CN105334995A - Touch panel and manufacturing method therefor - Google Patents
Touch panel and manufacturing method therefor Download PDFInfo
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- CN105334995A CN105334995A CN201410386657.6A CN201410386657A CN105334995A CN 105334995 A CN105334995 A CN 105334995A CN 201410386657 A CN201410386657 A CN 201410386657A CN 105334995 A CN105334995 A CN 105334995A
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Abstract
The invention discloses a touch panel and a manufacturing method therefor. The touch panel comprises a plurality of first electrodes arranged on a substrate, wherein the first electrodes are parallel to one another and extend in a first direction; a conductive photoresist film is arranged on the first electrodes and comprises an insulated photosensitive material layer and a plurality of second electrodes; the second electrodes are parallel to one another and extend in a second direction perpendicular to the first direction; and the insulated photosensitive material layer is arranged between the first electrodes and the second electrodes. In addition, the invention provides a manufacturing method for the touch panel. The method comprises the step of manufacturing the touch panel by using the conductive photoresist film.
Description
Technical field
The present invention relates to contact panel, particularly relate to the electrode pattern design of contact panel, and use contact panel and the manufacture method thereof of the making of conduction photoresist film.
Background technology
Along with the development of electronics industry, various digital product in recent years, other electronic products such as such as mobile phone, panel computer, digital camera have the demand of touch controllable function, use contact panel can provide more convenient and mode of operation fast in these electronic products.Current contact panel take capacitance touching control as major technique, and the stepped construction of capacitance type touch-control panel comprises the first conductive layer, the second conductive layer and the insulation course between the first conductive layer and the second conductive layer usually.
The electrode pattern of the first conductive layer of contact panel normally via deposit transparent conductive layer, and utilizes photoetching and etching process to be formed by pattern for transparent conductive layer.The electrode pattern of the second conductive layer then needs to be formed through another road deposition, photoetching and etching process step, and the insulation course be arranged between the first conductive layer and the second conductive layer also needs to deposit via another road, photoetching and etching process step are formed.
The electrode pattern of the first conductive layer and the second conductive layer adopts the electrode pattern design of rhombus usually, utilize a junction to divide between the rhombus electrode pattern in column with multiple arrangement to be electrically connected multiple being arranged in rows, on the coupling part between rhombus electrode pattern, the staggered place of the first conductive layer and the second conductive layer.
When there is contraposition skew between the first conductive layer adopting rhombus electrode pattern design and the second conductive layer, between the part that the staggered place of the first conductive layer and the second conductive layer can occur in rhombus electrode pattern and coupling part, because after contraposition skew, the overlapping area of the staggered place of the first conductive layer and the second conductive layer can change, and first distance between conductive layer and the rhombus electrode pattern of the second conductive layer also can change, therefore, compared to the capacitance that when contraposition offsets, the rhombus electrode pattern of contact panel produces does not occur, the capacitance that after there is contraposition skew, the rhombus electrode pattern of contact panel produces has very large variation, and then have influence on the touch-control sensitivity of contact panel.
Therefore, the manufacturing process steps of the manufacture of existing capacitance type touch-control panel is complicated, and also needs the contraposition precision of height between the electrode pattern of the first conductive layer and the second conductive layer.
Summary of the invention
The object of the present invention is to provide the electrode pattern design of contact panel, utilize the electrode pattern design of vertical bar shaped, there is contraposition between mutually perpendicular first electrode and the second electrode offset even if allow, also the overlapping area of the staggered place of the first electrode and the second electrode can not be changed, and first the total capacitance value produced between electrode and the second electrode also can not change, the capacitance that the electrode pattern of contact panel is produced can not be subject to the impact of contraposition skew, and then reaches the effect of the touch-control sensitivity improving contact panel.
In addition, a present invention also object is to provide the manufacture method using conduction photoresist film to make contact panel, by using conduction photoresist film, one deck conductive layer of contact panel and the manufacture craft of insulation course can be allowed to combine, reach the effect of the manufacturing process steps simplifying contact panel.
In some embodiments of the invention, provide contact panel, it comprises: multiple first electrode is arranged on substrate, and these first electrodes are parallel to each other and extend along first direction; And conduction photoresist film is arranged at above these first electrodes, conduction photoresist film comprises insulation photosensitive material layer and multiple second electrode, these second electrodes are parallel to each other and extend along second direction, second direction perpendicular to first direction, and insulate photosensitive material layer between these first electrodes and these the second electrodes.
In some embodiments of the invention, also provide the manufacture method of contact panel, the method comprises: form multiple first electrode on substrate, and these first electrodes are parallel to each other and extend along first direction; Be attached at by conduction photoresist film above these first electrodes, conduction photoresist film comprises insulation photosensitive material layer and conductive layer; And by conductive layer pattern, forming multiple second electrode, these second electrodes are parallel to each other and along second direction extension, second direction, perpendicular to first direction, wherein insulate photosensitive material layer between these first electrodes and these the second electrodes.
Accompanying drawing explanation
In order to object of the present invention, feature and advantage can be become apparent, appended accompanying drawing is below coordinated to be described in detail below:
Fig. 1 is the floor map of some embodiments of the present invention, contact panel;
Fig. 2 is some embodiments of the present invention, along the profile line I-I ' of Fig. 1, and the diagrammatic cross-section of contact panel;
Fig. 3 A-Fig. 3 D is some embodiments of the present invention, the floor map in each interstage of the contact panel of shop drawings 2;
Fig. 4 is other embodiments of the present invention, along the profile line I-I ' of Fig. 1, and the outline diagrammatic cross-section of contact panel;
Fig. 5 A-Fig. 5 F is some embodiments of the present invention, the floor map in each interstage of the contact panel of shop drawings 4.
Symbol description
100 ~ contact panel;
100A ~ active region;
100P ~ surrounding zone;
102,118 ~ substrate;
104 ~ the first electrodes;
104D ~ pseudo-first electrode;
The overlapping region of 105 ~ the first electrodes and the second electrode;
106 ~ the second electrodes;
106D ~ pseudo-second electrode;
108 ~ wire;
108P ~ conductive pad;
110 ~ flexible printed wiring board;
111 ~ conductive layer;
112 ~ insulation photosensitive material layer;
The depression of 112U ~ insulation photosensitive material layer;
The opening of 113 ~ insulation photosensitive material layer;
114 ~ protective seam;
116 ~ light shield layer;
120 ~ conduction photoresist film.
Embodiment
Structural design and the manufacture method of some embodiments of contact panel of the present invention are below described in detail in detail, but, be understandable that, inventive concept provided by the invention can be implemented in various background widely, at this specific embodiment discussed only for illustration of the manufacture of some embodiments of the present invention and the ad hoc fashion of use, be not intended to limit scope of the present invention.
As shown in Figure 1, the first electrode 104 that contact panel 100 comprises multiple vertical bar shaped is formed on substrate 102, and these first electrodes 104 are parallel to each other and along first direction, such as Y direction extends.In addition, the second electrode 106 that contact panel 100 also comprises multiple vertical bar shaped is formed at above these first electrodes 104, these second electrodes 106 are parallel to each other and along second direction, and such as X-direction extends, make the second electrode 106 and the first electrode 104 orthogonal.In order to avoid the staggered place of the first electrode 104 and the second electrode 106 is short-circuited, insulation course is provided with between the first electrode 104 and the second electrode 106, this insulation course is insulation photosensitive material layer, insulation photosensitive material layer is formed by conducting electricity photoresist film together with the second electrode 106, do not draw insulation photosensitive material layer in FIG, about the setting of the photosensitive material layer that insulate refers to Fig. 2 and Fig. 4.
As shown in Figure 1, also there is multiple pseudo-first electrode (dummyfirstelectrodes) 104D between the first adjacent electrode 104, the setting of these pseudo-first electrode 104D, although do not provide touch-control effect, but but can increase the sensitivity of touch-control sensing, also can reduce the visual vision taste problem caused of the first electrode 104 shape simultaneously.Similarly, also there is multiple pseudo-second electrode (dummysecondelectrodes) 106D between the second adjacent electrode 106, the setting of these pseudo-second electrode 106D, although do not provide touch-control effect, but but can increase the sensitivity of touch-control sensing, also can reduce the visual vision taste problem caused of the second electrode 106 shape simultaneously.
In addition, contact panel 100 also comprises many wires 108 and is connected to these the first electrode 104 and these second electrodes 106 respectively, and these wires 108 are via conductive pad (conductivepad) 108P and flexible printed wiring board (flexibleprintcircuit; FPC) 110 electrical connections.The region that these first electrodes 104 above-mentioned, pseudo-first electrode 104D, the second electrode 106 and pseudo-second electrode 106D are arranged can be described as active region (activearea) 100A of contact panel 100, and the region that wire 108 and conductive pad 108P are arranged can be described as surrounding zone (peripheralarea) 100P of contact panel 100.
Fig. 2 is according to some embodiments of the present invention, along the profile line I-I ' of Fig. 1, and the diagrammatic cross-section of contact panel 100.First electrode 104 and pseudo-first electrode 104D (not drawing in Fig. 2) are formed on substrate 102, in certain embodiments, first electrode 104 and pseudo-first electrode 104D can by transparent conductive materials, such as indium tin oxide (indiumtinoxide; Or indium-zinc oxide (indiumzincoxide ITO); Etc. IZO) make.In further embodiments, the first electrode 104 and pseudo-first electrode 104D also can be made up of metal wire or metal grill (metalmesh) etc.
Second electrode 106 and pseudo-second electrode 106D are formed in above the first electrode 104, at the second electrode 106, have the photosensitive material layer 112 that insulate between pseudo-second electrode 106D and the first electrode 104, the photosensitive material layer 112 that wherein insulate is in order to open the first electrode 104, pseudo-first electrode 104D and the second electrode 106, pseudo-second electrode 106D insulation gap.According to some embodiments of the present invention, second electrode 106 and pseudo-second electrode 106D and the photosensitive material layer 112 that insulate are made up of conduction photoresist film 120, conduction photoresist film 120 comprises insulation photosensitive material layer 112 and conductive layer 111, the conductive layer 111 of conduction photoresist film 120 is patterned to form the second electrode 106 and pseudo-second electrode 106D in manufacture craft, the insulation photosensitive material layer 112 of photoresist film 120 of conducting electricity then is patterned with respectively by the first electrode 104 and the second electrode 106 in manufacture craft, first electrode 104 and pseudo-second electrode 106D, pseudo-first electrode 104D and the second electrode 106, and pseudo-first electrode 104D and pseudo-second electrode 106D insulation gap.
In certain embodiments, the conductive layer 111 of conduction photoresist film 120 can by transparent conductive material, and such as indium tin oxide (ITO) or indium-zinc oxide (IZO) etc. are made.In addition, the conductive layer 111 of conduction photoresist film 120 also can by CNT (carbonnanotube; CNT), Graphene (graphene), nano-silver thread (Agnanowire; AGNW), metal grill or conducting polymer, such as poly-(3,4-ethylenedioxythiophene) (poly (3,4-ethylenedioxythiophene; PEDOT) make.The insulation photosensitive material layer 112 of conduction photoresist film 120 can be made up of photoresist or insulating gel.In certain embodiments, the thickness h of conduction photoresist film 120 between 1 μm to 15 μm, can be preferably between 2.5 μm to 5 μm.In further embodiments, the thickness h of conduction photoresist film 120 also can have other numerical ranges.
As shown in Figure 1, first electrode 104 of vertical bar shaped is orthogonal with the second electrode 106 of vertical bar shaped, in the staggered place of the first electrode 104 and the second electrode 106, the region 105 that first electrode 104 and the second electrode 106 overlap each other has the shape of rectangle, and under the state offset occurs for these first electrodes 104 and the contraposition of these the second electrodes 106, the area of this overlapping region 105 is constant.
Therefore, via electrode pattern design of the present invention, even if these first electrodes 104 offset with the contraposition of these the second electrodes 106, the total capacitance value produced between first electrode 104 and the second electrode 106 also can not change, that is the capacitance that produces of the electrode pattern of contact panel can not be subject to the impact that the first electrode 104 and the second electrode 106 contraposition offset, and then reach the effect of the touch-control sensitivity improving contact panel.
In some embodiments of the invention, the conductive layer 111 of conduction photoresist film 120 can be made up of nano-silver thread, that is second electrode 106 be made up of nano-silver thread with pseudo-second electrode 106D, the resistance of nano-silver thread be of a size of nonlinear change, when the first electrode 104 is made up of indium tin oxide (ITO), due to indium tin oxide (ITO) resistance be of a size of linear change, in order to the resistance allowing the resistance of thread second electrode 106 of Nano Silver can coordinate the first electrode 104 be made up of indium tin oxide (ITO), and allow the resistance demand that the resistance of the first electrode 104 and the second electrode 106 can coordinate the integrated circuit of contact panel (IC) to drive, the live width of the second electrode 106 needs to be set in a scope according to the thickness h of conduction photoresist film 120, and the area of the first electrode 104 and the second electrode 106 overlapping region 105 is also set in a scope according to this.
In certain embodiments, second electrode 106 is made up of nano-silver thread, first electrode 104 is made up of indium tin oxide (ITO), and under the state that the thickness h of conducting electricity photoresist film 120 is 2.5 μm, the area (can be described as again the node area of a touch control unit) of the first electrode 104 and the second electrode 106 overlapping region 105 can at 0.04mm
2to 0.18mm
2between.
In further embodiments, second electrode 106 is made up of nano-silver thread, first electrode 104 is made up of indium tin oxide (ITO), and conducts electricity the thickness h of photoresist film 120 when being 5 μm, and the area of the first electrode 104 and the second electrode 106 overlapping region 105 can at 0.04mm
2to 0.36mm
2between.In other examples, first electrode 104 and the second electrode 106 can be made up of other materials, and the thickness h of photoresist film 120 of conducting electricity also can be other numerical ranges, therefore, first electrode 104 can be set in other numerical ranges according to these different conditions from the area of the second electrode 106 overlapping region 105, such as: when the thickness h of conduction photoresist film 120 is 1 μm, the area of the first electrode 104 and the second electrode 106 overlapping region 105 can at 0.04mm
2to 0.072mm
2between; When the thickness h of conduction photoresist film 120 is 10 μm, the area of the first electrode 104 and the second electrode 106 overlapping region 105 can at 0.04mm
2to 0.72mm
2between; When the thickness h of conduction photoresist film 120 is 15 μm, the area of the first electrode 104 and the second electrode 106 overlapping region 105 can at 0.04mm
2to 1.08mm
2between.
In the embodiment of fig. 2, second electrode 106 is formed by with manufacturing process steps with pseudo-second electrode 106D and insulation photosensitive material layer 112, expose and lithographic fabrication process via to conduction photoresist film 120, the making of the second electrode 106 and pseudo-second electrode 106D and insulation photosensitive material layer 112 can be completed simultaneously.The second electrode 106 formed via the method, pseudo-second electrode 106D and insulation photosensitive material layer 112 have common inclined side, in other words, conduction photoresist film 120 has inclined side, between this inclined side and the first electrode 104 surface, there is angle theta, the scope of angle theta, usually can by angle theta design between 50 degree to 60 degree between 30 degree to 85 degree.
Because the second electrode 106, pseudo-second electrode 106D and insulation photosensitive material layer 112 are being formed with manufacturing process steps via conduction photoresist film 120, therefore the second electrode 106, pseudo-second electrode 106D are difficult to the side of insulation photosensitive material layer 112 side reaching vertical (90 degree).In addition, when angle theta between the inclined side and the first electrode 104 surface of the second electrode 106, pseudo-second electrode 106D and insulation photosensitive material layer 112 is less than 30 degree, represent that conduction photoresist film 120 there occurs poor visualization problem, this will cause being easy to the problem of being short-circuited between the second electrode 106 and pseudo-second electrode 106D.
In addition, when angle theta between the inclined side and the first electrode 104 surface of the second electrode 106, pseudo-second electrode 106D and insulation photosensitive material layer 112 is greater than 85 degree, represent that conduction photoresist film 120 there occurs overdevelop problem, this will cause the second electrode 106 and pseudo-second electrode 106D to be easy to stripping problem occurs.Therefore, the problems referred to above can be avoided to occur between 30 degree to 85 degree the design of the scope of angle theta.
As shown in Figure 2, have another substrate 118 above substrate 102, in certain embodiments, substrate 102 is flexual plastic substrates, such as polyethylene terephthalate (Polyethyleneterephthalate; PET) substrate, substrate 118 is then as the glass substrate of cover sheet (coverlens), and the inner surface of substrate 118 forms light shield layer 116, and the outer surface of substrate 118 is then as the touch surface of contact panel 100.
Light shield layer 116 is positioned at the surrounding zone 100P of contact panel 100, can cover wire 118 by the setting of light shield layer 116, and the wire 118 avoiding metal material to make produces reflective and affects the outward appearance of contact panel 100.The material of light shield layer 116 can be photoresist or the ink material of black or other colors, by coating and lithographic fabrication process, use black photoresist to make light shield layer 116, or by printing manufacture craft, make light shield layer 116 with colored ink.
In addition, also be formed with protective seam 114 on substrate 102, cover the first electrode 104, pseudo-first electrode 104D (not drawing pseudo-first electrode 104D in Fig. 2), the second electrode 106, pseudo-second electrode 106D, insulation photosensitive material layer 112 and wire 118 all sidedly, in certain embodiments, the material of protective seam 114 can be optical cement (opticalclearadhesive; OCA), substrate 102 and substrate 118 can be bonded together via optical cement.
Fig. 3 A-Fig. 3 D is according to some embodiments of the present invention, the floor map in each interstage of the contact panel 100 of shop drawings 2.As shown in Figure 3A, the first electrode 104 and pseudo-first electrode 104D is formed on substrate 102.In one embodiment, can depositing indium-tin-oxide (ITO) layer on substrate 102, indium tin oxide (ITO) layer forms photoresist oxidant layer, via the photoresist pattern exposed and development manufacture craft is formed and the pattern of the first electrode 104 and pseudo-first electrode 104D is consistent, using photoresist pattern as mask, via etching process by indium tin oxide (ITO) pattern layers, form the first electrode 104 and pseudo-first electrode 104D.
Consult Fig. 3 B, on substrate 102, attach conduction photoresist film 120 to cover the first electrode 104 and pseudo-first electrode 104D, conduction photoresist film 120 now comprises non-patterned conductive layer and is positioned at insulation photosensitive material layer non-patterned below conductive layer.
As shown in Figure 3 C, via exposure and development manufacture craft, by the conductive layer of conduction photoresist film 120 patterning together with insulation photosensitive material layer, wherein conductive layer forms the second electrode 106 and pseudo-second electrode 106D (conductive layer 111 as shown in Figure 2), the photosensitive material layer that simultaneously insulate is formed at the second electrode 106 and the insulation photosensitive material layer between pseudo-second electrode 106D and the first electrode 104 (insulation photosensitive material layer 112 as shown in Figure 2), and this insulation photosensitive material layer 112 has the pattern consistent with the second electrode 106 and pseudo-second electrode 106D.
Consult Fig. 3 D, at the surrounding zone 100P of contact panel 100, form many wires 108 on substrate 102, and be positioned at the conductive pad 108P of these wire 108 ends, these wires 108 are connected with each first electrode 104 and each the second electrode 106 respectively.In one embodiment, via screen painting manufacture craft, silver slurry can be used to print out the pattern of wire 108 and conductive pad 108P, completes the making of wire 108 and conductive pad 108P afterwards through overbaking manufacture craft.In addition, laser-induced thermal etching manufacture craft can also be carried out again, the live width of wire 108 is attenuated.
Fig. 4 is according to other embodiments of the present invention, along the profile line I-I ' of Fig. 1, and the diagrammatic cross-section of contact panel 100.The difference of Fig. 4 and Fig. 2 is to conduct electricity the insulation photosensitive material layer 112 not patterning together with conductive layer 111 of photic resist layer 120, after the conductive layer 111 of the photic resist layer 120 of conduction forms the second electrode 106 and pseudo-second electrode 106D, be positioned at the insulation photosensitive material layer 112 of contact panel 100 active region 100A and non-patterned, but form the insulation photosensitive material layer 112 of the active region 100A covering contact panel 100 all sidedly.
In addition, the part that the insulation photosensitive material layer 112 of photic resist layer 120 of conducting electricity is positioned at contact panel 100 surrounding zone 100P is then removed, and makes insulation photosensitive material layer 112 have the surrounding zone 100P that an opening is formed at contact panel 100.In addition, the wire 108 and the conductive pad 108P that are positioned at contact panel 100 surrounding zone 100P are formed on substrate 102, and are arranged in the opening of insulation photosensitive material layer 112.
As shown in Figure 4, in this embodiment, the insulation photosensitive material layer 112 being positioned at contact panel 100 active region 100A is not patterned, therefore, the structure of the embodiment of Fig. 4 has lower offset compared to the structure of the embodiment of Fig. 2, in certain embodiments, the structure offset d of the embodiment of Fig. 4 is about between 0.4 μm to 0.7 μm, the structure offset of the embodiment of Fig. 2 then equals in fact to conduct electricity the thickness of photic resist layer 120, in one embodiment, is about between 2.5 μm to 5 μm.
Because the structure offset of the embodiment of Fig. 4 is lower, the second electrode 106 of contact panel 100 and the etched mark of pseudo-second electrode 106D therefore can be reduced.In addition, the insulation photosensitive material layer 112 of the embodiment of Fig. 4 covers on first electrode 104 of active region 100A all sidedly, therefore also can avoid being short-circuited between the second electrode 106 and the first electrode 104.
Fig. 5 A-Fig. 5 F shows according to some embodiments of the present invention, the floor map in each interstage of the contact panel 100 of shop drawings 4.As shown in Figure 5A, the first electrode 104 and pseudo-first electrode 104D is formed on substrate 102.In one embodiment, can depositing indium-tin-oxide (ITO) layer on substrate 102, indium tin oxide (ITO) layer forms photoresist oxidant layer, via the photoresist pattern exposed and development manufacture craft is formed and the pattern of the first electrode 104 and pseudo-first electrode 104D is consistent, using photoresist pattern as mask, via etching process by indium tin oxide (ITO) pattern layers, form the first electrode 104 and pseudo-first electrode 104D.
Consult Fig. 5 B, on substrate 102, attach conduction photoresist film 120 to cover the first electrode 104 and pseudo-first electrode 104D, conduction photoresist film 120 now comprises non-patterned conductive layer and is positioned at insulation photosensitive material layer non-patterned below conductive layer.
As shown in Figure 5 C, use the optical mask pattern consistent with the pattern of the second electrode 106 and pseudo-second electrode 106D, exposure manufacture craft is carried out to conduction photoresist film 120, the conductive layer of the conduction photoresist film 120 of unexposed area is divested, form the second electrode 106 and pseudo-second electrode 106D (conductive layer 111 as shown in Figure 4), the insulation photosensitive material layer 112 of photoresist film 120 of conducting electricity then still all is retained on substrate 102.When the conductive layer of conduction photoresist film 120 carries out strip step, be positioned at the insulation photosensitive material layer 112 that conductive layer divests beneath portions, the part insulation photosensitive material on its surface also can be stripped, and forms other depressions in the surface 112U (as shown in Figure 4) slightly lower than insulation photosensitive material layer 112.
Consult Fig. 5 D, partial exposure is carried out to the insulation photosensitive material layer 112 of conduction photoresist film 120, the insulation photosensitive material layer 112 of the active region 100A being positioned at contact panel 100 is all exposed, and the insulation photosensitive material layer 112 being positioned at the surrounding zone 100P of contact panel 100 is not then exposed.
As shown in fig. 5e, development manufacture craft is carried out to the insulation photosensitive material layer 112 of conduction photoresist film 120, unexposed insulation photosensitive material layer 112 is removed after development, forms opening 113 at the surrounding zone 100P of contact panel 100, completes the insulation photosensitive material layer 112 of Fig. 4.
As illustrated in figure 5f, at the surrounding zone 100P of contact panel 100, form many wires 108 and the conductive pad 108P being positioned at these wire 108 ends on substrate 102, these wires 108 and conductive pad 108P are arranged in the opening 113 of insulation photosensitive material layer 112.In one embodiment, via screen painting manufacture craft, silver slurry can be used to print out the pattern of wire 108 and conductive pad 108P, completes the making of wire 108 and conductive pad 108P afterwards through overbaking manufacture craft.In addition, laser-induced thermal etching manufacture craft can also be carried out again, the live width of wire 108 is attenuated.
In certain embodiments, the substrate 102 of contact panel 100 of the present invention can engage with display panel via adhesion layer, and form touch control display apparatus, display panel can be display panels (liquidcrystaldisplay; Or Organic Light Emitting Diode (organiclight-emittingdiode LCD); OLED) display panel.
According to embodiments of the invention, first electrode of contact panel and the second electrode adopt the electrode pattern design of vertical bar shaped, contraposition is there is when offseting between the first electrode and the second electrode, the overlapping region area of the staggered place of the first electrode and the second electrode also can not change, even if therefore there is contraposition skew, the difference of the integral capacitor value of touch control electrode is also little, make the contraposition precision between the first electrode and the second electrode less for the touch-control sensitivity impact of contact panel, the fine ratio of product of contact panel can be promoted.
In addition, according to embodiments of the invention, use conduction photoresist film to make contact panel, one deck electrode pattern of contact panel and the manufacturing process steps of insulation course can be made to combine, reach the effect of the manufacturing process steps simplifying contact panel.
Although disclose the present invention in conjunction with above preferred embodiment, however itself and be not used to limit the present invention, those having an ordinary knowledge in this technical field are when can understand, without departing from the spirit and scope of the present invention, can do a little change and retouching.Therefore, what protection scope of the present invention should define with the claim of enclosing is as the criterion.
Claims (10)
1. a contact panel, comprising:
Substrate;
Multiple first electrode, is arranged on this substrate, those first electrodes parallel to each other and along one first direction extend; And
Conduction photoresist film, be arranged at above those first electrodes, this conduction photoresist film comprises insulation photosensitive material layer and multiple second electrode, those second electrodes parallel to each other and along one second direction extend, this second direction is perpendicular to this first direction, and this insulation photosensitive material layer is between those first electrodes and those the second electrodes.
2. contact panel as claimed in claim 1, wherein this insulation photosensitive material layer has a pattern consistent with those the second electrodes.
3. contact panel as claimed in claim 2, insulation photosensitive material layer wherein respectively between this second electrode and itself and this first electrode has a common inclined side, and the angular range between this common inclined side and this first electrode surface is between 30 degree to 85 degree.
4. contact panel as claimed in claim 1, this insulation photosensitive material layer being wherein positioned at an active region of this contact panel covers this active region of this contact panel all sidedly.
5. contact panel as claimed in claim 4, wherein this insulation photosensitive material layer has an opening, is positioned at a surrounding zone of this contact panel.
6. contact panel as claimed in claim 5, also comprises many wires, is electrically connected to those first electrodes and those second electrodes, and wherein those wires to be arranged on this substrate and to be arranged in this opening of this insulation photosensitive material layer.
7. contact panel as claimed in claim 1, wherein the material of this second electrode is nano-silver thread, and the thickness of this conduction photoresist film is 1 μm to 15 μm.
8. contact panel as claimed in claim 7, wherein the area of those first electrodes and those the second electrode overlapping regions is 0.04mm
2to 1.08mm
2.
9. a manufacture method for contact panel, comprising:
Form multiple first electrode on a substrate, those first electrodes parallel to each other and along one first direction extend;
Be attached at above those first electrodes by a conduction photoresist film, this conduction photoresist film comprises an insulation photosensitive material layer and a conductive layer; And
By this conductive layer pattern, form multiple second electrode, those second electrodes are parallel to each other and along a second direction extension, this second direction is perpendicular to this first direction, and wherein this insulation photosensitive material layer is between those first electrodes and those the second electrodes.
10. the manufacture method of contact panel as claimed in claim 9, also comprise this insulation photosensitive material pattern layers, make this insulation photosensitive material layer have a pattern consistent with those the second electrodes, wherein the patterning step of this conductive layer is carried out via with exposure and development manufacture craft with the patterning step of this insulation photosensitive material layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410386657.6A CN105334995A (en) | 2014-08-07 | 2014-08-07 | Touch panel and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410386657.6A CN105334995A (en) | 2014-08-07 | 2014-08-07 | Touch panel and manufacturing method therefor |
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| Publication Number | Publication Date |
|---|---|
| CN105334995A true CN105334995A (en) | 2016-02-17 |
Family
ID=55285588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410386657.6A Pending CN105334995A (en) | 2014-08-07 | 2014-08-07 | Touch panel and manufacturing method therefor |
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|---|---|
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018205528A1 (en) * | 2017-05-08 | 2018-11-15 | 京东方科技集团股份有限公司 | Thin-film transistor and preparation method therefor, array substrate, and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM408742U (en) * | 2011-03-08 | 2011-08-01 | Dalux Technology Co Ltd | Low impedance electric control circuit structure of touch panel |
| CN103207715A (en) * | 2012-01-11 | 2013-07-17 | 恒颢科技股份有限公司 | Capacitive touch panel and touch display panel |
| CN103376966A (en) * | 2012-04-19 | 2013-10-30 | 乐金显示有限公司 | Electrostatic capacity type touch screen panel for display device and method of manufacturing the same |
-
2014
- 2014-08-07 CN CN201410386657.6A patent/CN105334995A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM408742U (en) * | 2011-03-08 | 2011-08-01 | Dalux Technology Co Ltd | Low impedance electric control circuit structure of touch panel |
| CN103207715A (en) * | 2012-01-11 | 2013-07-17 | 恒颢科技股份有限公司 | Capacitive touch panel and touch display panel |
| CN103376966A (en) * | 2012-04-19 | 2013-10-30 | 乐金显示有限公司 | Electrostatic capacity type touch screen panel for display device and method of manufacturing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018205528A1 (en) * | 2017-05-08 | 2018-11-15 | 京东方科技集团股份有限公司 | Thin-film transistor and preparation method therefor, array substrate, and display device |
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