CN105335833B - Offline management and control method for silicon wafer set - Google Patents
Offline management and control method for silicon wafer set Download PDFInfo
- Publication number
- CN105335833B CN105335833B CN201410273949.9A CN201410273949A CN105335833B CN 105335833 B CN105335833 B CN 105335833B CN 201410273949 A CN201410273949 A CN 201410273949A CN 105335833 B CN105335833 B CN 105335833B
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- group
- lot
- offline
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention provides a method for controlling the discharge of a silicon wafer group, which is characterized in that the probability of errors in taking the silicon wafer group is reduced by setting the unique serial number of the silicon wafer group; after the silicon wafer group is obtained, the silicon wafer group is matched with an LOT number on a manufacturing execution system to confirm the silicon wafer group, so that the condition that the silicon wafer group is mistakenly generated can be avoided; and the matched silicon wafer group is subjected to offline operation through automatic equipment, so that the error conditions of misoperation and the like caused by manual offline are avoided midway.
Description
Technical Field
The invention relates to the field of semiconductor device manufacturing, in particular to a silicon wafer group descending wire control method.
Background
Since silicon wafers used in a semiconductor manufacturing factory (Fab) are generally supplied by a supplier and the silicon wafers supplied by the supplier are loaded in wafer cassettes in a predetermined number, the supplier usually sets a LOT number (LOT ID) for each wafer cassette for the sake of management, but the LOT ID of each wafer cassette is not unique among several LOT IDs, and there may be a case where LOT IDs of a plurality of wafer cassettes are the same. This results in the Fab having to renumber these wafers to get a unique LOT ID when they are processed.
At present, most of fabs do not have established perfect silicon wafer warehousing and MES pairing mechanisms, so before the silicon wafers are off-line, LOTs of Fab need to be paired by manual labor, so that the risk of mutual misutilization of two or more groups of silicon wafers exists, production accidents such as scrap and the like can be caused if the risk is not eliminated in time, and for the problem, the existing method has no other better method except for enhancing the strength of secondary inspection (double check).
Chinese patent (CN101276444A) discloses an inventory management system, an inventory management method and a program for non-finished wafers, which includes: according to the inventory inquiry from the expenditure terminal, the inventory of the non-finished product wafer is confirmed, the indication request is accepted and the expenditure processing is carried out, and the inventory management part is provided for distinguishing and managing the non-finished product wafer through the thickness of the wafer; and an inventory inquiry processing unit for giving an answer to the request to give priority to the inventory of wafers belonging to the thinnest wafer thickness category among the inventory of the conditions (use process, use purpose, or name derived therefrom) for which the non-finished wafers are inquired by the payout terminal. The method provided by this patent enables proper management of wafer inventory, but is based on the condition that the wafers are not the same thickness.
Therefore, the above patent still does not solve the above-mentioned several problems.
Disclosure of Invention
In view of the above problems, the present invention provides a method for controlling the discharge of silicon wafer sets.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a method for controlling the discharge of a silicon wafer group comprises the following steps:
step S1, providing a plurality of silicon wafer groups with numbers and non-repeated numbers;
step S2, generating LOT number on a manufacturing terminal;
step S3, binding the serial number of the silicon slice group with the LOT serial number according to the type of the silicon slice;
step S4, making a feeding plan of the silicon slice group, and obtaining the corresponding silicon slice group according to the feeding plan;
step S5, matching the obtained serial number of the silicon wafer group with the LOT serial number on the manufacturing terminal to determine the serial number of the silicon wafer group needing offline;
and step S6, the manufacturing terminal performs offline operation on the corresponding silicon slice group according to the serial number of the silicon slice group needing offline.
The silicon wafer group offline management and control method is characterized in that the manufacturing terminal comprises a manufacturing execution system.
The silicon wafer group offline management and control method is characterized in that the silicon wafer groups are kept by a material management department in the Fab.
In the silicon wafer group offline controlling method, in step S4, the manufacturing part in the Fab makes a feeding plan of the silicon wafer group, and sends a material receiving list to the material management department according to the feeding plan, and the material management department sends the corresponding silicon wafer group to the manufacturing part according to the material receiving list, so that the manufacturing part obtains the corresponding silicon wafer group.
In the silicon wafer group offline control method, in step S2, a plurality of LOT numbers corresponding to the silicon wafer group numbers one by one are established by a production control department in Fab and created at the manufacturing terminal.
In the silicon wafer group offline control method, in step S6, the manufacturing terminal performs offline operation on the corresponding silicon wafer group according to the serial number of the silicon wafer group requiring offline through a production automation system.
The silicon wafer group unloading management and control method is characterized in that the feeding plan specifies the number and the serial number of the silicon wafer groups which need to be fed to the production line every day.
The technical scheme has the following advantages or beneficial effects:
the following two situations can be avoided by the invention:
1) wrong delivery is sent out from the warehouse without being found on site, so that the silicon wafers sent out in a wrong way are used for products which are off-line;
2) the warehouse does not send wrong goods, but the selection of the product silicon wafer is wrong due to negligence in manual silicon wafer selection.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.
FIG. 1 is a block flow diagram of the method of the present invention;
FIG. 2 is a schematic flow chart of the method of the present invention after steps are refined.
Detailed Description
The invention provides a silicon wafer set offline control method, in particular to a silicon wafer automatic offline fool-proof control method. The method mainly comprises the steps of setting each silicon wafer group into a unique number before the silicon wafer group is obtained, matching the obtained silicon wafer group with an LOT number on a manufacturing execution system after the silicon wafer group is obtained, and finally automatically offline the matched silicon wafer group through an automatic program, so that the possibility of missing the silicon wafer group is effectively avoided.
The offline control method of the silicon wafer set mainly comprises the following steps: step S1, providing a plurality of silicon wafer groups with numbers and non-repeated numbers; step S2, generating LOT number on a manufacturing terminal; step S3, binding the serial number of the silicon slice group with the LOT serial number according to the type of the silicon slice; step S4, making a feeding plan of the silicon slice group, and obtaining the corresponding silicon slice group according to the feeding plan; step S5, matching the obtained serial number of the silicon wafer group with the LOT serial number on the manufacturing terminal to determine the serial number of the silicon wafer group needing offline; and step S6, the manufacturing terminal performs offline operation on the corresponding silicon slice group according to the serial number of the silicon slice group needing offline.
The method of the present invention is described in detail below with reference to the accompanying drawings and specific examples.
As shown in fig. 1, the method in this embodiment includes creating a LOT, making a feeding plan, sending out an original group of silicon slices, receiving the original group of silicon slices, and feeding out a production line.
Wherein, mainly include in the course of establishing the LOT: as shown in fig. 2, step S1: providing a plurality of silicon wafer groups with numbers and non-repeated numbers; the groups of wafers are typically stored in a material management department (MC) in the Fab and stored in a warehouse by the material management department. The serial numbers of the plurality of silicon wafer groups can be serial numbers formulated when the silicon wafers are put into a warehouse in a factory, and the serial numbers are required to be in one-to-one correspondence with the serial numbers provided by a supplier of the silicon wafers and are not repeated, so that the risk of taking wrong silicon wafer groups due to the fact that the serial numbers are not unique when the silicon wafer groups are taken in the follow-up process is avoided. Then, step S2 is performed: generating a LOT number on a manufacturing terminal; the manufacturing terminal in this step may preferably be a Manufacturing Execution System (MES). Subsequently, step S3 is performed: binding the serial number of the silicon wafer group with the LOT serial number according to the type of the silicon wafer; the binding process may also be performed at a manufacturing terminal, which is preferably the same as the manufacturing terminal used in step S2 above, i.e., the binding operation is performed at the manufacturing execution system.
The above-mentioned steps S1 to S3 are all in charge of the production control department (PC) in Fab.
After the process of creating the LOT is completed, a feeding plan needs to be made, an original silicon slice group is sent out, and the original silicon slice group is received; the process of making the feeding plan can be executed by a manufacturing department (MFG) in the Fab, the process of sending out the original silicon wafer group is executed by a material management department in the Fab, and the process of receiving the original silicon wafer group is also executed by the manufacturing department. Corresponding to the above three steps, step S4 is performed: formulating a feeding plan of the silicon wafer group, and obtaining a corresponding silicon wafer group according to the feeding plan; further, after the manufacturing department formulates a feeding plan of the silicon wafer group, a material receiving list is sent to a material management department according to the feeding plan, and after the material management department receives the material receiving list, the material management department sends the corresponding silicon wafer group to the manufacturing department according to the material receiving list, so that the manufacturing department can obtain the corresponding silicon wafer group. The material receiving sheet can be a real document or a digital document, and preferably can be generated in a manufacturing execution system and sent and received by the manufacturing execution system, so that automation of operation is realized and accuracy of data is guaranteed. In an actual production process, an Enterprise Resource Planning (ERP) may be employed to manage shipments by the materials management department. The feeding plan established in the step specifies the number of silicon wafer groups required to be fed to the production line every day and the corresponding numbers of the silicon wafer groups.
After the manufacturing department completes the formulation of the feeding plan and sends the material receiving list to the material management department, and receives the corresponding silicon wafer group sent by the material management department, the step S5 is required to be performed: matching the obtained serial number of the silicon wafer group with an LOT serial number on a manufacturing terminal to determine the serial number of the silicon wafer group needing offline; in this step, after the manufacturing part acquires the silicon wafer group sent from the material management department, the number of the silicon wafer group can be compared with the LOT number established on the manufacturing terminal in advance, so as to determine whether the silicon wafer group sent from the material management department is consistent with the silicon wafer group needing offline.
Finally, feeding and offline are carried out, and the step S6 is correspondingly carried out: the manufacturing terminal carries out offline operation on the corresponding silicon wafer group according to the serial number of the silicon wafer group needing offline; this step is performed by the manufacturing section, and when the manufacturing section confirms that the acquired silicon wafer group matches the LOT number on the manufacturing terminal, the corresponding silicon wafer group is taken off-line by a production automation system (EAP) on the manufacturing terminal.
In summary, the invention reduces the error probability when taking the silicon wafer group by setting the unique number of the silicon wafer group; after the silicon wafer group is obtained, the silicon wafer group is matched with an LOT number on a manufacturing execution system to confirm the silicon wafer group, so that the condition that the silicon wafer group is mistakenly generated can be avoided; and the matched silicon wafer group is subjected to offline operation through automatic equipment, so that the error conditions of misoperation and the like caused by manual offline are avoided midway.
Various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such variations and modifications as fall within the true spirit and scope of the invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of the present invention.
Claims (7)
1. A method for controlling the discharge of a silicon wafer group is characterized by comprising the following steps:
step S1, providing a plurality of silicon wafer groups with numbers and non-repeated numbers;
step S2, generating LOT number on a manufacturing terminal;
step S3, binding the serial number of the silicon slice group with the LOT serial number according to the type of the silicon slice;
step S4, making a feeding plan of the silicon slice group, and obtaining the corresponding silicon slice group according to the feeding plan;
step S5, matching the obtained serial number of the silicon wafer group with the LOT serial number on the manufacturing terminal to determine the serial number of the silicon wafer group needing offline;
and step S6, the manufacturing terminal performs offline operation on the corresponding silicon slice group according to the serial number of the silicon slice group needing offline.
2. The silicon slice lot offline management method of claim 1, wherein said manufacturing terminal comprises a manufacturing execution system.
3. The wafer lot offline management method according to claim 2, wherein said plurality of wafer lots are managed by a material management department in a semiconductor manufacturing plant.
4. The wafer group offline management method according to claim 3, wherein in step S4, a manufacturing department in a semiconductor manufacturing factory makes a feeding plan of the wafer group, and sends a material receiving list to the material management department according to the feeding plan, and the material management department sends the corresponding wafer group to the manufacturing department according to the material receiving list, so that the manufacturing department obtains the corresponding wafer group.
5. The wafer LOT offline management method according to claim 4, wherein in step S2, a plurality of LOT numbers corresponding one-to-one to said plurality of wafer LOT numbers are prepared by a production control department in a semiconductor manufacturing factory and created at said manufacturing terminal.
6. The wafer lot offline management method according to claim 5, wherein in step S6, the manufacturing terminal performs an offline operation on the corresponding wafer lot according to the number of the wafer lot to be offline by a production automation system.
7. The method for controlling the discharge of silicon wafer lots according to claim 6, wherein the charging plan specifies the number and number of silicon wafer lots to be charged into the production line per day.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410273949.9A CN105335833B (en) | 2014-06-18 | 2014-06-18 | Offline management and control method for silicon wafer set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410273949.9A CN105335833B (en) | 2014-06-18 | 2014-06-18 | Offline management and control method for silicon wafer set |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105335833A CN105335833A (en) | 2016-02-17 |
| CN105335833B true CN105335833B (en) | 2020-06-30 |
Family
ID=55286348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410273949.9A Active CN105335833B (en) | 2014-06-18 | 2014-06-18 | Offline management and control method for silicon wafer set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105335833B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1329749A (en) * | 1998-12-04 | 2002-01-02 | 佛姆法克特股份有限公司 | A method and apparatus for transport and tracking of electronic component |
| CN1790614A (en) * | 2004-11-10 | 2006-06-21 | 东京毅力科创株式会社 | Method of resetting substrate processing apparatus, storing program and substrate processing apparatus |
| CN101075132A (en) * | 2006-05-18 | 2007-11-21 | 力晶半导体股份有限公司 | Method for controlling administration robot by statistical process |
| CN101604973A (en) * | 2009-07-13 | 2009-12-16 | 松翰科技股份有限公司 | The coding method of chip identification serial number and device thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7896723B2 (en) * | 2007-10-24 | 2011-03-01 | Atomic Energy Council - Institute Of Nuclear Energy Research | Method for making a silicon quantum dot fluorescent lamp |
-
2014
- 2014-06-18 CN CN201410273949.9A patent/CN105335833B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1329749A (en) * | 1998-12-04 | 2002-01-02 | 佛姆法克特股份有限公司 | A method and apparatus for transport and tracking of electronic component |
| CN1790614A (en) * | 2004-11-10 | 2006-06-21 | 东京毅力科创株式会社 | Method of resetting substrate processing apparatus, storing program and substrate processing apparatus |
| CN101075132A (en) * | 2006-05-18 | 2007-11-21 | 力晶半导体股份有限公司 | Method for controlling administration robot by statistical process |
| CN101604973A (en) * | 2009-07-13 | 2009-12-16 | 松翰科技股份有限公司 | The coding method of chip identification serial number and device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105335833A (en) | 2016-02-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1725242B (en) | Method for solving transferred error in automatic material processing system | |
| CN110398941B (en) | Method and system for glass substrate production control | |
| US7254457B1 (en) | Manufacturing process control methods and systems | |
| CN112309887B (en) | Pre-dispatching method for wafer manufacturing, electronic device, computer equipment and system | |
| CN104166378A (en) | Material CIM automatic management system and method for AMOLED factory | |
| CN103440545B (en) | Product batches hierarchical management system and method | |
| CN112349616B (en) | Automatic control wafer replacing system and automatic control wafer replacing method | |
| US6968245B2 (en) | Flexible recipe modeling and recipe cluster management system | |
| CN105335833B (en) | Offline management and control method for silicon wafer set | |
| CN116092961A (en) | Detection method and detection system for automatically detecting incoming wafers | |
| US10031516B2 (en) | Method and system for automatically collecting semiconductor manufacturing parameters | |
| US6959226B2 (en) | System and method for split lot ID naming | |
| KR102425156B1 (en) | automatic loading warehouse interlocking manufacturing execution system | |
| US8335581B2 (en) | Flexible job preparation and control | |
| CN117836731A (en) | Automated control system and method and chemical industry park | |
| CN116644219A (en) | Method and device for detecting and processing goods delivery abnormality | |
| US20150253764A1 (en) | Monitor data attachment to product lots for batch processes | |
| US7206653B1 (en) | Wafer-based planning methods and systems for batch-based processing tools | |
| Sonar et al. | Automation: Key to cycle time improvement in semiconductor manufacturing | |
| CN103439893B (en) | The reservation of equipment load port uses control method | |
| US20020198617A1 (en) | System and method for controlling priority of lots employed in MES | |
| CN105182916A (en) | Semiconductor production constraint control method | |
| CN104751258A (en) | Product mixed-processing system and product mixed-processing method | |
| CN110391150B (en) | Wafer box monitoring method, wafer box monitoring device and semiconductor processing system | |
| US20220283573A1 (en) | Method for Allocating Resources to Machines of a Production Facility |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |