CN105345621A - Novel silicon wafer flaw finishing technology - Google Patents
Novel silicon wafer flaw finishing technology Download PDFInfo
- Publication number
- CN105345621A CN105345621A CN201510708720.8A CN201510708720A CN105345621A CN 105345621 A CN105345621 A CN 105345621A CN 201510708720 A CN201510708720 A CN 201510708720A CN 105345621 A CN105345621 A CN 105345621A
- Authority
- CN
- China
- Prior art keywords
- side plate
- silicon chip
- silicon wafer
- groove
- special frock
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 65
- 239000010703 silicon Substances 0.000 title claims abstract description 65
- 238000005516 engineering process Methods 0.000 title abstract description 4
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000005498 polishing Methods 0.000 claims abstract description 11
- 230000007547 defect Effects 0.000 claims description 33
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 230000002950 deficient Effects 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000005461 lubrication Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510708720.8A CN105345621B (en) | 2015-10-28 | 2015-10-28 | A kind of method for trimming of Defect |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510708720.8A CN105345621B (en) | 2015-10-28 | 2015-10-28 | A kind of method for trimming of Defect |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105345621A true CN105345621A (en) | 2016-02-24 |
CN105345621B CN105345621B (en) | 2017-06-20 |
Family
ID=55321756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510708720.8A Active CN105345621B (en) | 2015-10-28 | 2015-10-28 | A kind of method for trimming of Defect |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105345621B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010007812A1 (en) * | 1999-04-09 | 2001-07-12 | Yoshihisa Naoi | Inner diameter grinding wheel and grinding apparatus using the wheel for grinding a cylindrical workpiece |
CN203391136U (en) * | 2013-08-06 | 2014-01-15 | 保定天威英利新能源有限公司 | Silicon wafer reprocessing fixture |
CN203622175U (en) * | 2013-12-30 | 2014-06-04 | 天津英利新能源有限公司 | Silicon slice grinding device |
CN203853885U (en) * | 2014-04-09 | 2014-10-01 | 阿特斯(中国)投资有限公司 | Tool for edging silicon wafers |
CN204053696U (en) * | 2014-09-17 | 2014-12-31 | 浙江昊能光电有限公司 | A kind of wafer chamfering machine |
-
2015
- 2015-10-28 CN CN201510708720.8A patent/CN105345621B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010007812A1 (en) * | 1999-04-09 | 2001-07-12 | Yoshihisa Naoi | Inner diameter grinding wheel and grinding apparatus using the wheel for grinding a cylindrical workpiece |
CN203391136U (en) * | 2013-08-06 | 2014-01-15 | 保定天威英利新能源有限公司 | Silicon wafer reprocessing fixture |
CN203622175U (en) * | 2013-12-30 | 2014-06-04 | 天津英利新能源有限公司 | Silicon slice grinding device |
CN203853885U (en) * | 2014-04-09 | 2014-10-01 | 阿特斯(中国)投资有限公司 | Tool for edging silicon wafers |
CN204053696U (en) * | 2014-09-17 | 2014-12-31 | 浙江昊能光电有限公司 | A kind of wafer chamfering machine |
Also Published As
Publication number | Publication date |
---|---|
CN105345621B (en) | 2017-06-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Silicon wafer flaw finishing method Effective date of registration: 20191113 Granted publication date: 20170620 Pledgee: China Everbright Bank Limited by Share Ltd. Nanjing branch Pledgor: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. Registration number: Y2019320000279 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210127 Granted publication date: 20170620 Pledgee: China Everbright Bank Limited by Share Ltd. Nanjing branch Pledgor: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. Registration number: Y2019320000279 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210225 Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 212200 No. 198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: 212200 No. 198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Meike Solar Energy Technology Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method for repairing silicon wafer defects Effective date of registration: 20211125 Granted publication date: 20170620 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: Jiangsu Meike Solar Energy Technology Co.,Ltd. Registration number: Y2021980013231 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221031 Granted publication date: 20170620 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: Jiangsu Meike Solar Energy Technology Co.,Ltd. Registration number: Y2021980013231 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method for repairing defects in silicon wafers Effective date of registration: 20221130 Granted publication date: 20170620 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: Jiangsu Meike Solar Energy Technology Co.,Ltd. Registration number: Y2022980024342 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230317 Granted publication date: 20170620 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: Jiangsu Meike Solar Energy Technology Co.,Ltd. Registration number: Y2022980024342 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |