CN105374769A - Heat radiation apparatus - Google Patents
Heat radiation apparatus Download PDFInfo
- Publication number
- CN105374769A CN105374769A CN201510888353.4A CN201510888353A CN105374769A CN 105374769 A CN105374769 A CN 105374769A CN 201510888353 A CN201510888353 A CN 201510888353A CN 105374769 A CN105374769 A CN 105374769A
- Authority
- CN
- China
- Prior art keywords
- substrate
- recessed
- recessed piece
- heat abstractor
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat radiation apparatus. The heat radiation apparatus comprises a substrate, radiating fins and a heat dissipation fan, wherein the radiating fins are arranged on the substrate, the heat dissipation fan is installed on the radiating fins, the substrate is of an integral structure, a first recessed block, a second recessed block, a third recessed block, a fourth recessed block and a fifth recessed block are stamped at the side, which is in contact with a chip plate, of the substrate, the first recessed block to the fifth recessed block are assembled to form the whole substrate, the heights of the recessed blocks are different, the first recessed block and the third recessed block are each provided with a through hole, the radiating fins are provided with multiple arch-shaped grooves, the end, which are away from the grooves, of the radiating fins are connected with the substrate through the through holes, and the substrate is fixed on the chip plate through heat conduction silica gel. According to the invention, the heights and depths of the recessed blocks are different, the contact surfaces between the recessed blocks and the chip plate are increased through the silica gel, and on the basis that the number of the heat dissipation fan is not increased, the heat dissipation efficiency of the chip plate is improved through increasing the contact surfaces.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly relate to a kind of heat abstractor for central processing unit membrane module.
Background technology
Along with the fast development of information industry, the various electric components of electronic product inside installing are also increasing, such as chip, power supply unit, disc unit, CD player etc.Because each electric component can produce sizable heat in operation, therefore, how effectively to solve the heat radiation of electronic product inside, avoiding affecting its normal operation is the problem that must solve as early as possible.
In various electric component, especially should be noted that the heat got rid of central processor core and produce, and along with its arithmetic speed is accelerated, the heat that central processor core produces is even up to more than 40 watts, therefore, electronic product is inner except the fan of existing wind cooled is housed, near central processing unit, also set up a small-sized fans group, coordinate relevant heat dissipation element, to guarantee that central processing unit works at a proper temperature.
But, existing chip plate model is different, except for except central processor radiating, unified fan can only be relied on to dispel the heat to other electric device, two cooling mechanisms coordinate heat radiation, though add radiating efficiency, increase heat radiation cost, when only needing a cooling mechanism, its radiating efficiency is not good again.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of heat abstractor, for solving the problem of prior art chips plate poor heat radiation.
For achieving the above object and other relevant objects, the invention provides a kind of heat abstractor, comprising:
Substrate, fin and radiator fan, described fin is arranged on the substrate, described radiator fan is installed on fin, wherein, described substrate is integral type structure, the side punching press of described substrate contacts chip plate has first recessed piece, second recessed piece, 3rd recessed piece, 4th recessed piece and the 5th recessed piece, described first recessed piece to five recessed piece spelling is whole substrate, and each recessed tile height is different, a through hole is respectively established for described first recessed piece with described 3rd recessed piece, described fin is provided with multiple groove in arcuation, described fin away from one end of groove connect described substrate by described through hole.
Preferably, a fixing hole is respectively established in the corner of described fin.
Preferably, described fixing hole upper end is pyramid type, and the angle that this conical bore is corresponding is 90 degree.
Preferably, the height of described first recessed piece is 0.3mm.
Preferably, described second recessed piece is 1.7mm with the height of the 3rd recessed piece.
Preferably, the height of described 4th recessed piece is 0.8mm.
Preferably, the height of described 5th recessed piece is 0.6mm.
Preferably, the broadband of described groove is 2 ~ 5mm.
Preferably, described substrate is fixed on described chip plate by heat conductive silica gel.
As mentioned above, heat abstractor of the present invention, has following beneficial effect:
According to chip plate chip-shaped difference, arranging substrate in heat abstractor is different recessed piece of degree of depth height, uses heat conductive silica gel to be contacted with chip plate by substrate, increases heat radiation contact area, under identical heat abstractor, improve the efficiency of heat radiation.
Accompanying drawing explanation
Fig. 1 is shown as construction for heat radiating device schematic diagram of the present invention;
Fig. 2 is shown as the vertical view of substrate in heat abstractor of the present invention;
Fig. 3 is shown as the end view of substrate in heat abstractor of the present invention.
Element numbers explanation
1 substrate
2 fin
3 chip plates
4 through holes
5 fixing holes
6 first recessed pieces
7 second recessed pieces
8 the 3rd recessed piece
9 the 4th recessed piece
10 the 5th recessed piece
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this specification can understand other advantages of the present invention and effect easily.
Refer to Fig. 1 to Fig. 3.Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Refer to Fig. 1 to Fig. 3, the invention provides a kind of construction for heat radiating device schematic diagram of the present invention, comprising:
Substrate 1, fin 2 and radiator fan, described fin 2 is arranged on described substrate 1, and described radiator fan is installed on fin 2, and described substrate 1 is fixed on described chip plate 3 by heat conductive silica gel.A fixing hole 5 is respectively established in the corner of described fin 2.Described fixing hole 5 upper end is pyramid type, and the angle that this conical bore is corresponding is 90 degree, and this cone angle is more easily fixed, and reinforces substrate 1 further and is fixed to chip plate 3, prevent it from dropping by described fixing hole 5.Wherein, described substrate 1 is integral type structure, the side punching press of described substrate 1 contact chip plate 3 has first recessed piece 6, second recessed piece 7, 3rd recessed piece 8, 4th recessed piece 9 and the 5th recessed piece 10, described first recessed piece 6 to the 5th recessed piece 10 spellings are whole substrate 1, and each recessed tile height is different, a through hole 4 is respectively established for described first recessed piece 6 with described 3rd recessed piece 8, the height of described first recessed piece 6 to the 5th recessed piece 10 is 0.3mm, 1.7mm, 1.7mm, 0.8mm, 0.6mm, described fin 2 is provided with multiple groove in arcuation, the width of described groove is 2 ~ 5mm, described fin 2 away from one end of groove connect described substrate 1 by described through hole 4, most of heat falls apart by the groove of fin 2 by radiator fan, from the phenomenon stopping certain chip part of heat conduction at all, improve radiating efficiency.
In sum, the present invention is different according to chip plate 3 chip model, and arranging substrate 1 in heat abstractor be just different recessed piece of the degree of depth, heat conductive silica gel is used to be contacted with chip plate 3 by substrate 1, increase heat radiation contact area, under identical heat abstractor, improve the efficiency of heat radiation.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (8)
1. a heat abstractor, it is characterized in that, comprise: substrate, fin and radiator fan, described fin is arranged on the substrate, described radiator fan is installed on fin, wherein, described substrate is integral type structure, the side punching press of described substrate contacts chip plate has first recessed piece, second recessed piece, 3rd recessed piece, 4th recessed piece and the 5th recessed piece, described first recessed piece to five recessed piece spelling is whole substrate, and each recessed tile height is different, a through hole is respectively established for described first recessed piece with described 3rd recessed piece, described fin is provided with multiple groove in arcuation, described fin away from one end of groove connect described substrate by described through hole, described substrate is fixed on described chip plate by heat conductive silica gel.
2. heat abstractor according to claim 1, is characterized in that, a fixing hole is respectively established in the corner of described fin.
3. heat abstractor according to claim 1, is characterized in that, described fixing hole upper end is pyramid type, and the angle that this conical bore is corresponding is 90 degree.
4. heat abstractor according to claim 1, is characterized in that, the height of described first recessed piece is 0.3mm.
5. heat abstractor according to claim 1, is characterized in that, described second recessed piece is 1.7mm with the height of the 3rd recessed piece.
6. heat abstractor according to claim 1, is characterized in that, the height of described 4th recessed piece is 0.8mm.
7. heat abstractor according to claim 1, is characterized in that, the height of described 5th recessed piece is 0.6mm.
8. heat abstractor according to claim 1, is characterized in that, the broadband of described groove is 2 ~ 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510888353.4A CN105374769A (en) | 2015-12-04 | 2015-12-04 | Heat radiation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510888353.4A CN105374769A (en) | 2015-12-04 | 2015-12-04 | Heat radiation apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105374769A true CN105374769A (en) | 2016-03-02 |
Family
ID=55376825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510888353.4A Pending CN105374769A (en) | 2015-12-04 | 2015-12-04 | Heat radiation apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105374769A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050185379A1 (en) * | 2004-02-20 | 2005-08-25 | Vinson Wade D. | Heat sink having compliant interface to span multiple components |
| US20060171121A1 (en) * | 2005-01-28 | 2006-08-03 | Bell Michael R | Apparatus and method for transferring heat from an electrical module |
| CN102196713A (en) * | 2010-03-17 | 2011-09-21 | 日立汽车***株式会社 | Electronic controller for vehicle |
| CN102458038A (en) * | 2010-10-18 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation part and electronic apparatus having heat radiation part |
| CN103369929A (en) * | 2012-04-09 | 2013-10-23 | 株式会社村田制作所 | Power supply module |
| JP2014146702A (en) * | 2013-01-29 | 2014-08-14 | Nec Corp | Electronic apparatus and housing |
| CN104663010A (en) * | 2012-09-21 | 2015-05-27 | 日立汽车***株式会社 | Electronic control apparatus |
| CN205376499U (en) * | 2015-12-04 | 2016-07-06 | 重庆臻远电气有限公司 | Radiator |
-
2015
- 2015-12-04 CN CN201510888353.4A patent/CN105374769A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050185379A1 (en) * | 2004-02-20 | 2005-08-25 | Vinson Wade D. | Heat sink having compliant interface to span multiple components |
| US20060171121A1 (en) * | 2005-01-28 | 2006-08-03 | Bell Michael R | Apparatus and method for transferring heat from an electrical module |
| CN102196713A (en) * | 2010-03-17 | 2011-09-21 | 日立汽车***株式会社 | Electronic controller for vehicle |
| CN102458038A (en) * | 2010-10-18 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation part and electronic apparatus having heat radiation part |
| CN103369929A (en) * | 2012-04-09 | 2013-10-23 | 株式会社村田制作所 | Power supply module |
| CN104663010A (en) * | 2012-09-21 | 2015-05-27 | 日立汽车***株式会社 | Electronic control apparatus |
| JP2014146702A (en) * | 2013-01-29 | 2014-08-14 | Nec Corp | Electronic apparatus and housing |
| CN205376499U (en) * | 2015-12-04 | 2016-07-06 | 重庆臻远电气有限公司 | Radiator |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160302 |