CN105313412A - High puncture resistant polyamide film - Google Patents
High puncture resistant polyamide film Download PDFInfo
- Publication number
- CN105313412A CN105313412A CN201410363455.XA CN201410363455A CN105313412A CN 105313412 A CN105313412 A CN 105313412A CN 201410363455 A CN201410363455 A CN 201410363455A CN 105313412 A CN105313412 A CN 105313412A
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- CN
- China
- Prior art keywords
- rete
- tie
- film
- resistance
- height
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The present invention discloses a high puncture resistant polyamide film. The film is structurally formed by compounding 7 layers of composite materials which sequentially comprise a VMDPE film layer 1, a TIE film layer 2, a PA film layer 3, a TIE film layer 2, a TPP film layer 4, a TIE film layer 2, and a GEVA film layer 5 from outside to inside. The high puncture resistant polyamide film disclosed by the present invention has the beneficial effects of simple structure and high practicability.
Description
Technical field
The present invention relates to packaging material application, particularly the anti-puncture film of the resistance to height of a kind of polyamide.
Background technology
The anti-puncture film of resistance to height is used in the packaging of bone class herding product mostly, and the anti-puncture film ubiquity of resistance to height of at present circulation easily absorbs water the problem such as to make moist, production cost is high.
Summary of the invention
The object of the invention is to solve the problem, devising the anti-puncture film of the resistance to height of a kind of polyamide.
Realizing above-mentioned purpose technical scheme of the present invention is, the anti-puncture film of a kind of resistance to height of polyamide, the structure of this packaging film is composited by 7 layers of composite, described 7 layers of composite comprise VMDPE rete 1, TIE rete 2, PA rete 3, TIE rete 2, TPP rete 4, TIE rete 2 and GEVA rete 5 from outside to inside successively.
Described VMDPE rete 1 is modified polyolefin resin.
Described TPP rete 4 is multi-component copolymer allyl resin.
Described TIE rete 2 is the extremely strong adhesive of bonding force.
The anti-puncture film of the resistance to height of the polyamide utilizing technical scheme of the present invention to make, beneficial effect not easily absorbs water to make moist, and production cost is lower.
Accompanying drawing explanation
Fig. 1 is the structural representation of the anti-puncture film of the resistance to height of polyamide of the present invention;
In figure, 1, VMDPE rete; 2, TIE rete; 3, PA rete; 4, TPP rete; 5, GEVA rete.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is specifically described, as the structural representation that Fig. 1 is the anti-puncture film of the resistance to height of polyamide of the present invention, the anti-puncture film of a kind of resistance to height of polyamide, the structure of this packaging film is composited by 7 layers of composite, described 7 layers of composite comprise VMDPE rete from outside to inside successively, TIE rete, PA rete, TIE rete, TPP rete, TIE rete and GEVA rete; Described VMDPE rete is modified polyolefin resin; Described TPP rete is multi-component copolymer allyl resin; Described TIE rete is the extremely strong adhesive of bonding force.
The feature of the present embodiment is, the structure of this packaging film is composited by 5 layers of composite, and described 7 layers of composite comprise VMDPE rete from outside to inside successively, TIE rete, PA rete, TIE rete, TPP rete, TIE rete and GEVA rete.VMDPE rete has good shrinkage, play envelope temperature low, heat seal strength is high, antipollution heat sealability is good, puncture resistance and impact strength excellence, there is good optical property, fineness and brightness are all higher, TIE rete improves the toughness of packaging film, strengthen bonding adhesive attraction, PA rete is wear-resisting, tough, OTR oxygen transmission rate is low, fungi-proofing chemical reagent coating has efficient antibacterial effect, TPP layer has heat-resisting quantity, reduce envelope temperature, heat-sealing firmness is not affected when there being dirt yet, improve the surface smoothness of goods, brightness and transparency, convergent force and shrinkage factor are improved, toughness and pliability are changed, GEVA rete cold resistance is better, there is higher transparency, heat seal strength is higher, low temperature contractibility is better.
Technique scheme only embodies the optimal technical scheme of technical solution of the present invention, and those skilled in the art all embody principle of the present invention to some variations that wherein some part may be made, and belong within protection scope of the present invention.
Claims (4)
1. the anti-puncture film of the resistance to height of polyamide, the structure of this packaging film is composited by 7 layers of composite, it is characterized in that, described 7 layers of composite comprise VMDPE rete (1) from outside to inside successively, TIE rete (2), PA rete (3), TIE rete (2), TPP rete (4), TIE rete (2) and GEVA rete (5).
2. the anti-puncture film of the resistance to height of polyamide according to claim 1, is characterized in that, described VMDPE rete (1) is modified polyolefin resin.
3. the anti-puncture film of the resistance to height of polyamide according to claim 1, is characterized in that, described TPP rete (4) is multi-component copolymer allyl resin.
4. the anti-puncture film of the resistance to height of polyamide according to claim 1, is characterized in that, described TIE rete (2) is the extremely strong adhesive of bonding force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410363455.XA CN105313412A (en) | 2014-07-25 | 2014-07-25 | High puncture resistant polyamide film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410363455.XA CN105313412A (en) | 2014-07-25 | 2014-07-25 | High puncture resistant polyamide film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105313412A true CN105313412A (en) | 2016-02-10 |
Family
ID=55242186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410363455.XA Pending CN105313412A (en) | 2014-07-25 | 2014-07-25 | High puncture resistant polyamide film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105313412A (en) |
-
2014
- 2014-07-25 CN CN201410363455.XA patent/CN105313412A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160210 |