CN105323944A - Electrostatic protection structure of circuit substrate - Google Patents
Electrostatic protection structure of circuit substrate Download PDFInfo
- Publication number
- CN105323944A CN105323944A CN201410366716.3A CN201410366716A CN105323944A CN 105323944 A CN105323944 A CN 105323944A CN 201410366716 A CN201410366716 A CN 201410366716A CN 105323944 A CN105323944 A CN 105323944A
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- protection structure
- electrostatic protection
- conducting wire
- circuit substrate
- conductive segment
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Abstract
The invention discloses an electrostatic protection structure of a circuit substrate. The circuit substrate possesses a circuit configuration area and a peripheral area. The peripheral area is adjacent to a periphery of the circuit configuration area. The electrostatic protection structure comprises at least one conductive circuit. The conductive circuit is arranged in the peripheral area. The conductive circuit is formed by a plurality of conductive segments. At least one of the conductive segments is in a zigzag shape, a wave shape, a spiral shape or a combined pattern. The electrostatic protection structure possesses several electrostatic discharging paths and a good electrostatic protection effect.
Description
[technical field]
The present invention relates to a kind of electrostatic protection structure, particularly a kind of electrostatic protection structure of circuit substrate.
[background technology]
Electric product all can have the problem of electrostatic, when there is static discharge, generally can produce with spark or electric current, can run through circuit board or dissolve circuit top layer, cause the fault of product, damage time serious.
In addition, along with science and technology constantly progress, various massaging device is constantly weeded out the old and bring forth the new, such as mobile phone, flat computer, ultra-thin notebook computer and satellite navigation etc.Except generally with except keyboard or mouse input or manipulation, touch technology is utilized to be a kind of quite intuition and welcome control mode to manipulate massaging device.Wherein, touch control display apparatus has the input operation interface of hommization and intuitive, makes the user of any age level all can directly choose with finger or pointer or manipulate massaging device.
In known contact panel, be after touch control sensing circuit is set on substrate, then contact panel and display floater are combined into as touch-control display panel.But, on the electrostatic defending of contact panel or touch-control display panel, the general practice is only the protection circuit arranging straight line shape around panel.But this simple design also cannot provide enough electrostatic discharging paths, causes electrostatic usually can wound the internal circuit of panel and cause the fault of product to damage.
[summary of the invention]
The object of the present invention is to provide a kind of electrostatic protection structure of circuit substrate, more electrostatic discharging path can be had and there is preferably electrostatic defending effect.
For reaching above-mentioned purpose, the electrostatic protection structure of a kind of circuit substrate of the present invention.Circuit substrate has a Circnit Layout district and a surrounding zone, and surrounding zone neighbour is located at the periphery in Circnit Layout district.Electrostatic protection structure comprises at least one conducting wire, and conducting wire is arranged on surrounding zone, and conducting wire is made up of multiple conductive segment.Wherein, the pattern of at least one of them conductive segment indentation, wavy, helical form or its combination.
In one embodiment, conducting wire is made up of multiple conductive segment interval.
In one embodiment, the average headway between multiple conductive segment is between 10 microns to 50 microns.
In one embodiment, conductive segment is in turnover continuously, and turnover is made up of straight line, curve or its combination continuously.
In one embodiment, when having multiple conducting wire, the average headway between multiple conducting wire is between 90 microns to 110 microns.
In one embodiment, when having multiple conducting wire, multiple conducting wire is configured in the same layer of surrounding zone.
In one embodiment, when having multiple conducting wire, multiple conducting wire is configured in the different layers of surrounding zone.
In one embodiment, conducting wire and an earth terminal are electrically connected.
In one embodiment, earth terminal position is in circuit substrate, or position is outside circuit substrate.
In one embodiment, circuit substrate is applied in contact panel, display floater or touch-control display panel.
From the above, in the electrostatic protection structure of circuit substrate of the present invention, electrostatic protection structure comprises at least one conducting wire, and conducting wire is arranged on surrounding zone, and conducting wire is made up of multiple conductive segment.Wherein, the pattern of at least one of them conductive segment indentation, wavy, helical form or its combination.Like this, when circuit substrate runs into electrostatic invasion, can pass through indentation, wavy, helical form or its combination the conductive segment of pattern to increase the discharge path of electrostatic, consume electrostatic energy, therefore can prevent extraneous electrostatic from scurrying into the Circnit Layout district of circuit substrate and causing the destruction of its circuit structure, make circuit substrate have preferably electrostatic defending effect.
[accompanying drawing explanation]
Fig. 1 is a kind of circuit substrate of present pre-ferred embodiments and the schematic diagram of electrostatic protection structure thereof.
Fig. 2 A and Fig. 2 B is the schematic diagram that the present invention's difference implements the electrostatic protection structure of aspect respectively.
Fig. 2 C is the enlarged diagram of the region A of Fig. 2 B.
Fig. 2 D is the enlarged diagram of the region A difference enforcement aspect of Fig. 2 B.
Fig. 2 E is another enforcement circuit substrate of aspect and schematic diagram of electrostatic protection structure thereof of the present invention.
Fig. 3 A is in Fig. 1, linearly the cross-sectional schematic of A-A.
Fig. 3 B to Fig. 3 D is the different application schematic diagram of circuit substrate.
[embodiment]
Below with reference to relevant drawings, the electrostatic protection structure of the circuit substrate according to present pre-ferred embodiments is described, wherein identical element is illustrated with identical reference symbol.
Please refer to shown in Fig. 1, it is a kind of circuit substrate 1 of present pre-ferred embodiments and the schematic diagram of electrostatic protection structure 2 thereof.
Circuit substrate 1 has Circnit Layout district 11 and a surrounding zone 12, and surrounding zone 12 neighbour is located at the periphery in Circnit Layout district 11.In the present embodiment, the mid portion of 11, Circnit Layout district at circuit substrate 1, be the region that circuit structure (touch control sensing circuit in such as Fig. 1 Circnit Layout district 11) is arranged, 12, surrounding zone is looped around the periphery in Circnit Layout district 11.Wherein, circuit substrate 1 can be made by light-permeable material, and its material is such as glass, quartz or analog, plastics, rubber, glass fibre or other macromolecular material; Or circuit substrate 1 also can be made by light tight material, such as, be metal-glass fiber composite plate, metal-ceramic composite plate, or printed circuit board (PCB), or other material, the present invention does not limit.
Electrostatic protection structure 2 comprises at least one conducting wire 21, and conducting wire 21 is arranged on surrounding zone 12, and conducting wire 21 is made up of multiple conductive segment.Wherein, conductive segment can be the combination of homogenous material or multiple material, and material such as but not limit be indium tin oxide (indium-tinoxide, ITO), indium-zinc oxide (indium-zincoxide, IZO) or metal (such as aluminum metal, Nai meter Yin) material, the present invention does not limit.At least conductive segment indentation of one of them, the pattern of wavy, helical form or its combination.
In the present embodiment, be for a conducting wire 21.The conducting wire 21 of the present embodiment has two conductive segments 211,212, and conductive segment 211 is connected with conductive segment 212, and multiaspect surrounds Circnit Layout district 11.In the present embodiment, be enclose Circnit Layout district 11 (left side outside Circnit Layout district 11, upside and right side) for three bread.But, in other enforcement aspect, conductive segment 211,212 also can be that two sides surrounds or completely encircle Circnit Layout district 11, and the present invention does not limit.
Wherein, such as but not limit be zigzag, and conductive segment 212 is linearities to conductive segment 211 formed.In other words, the conductive segment 211 of the present embodiment presents continuous print turnover, and these continuous turnovers are made up of straight line, to form zigzag.But, in other enforcement aspect, conductive segment 211 also can be made up of the shape of curve or straight line and curve combination, to form different shapes, and the pattern of such as wavy, helical form or its combination.
In addition, electrostatic protection structure 2 also can comprise an earth terminal (figure do not show), and one end of conducting wire 21 and earth terminal are electrically connected (its other end can ground connection, also can suspension joint).In the present embodiment, be one end ground connection with conductive segment 211.Wherein, earth terminal is configurable in circuit substrate 1 (such as position is in Circnit Layout district 11 or surrounding zone 12), or earth terminal is also configurable on (such as position is on the flexible circuit board be connected with circuit substrate 1) outside circuit substrate 1.In the present embodiment, earth terminal be for circuit substrate 1 outside earth terminal (earth terminal can be electrically connected to the earth terminal of Circuits System again).Be electrically connected by conducting wire 21 and earth terminal, if when having electrostatic contact circuit substrate 1, can pass through conducting wire 21 by electrostatic guide to grounding system.
Therefore, when the circuit substrate 1 of the present embodiment runs into electrostatic invasion, can pass through indentation, wavy, helical form or its combination the conductive segment 211 of pattern to increase the discharge path (discharge path is elongated) of electrostatic, consume electrostatic energy, therefore the electrostatic that can improve the external world is scurried into the Circnit Layout district 11 of circuit substrate 1 and causes circuit structure to be destroyed, and makes circuit substrate 1 have preferably electrostatic defending effect.
In addition, please refer to shown in Fig. 2 A to Fig. 2 C.Wherein, Fig. 2 A and Fig. 2 B is the schematic diagram that the present invention's difference implements electrostatic protection structure 2a, 2b of aspect respectively, and Fig. 2 C is the enlarged diagram of the region A of Fig. 2 B.
As shown in Figure 2 A, main different of electrostatic protection structure 2a and electrostatic protection structure 2 are, the conducting wire 21a of electrostatic protection structure 2a is made up of 3 conductive segments 211a, 212a and 213a, and conductive segment 211a is connected with conductive segment 212a, conductive segment 212a is connected with conductive segment 213a (connecting continuously), and conductive segment 211a, 212a, 213a tri-bread enclose Circnit Layout district 11.Wherein, conductive segment 211a, 212a, 213a respectively indentation, but not as limit, it also can respectively in wavy, helical form or the pattern of its combination.
In addition, as shown in Fig. 2 B and Fig. 2 C, in this enforcement aspect, the conducting wire 21b of electrostatic protection structure 2b is made up of multiple conductive segment 211b ~ 216b interval.Wherein, conductive segment 211b is not connected with conductive segment 212b, and conductive segment 212b is connected with conductive segment 213b, and conductive segment 213b is not connected with conductive segment 214b, and conductive segment 214b is connected with conductive segment 215b, and conductive segment 215b is not connected with conductive segment 216b.Wherein, conductive segment 211b ~ 216b respectively indentation, but also not as limit, it also can in wavy, helical form or the pattern of its combination.But, implementing in aspect at other, also can be that the conductive segment of a part is linearly, the pattern of the conductive segment indentation of another part, wavy, helical form or its combination.
As shown in Figure 2 C, for between conductive segment 213b and conductive segment 214b, conductive segment 213b is not connected with conductive segment 214b, such as, and the average headway d1 between conductive segment 213b and conductive segment 214b can respectively between 10 microns to 50 microns (10 μ m≤d1≤50 μm), be 20 μm.In addition, the average headway between conductive segment 211b and conductive segment 212b and the average headway between conductive segment 215b and conductive segment 216b can respectively between 10 microns to 50 microns.
In addition, the further feature of electrostatic protection structure 2a, 2b with reference to the similar elements of electrostatic protection structure 2, can repeat no more.
Special one carry be, between the conductive segment 213b of the electrostatic protection structure 2b of Fig. 2 C and conductive segment 214b (or between conductive segment 211b and conductive segment 212b, or between conductive segment 215b and conductive segment 216b) interval region that formed constitutes multiple vertical bar and transfer, but, in other enforcement aspect, such as, shown in Fig. 2 D, the interval region formed between two conductive segments 217,218 also can constitute the turnover of multiple sawtooth, or the turnover of other pattern, the present invention does not limit.By the subsection setup of Fig. 2 B to Fig. 2 D, and the interval region formed between two sections also can increase the discharge path of electrostatic, improves the protected effect of electrostatic.
In addition, please refer to shown in Fig. 2 E, it is another enforcement circuit substrate 1c of aspect and schematic diagram of electrostatic protection structure 2c thereof of the present invention.
Be from the circuit substrate 1 of Fig. 1 and main different of electrostatic protection structure 2, the surrounding zone 12c of the circuit substrate 1c of this enforcement aspect has larger space, therefore, electrostatic protection structure 2c is except conducting wire 21, its periphery is also provided with another conducting wire 21c (quantity of conducting wire, depending on the space of surrounding zone, also can arrange the conducting wire of more than two).Wherein, multiple conducting wire 21,21c are configurable on the same layer on the 12c of surrounding zone, or multiple conducting wire 21,21c are also configurable on different layers (the such as upper and lower layer of surrounding zone 12c, and separate with insulating barrier, or be electrically connected with the electric conducting material in insulating barrier), the present invention does not limit.
The conducting wire 21c of the present embodiment is the same with conducting wire 21 has two conductive segments 211c, 212c, and conductive segment 211c is connected with conductive segment 212c.Wherein, conductive segment 211c still indentation, and conductive segment 212c is still the linearity with turnover formed.In addition, the average headway d2 between multiple conducting wire 21,21c between 90 microns to 110 microns (90 μ m≤d2≤110 μm), such as, can be 100 microns.Certainly, if the space of surrounding zone 12c is enough large, its average headway d2 also can be greater than 110 microns.
In addition, other technical characteristic of circuit substrate 1c and electrostatic protection structure 2c thereof can the similar elements of reference circuit substrate 1 and electrostatic protection structure 2 thereof, repeats no more.
One carry, above-mentioned circuit substrate 1 (or 1c) can be applicable on such as contact panel, display floater or touch-control display panel, or also can be applicable on the circuit substrate of other form again.
For contact panel, if during external hanging type (Out-Cell) contact panel, then circuit substrate is such as glass substrate, and circuit structure can be touch control sensing circuit.Therefore, as shown in Figure 3A, it is in Fig. 1, linearly the cross-sectional schematic of A-A.Black matrix" BM can be arranged on the surrounding zone 12 of circuit substrate 1, and position is between conductive segment 212 and circuit substrate 1.Therefore; as shown in Figure 3 B (Fig. 3 B, Fig. 3 C and Fig. 3 D do not show its electrostatic protection structure 2), the circuit substrate (representing with 1d) with electrostatic protection structure 2 can be turned upside down and be combined into display floater 4 as touch-control display panel (cover plate (CoverLens) can be arranged again and protect touch-control display panel).But, when the aspect of OGS formula contact panel, namely the circuit substrate 1d itself with electrostatic protection structure 2 is cover plate (CoverLens), does not need separately to arrange cover plate (CoverLens).
Again as shown in Figure 3 C, when the aspect of externally embedded type (On-Cell) contact panel, circuit substrate 1 is such as the transparent substrates of colored optical filtering substrates, and circuit structure (representing with 3) is touch control sensing circuit, and be formed directly into the outer surface (uper side surface of Fig. 3 B circuit substrate 1) of transparent substrates, and be combined into as touch-control display panel (both can sandwiching liquid crystal layer) with thin film transistor base plate 6.
In addition, when the aspect of embedded (In-Cell) contact panel, as shown in Figure 3 D, circuit substrate 1 is such as the transparent substrates of colored optical filtering substrates, and circuit structure is touch control sensing circuit, and be formed directly into transparent substrates in the face of the side of thin film transistor base plate 6 on the surface; Or circuit substrate 1 also can be the transparent substrates of thin film transistor base plate, and circuit structure is touch control sensing circuit, and be formed directly into the side on the surface (not shown) of transparent substrates in the face of colored optical filtering substrates.
In addition, in other embodiments, circuit substrate 1 is such as the transparent substrates of thin film transistor base plate, and circuit structure is such as display circuit structure (such as film transistor matrix structure), therefore, circuit substrate 1 can be thin film transistor base plate, and is applied in display floater, such as liquid crystal display (LCD) panel or Organic Light Emitting Diode (OLED) display floater.
In sum, in the electrostatic protection structure of circuit substrate of the present invention, electrostatic protection structure comprises at least one conducting wire, and conducting wire is arranged on surrounding zone, and conducting wire is made up of multiple conductive segment.Wherein, the pattern of at least one of them conductive segment indentation, wavy, helical form or its combination.Like this, when circuit substrate runs into electrostatic invasion, can pass through indentation, wavy, helical form or its combination the conductive segment of pattern to increase the discharge path of electrostatic, consume electrostatic energy, therefore can prevent extraneous electrostatic from scurrying into the Circnit Layout district of circuit substrate and causing the destruction of its circuit structure, make circuit substrate have preferably electrostatic defending effect.
The above is only illustrative, instead of restrictive.Anyly do not depart from the spirit and scope of the present invention, and to its equivalent modifications of carrying out or change, all should comprise in the appended claims.
Claims (10)
1. an electrostatic protection structure for circuit substrate, described circuit substrate has a Circnit Layout district and a surrounding zone, and described surrounding zone neighbour is located at the periphery in described Circnit Layout district, and it is characterized in that, described electrostatic protection structure comprises:
At least one conducting wire, is arranged on described surrounding zone, and described conducting wire is made up of multiple conductive segment,
Wherein, the pattern of at least one of them conductive segment indentation, wavy, helical form or its combination.
2. electrostatic protection structure as claimed in claim 1, it is characterized in that, described conducting wire is made up of described multiple conductive segment interval.
3. electrostatic protection structure as claimed in claim 1, it is characterized in that, the average headway between described multiple conductive segment is between 10 microns to 50 microns.
4. electrostatic protection structure as claimed in claim 1, is characterized in that, described conductive segment is in turnover continuously, and described continuous turnover is made up of straight line, curve or its combination.
5. electrostatic protection structure as claimed in claim 1, it is characterized in that, when having multiple conducting wire, the average headway between described multiple conducting wire is between 90 microns to 110 microns.
6. electrostatic protection structure as claimed in claim 1, it is characterized in that, when having multiple conducting wire, described multiple conducting wire is configured in the same layer of described surrounding zone.
7. electrostatic protection structure as claimed in claim 1, it is characterized in that, when having multiple conducting wire, described multiple conducting wire is configured in the different layers of described surrounding zone.
8. electrostatic protection structure as claimed in claim 1, it is characterized in that, described conducting wire and an earth terminal are electrically connected.
9. electrostatic protection structure as claimed in claim 8, it is characterized in that, described earth terminal position is in described circuit substrate, or position is outside described circuit substrate.
10. electrostatic protection structure as claimed in claim 1, it is characterized in that, described circuit substrate is applied in contact panel, display floater or touch-control display panel.
Priority Applications (1)
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CN201410366716.3A CN105323944A (en) | 2014-07-29 | 2014-07-29 | Electrostatic protection structure of circuit substrate |
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CN201410366716.3A CN105323944A (en) | 2014-07-29 | 2014-07-29 | Electrostatic protection structure of circuit substrate |
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Cited By (2)
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CN106055167A (en) * | 2016-07-19 | 2016-10-26 | 深圳市骏达光电股份有限公司 | Conducting film circuit structure and touch screen with conducting film circuit structure |
WO2017215366A1 (en) * | 2016-06-17 | 2017-12-21 | 京东方科技集团股份有限公司 | Circuit substrate, display panel and display device |
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CN101201485A (en) * | 2006-12-15 | 2008-06-18 | 英业达股份有限公司 | Display device |
CN101630078A (en) * | 2008-07-17 | 2010-01-20 | 胜华科技股份有限公司 | Liquid crystal display panel |
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