CN105338760A - Manufacturing method of NFC antenna circuit board - Google Patents
Manufacturing method of NFC antenna circuit board Download PDFInfo
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- CN105338760A CN105338760A CN201410383943.7A CN201410383943A CN105338760A CN 105338760 A CN105338760 A CN 105338760A CN 201410383943 A CN201410383943 A CN 201410383943A CN 105338760 A CN105338760 A CN 105338760A
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Abstract
The invention discloses a manufacturing method of an NFC antenna circuit board. The method comprises the following steps: (1) coating the bottom surface of a base material of the antenna circuit board with a micro-viscous film through a laminating machine; (2) fabricating a multi-layer printed board on the base material through an addition process; (3) removing the micro-viscous film on the bottom surface of the base material; and (4) pasting a double faced adhesive tape on the bottom surface of the base material, and pasting a ferrite layer on a second solder resist ink layer. According to the manufacturing method, the strength of the base material is strengthened through the micro-viscous film; and the base material is not stretched or folded in the technological process of an addition process, so that an ultrathin base material can be selected for manufacturing the antenna circuit board; and the thickness of an NFC antenna is reduced to reduce the size of radio equipment. In addition, the processing procedures of drilling and hole metallization are omitted; the manufacturing procedure is shortened; the processing difficulty is lowered; auxiliary material waste in drilling and etching procedures is avoided; the processing cost is reduced; wastewater in hole-processing and etching procedures is not generated; and environmental protection is facilitated.
Description
Technical field
The present invention relates to antcnnas manufacturing technology, particularly relate to a kind of manufacture method of NFC antenna wiring board.
Background technology
NFC antenna is used for launching or receiving electromagnetic device in wireless device, and NFC antenna wiring board is one of its vitals.
NFC antenna wiring board is generally and is made up of flexible parent metal and multilayer printed circuit board thereon, because the thickness of flexible parent metal in wiring board manufacture process can not be too thin, is generally 25mm, makes existing NFC antenna thickness bigger than normal, brings inconvenience.
In addition, multilayer printed circuit board generally has two-layer conductive copper layer, in order to make the non-conduction SI semi-insulation between two-layer conductive copper layer, usually there is insulating barrier between the two, and in order to consider the turning part between two-layer conductive copper layer, then need to carry out on the insulating layer holing and hole metallization process, realize interlayer circuit interconnection, cause work flow long, difficulty is large, in addition, the auxiliary material that boring and etching work procedure need improves the cost of processing, and the waste water produced when hole process and circuit etching is unfavorable for environmental protection.
Summary of the invention
Based on this, for above-mentioned technical problem, provide a kind of manufacture method of NFC antenna wiring board.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A manufacture method for NFC antenna wiring board, comprises the following steps:
One, cover the micro-mucous membrane of one deck by laminating machine in the bottom surface of antenna traces plate substrate, the thickness of described antenna traces plate substrate is 5-25 μm, and the micro-sticky peeling force of described micro-mucous membrane is 3-6gf/inch
2it is made up of the PET/PEN basic unit and the layer of silica gel be superimposed in this PET/PEN basic unit being positioned at bottom, the thickness of described PET/PEN basic unit is 25-100 μm, the thickness of described layer of silica gel is 5-10 μm, the coated temperature of described laminating machine is 40-50 DEG C, wheel speeds 0.5-1.5 meter per second, pressure 4.5-5.5kg;
Two, multilayer board is made on the substrate by addition process:
Print thickness is the ground floor catalytic ink of 4-10 μm on the substrate;
On described ground floor catalytic ink, form by displacement and electroplating technology the ground floor copper wire layer that thickness is 2-35 μm, the middle part of this ground floor copper wire layer is non-conduction portion;
At the ground floor solder mask that described non-conduction portion print thickness is 10-20 μm;
On described ground floor solder mask, print thickness is the second layer catalytic ink of 4-10 μm, and this second layer catalytic ink is covered in described ground floor solder mask and ground floor copper wire layer, in a few font;
On described second layer catalytic ink, form by displacement and electroplating technology the second layer copper wire layer that thickness is 2-35 μm, the two ends of this second layer copper wire layer connect with the two ends of described ground floor copper wire layer;
In described second layer copper wire layer, print thickness is the second layer solder mask of 10-20 μm, and exposed pad.
Three, the micro-mucous membrane on described base material bottom surface is removed;
Four, cover in the bottom surface of described base material the double faced adhesive tape that thickness is 10 μm, described second layer solder mask covers the ferrite layer that thickness is 60 μm.
Described micro-mucous membrane is divested by laminating machine, this laminating machine wheel speeds 1-2 meter per second.
Described micro-mucous membrane is removed by peel manually.
Described base material is PET or PI basement membrane.
The present invention strengthens the intensity of base material by micro-mucous membrane, make it can not to be stretched in addition process technological process, fold, thus ultra-thin base material can be selected to carry out the manufacture of antenna circuit board, reduce the thickness of NFC antenna, and then reduce the volume of wireless device; In addition, eliminate boring and hole metallization handling process, shorten manufacturing procedure, reduce difficulty of processing, avoid auxiliary material waste when boring and etching work procedure, reduce processing cost, the waste water of hole process and etching work procedure can not be produced, be beneficial to environmental protection.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail:
Fig. 1 is schematic diagram of the present invention.
Embodiment
As shown in Figure 1, a kind of manufacture method of NFC antenna wiring board, comprises the following steps:
One, the micro-mucous membrane of one deck is covered by laminating machine in the bottom surface of antenna traces plate substrate 11.
Wherein, antenna traces plate substrate 11 is PET (Polyethyleneterephthalate, poly terephthalic acid class plastics) or PI (PolyimideFilm, polyimide film), and thickness is 5-25 μm.
The micro-sticky peeling force of micro-mucous membrane is 3-6gf/inch
2, it is made up of the PET/PEN basic unit and the layer of silica gel be superimposed in this PET/PEN basic unit being positioned at bottom, and the thickness of PET/PEN basic unit is 25-100 μm, the thickness of layer of silica gel is 5-10 μm, the coated temperature of laminating machine is 40-50 DEG C, wheel speeds 0.5-1.5 meter per second, pressure 4.5-5.5kg.
Two, on base material 11, multilayer board is made by addition process.
On base material 11, print thickness is the ground floor catalytic ink 13a of 4-10 μm;
On ground floor catalytic ink 13a, form by displacement and electroplating technology the ground floor copper wire layer 14a that thickness is 2-35 μm, the middle part of this ground floor copper wire layer 14a is non-conduction portion;
At the ground floor solder mask 15a that above-mentioned non-conduction portion print thickness is 10-20 μm, for insulation.
On ground floor solder mask 15a, print thickness is 4-10 μm of second layer catalytic ink 13b, and this second layer catalytic ink 13b is covered in ground floor solder mask and ground floor copper wire layer, in a few font;
On second layer catalytic ink 13b, form by displacement and electroplating technology the second layer copper wire layer 14b that thickness is 2-35 μm, the two ends of this second layer copper wire layer 14b connect with the two ends of ground floor copper wire layer 14a;
On second layer copper wire layer 14b, print thickness is the second layer solder mask 15b of 10-20 μm, and exposed pad.
Ground floor solder mask 15a can avoid the conducting position of the first copper electroplating layer 14a and the second copper electroplating layer 14b, eliminate boring and hole metallization handling process, shorten manufacturing procedure, reduce difficulty of processing, avoid the waste of boring and the auxiliary material of etching work procedure, reduce processing cost, the waste water of hole process and etching work procedure can not be produced, be beneficial to environmental protection.
Three, after multilayer board completes, the micro-mucous membrane on base material 11 bottom surface is removed.
Particularly, micro-mucous membrane is divested by laminating machine, this laminating machine wheel speeds 1-2 meter per second.
Certainly, micro-mucous membrane also can be removed by peel manually.
Four, covering double faced adhesive tape 12 in the bottom surface of base material 11, for NFC antenna wiring board being labelled to the casing of wireless device, second layer solder mask 15b covering ferrite layer 16, for preventing battery interference signal.
The inventive method strengthens the intensity of above-mentioned base material 11 by micro-mucous membrane, make it can not to be stretched in addition process technological process, fold, thus ultra-thin base material can be selected to carry out the manufacture of antenna circuit board, reduce the thickness of NFC antenna, and then reduce the volume of wireless device.
Embodiment 1
The thickness of the NFC antenna wiring board of the present embodiment method manufacture is 137.5 μm, and be almost 1/5 of traditional NFC antenna wiring board thickness, its manufacture process is as follows:
First the micro-mucous membrane of one deck is covered by laminating machine in the bottom surface of antenna traces plate substrate 11.
Wherein, antenna traces plate substrate 11 is PET basement membrane, and thickness is 10 μm.
The micro-sticky peeling force of micro-mucous membrane is 4.5gf/inch
2, be made up of PET basic unit and layer of silica gel, PET groundwork thickness is 65 μm, and the thickness of layer of silica gel is 8 μm, and the coated temperature of laminating machine is 45 DEG C, wheel speeds 1 meter per second, pressure 5kg.
Then on base material 11, multilayer board is made by addition process:
On base material 11, print thickness is the ground floor catalytic ink 13a of 7 μm;
On ground floor catalytic ink 13a, form by displacement and electroplating technology the ground floor copper wire layer 14a that thickness is 18 μm, the middle part of this ground floor copper wire layer 14a is non-conduction portion;
At the ground floor solder mask 15a that above-mentioned non-conduction portion print thickness is 15 μm.
On ground floor solder mask 15a, print thickness is 7 μm of second layer catalytic ink 13b, and this second layer catalytic ink 13b is covered in ground floor solder mask and ground floor copper wire layer, in a few font;
On second layer catalytic ink 13b, form by displacement and electroplating technology the second layer copper wire layer 14b that thickness is 18 μm, the two ends of this second layer copper wire layer 14b connect with the two ends of ground floor copper wire layer 14a;
On second layer copper wire layer 14b, print thickness is the second layer solder mask 15b of 10-20 μm, and exposed pad.
After multilayer board completes, divest the micro-mucous membrane on base material 11 bottom surface by laminating machine, laminating machine wheel speeds 1.5 meter per second.
Finally, cover the double faced adhesive tape 12 of 10 μm in the bottom surface of base material 11, and cover the ferrite layer 16 of 60 μm on second layer solder mask 15b.
Embodiment 2
The thickness of the NFC antenna wiring board of the present embodiment method manufacture is 140 μm, and be almost 1/5 of traditional NFC antenna wiring board thickness, its manufacture process is as follows:
First the micro-mucous membrane of one deck is covered by laminating machine in the bottom surface of antenna traces plate substrate 11.
Wherein, antenna traces plate substrate 11 is PI basement membrane, and thickness is 5 μm.
The micro-sticky peeling force of micro-mucous membrane is 3.0gf/inch
2, be made up of PEN basic unit and layer of silica gel, PEN groundwork thickness is 75 μm, and the thickness of layer of silica gel is 5 μm, and the coated temperature of laminating machine is 45 DEG C, wheel speeds 0.5 meter per second, pressure 5kg.
Then on base material 11, multilayer board is made by addition process:
On base material 11, print thickness is the ground floor catalytic ink 13a of 7 μm;
On ground floor catalytic ink 13a, form by displacement and electroplating technology the ground floor copper wire layer 14a that thickness is 18 μm, the middle part of this ground floor copper wire layer 14a is non-conduction portion;
At the ground floor solder mask 15a that above-mentioned non-conduction portion print thickness is 15 μm.
On ground floor solder mask 15a, print thickness is 7 μm of second layer catalytic ink 13b, and this second layer catalytic ink 13b is covered in ground floor solder mask and ground floor copper wire layer, in a few font;
On second layer catalytic ink 13b, form by displacement and electroplating technology the second layer copper wire layer 14b that thickness is 18 μm, the two ends of this second layer copper wire layer 14b connect with the two ends of ground floor copper wire layer 14a;
On second layer copper wire layer 14b, print thickness is the second layer solder mask 15b of 10-20 μm, and exposed pad.
After multilayer board completes, divest the micro-mucous membrane on base material 11 bottom surface by laminating machine, laminating machine wheel speeds 1 meter per second.
Finally, cover the double faced adhesive tape 12 of 10 μm in the bottom surface of base material 11, and cover the ferrite layer 16 of 60 μm on second layer solder mask 15b.
Embodiment 3
The thickness of the NFC antenna wiring board of the present embodiment method manufacture is 132.5 μm, and be almost 1/5 of traditional NFC antenna wiring board thickness, its manufacture process is as follows:
First the micro-mucous membrane of one deck is covered by laminating machine in the bottom surface of antenna traces plate substrate 11.
Wherein, antenna traces plate substrate 11 is PET basement membrane, and thickness is 25 μm.
The micro-sticky peeling force of micro-mucous membrane is 6.0gf/inch
2, be made up of PET basic unit and layer of silica gel, PET groundwork thickness is 50 μm, and the thickness of layer of silica gel is 10 μm, and the temperature of laminating machine is 45 DEG C, wheel speeds 1.5 meter per second, pressure 5kg.
Then on base material 11, multilayer board is made by addition process:
On base material 11, print thickness is the ground floor catalytic ink 13a of 7 μm;
On ground floor catalytic ink 13a, form by displacement and electroplating technology the ground floor copper wire layer 14a that thickness is 18 μm, the middle part of this ground floor copper wire layer 14a is non-conduction portion;
At the ground floor solder mask 15a that above-mentioned non-conduction portion print thickness is 15 μm.
On ground floor solder mask 15a, print thickness is 7 μm of second layer catalytic ink 13b, and this second layer catalytic ink 13b is covered in ground floor solder mask and ground floor copper wire layer, in a few font;
On second layer catalytic ink 13b, form by displacement and electroplating technology the second layer copper wire layer 14b that thickness is 18 μm, the two ends of this second layer copper wire layer 14b connect with the two ends of ground floor copper wire layer 14a;
On second layer copper wire layer 14b, print thickness is the second layer solder mask 15b of 10-20 μm, and exposed pad.
After multilayer board completes, divest the micro-mucous membrane on base material 11 bottom surface by laminating machine, laminating machine wheel speeds 2.0 meter per second.
Finally, cover the double faced adhesive tape 12 of 10 μm in the bottom surface of base material 11, and cover the ferrite layer 16 of 60 μm on second layer solder mask 15b.
But, those of ordinary skill in the art will be appreciated that, above embodiment is only used to the present invention is described, and be not used as limitation of the invention, as long as in spirit of the present invention, all will drop in Claims scope of the present invention the change of the above embodiment, modification.
Claims (4)
1. a manufacture method for NFC antenna wiring board, is characterized in that, comprises the following steps:
One, cover the micro-mucous membrane of one deck by laminating machine in the bottom surface of antenna traces plate substrate, the thickness of described antenna traces plate substrate is 5-25 μm, and the micro-sticky peeling force of described micro-mucous membrane is 3-6gf/inch
2it is made up of the PET/PEN basic unit and the layer of silica gel be superimposed in this PET/PEN basic unit being positioned at bottom, the thickness of described PET/PEN basic unit is 25-100 μm, the thickness of described layer of silica gel is 5-10 μm, the coated temperature of described laminating machine is 40-50 DEG C, wheel speeds 0.5-1.5 meter per second, pressure 4.5-5.5kg;
Two, multilayer board is made on the substrate by addition process:
Print thickness is the ground floor catalytic ink of 4-10 μm on the substrate;
On described ground floor catalytic ink, form by displacement and electroplating technology the ground floor copper wire layer that thickness is 2-35 μm, the middle part of this ground floor copper wire layer is non-conduction portion;
At the ground floor solder mask that described non-conduction portion print thickness is 10-20 μm;
On described ground floor solder mask, print thickness is the second layer catalytic ink of 4-10 μm, and this second layer catalytic ink is covered in described ground floor solder mask and ground floor copper wire layer, in a few font;
On described second layer catalytic ink, form by displacement and electroplating technology the second layer copper wire layer that thickness is 2-35 μm, the two ends of this second layer copper wire layer connect with the two ends of described ground floor copper wire layer;
In described second layer copper wire layer, print thickness is the second layer solder mask of 10-20 μm, and exposed pad.
Three, the micro-mucous membrane on described base material bottom surface is removed;
Four, cover in the bottom surface of described base material the double faced adhesive tape that thickness is 10 μm, described second layer solder mask covers the ferrite layer that thickness is 60 μm.
2. the manufacture method of a kind of NFC antenna wiring board according to claim 1, is characterized in that, described micro-mucous membrane is divested by laminating machine, this laminating machine wheel speeds 1-2 meter per second.
3. the manufacture method of a kind of NFC antenna wiring board according to claim 1, is characterized in that, described micro-mucous membrane is removed by peel manually.
4. the manufacture method of a kind of NFC antenna wiring board according to Claims 2 or 3, is characterized in that, described base material is PET or PI basement membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410383943.7A CN105338760A (en) | 2014-08-06 | 2014-08-06 | Manufacturing method of NFC antenna circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410383943.7A CN105338760A (en) | 2014-08-06 | 2014-08-06 | Manufacturing method of NFC antenna circuit board |
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| CN105338760A true CN105338760A (en) | 2016-02-17 |
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| CN201410383943.7A Pending CN105338760A (en) | 2014-08-06 | 2014-08-06 | Manufacturing method of NFC antenna circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107546490A (en) * | 2016-06-27 | 2018-01-05 | 上海光线新材料科技有限公司 | A kind of antenna modules and its manufacture method based on magnetic material |
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| CN102833941A (en) * | 2012-09-04 | 2012-12-19 | 上海蓝沛新材料科技股份有限公司 | Novel slide and preparation method thereof |
| CN103715501A (en) * | 2013-12-26 | 2014-04-09 | 惠州Tcl移动通信有限公司 | NFC antenna, mobile terminal and manufacturing method of NFC antenna |
| CN103763854A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Printed circuit board and manufacturing method thereof |
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2014
- 2014-08-06 CN CN201410383943.7A patent/CN105338760A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101375463A (en) * | 2006-01-24 | 2009-02-25 | 艾利丹尼森公司 | Radio frequency (RF) antenna containing element and methods of making the same |
| TW201008431A (en) * | 2008-08-08 | 2010-02-16 | Foxconn Advanced Tech Inc | Method for manufacturing flexible printed circuit boards |
| CN102625570A (en) * | 2012-04-27 | 2012-08-01 | 上海贺鸿电子有限公司 | Printed wiring board and addition process manufacturing method thereof |
| CN102833941A (en) * | 2012-09-04 | 2012-12-19 | 上海蓝沛新材料科技股份有限公司 | Novel slide and preparation method thereof |
| CN103715501A (en) * | 2013-12-26 | 2014-04-09 | 惠州Tcl移动通信有限公司 | NFC antenna, mobile terminal and manufacturing method of NFC antenna |
| CN103763854A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Printed circuit board and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107546490A (en) * | 2016-06-27 | 2018-01-05 | 上海光线新材料科技有限公司 | A kind of antenna modules and its manufacture method based on magnetic material |
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Address after: 201505 Shanghai Jinshan District City Lin Zhen Lin Shing Road 198 Building 9 Applicant after: SHANGHAI GUANGXIAN NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 201505 Shanghai Jinshan District City Lin Zhen Lin Shing Road 198 Building 9 Applicant before: SHANGHAI XINWEI LANPEI NEW MATERIAL TECHNOLOGY CO., LTD. |
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Effective date of abandoning: 20190104 |