CN105294079A - High-thermal-conductivity ceramic material and manufacturing method thereof - Google Patents

High-thermal-conductivity ceramic material and manufacturing method thereof Download PDF

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Publication number
CN105294079A
CN105294079A CN201510703831.XA CN201510703831A CN105294079A CN 105294079 A CN105294079 A CN 105294079A CN 201510703831 A CN201510703831 A CN 201510703831A CN 105294079 A CN105294079 A CN 105294079A
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China
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ceramic material
heat
aluminum oxide
mixed powder
conductivity ceramic
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CN201510703831.XA
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张甘霖
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Xining Ke Jin Industrial Design Co Ltd
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Xining Ke Jin Industrial Design Co Ltd
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Priority to CN201510703831.XA priority Critical patent/CN105294079A/en
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Abstract

The invention discloses a high-thermal-conductivity ceramic material. The material is formed in the mode that mixed alumina and aluminum nitride powder is formed and then sintered. The invention further discloses a manufacturing method of the high-thermal-conductivity ceramic material. The method includes the steps that a gray blank formed after the mixed alumina and aluminum nitride powder is formed is placed in a high-temperature furnace, heat preservation is performed for a preset period of time under the protective atmosphere, then sintering is performed, and the mixed alumina and aluminum nitride powder is obtained in the mode that nano alumina powder and carbon powder are mixed and then carbonized and oxidized. The manufacturing method of the high-thermal-conductivity ceramic material is simple, raw materials are easy to obtain, and technological cost is low. The thermal conductivity of the alumina-aluminum nitride compound ceramic prepared through the method is higher than 30 W/(m*K) and is higher than that of pure alumina ceramic.

Description

A kind of high-heat-conductivity ceramic material and manufacture method thereof
Technical field
The present invention relates to high heat-conducting ceramic field, relate to a kind of high-heat-conductivity ceramic material and manufacture method thereof specifically.
Background technology
LED illumination is day by day universal, and the light efficiency of LED lamp also rises year by year.In recent years, LED illumination is used widely at interior lighting, commercial illumination, street lamp, Landscape Lighting etc.Compare traditional lighting as incandescent light, fluorescent lamp etc., LED illumination has the advantages such as light efficiency is high, life-span length, environmental protection.But due to a variety of causes, the light efficiency of current LED also has obvious gap from its theoretical value, causes it to have a large amount of electric energy conversions to become heat energy when lighting.If these a large amount of heats can not leave timely and effectively, the life-span of LED lamp will be had influence on.Baseplate material has material impact to LED lamp heat radiation.The baseplate material of current main flow is aluminium base.This substrate has good thermal conductivity.But meanwhile, aluminium is heated and easily expands, thus the gold thread be communicated with for realizing LED electrical may be caused to come off, thus have influence on the life-span of LED lamp, particularly high-power LED light fixture.
For the gold thread avoiding baseplate material expanded by heating to cause comes off, people adopt ceramic substrate as the pottery such as aluminum oxide, aluminium nitride in great power LED.Opposing metallic aluminium, the stupalith coefficient of expansion is little.But the heat conductivility of alumina-ceramic is poor, be unfavorable for the heat radiation of LED chip, the life-span of LED lamp can be had a strong impact on equally.And though aluminium nitride ceramics has very high thermal conductivity, but it is with high costs, is not suitable for scale operation and application, and particularly LED product take price as the market of guiding at present.Therefore, a kind ofly can balance that heat conduction is higher, the coefficient of expansion is less and the low high baseplate material of cost is current LED illumination product, particularly high-power product is badly in need of.The composite ceramic material of aluminum oxide and aluminium nitride has good thermal conductivity.But, prepare this matrix material and need highly purified aluminum oxide and aluminium nitride powder, particularly high purity silicon nitride aluminium powder body, not only expensive, also need import.
Summary of the invention
The object of the invention is to solve by a kind of mode of lower cost the problem that the LED illumination baseplate material coefficient of expansion is large or thermal conductivity is low, providing a kind of cost rationally to have the high-heat-conductivity ceramic material as baseplate material and the manufacture method thereof of good thermal conductivity and lower thermal expansivity.
In order to realize above-mentioned object, present invention employs following technical scheme:
A kind of high-heat-conductivity ceramic material, is formed by the shaping rear sintering of mixed powder of aluminum oxide and aluminium nitride.
Wherein, described alumina powder jointed grain diameter is 100nm-500nm, preferably 100nm-500nm.
Wherein, described carbon dust powder granule particle diameter is 50nm-200nm, preferably 50nm-100nm.
Wherein, described aluminum oxide and carbon dust mixed powder are by above-mentioned aluminum oxide and carbon dust being mixed by a certain percentage.In described mixed powder, the mass percent of carbon dust is for being 4%-6%, preferably 5%-6%.
Wherein, the carbonization of described mixed powder oxidation is in the high pure nitrogen of flowing, 1100 DEG C-1500 DEG C insulations after 4-6 hour, obtains the mixed powder of aluminum oxide containing carbon of having a surplus and aluminium nitride.
Wherein, the described aluminum oxide containing carbon of having a surplus and the mixed powder of aluminium nitride are heated to 500 DEG C-700 DEG C in atmosphere and are incubated 3-5 hour, obtain the mixed powder of carbon-free aluminum oxide and aluminium nitride.
Another object of the present invention is to the manufacture method that a kind of high-heat-conductivity ceramic material is provided; comprise and the plain embryo after shaping for the mixed powder of aluminum oxide and aluminium nitride is placed in High Temperature Furnaces Heating Apparatus; under protective atmosphere, be incubated scheduled time sintering form, after described aluminum oxide and the mixed powder of aluminium nitride are mixed by nano alumina powder jointed and carbon dust, carbonization is oxidized and forms.
Wherein, by carbon-free aluminum oxide and aluminium nitride mixing moulding mode be one in dry-pressing formed, isostatic pressing, casting.
Wherein, the described holding temperature under protective atmosphere is 1000-1500 DEG C.Sinter rear naturally cooling.Described protective atmosphere is nitrogen or rare gas element, preferably nitrogen.
Wherein, the described holding temperature under protective atmosphere is 1000-1500 DEG C, preferably 1300-1500 DEG C.
Wherein, the described scheduled time of insulation is 4-20 hour, preferably 5-10 hour.
Method of the present invention is simple and easy, and raw material is easy to get, and process costs is low.By aluminum oxide-Aluminum nitride composite ceramic that the method is prepared, there is the thermal conductivity higher than 30W/ (mK), higher than pure alumina pottery.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Embodiment 1
The carbon be the alumina powder jointed of 100nm by particle diameter being 100nm with particle diameter mixes, and wherein the mass percent of carbon dust is 4%.Obtained mixed powder is incubated 4 hours at 1200 DEG C in flowing nitrogen, must containing the aluminum oxide of carbon of having a surplus and aluminium nitride mixed powder.This mixed powder is incubated 5 hours in the air of 500 DEG C, obtains the mixed powder of aluminum oxide and aluminium nitride.By dry-pressing formed for this mixed powder, obtain plain embryo.By plain embryo as in the High Temperature Furnaces Heating Apparatus of nitrogen protection, at 1200 DEG C of sintering after 6 hours, naturally cooling, obtains sample finally.Through surveying, it is 40W/ (mK) that this sample obtains thermal conductivity.
Embodiment 2
The carbon be the alumina powder jointed of 200nm by particle diameter being 100nm with particle diameter mixes, and wherein the mass percent of carbon dust is 5%.Obtained mixed powder is incubated 6 hours at 1100 DEG C in flowing nitrogen, must containing the aluminum oxide of carbon of having a surplus and aluminium nitride mixed powder.This mixed powder is incubated 4 hours in the air of 550 DEG C, obtains the mixed powder of aluminum oxide and aluminium nitride.By dry-pressing formed for this mixed powder, obtain plain embryo.By plain embryo as in the High Temperature Furnaces Heating Apparatus of nitrogen protection, at 1300 DEG C of sintering after 5 hours, naturally cooling, obtains sample finally.Through surveying, it is 42.3W/ (mK) that this sample obtains thermal conductivity.
Embodiment 3
The carbon be the alumina powder jointed of 300nm by particle diameter being 100nm with particle diameter mixes, and wherein the mass percent of carbon dust is 6%.Obtained mixed powder is incubated 4 hours at 1300 DEG C in flowing nitrogen, must containing the aluminum oxide of carbon of having a surplus and aluminium nitride mixed powder.This mixed powder is incubated 4 hours in the air of 60 DEG C, obtains the mixed powder of aluminum oxide and aluminium nitride.By this mixed powder isostatic pressing, obtain plain embryo.By plain embryo as in the High Temperature Furnaces Heating Apparatus of nitrogen protection, at 1300 DEG C of sintering after 6 hours, naturally cooling, obtains sample finally.Through surveying, it is 45.1W/ (mK) that this sample obtains thermal conductivity.
The above is only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection domain of the application.

Claims (10)

1. a high-heat-conductivity ceramic material, is characterized in that, is formed by the shaping rear sintering of mixed powder of aluminum oxide and aluminium nitride.
2. high-heat-conductivity ceramic material according to claim 1, is characterized in that, after described aluminum oxide and the mixed powder of aluminium nitride are mixed by nano alumina powder jointed and carbon dust, carbonization is oxidized and forms.
3. high-heat-conductivity ceramic material according to claim 2, is characterized in that, the mass percent of described carbon dust is 4%-6%.
4. high-heat-conductivity ceramic material according to claim 3, is characterized in that, the mass percent of described carbon dust is 5%-6%.
5. high-heat-conductivity ceramic material according to claim 2, is characterized in that, the condition of described carbonization oxidation to be included in flowing nitrogen at 1100 DEG C-1500 DEG C insulation 4-6 hour, obtains the mixed powder of aluminum oxide containing carbon of having a surplus and aluminium nitride.
6. high-heat-conductivity ceramic material according to claim 5, it is characterized in that, the described aluminum oxide containing carbon of having a surplus and the mixed powder of aluminium nitride are heated to 500 DEG C-700 DEG C in atmosphere and are incubated 3-5 hour, obtain the mixed powder of carbon-free described aluminum oxide and aluminium nitride.
7. the manufacture method of a high-heat-conductivity ceramic material; it is characterized in that; comprise and the plain embryo after shaping for the mixed powder of aluminum oxide and aluminium nitride is placed in High Temperature Furnaces Heating Apparatus; under protective atmosphere, be incubated scheduled time sintering form, after described aluminum oxide and the mixed powder of aluminium nitride are mixed by nano alumina powder jointed and carbon dust, carbonization is oxidized and forms.
8. the manufacture method of high-heat-conductivity ceramic material according to claim 7, is characterized in that, the molding mode of described aluminum oxide and the mixed powder of aluminium nitride is the one in dry-pressing formed, isostatic pressing, casting.
9. the manufacture method of high-heat-conductivity ceramic material according to claim 7, is characterized in that, the described holding temperature under protective atmosphere is 1000-1500 DEG C.
10. the manufacture method of high-heat-conductivity ceramic material according to claim 7, is characterized in that, the described scheduled time of insulation is 4-20 hour.
CN201510703831.XA 2015-10-26 2015-10-26 High-thermal-conductivity ceramic material and manufacturing method thereof Pending CN105294079A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017079877A1 (en) * 2015-11-09 2017-05-18 深圳市博世知识产权运营有限公司 Ceramic material with high thermal conductivity and preparation method therefor
CN107318179A (en) * 2017-07-20 2017-11-03 湖北国瓷科技有限公司 A kind of method that toughened aluminum oxide makes high temperature co-firing heat-generating pipe
CN110467443A (en) * 2019-09-19 2019-11-19 广东工业大学 A kind of aluminium nitride/Toughened Alumina Ceramics and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103435334A (en) * 2013-08-12 2013-12-11 唐山市科硕特种陶瓷制造有限公司 Composite ceramic material for LED energy-saving lamp base

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103435334A (en) * 2013-08-12 2013-12-11 唐山市科硕特种陶瓷制造有限公司 Composite ceramic material for LED energy-saving lamp base

Non-Patent Citations (2)

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Title
王杰等: "氮化铝陶瓷粉体制备方法研究进展及展望", 《硅酸盐通报》 *
秦明礼等: "氮化铝陶瓷研究和发展", 《稀有金属材料与工程》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017079877A1 (en) * 2015-11-09 2017-05-18 深圳市博世知识产权运营有限公司 Ceramic material with high thermal conductivity and preparation method therefor
CN107318179A (en) * 2017-07-20 2017-11-03 湖北国瓷科技有限公司 A kind of method that toughened aluminum oxide makes high temperature co-firing heat-generating pipe
CN110467443A (en) * 2019-09-19 2019-11-19 广东工业大学 A kind of aluminium nitride/Toughened Alumina Ceramics and preparation method thereof

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