment and being corrected by exposure plotting portion 30 to depicting pattern data makes to describe positional shift to carry out, Huo Zheke
By making drawing desk 15 be moved upward to carry out in the side θ XY.The direction θ is the direction of rotation in the direction parallel with Z-direction.In this way
Opposite position alignment technology be well known technology, can according to need using method appropriate.
Step 6 is rapid
The description of pattern (being character L in the example of diagram) is carried out on the front (the 1st face) of substrate W.It is retouched by exposure
The relative movement between portion 30 and drawing desk 15 (substrate W) is drawn, the description of pattern is carried out.In the present embodiment, work as drawing desk
15 when continuously moving in the X direction, and exposure plotting portion 30 is continuously irradiated to substrate W describes light.Pass through well known multiple exposure
Light technology carries out the description of pattern.
Step 7 is rapid
The substrate W for finishing the pattern plotter in positive (the 1st face) is moved out from drawing desk 15.The substrate W moved out is overturn
And make reverse side (the 2nd face) upward.Operation is moved out and overturns to carry out using conveying device (not shown) or by operating personnel's hand
Come carry out.
Step 8 is rapid
Substrate W (Fig. 6) on the cover board 15P of drawing desk 15 after mounting overturning.In addition, drawing desk at this time (describes dress
Set) can be with step 1 identical device suddenly, or be also possible to different drawing apparatus.With step 1 suddenly in the same manner as, substrate W
It is loaded in the state of after prealignment.
Step 9 is rapid
In the same manner as second step, vacuum suction is carried out to the substrate W being positioned on cover board 15P, and utilize substrate casting die
17 clampings and fixed substrate W.
Step 10 is rapid
Aligned with camera AC is relatively moved to the position for the alignment mark AM being formed on the reverse side (the 2nd face) of substrate W
Place.The indirect illumination having using aligned with camera AC shoots alignment mark AM, sends image (Fig. 6) to positioning device.
Step 11 is rapid
Positioning device finds out the position of alignment mark AM according to the image from aligned with camera AC, suddenly same as step 4
Ground carries out opposite position alignment (Fig. 6) to pattern plotter position and substrate position.And at this point it is possible to not only carry out opposite
Position alignment, also with substrate is flexible accordingly corrects the shape described the data.This is to retouch to the caused pattern of deformation
The error for drawing position is corrected and carries out, which is since after the exposure plotting to positive (the 1st face), substrate is sometimes
It is influenced to occur by temperature change etc. flexible and generation.
Step 12 is rapid
With step 6 suddenly in the same manner as, on the reverse side (the 2nd face) of substrate W carry out pattern (frame F) description (Fig. 6).
Step 13 is rapid
The substrate W for finishing the pattern plotter of reverse side (the 2nd face) is moved out from drawing desk 15, and is transported to subsequent processing.
In the above embodiment, multiple (4) labels are provided with for 1 reference mark 41 and form unit 42, but
It is that 1 reference mark 41 can also be made to correspond to 1 label according to the planar dimension of substrate W to form unit 42.It is more being arranged
In the case that a label forms unit 42, in the above embodiment, configure with lining up 1 column, yet it is not desirable to be configured to 1
Column are arranged in and alignment mark can be formed in for reference mark as long as multiple labels are formed unit 42 according to substrate size
At determining position.
Alternatively, it is also possible to correspondingly replace cover board 15P with substrate W.Thereby, it is possible to correspond to various substrates and mark
Remember position.
In addition, the light source that reference mark 41 and label form unit 42 may not be LED, in addition, for the wavelength of light,
Can with coat or be attached to the sensitivity of the photosensitive material on substrate correspondingly, suitably selecting can be sufficiently formed from colour developing picture
Wavelength.
About reference mark 41, as long as can be shot using aligned with camera AC to determine position, or
Non-luminescent property (such as printed article).
Claims (6)
1. a kind of drawing apparatus includes drawing desk, substrate is loaded;And exposure plotting portion, it is opposite with above-mentioned drawing desk
Ground is moved, and by pattern plotter on the substrate on the drawing desk, above-mentioned drawing apparatus is characterized in that,
On above-mentioned drawing desk, equipped with multiple reference marks and the more of the position marked relative to each said reference are determined
A label forms unit, and above-mentioned multiple reference marks are used to set the position reference relative to above-mentioned exposure plotting portion, above-mentioned more
A label forms unit and is formed in alignment mark on the reverse side for the substrate being placed on the drawing desk, the reference mark and institute
It is fixed for stating label and forming the positional relationship between unit on the drawing desk.
2. drawing apparatus according to claim 1, which is characterized in that
Above-mentioned drawing desk has platform main body and the cover board in this main body, and above-mentioned label forms unit by following part structure
At: through at least one through hole being arranged on above-mentioned cover board;And light source is formed by the label of above-mentioned body abutment, on
State label formed light source from above-mentioned through hole project label form light.
3. drawing apparatus according to claim 2, which is characterized in that
Multiple above-mentioned through holes for forming above-mentioned label and forming unit are provided through on above-mentioned cover board, above-mentioned main body has
Label forms light source, and above-mentioned label forms the through hole that is selected of the light source into multiple above-mentioned through holes and projects label formation
Light.
4. according to claim 1 to drawing apparatus described in any one in 3, which is characterized in that
Said reference label and label form unit positioned at the opposite of the peripheral part for the substrate being positioned on above-mentioned drawing desk
Both sides, and it is each provided with a pair.
5. according to claim 1 to drawing apparatus described in any one in 3, which is characterized in that
Above-mentioned exposure plotting portion has the camera unit shot to said reference label or alignment mark, using according to above-mentioned
The positive pattern of aforesaid substrate is retouched in reference mark position information captured by camera unit and the coordinate system set, execution
It draws, the coordinate system set using the alignment mark location information according to captured by above-mentioned camera unit, executes aforesaid substrate
Positive and negative overturning after the pattern plotter to substrate back side that carries out.
6. according to claim 1 to drawing apparatus described in any one in 3, which is characterized in that
Said reference label is the spot mark from visible light source.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014172363A JP6465591B2 (en) | 2014-08-27 | 2014-08-27 | Drawing device |
JP2014-172363 | 2014-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105388707A CN105388707A (en) | 2016-03-09 |
CN105388707B true CN105388707B (en) | 2019-01-15 |
Family
ID=55421130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510354272.6A Active CN105388707B (en) | 2014-08-27 | 2015-06-24 | Drawing apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6465591B2 (en) |
KR (1) | KR102333949B1 (en) |
CN (1) | CN105388707B (en) |
TW (1) | TWI660246B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106371298B (en) * | 2016-11-25 | 2018-09-14 | 天津津芯微电子科技有限公司 | LDI position alignment of inner layer plates method and system |
DE102018132001A1 (en) | 2018-12-12 | 2020-06-18 | Laser Imaging Systems Gmbh | Device for exposing plate-shaped workpieces with high throughput |
KR102238691B1 (en) * | 2018-12-17 | 2021-04-12 | 주식회사 선익시스템 | wafer size expanding apparatus and wafer alignment apparatus including the same |
KR102214357B1 (en) * | 2018-12-18 | 2021-02-10 | 주식회사 선익시스템 | wafer size expanding apparatus and wafer alignment apparatus including the same |
SG11202106554WA (en) * | 2018-12-19 | 2021-07-29 | Jiangsu Ysphotech Integrated Circuit Equipment Co Ltd | Alignment device, method and equipment for double-sided exposure |
CN109471337B (en) * | 2018-12-29 | 2023-12-05 | 源卓微纳科技(苏州)股份有限公司 | Exposure machine for exposure of PCB inner layer plate and alignment exposure method |
CN112549170A (en) * | 2019-09-10 | 2021-03-26 | 昊佰电子科技(上海)有限公司 | Machining method for flat plate cutting plotter |
CN117082746B (en) * | 2023-10-12 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Processing method of half-etched copper characters |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101185035A (en) * | 2005-04-28 | 2008-05-21 | 富士胶片株式会社 | Work position information acquisition method and device |
CN102540781A (en) * | 2010-12-28 | 2012-07-04 | 上海微电子装备有限公司 | Backside alignment device and method |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1116823A (en) * | 1997-06-27 | 1999-01-22 | Nec Kagoshima Ltd | Method and device for pre-alignment of reflection type aligner |
JP2004012903A (en) * | 2002-06-07 | 2004-01-15 | Fuji Photo Film Co Ltd | Aligner |
JP2006309022A (en) * | 2005-04-28 | 2006-11-09 | Fuji Photo Film Co Ltd | Drawing device and drawing method |
WO2006118134A1 (en) * | 2005-04-28 | 2006-11-09 | Fujifilm Corporation | Drawing apparatus and drawing method |
JP2007034186A (en) * | 2005-07-29 | 2007-02-08 | Fujifilm Corp | Drawing method and device |
KR101372036B1 (en) * | 2007-01-18 | 2014-03-10 | 엘지전자 주식회사 | Apparatus of forming reference mark for exposing |
JP5452889B2 (en) | 2008-06-04 | 2014-03-26 | 株式会社オーク製作所 | Drawing device |
JP5961429B2 (en) * | 2012-03-30 | 2016-08-02 | 株式会社アドテックエンジニアリング | Exposure drawing apparatus and exposure drawing method |
JP5813555B2 (en) * | 2012-03-30 | 2015-11-17 | 株式会社アドテックエンジニアリング | Exposure drawing apparatus and exposure drawing method |
JP5813556B2 (en) * | 2012-03-30 | 2015-11-17 | 株式会社アドテックエンジニアリング | Exposure drawing apparatus, program, and exposure drawing method |
-
2014
- 2014-08-27 JP JP2014172363A patent/JP6465591B2/en active Active
-
2015
- 2015-04-28 TW TW104113472A patent/TWI660246B/en active
- 2015-06-23 KR KR1020150088912A patent/KR102333949B1/en active IP Right Grant
- 2015-06-24 CN CN201510354272.6A patent/CN105388707B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101185035A (en) * | 2005-04-28 | 2008-05-21 | 富士胶片株式会社 | Work position information acquisition method and device |
CN102540781A (en) * | 2010-12-28 | 2012-07-04 | 上海微电子装备有限公司 | Backside alignment device and method |
Also Published As
Publication number | Publication date |
---|---|
JP6465591B2 (en) | 2019-02-06 |
KR102333949B1 (en) | 2021-12-01 |
TWI660246B (en) | 2019-05-21 |
KR20160025441A (en) | 2016-03-08 |
CN105388707A (en) | 2016-03-09 |
JP2016048273A (en) | 2016-04-07 |
TW201608345A (en) | 2016-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105388707B (en) | Drawing apparatus | |
CN101980086B (en) | Immersion exposure apparatus and method | |
JP5605044B2 (en) | Pattern forming apparatus, pattern forming method, and device manufacturing method | |
KR101689049B1 (en) | Pattern forming device, pattern forming method, and device manufacturing method | |
US9274415B2 (en) | Photomask, photomask set, exposure apparatus and exposure method | |
JP4369504B2 (en) | Laser direct drawing apparatus and drawing method | |
CN101981512A (en) | Alignment device for planar element, manufacturing equipment for the same, alignment method for the same, and manufacturing method for the same | |
CN100578363C (en) | Base plate exposure device and base plate exposure method | |
JP4324606B2 (en) | Alignment apparatus and exposure apparatus | |
JP4309874B2 (en) | Exposure equipment | |
US6258495B1 (en) | Process for aligning work and mask | |
CN111742263A (en) | Digital double-sided lithography or exposure system and method | |
CN115857281A (en) | Proximity contact type exposure device | |
CN104977811A (en) | Exposure device and fixing method thereof | |
KR102188569B1 (en) | Alignment system for glass alignment camera | |
TW201643558A (en) | Exposure apparatus, manufacturing method of flat panel display, device manufacturing method, and exposure method | |
JP6347285B2 (en) | Object processing apparatus, exposure apparatus, exposure method, and device manufacturing method | |
JP2008209632A (en) | Mask attaching method and exposure apparatus unit | |
CN214751321U (en) | Back alignment device | |
CN216351772U (en) | Alignment device of direct-writing type photoetching machine | |
CN113960894A (en) | Proximity contact type exposure device | |
JP5304017B2 (en) | Exposure apparatus, exposure method, and device manufacturing method | |
JP2009168507A (en) | Method and apparatus for detecting edge position of transparent substrate | |
JP2016035589A (en) | Exposure apparatus, exposure method, and method for manufacturing device | |
JP5831773B2 (en) | Conveying apparatus, object processing apparatus, conveying method, and object processing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |