CN105328561A - Two-sided lapping machine for wafer lapping - Google Patents
Two-sided lapping machine for wafer lapping Download PDFInfo
- Publication number
- CN105328561A CN105328561A CN201510622216.6A CN201510622216A CN105328561A CN 105328561 A CN105328561 A CN 105328561A CN 201510622216 A CN201510622216 A CN 201510622216A CN 105328561 A CN105328561 A CN 105328561A
- Authority
- CN
- China
- Prior art keywords
- lapping
- backing pin
- top lap
- disc
- outer disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to a two-sided lapping machine for wafer lapping. The two-sided lapping machine comprises an outer disc and an upper lapping disc. The upper lapping disc is located at the upper end of the outer disc and can rotate relative to the outer disc. The edge of the upper lapping disc is provided with a first stop pin. The upper end of the outer disc is provided with a second stop pin. The first stop pin is matched with the second stop pin for blocking. Through cooperation of the stop pins between the outer disc and the upper lapping disc, the upper lapping disc and the outer disc rotate at the same speed, so that the upper lapping disc rotates more stably, and the lapping quality of the lapping machine is improved.
Description
Technical field
The present invention relates to a kind of twin grinder for wafer grinding.
Background technology
Usually, in the process of carrying out polishing semiconductor wafer, according to different needs, use twin grinder and single-sided lapping machine to carry out twin grinding and one side grinding respectively.In general, good than single-sided polishing of the flatness of the wafer of twin grinding machining.
Exist in existing twin grinder, top lap and outer disk are separately rotated, and top lap is owing to depositing defect in design, and when rotation, stationarity is poor, and therefore, the wafer surface that tradition grinds out exists irregular radian, easily occurs substandard products.
Summary of the invention
The technical problem to be solved in the present invention is: overcome the deficiencies in the prior art, provides a kind of twin grinder for wafer grinding.
The technical solution adopted for the present invention to solve the technical problems is: a kind of twin grinder for wafer grinding, comprises outer disk and top lap, and described top lap is positioned at outer disk upper end, and top lap and outer disk relatively rotate setting;
The edge of described top lap is provided with the first backing pin, and the upper end of described outer disk is provided with the second backing pin, and described first backing pin and the second backing pin coordinate and stop.
Further, the edge of described top lap is provided with the first pedestal, and described first backing pin is fixedly connected with the first pedestal; The upper end of described outer disk is provided with the second pedestal, and described second backing pin is fixedly connected with the second pedestal.
Further, the top of described top lap is provided with liquid dispersal device, and described liquid dispersal device comprises spill water tank, and water inlet is offered in the upper end of described water tank, and the lower end of described water tank offers some apopores.
The invention has the beneficial effects as follows: rely on outer disk to coordinate with the backing pin between top lap, make top lap and the synchronized rotation of outer disk, thus make the rotation of top lap more steady, improve the Grinding Quality of grinder.
The setting of liquid dispersal device, can add liquid for abrasive disk grinding, be convenient to better grinding.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention is further described.
Fig. 1 is the schematic diagram of grinder of the present invention;
Fig. 2 is the schematic diagram of liquid dispersal device;
Wherein, 1, top lap, 2, outer disk, the 3, first pedestal, the 4, first backing pin, the 5, second pedestal, the 6, second backing pin, 7, liquid dispersal device, 71, water inlet, 72, apopore.
Detailed description of the invention
The present invention is further illustrated by reference to the accompanying drawings now.The schematic diagram that these accompanying drawings are simplification only illustrates basic structure of the present invention in a schematic way, and therefore it only shows the formation relevant with the present invention.
As shown in Fig. 1 Fig. 2, a kind of twin grinder for wafer grinding, comprises outer disk 2 and top lap 1, and top lap 1 is positioned at outer disk 2 upper end, and top lap 1 and outer disk 2 relatively rotate setting; The edge of top lap 1 is provided with the first backing pin 4, and the upper end of outer disk 2 is provided with the second backing pin 6, first backing pin 4 and the second backing pin 6 coordinates stop.
The edge of top lap 1 is provided with the first pedestal 3, first backing pin 4 and is fixedly connected with the first pedestal 3; The upper end of outer disk 2 is provided with the second pedestal 5, second backing pin 6 and is fixedly connected with the second pedestal 5.
Rely on outer disk 2 to coordinate with the backing pin between top lap 1, make top lap 1 and the synchronized rotation of outer disk 2, thus make the rotation of top lap 1 more steady, improve the Grinding Quality of grinder.
The top of top lap 1 is provided with liquid dispersal device 7, and liquid dispersal device 7 comprises spill water tank, and water inlet 71 is offered in the upper end of water tank, and the lower end of water tank offers some apopores 72.
The setting of liquid dispersal device 7, can add liquid for abrasive disk grinding, be convenient to better grinding.
With above-mentioned according to desirable embodiment of the present invention for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this invention technological thought, can carry out various change and amendment completely.The technical scope of this invention is not limited to the content on description, must determine its technical scope according to right.
Claims (3)
1. the twin grinder for wafer grinding, it is characterized in that, comprise outer disk (2) and top lap (1), described top lap (1) is positioned at outer disk (2) upper end, and top lap (1) and outer disk (2) relatively rotate setting;
The edge of described top lap (1) is provided with the first backing pin (4), the upper end of described outer disk (2) is provided with the second backing pin (6), and described first backing pin (4) and the second backing pin (6) coordinate and stop.
2. the twin grinder for wafer grinding according to claim 1, it is characterized in that, the edge of described top lap (1) is provided with the first pedestal (3), and described first backing pin (4) is fixedly connected with the first pedestal (3); The upper end of described outer disk (2) is provided with the second pedestal (5), and described second backing pin (6) is fixedly connected with the second pedestal (5).
3. the twin grinder for wafer grinding according to claim 1, it is characterized in that, the top of described top lap (1) is provided with liquid dispersal device (7), described liquid dispersal device (7) comprises spill water tank, water inlet (71) is offered in the upper end of described water tank, and the lower end of described water tank offers some apopores (72).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510622216.6A CN105328561A (en) | 2015-09-25 | 2015-09-25 | Two-sided lapping machine for wafer lapping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510622216.6A CN105328561A (en) | 2015-09-25 | 2015-09-25 | Two-sided lapping machine for wafer lapping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105328561A true CN105328561A (en) | 2016-02-17 |
Family
ID=55279429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510622216.6A Pending CN105328561A (en) | 2015-09-25 | 2015-09-25 | Two-sided lapping machine for wafer lapping |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105328561A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2944375A (en) * | 1956-10-26 | 1960-07-12 | Lipkins Morton | Lapping machine |
| JP2003285262A (en) * | 2002-03-28 | 2003-10-07 | Shin Etsu Handotai Co Ltd | Duplex polishing apparatus and duplex polishing method for wafer |
| EP1555089A1 (en) * | 2004-01-15 | 2005-07-20 | Fujikoshi Machinery Corporation | Polishing apparatus |
| CN201776693U (en) * | 2010-04-21 | 2011-03-30 | 云南中科鑫圆晶体材料有限公司 | Double-side polisher |
| CN104380439A (en) * | 2012-06-25 | 2015-02-25 | 胜高股份有限公司 | Method for polishing work and work polishing device |
-
2015
- 2015-09-25 CN CN201510622216.6A patent/CN105328561A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2944375A (en) * | 1956-10-26 | 1960-07-12 | Lipkins Morton | Lapping machine |
| JP2003285262A (en) * | 2002-03-28 | 2003-10-07 | Shin Etsu Handotai Co Ltd | Duplex polishing apparatus and duplex polishing method for wafer |
| EP1555089A1 (en) * | 2004-01-15 | 2005-07-20 | Fujikoshi Machinery Corporation | Polishing apparatus |
| CN201776693U (en) * | 2010-04-21 | 2011-03-30 | 云南中科鑫圆晶体材料有限公司 | Double-side polisher |
| CN104380439A (en) * | 2012-06-25 | 2015-02-25 | 胜高股份有限公司 | Method for polishing work and work polishing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160217 |