CN105355757A - 一体化光引擎封装方法 - Google Patents
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000741 silica gel Substances 0.000 claims abstract description 5
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 5
- 239000004411 aluminium Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 10
- 238000012856 packing Methods 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000002861 polymer material Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- 239000011436 cob Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract 4
- 239000010410 layer Substances 0.000 abstract 3
- 238000003466 welding Methods 0.000 abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
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Abstract
本发明公开一体化光引擎封装方法，该光引擎依次包括COB透镜、防水圈、防水胶层、LED光源芯片与驱动部件、铝基板，将LED光源芯片采用倒装形式封装在铝基板中间位置上，LED驱动部件SMT贴片在铝基板周围，与LED光源芯片形成一体化结构，COB透镜以卡扣方式装在铝基板上。所述LED光源芯片上涂荧光粉与硅胶层。所述LED光源芯片采用倒装封装形式，倒装芯片封装器件包括LED倒装芯片、封装本体，所述封装本体将该LED倒装芯片包覆，该LED倒装芯片的N焊盘层与P焊盘层外露于该封装本体。本发明提供了一种LED光源与驱动器一体化，节省生产成本、提高生产效率的一体化光引擎封装方法。
Description
技术领域
本发明涉及光引擎,具体地说是一种一体化光引擎封装方法。
背景技术
LED光引擎即包含LED封装元件或LED阵列模块、LED驱动器、以及其他光度、热学、机械和电气元件的整体组合，该组合通过一个与LED灯具匹配的常规连接器直接连接到分支电路上。因此LED光引擎是一个介于LED灯具和LED灯之间的器件，与LED灯的区别是它不含有标准灯头不能与分支电路直接连接，与LED灯具的相同点是可以具有设定的配光及散热功能。该产品能有效的提高LED室内灯具的稳定性，提高各性能参数(如显色性，***光效等)。
目前，LED光引擎其元件阵列结构及其封装方法生产效率较低。
发明内容
本发明解决的技术问题:本发明克服了现有技术的不足,提供了一种LED光源与驱动器一体化,节省生产成本、提高生产效率的一体化光引擎封装方法。
技术方案：一体化光引擎封装方法，其特征在于：该光引擎依次包括COB透镜、防水圈、防水胶层、LED光源芯片与驱动部件、铝基板，将LED光源芯片采用倒装形式封装在铝基板中间位置上，LED驱动部件SMT贴片在铝基板周围，与LED光源芯片形成一体化结构，COB透镜以卡扣方式装在铝基板上。
所述LED光源芯片上涂荧光粉与硅胶层。
所述LED光源芯片采用倒装封装形式，倒装芯片封装器件包括LED倒装芯片、封装本体，所述封装本体将该LED倒装芯片包覆，该LED倒装芯片的N焊盘层与P焊盘层外露于该封装本体。
所述COB透镜1通过双色注塑制成，COB透镜包括材质为透明高分子材料的透镜主体和材质为半透明高分子材料的透镜外层，COB透镜主体贴近LED光源芯片，发出的光线经过透镜主体后，再通过透镜外层出射。
本发明有益效果：本发明由于采用了上述技术方案，实现LED光源与驱动器一体化，节能成本，提高了生产效率。绝缘性能好，稳定性高，同时封装工艺简单，大大提高了LED倒装芯片的封装效率及产品优良率。
本发明LED光源采用倒装的形式封装在铝基板上,LED光源可以充分散热，LED驱动器部分SMT在铝基板上,与LED光源一体化。为了实现LED光源良好的散射性能,在LED光源上采用卡扣形式组装一个COB透镜。本发明通过安装防水圈在COB透镜与铝基板处，达到防水效果。
附图说明
图1是本发明结构示意图。
图2是本发明结构分解示意图。
主要元件说明：1COB透镜,2卡扣孔位,3防水圈,4防水胶层,5驱动电源元器件,6光引擎IC芯片,7SMD电子元器件,8LED光源芯片,9荧光粉及硅胶层,10铝基板,11防水接头,12卡扣。
具体实施方式
见图1、图2，一体化光引擎封装方法，该光引擎依次包括COB透镜1、防水圈3、防水胶层4、LED光源芯片8与驱动部件、铝基板10，将LED光源芯片采用倒装形式封装在铝基板10中间位置上，LED驱动部件SMT贴片在铝基板周围，与LED光源芯片形成一体化结构，COB透镜1以卡扣方式装在铝基板上。驱动部件包括驱动电源元器件5,光引擎IC芯片6,SMD电子元器件7。
SMT是指采用表面贴装技术将LED驱动部件装于在铝基板周围。
COB透镜1以卡扣方式装在铝基板上，是将COB透镜1周边的卡扣孔位2扣合在铝基板周边的卡扣12中，装配简单，提高生产效率。
在LED光源芯片8上涂荧光粉与硅胶层9。焊接防水接头11与打防水胶，起到防水作用。组装防水圈3在防水接头11的位置上。
LED光源芯片8采用倒装封装形式，倒装芯片封装器件包括LED倒装芯片、封装本体，所述封装本体将该LED倒装芯片包覆，该LED倒装芯片的N焊盘层与P焊盘层外露于该封装本体。该LED倒装芯片封装器件中的LED倒装芯片散热、绝缘性能好，稳定性高，同时封装工艺简单，大大提高了LED倒装芯片的封装效率及产品优良率。
所述COB透镜1通过双色注塑制成，COB透镜包括材质为透明高分子材料的透镜主体和材质为半透明高分子材料的透镜外层，COB透镜主体贴近LED光源芯片，发出的光线经过透镜主体后，再通过透镜外层出射。这种COB透镜直射不会给用户带来非常刺眼的不良感觉，具有良好的散射性能。
本发明绝非仅限于这些例子。以上所述仅为本发明较好的实施例，仅仅用于描述本发明，不能理解为对本发明的范围的限制。应当指出的是，凡在本发明的精神和原则之内所做的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。
Claims (4)
1.一体化光引擎封装方法，其特征在于：该光引擎依次包括COB透镜、防水圈、防水胶层、LED光源芯片与驱动部件、铝基板，将LED光源芯片采用倒装形式封装在铝基板中间位置上，LED驱动部件SMT贴片在铝基板周围，与LED光源芯片形成一体化结构，COB透镜以卡扣方式装在铝基板上。
2.根据权利要求1所述的一体化光引擎封装方法，其特征在于：所述LED光源芯片上涂荧光粉与硅胶层。
3.根据权利要求1所述的一体化光引擎封装方法，其特征在于：所述LED光源芯片采用倒装封装形式，倒装芯片封装器件包括LED倒装芯片、封装本体，所述封装本体将该LED倒装芯片包覆，该LED倒装芯片的N焊盘层与P焊盘层外露于该封装本体。
4.根据权利要求1所述的一体化光引擎封装方法，其特征在于：所述COB透镜通过双色注塑制成，COB透镜包括材质为透明高分子材料的透镜主体和材质为半透明高分子材料的透镜外层，COB透镜主体贴近LED光源芯片，发出的光线经过透镜主体后，再通过透镜外层出射。
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105762260A (zh) * | 2016-04-18 | 2016-07-13 | 广州硅能照明有限公司 | 一种cob光模组及制备方法 |
| CN105762256A (zh) * | 2016-04-18 | 2016-07-13 | 广州硅能照明有限公司 | 一种具有光学结构的一体化cob光模组及制备方法 |
| CN105810801A (zh) * | 2016-04-18 | 2016-07-27 | 广州硅能照明有限公司 | 一种高等级防护的cob光模组及制备方法 |
| CN106641764A (zh) * | 2017-02-27 | 2017-05-10 | 宁波亚茂光电股份有限公司 | 一种led发光设备 |
| CN107240636A (zh) * | 2017-07-21 | 2017-10-10 | 湖南粤港模科实业有限公司 | 一种卡扣式超薄系列散热器与芯片一体化封装光源结构 |
| CN109764265A (zh) * | 2019-01-14 | 2019-05-17 | 中山市高沃光电科技有限公司 | 一体倒装式cob驱动 |
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| CN103915558A (zh) * | 2014-04-21 | 2014-07-09 | 杭州华普永明光电股份有限公司 | 一种led模组 |
| CN203787420U (zh) * | 2013-09-18 | 2014-08-20 | 中山市光圣半导体科技有限责任公司 | 可变换连接的阵列式cob光源 |
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| CN105762260A (zh) * | 2016-04-18 | 2016-07-13 | 广州硅能照明有限公司 | 一种cob光模组及制备方法 |
| CN105762256A (zh) * | 2016-04-18 | 2016-07-13 | 广州硅能照明有限公司 | 一种具有光学结构的一体化cob光模组及制备方法 |
| CN105810801A (zh) * | 2016-04-18 | 2016-07-27 | 广州硅能照明有限公司 | 一种高等级防护的cob光模组及制备方法 |
| CN105810801B (zh) * | 2016-04-18 | 2018-08-07 | 广州硅能照明有限公司 | 一种高等级防护的cob光模组及制备方法 |
| CN105762260B (zh) * | 2016-04-18 | 2018-08-07 | 广州硅能照明有限公司 | 一种cob光模组及制备方法 |
| CN105762256B (zh) * | 2016-04-18 | 2018-08-07 | 广州硅能照明有限公司 | 一种具有光学结构的一体化cob光模组及制备方法 |
| CN106641764A (zh) * | 2017-02-27 | 2017-05-10 | 宁波亚茂光电股份有限公司 | 一种led发光设备 |
| CN107240636A (zh) * | 2017-07-21 | 2017-10-10 | 湖南粤港模科实业有限公司 | 一种卡扣式超薄系列散热器与芯片一体化封装光源结构 |
| CN109764265A (zh) * | 2019-01-14 | 2019-05-17 | 中山市高沃光电科技有限公司 | 一体倒装式cob驱动 |
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