CN105323700A - Production method of customized ear-plugging earphone - Google Patents
Production method of customized ear-plugging earphone Download PDFInfo
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- CN105323700A CN105323700A CN201510875895.8A CN201510875895A CN105323700A CN 105323700 A CN105323700 A CN 105323700A CN 201510875895 A CN201510875895 A CN 201510875895A CN 105323700 A CN105323700 A CN 105323700A
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- earphone
- customized
- manufacture method
- frequency response
- auricle
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Headphones And Earphones (AREA)
Abstract
The invention provides a production method of a customized ear-plugging earphone. The method comprises the following steps: providing a three-dimensional printing device, a scanning device and an earphone inner shell comprising a loudspeaker, and producing an auricle model, wherein the earphone inner shell comprising the loudspeaker and the auricle model are provided with an equivalent circuit frequency response evaluation model; scanning the auricle model by the scanning device to generate a three-dimensional image; producing an earphone outer shell by the three-dimensional printing device according to the three-dimensional image; connecting the earphone outer shell and the earphone inner shell comprising the loudspeaker to form an earphone; setting a frequency response curve program, and storing the frequency response curve program in the equivalent circuit; and optimizing the frequency response curve program by using a particle swarm optimization algorithm. By means of the method, a customized earphone which can completely fit with the auricle of human ears can be provided, the frequency response characteristic curve can be accurately predicted by adopting the optimization algorithm, the diversified and rapidly-variable consumption market can be satisfied, and the development time and cost of the earphone can be effectively saved.
Description
Technical field
The present invention is applied to electroacoustic techniques field, about the customized In-Ear Headphones manufacture method of one, refers to a kind of its manufacture method of earphone being applicable to different users's auricle and audio frequency hobby especially.
Prior art
Press, at present because science and technology is flourishing and then make various action electronic music apparatus such as intelligent mobile phone and action video-audio playing device constantly release, also extensively used by consumer, therefore most people is at listoning music and when appreciating film, for by external interference or not affecting other people, big city uses earphone.If earphone with Function Classification as wired earphone and wireless headset, supra-aural earphone and headphone is then had with type, in order in response to diversification and fast-changing consumption market, mobile-phone manufacturers constantly must release new product, cause earphone exterior of commodity on the market and of a great variety at present.
And if earphone is with function, divide again the earphone etc. having monophony, multichannel, high frequency, middle bass and noise resistance circuit.Certainly, according to different usefulness and function, its function is also just high by many persons price, thus most consumers when buying earphone big city with economic consideration, first buy the lower earphone of price, more slowly buy more according to self hobby the earphone that function is more, price is higher.
And in the process bought; because not all earphone all can provide consumer to try on and audition; consumer is when choosing earphone; often cannot find most suitable earphone according to the hobby of oneself; can only conjesture with sensation; therefore usually have and bought earphone that just discovery buys and ear is not fitted, worn uncomfortable or occur the unsatisfied situation of earpiece audio, cause consumer to need to spend more expenses to buy the puzzlement of other earphone.
Summary of the invention
The earphone peddled on the market cannot provide the most applicable earphone shortcoming in response to different client is mentioned because above-mentioned, inventor adheres to excelsior kindhearted motivation, a kind of customized In-Ear Headphones manufacture method is proposed, the complete laminating user auricle of energy can be produced, and the In-Ear Headphones of the frequency response characteristic meeting user's hobby is provided.
In order to achieve the above object, the present invention takes following technological means to be reached, wherein, customized In-Ear Headphones manufacture method of the present invention, comprises the following steps: provide a 3 D-printing device, earphone inner casing that one scan device, comprises loud speaker and an equivalent channel frequency response assessment models; Make an auricle model, wherein this comprises the earphone inner casing of loud speaker and this auricle model and has this equivalent channel frequency and respond assessment models; Utilize this scanning means to scan this auricle model and produce a stereo-picture; An earphone cavity body structure parameter is provided to form the design of this stereo-picture; Utilize this 3 D-printing device based on this stereo-image producing one earphone outer covering; The earphone inner casing this earphone outer covering and this being comprised loud speaker is connected formation one earphone; And setting one frequency response curve program, this frequency response curve program storage is in this equivalent electric circuit.
In present pre-ferred embodiments, this scanning means is a 3 D non-contacting type scanner.
In present pre-ferred embodiments, this step: make an auricle model and silicon Li Kang (Silicon) is inserted auricle sizing to obtain this auricle model.
In present pre-ferred embodiments, the method more comprises a step: the external form of repairing this auricle model, produces too much information during to reduce follow up scan.
In present pre-ferred embodiments, this earphone cavity body structure parameter comprises: the length of sound guide tube and diameter in sender, earphone string holes, cavity, this parameter comprising the earphone inner casing position of loud speaker is installed, leakage parameters when adjusting damping value and wear.
In present pre-ferred embodiments, this earphone outer covering inside has accommodation space, in order to the accommodating earphone inner casing comprising loud speaker.
In present pre-ferred embodiments, this earphone outer covering comprises: one first housing; And one second housing, through adhesive material and this first housing phase gluing, this second housing has a voice guide hole.
In present pre-ferred embodiments, the method more comprises a step: utilize a population algorithm to optimize this frequency response curve program.
Accompanying drawing explanation
Fig. 1 is the method flow diagram of the present invention's customized In-Ear Headphones manufacture method one embodiment;
Fig. 2 is the auricle modelling schematic diagram one of the present invention's customized In-Ear Headphones manufacture method one embodiment;
Fig. 3 is the auricle modelling schematic diagram two of the present invention's customized In-Ear Headphones manufacture method one embodiment;
Fig. 4 is the auricle cast trimming schematic diagram of the present invention's customized In-Ear Headphones manufacture method one embodiment;
Fig. 5 is the stereo-image producing schematic diagram of the present invention's customized In-Ear Headphones manufacture method one embodiment;
Fig. 6 A is the stereo-picture design diagram one of the present invention's customized In-Ear Headphones manufacture method one embodiment;
Fig. 6 B is the stereo-picture design diagram two of the present invention's customized In-Ear Headphones manufacture method one embodiment;
Fig. 6 C is that the phone housing of the present invention's customized In-Ear Headphones manufacture method one embodiment makes schematic diagram;
Fig. 7 is that the earphone of the present invention's customized In-Ear Headphones manufacture method one embodiment makes schematic diagram;
Fig. 8 is the frequency response curve program schematic diagram of another embodiment of the customized In-Ear Headphones manufacture method of the present invention;
Fig. 9 is the frequency response curve program optimization schematic diagram of another embodiment of the customized In-Ear Headphones manufacture method of the present invention.
symbol description
13 D-printing device
2 scanning means
21 stereo-pictures
211 first cavitys
212 second cavitys
The 3 earphone inner casings comprising loud speaker
31 equivalent electric circuits
32 transmission lines
40 earphones
4 earphone outer coverings
41 first housings
42 second housings
421 voice guide holes
5 fast shaping materials
51,51 ' auricle model
6 users
91 ~ 98 steps.
Embodiment
For reaching above-mentioned purpose and effect, the technology used in the present invention means and structure, with regard to present pre-ferred embodiments, hereby drawing illustrates that its features and functions is as follows in detail, understand completely in order to do profit, but it is noted that, these contents do not form restriction of the present invention.
Shown in Fig. 1, Fig. 5, Fig. 6 C and Fig. 7, it is the method flow diagram of the present invention's customized In-Ear Headphones manufacture method one embodiment, stereo-image producing schematic diagram, phone housing make schematic diagram and earphone makes schematic diagram.Customized In-Ear Headphones manufacture method, comprises the following steps:
Step 91: provide a 3 D-printing device 1, earphone inner casing that one scan device 2, comprises loud speaker 3 and an equivalent channel frequency response assessment models 31.This 3 D-printing device 1 applies rapid shaping (RapidPrototyping, RP) technology, that is the 3D printing technique be commonly called as, the mode adopting material accurately to pile up stereoscopic image data, namely be piled into face by point, be piled into three-dimensional model by face, be finally made into entity.Rely on this technology can generate very complicated entity, and assisting without the need to mould in shaping process.This scanning means 2 is a 3 D non-contacting type scanner, comprise the earphone inner casing 3 of loud speaker overall with this loud speaker 3 through a transmission line 32 received current signal, and in order to current signal is converted to audio signal.
Step 92: make an auricle model 51.Shown in Fig. 2, Fig. 3 and Fig. 4, it is the auricle modelling schematic diagram one of the present invention's customized In-Ear Headphones manufacture method one embodiment, schematic diagram two and auricle cast trimming schematic diagram.User 6 auricle inserted by the one fast shaping material 5 that will comprise silicon Li Kang (Silicon), such as this fast shaping material 5 is put into a filling device (not shown), and insert this user 6 auricle, and take out with the auricle model 51 obtaining this user after solidifying sizing, wherein this earphone inner casing 3 comprising loud speaker has this equivalent channel frequency with this auricle model 51 and responds assessment models 31.This filling device can be a syringe, but is not limited thereto.In the present embodiment, this fast shaping material 5 solidifies shaping time and is about 4-5 minute.Preferably, roughly can repair the external form of this auricle model 51 ', during to reduce follow up scan, produce too much information.
Step 93: utilize this scanning means 2 to scan this auricle model 51 ' and produce a stereo-picture 21.As shown in Figure 5, this scanning means 2 is utilized to scan with eight visual angles the stereo-picture 21 that this auricle model 51 ' produces human body auricle, in the present embodiment, these eight visual angles are respectively: 0 °, 60 °, 200 °, 280 ° of horizontal view angle with 0 °, 60 °, 200 °, 280 ° of oblique 45 ° of visual angles.
Step 94: provide an earphone cavity body structure parameter (not shown) to form this stereo-picture 21 and design.Shown in Fig. 6 A and Fig. 6 B, it is stereo-picture design diagram one and the schematic diagram two of the present invention's customized In-Ear Headphones manufacture method one embodiment.Utilize an earphone cavity body structure parameter in computer, to form this stereo-picture 21 in conjunction with curve reestablishing software to design, this stereo-picture 21 can comprise one first cavity 211 and one second cavity 212, wherein, this earphone cavity body structure parameter comprises: the length of sound guide tube and diameter in sender, earphone string holes, cavity, this parameter comprising earphone inner casing 3 position of loud speaker is installed, leakage parameters when adjusting damping value and wear etc.
Step 95: utilize this 3 D-printing device 1 to make an earphone outer covering 4 based on this stereo-picture 21.Shown in Fig. 6 C, it is the phone housing making schematic diagram of the present invention's customized In-Ear Headphones manufacture method one embodiment.This first cavity 211 and this second cavity 212 are imported this 3 D-printing device 1, application rapid shaping technique, utilized by this stereo-picture 21 rapid prototyping material such as ABS (AcrylonitrileButadieneStyrene) resin, optic-solidified adhesive or nylon to make this earphone outer covering 4, this earphone outer covering 4 comprises one first housing 41 and one second housing 42.
Step 96: be connected the earphone inner casing 3 that this earphone outer covering 4 and this comprise loud speaker formation one earphone 40.As shown in Figure 7, this second housing 42 has a voice guide hole 421, and this second housing 42 can pass through adhesive material and this first housing 41 phase gluing.After this first housing 41 and this second housing 42 phase gluing, its inside has accommodation space, can comprise the earphone inner casing 3 of loud speaker, and this sender comprising the earphone inner casing 3 of loud speaker is relative with this voice guide hole 421 in order to accommodating this.
Step 97: set a frequency response curve program, this frequency response curve program storage is in this equivalent electric circuit 31.Shown in Fig. 8, it is the frequency response curve program schematic diagram of the present invention's customized In-Ear Headphones manufacture method one embodiment.According to the fancy setting one frequency response curve program of this user, the relation namely between sound pressure levels (soundpressurelevel, SPL) and frequency, to meet the hearing effect that this user likes.
Step 98: utilize population algorithm (ParticleSwarmOptimization, PSO) to optimize this frequency response curve program.Shown in Fig. 9, it is the frequency response curve program optimization schematic diagram of the present invention's customized In-Ear Headphones manufacture method one embodiment.The step of population algorithm is described as follows: the initial group setting up population algorithm based on this frequency response curve program; By the particle initialization of initial group; Calculate the adaptive value of initialization particle; And upgrade the Position And Velocity of each particle.The Position And Velocity of described each particle of population algorithm meeting continuous updating is until this frequency response curve program particle group optimizing completes.
Comprehensively above-mentioned, the customized In-Ear Headphones manufacture method that the present invention proposes can be found out, not only can produce the customized earphone of user's auricle of completely fitting, more can in conjunction with optimization algorithm predict frequency resonse characteristic accurately, meet diversification and fast-changing consumption market, effectively save earphone development time and cost.
Through above-mentioned detailed description, fully showing the progressive that the present invention has enforcement, and be new invention not seen before, meet patent of invention important document completely, files an application in whence in accordance with the law.Only the foregoing is only preferred embodiment of the present invention, when can not in order to limit scope of the invention process, that is the equalization change done according to the scope of the claims of the present invention with modify, all should belong in scope that patent of the present invention contains.
Claims (8)
1. a customized In-Ear Headphones manufacture method, is characterized in that, comprise the following steps:
One 3 D-printing device is provided, earphone inner casing that one scan device, comprises loud speaker and an equivalent channel frequency response assessment models;
Make an auricle model, wherein this comprises the earphone inner casing of loud speaker and this auricle model and has this equivalent channel frequency and respond assessment models;
Utilize this scanning means to scan this auricle model and produce a stereo-picture;
An earphone cavity body structure parameter is provided to form the design of this stereo-picture;
Utilize this 3 D-printing device based on this stereo-image producing one earphone outer covering;
The earphone inner casing this earphone outer covering and this being comprised loud speaker is connected formation one earphone; And
Set a frequency response curve program, this frequency response curve program storage is in this equivalent electric circuit.
2. customized In-Ear Headphones manufacture method as claimed in claim 1, is characterized in that, this scanning means is a 3 D non-contacting type scanner.
3. customized In-Ear Headphones manufacture method as claimed in claim 1, is characterized in that, this step: make an auricle model and silicon Li Kang (Silicon) is inserted auricle sizing to obtain this auricle model.
4. customized In-Ear Headphones manufacture method as claimed in claim 1, it is characterized in that, the method more comprises a step:
Repair the external form of this auricle model, during to reduce follow up scan, produce too much information.
5. customized In-Ear Headphones manufacture method as claimed in claim 1, it is characterized in that, this earphone cavity body structure parameter comprises: the length of sound guide tube and diameter in sender, earphone string holes, cavity, this parameter comprising the earphone inner casing position of loud speaker is installed, leakage parameters when adjusting damping value and wear.
6. customized In-Ear Headphones manufacture method as claimed in claim 1, is characterized in that, this earphone outer covering inside has accommodation space, comprises the earphone inner casing of loud speaker in order to accommodating this.
7. customized In-Ear Headphones manufacture method as claimed in claim 1, it is characterized in that, this earphone outer covering comprises:
One first housing; And
One second housing, through adhesive material and this first housing phase gluing, this second housing has a voice guide hole.
8. customized In-Ear Headphones manufacture method as claimed in claim 1, it is characterized in that, the method more comprises a step:
A population algorithm is utilized to optimize this frequency response curve program.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510875895.8A CN105323700A (en) | 2015-12-02 | 2015-12-02 | Production method of customized ear-plugging earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510875895.8A CN105323700A (en) | 2015-12-02 | 2015-12-02 | Production method of customized ear-plugging earphone |
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| Publication Number | Publication Date |
|---|---|
| CN105323700A true CN105323700A (en) | 2016-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510875895.8A Pending CN105323700A (en) | 2015-12-02 | 2015-12-02 | Production method of customized ear-plugging earphone |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111918164A (en) * | 2020-07-31 | 2020-11-10 | 深圳市豪恩声学股份有限公司 | Manufacturing method of Bluetooth earphone and Bluetooth earphone |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011000375A1 (en) * | 2009-07-02 | 2011-01-06 | Widex A/S | An ear plug with surface electrodes |
| US20130315431A1 (en) * | 2012-05-22 | 2013-11-28 | Shure Acquisition Holdings, Inc. | Earphone assembly |
| CN104008751A (en) * | 2014-06-18 | 2014-08-27 | 周婷婷 | Speaker recognition method based on BP neural network |
| CN104064177A (en) * | 2014-05-05 | 2014-09-24 | 浙江银江研究院有限公司 | Active noise control method based on quantum particle swarm optimization algorithm |
| CN104796806A (en) * | 2014-01-16 | 2015-07-22 | 英塔玛·乔巴尼 | System and method for producing a personalized earphone |
| CN104936054A (en) * | 2015-04-28 | 2015-09-23 | 西安慕声电子科技有限公司 | Modularized profiling earphone and manufacturing method |
-
2015
- 2015-12-02 CN CN201510875895.8A patent/CN105323700A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011000375A1 (en) * | 2009-07-02 | 2011-01-06 | Widex A/S | An ear plug with surface electrodes |
| US20130315431A1 (en) * | 2012-05-22 | 2013-11-28 | Shure Acquisition Holdings, Inc. | Earphone assembly |
| CN104796806A (en) * | 2014-01-16 | 2015-07-22 | 英塔玛·乔巴尼 | System and method for producing a personalized earphone |
| CN104064177A (en) * | 2014-05-05 | 2014-09-24 | 浙江银江研究院有限公司 | Active noise control method based on quantum particle swarm optimization algorithm |
| CN104008751A (en) * | 2014-06-18 | 2014-08-27 | 周婷婷 | Speaker recognition method based on BP neural network |
| CN104936054A (en) * | 2015-04-28 | 2015-09-23 | 西安慕声电子科技有限公司 | Modularized profiling earphone and manufacturing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111918164A (en) * | 2020-07-31 | 2020-11-10 | 深圳市豪恩声学股份有限公司 | Manufacturing method of Bluetooth earphone and Bluetooth earphone |
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Application publication date: 20160210 |