CN105287047B - The sealing structure of built-in type device and its manufacture method - Google Patents
The sealing structure of built-in type device and its manufacture method Download PDFInfo
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- CN105287047B CN105287047B CN201510737633.5A CN201510737633A CN105287047B CN 105287047 B CN105287047 B CN 105287047B CN 201510737633 A CN201510737633 A CN 201510737633A CN 105287047 B CN105287047 B CN 105287047B
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/02—Prostheses implantable into the body
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/36046—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation of the eye
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3758—Packaging of the components within the casing
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- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Neurology (AREA)
- Neurosurgery (AREA)
- Cardiology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Transplantation (AREA)
- Heart & Thoracic Surgery (AREA)
- Vascular Medicine (AREA)
- Ophthalmology & Optometry (AREA)
- Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Prostheses (AREA)
Abstract
The present invention provides a kind of sealing structure of built-in type device and its manufacture method, and this sealing structure includes：Ceramic bases, it has upper and lower surface, and is formed with one or more through hole of insertion upper surface and lower surface；Metal column, it fills through hole, in the contact interface of metal column and ceramic bases, is formed with concaveconvex structure.In the sealing structure of built-in type device involved in the present invention, it is formed with concaveconvex structure in the contact interface of metal column and ceramic bases, thus, it is possible to improve the contact area of metal column and ceramic bases.Therefore, for the through hole constant compared to the radius of prior art, moisture, gas or other compositions can be more efficiently suppressed to leak into outside sealing structure along the contact interface of metal column and ceramic bases, thus, it is possible to improve the air-tightness of sealing structure.
Description
Technical field
The present invention relates to the sealing structure of built-in type device and its manufacture method.
Background technology
At present, built-in type device has been widely used for recovering body function, improves quality of life or save life etc.
Various aspects.Such built-in type device for example includes being implanted into internal cardiac pacemaker, deep brain stimulator, artificial ear
Snail, artificial retina etc..
Because built-in type device needs to implant and retain for a long time in vivo, therefore it is implanted to internal implanted device
Part needs to face internal complex physiologic environment, and this physiological environment condition is often harsh, and built-in type device has after being chronically implanted
May interact with surrounding tissue and organ, the material of such as built-in type device can occur aging, degraded, cracking, crosslinked again
React Deng physically or chemically, thus implantation object is adversely affected for example causing the bad biological respinse such as inflammation.Therefore, right
For built-in type device, biological safety, the requirement being chronically implanted reliability etc. are all very high.Generally, in order to ensure implantation
The biological safety of formula device, it is chronically implanted reliability etc., on the one hand need with biological safety and to be chronically implanted reliability good
Good seal casinghousing by the abiotic security component in built-in type device such as silicon base chip, printed circuit board (PCB) (PCB) etc. with
Implanted position (such as blood, tissue or skeleton) isolation；On the other hand in addition it is also necessary to from this seal casinghousing draw for example with stimulation
Part carries out the function wire of signal interaction.
In view of the biological safety of built-in type device, seal casinghousing is usually with the good glass of biological safety, pottery
Deng as substrate (substrate), and formed close by good metal cap body of biological safety etc. is covered on substrate
Seal structure.In such sealing structure, substrate generally has multiple through holes (via), is filled with metal and leads in these through holes
Road (feedthrough).In addition, be encapsulated in electronic unit within this seal casinghousing via these metal passages with outside
Carry out signal interaction.
Content of the invention
In the sealing structure of existing built-in type device, generally bore in ceramic green sheet as substrate etc. and open (drill)
Multiple cylindrical holes, then insert the metal column (such as platinum post) with through-hole diameter substantially adaptation in these through holes,
Then it is sintered in the case that metal column is contacted with the through hole of ceramic green sheet, make the cylinder of metal column and ceramic green sheet
Shape through hole fits tightly and forms the ceramic bases with metal column.Then, ceramic bases are welded with metal-back, thus will make pottery
Porcelain substrate and metal-back fit together and form sealing structure.
However, in the sealing structure of existing built-in type device, make use of metal and the contraction or expansion of pottery to carry out shape
One-tenth metal column is fitted tightly with the through hole of ceramic bases.In this case, due to the sintering in metal column and ceramic bases
During (burn altogether) is processed, the ceramic green sheet as ceramic bases is often heated inequality and causes metal column in each through hole
Contraction or expansion degree is different, as a result, metal column is bad with the stickiness of the through hole of ceramic green sheet, leads to existing sealing structure
Air-tightness not good.
The present inventor etc. thinks after long-term practical experience, the bad master of air-tightness of above-mentioned existing sealing structure
It is, the thermal coefficient of expansion (CTE of the metal column in ceramic green sheet and the through hole being filled in this ceramic green sheet：
Coefficient of thermal expansion) and incomplete same, it is not easy to find the ceramic green sheet of CTE coupling completely
And metal column, therefore, in this case, after ceramic green sheet being sintered together with metal column using above-mentioned existing technique, gold
Belong to how many posts occurs, with the through hole of ceramic green sheet, untight problem of fitting, lead to the air-tightness of sealing structure not good.
The present invention completes in view of the situation of above-mentioned prior art, and its object is to offer one kind being capable of improve the air-tightness
The sealing structure of built-in type device of energy and its manufacture method.
An aspect of of the present present invention is related to the sealing structure of built-in type device, and it includes：Ceramic bases, its have upper surface and
Lower surface, and it is formed with the more than one through hole of insertion upper surface and lower surface；Metal column, it fills through hole, in metal
The contact interface with ceramic bases of post, is formed with concaveconvex structure.
In the sealing structure of built-in type device involved in the present invention, in the contact interface of metal column and ceramic bases,
It is formed with concaveconvex structure, thus, it is possible to improve the contact area of metal column and ceramic bases.Therefore, compared to the half of prior art
For the constant through hole in footpath, can more efficiently suppress moisture, gas or other compositions along metal column and ceramic bases
Contact interface and leak into outside sealing structure, thus, it is possible to improving the biological safety of sealing structure and being chronically implanted reliability
Property.
In addition, in the sealing structure of built-in type device involved in the present invention, alternatively, ceramic bases are by more than 99%
Aluminium oxide constitute.In this case, the biological safety of ceramic bases and the air-tightness of sealing structure that formed be more preferably.
In addition, in the sealing structure of built-in type device involved in the present invention, alternatively, the thickness of ceramic bases is
More than 0.25mm and below 0.75mm.
In addition, in the sealing structure of built-in type device involved in the present invention, alternatively, metal column by selected from platinum, iridium,
At least one composition in niobium, tantalum or gold.
Additionally, in the sealing structure of built-in type device involved in the present invention, alternatively, through hole is straight in upper surface
Footpath is more than 0.1mm and below 0.5mm.
The manufacture method of the sealing structure of the built-in type device that another aspect of the present invention is related to, it comprises the steps：
Preparation metal column, and the part in metal column, the length direction along metal column is formed with concaveconvex structure；Metal column is inserted
Enter ceramic paste, and the formation of ceramic paste covering metal column has a part for concaveconvex structure；Ceramic paste is compressing,
Form ceramic green sheet；And metal column is sintered together with ceramic green sheet, is consequently formed the ceramic bases with metal column.
In the manufacture method of the sealing structure of built-in type device involved in the present invention, due in metal column and ceramic base
The contact interface at bottom forms concaveconvex structure, therefore, for the through hole being not changed in compared to the radius of prior art, can be more
Suppression moisture, gas or other compositions leak into outside sealing structure along the contact interface of metal column and ceramic bases effectively
Portion, thus, it is possible to improving the biological safety of sealing structure and being chronically implanted reliability.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, ceramic bases
It is made up of more than 99% aluminium oxide.In this case, the biological safety of made ceramic bases is close with formed
The air-tightness of seal structure is more preferably.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, ceramic bases
Thickness be more than 0.25mm and below 0.75mm.
In addition, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, metal column by
At least one composition in platinum, iridium, niobium, tantalum or gold.Thereby, it is possible to obtain air-tightness better seal structure.
Additionally, in the manufacture method of the sealing structure of built-in type device involved in the present invention, alternatively, through hole
A diameter of more than 0.1mm of the upper surface of ceramic bases and below 0.5mm.
Sealing structure according to built-in type device involved in the present invention and its manufacture method, using the teaching of the invention it is possible to provide air-tightness obtains
Sealing structure to the built-in type device improving.
Brief description
Fig. 1 shows the stereochemical structure of the sealing structure of the built-in type device involved by the first embodiment of the present invention
Figure.
Fig. 2 shows the schematic internal view of the sealing structure of the built-in type device shown in Fig. 1.
Fig. 3 shows the plane graph of the ceramic bases of the sealing structure of the built-in type device shown in Fig. 1.
Fig. 4 shows cutting of the ceramic bases that the sealing structure of the built-in type device shown in Fig. 3 intercepts along straight line I-I '
Face figure.
Fig. 5 shows the structural representation of the metal column of the sealing structure of built-in type device.
Fig. 6 shows the ceramic bases of the sealing structure of the built-in type device involved by the first embodiment of the present invention
The flow chart of making step.
Fig. 7 (Fig. 7 (A) to Fig. 7 (E)) shows the sealing of the built-in type device involved by first embodiment of the present invention
The schematic diagram of the making step of the ceramic bases of structure.
Fig. 8 shows the ceramic bases of the sealing structure of the built-in type device involved by second embodiment of the present invention
Schematic section.
Fig. 9 shows the ceramic bases of the sealing structure of the built-in type device involved by third embodiment of the present invention
Schematic section.
Figure 10 shows the ceramic bases of the sealing structure of built-in type device involved by the 4th embodiment of the present invention
Schematic section.
Symbol description：
10th, 101,102,103 ... sealing structure, 11,111,112,113 ... ceramic bases, 11c ... through hole, 12 ... metals
Ring, 13 ... crown caps, 11a ... upper surface, 11b ... lower surface, 20,201,202,203 ... metal columns, 20a ... post body,
20b ... post projection, 30 ... electronic units, 40 (40a, 40b) ... mould.
Specific embodiment
Hereinafter, the preferred embodiment of the present invention is described in detail with reference made to the accompanying drawings.In the following description, for identical
Part gives identical symbol, and the repetitive description thereof will be omitted.In addition, accompanying drawing is simply schematically schemed, part size each other
Ratio or the shape etc. of part can be different from actual.
Sealing structure 10 involved in the present invention goes for built-in type device and for example includes being implanted into the internal heart
Dirty pacemaker, deep brain stimulator, artificial cochlea, artificial retina etc..In addition, the sealing structure 10 involved by present embodiment
It is also especially suitable for high density ceramic encapsulation.
Further, since sealing structure 10 involved by present embodiment needs to be placed in the internal of implantation object, therefore, for
It is readily understood that arriving for those skilled in the art, with sealing structure blood, tissue or bone-contact involved in the present invention
10 exterior material (ceramic bases 11 that inclusion is described later on, becket 12, crown cap 13 and be filled in ceramic bases 11
Constituent material of metal column 20 of through hole etc.) all need to meet required standard (such as ISO10993 (international standard), GB/T
16886 (Chinese Industrial Standards (CIS)s)) biological safety and be chronically implanted reliability.
(first embodiment)
Fig. 1 shows the stereochemical structure of the sealing structure 10 of the built-in type device involved by the first embodiment of the present invention
Figure.Fig. 2 shows the schematic internal view of the sealing structure 10 of the built-in type device shown in Fig. 1.
As depicted in figs. 1 and 2, the sealing structure 10 of the built-in type device involved by the first embodiment of the present invention includes
Ceramic bases 11, becket 12 and crown cap 13.Specifically, sealing structure 10 is passed through to arrange (for example in ceramic bases 11
Welding) there are becket 12 and crown cap 13 to be formed as the seal with the receiving space for accommodating electronic unit 30.
In addition, as shown in figure 1, sealing structure 10 is in the shape of approximately parallelepiped body.In the present embodiment, typical implantation
The size of the sealing structure 10 of formula device is, for example, length 10mm × width 10mm × thickness 5mm.
In the present embodiment, ceramic bases 11 can be by aluminium oxide (chemical formula Al2O3, it include the sapphire of monocrystalline and
Ruby or polycrystalline α-Al2O3), zirconium oxide (chemical formula ZrO2, it includes magnesia partial stabilized zirconia (Mg-PSZ)),
The structures such as the tetragonal zirconia polycrystal (Ce-TZP) of the tetragonal zirconia polycrystal (Y-TZP) of stabilized with yttrium oxide or ceria stabilized
Become.
In the present embodiment, ceramic bases 11 are preferably by the aluminium oxide (Al of more than 96% (mass fraction, similarly hereinafter)2O3)
Constitute.In addition, ceramic bases 11 are more preferably made up of more than 99% aluminium oxide.Additionally, ceramic bases 11 most preferably by
More than 99.99% aluminium oxide is constituted.In general, in ceramic bases 11, with aluminium oxide (Al2O3) mass fraction increasing
Plus, principal crystalline phase increases, and the physical property of ceramic bases 11 also gradually steps up, for example comprcssive strength (MPa), bending strength (MPa),
Elastic modelling quantity (GPa) also correspondingly improves, thus it is considered that more preferable biological safety and long-term reliability can be assumed.
In the present embodiment, the thickness of ceramic bases 11 is not particularly limited, for example, can be more than 0.1mm and 2mm
Below.In the present embodiment, the thickness of ceramic bases 11 is preferably more than 0.25mm and below 0.75mm.
In the present embodiment, becket 12 is shaped generally as the banded structure of annular.Becket 12 is along ceramic bases
11 edge (being rectangular four sides here, referring to Fig. 3) arranges and welds (such as soldering) in ceramic bases 11.Becket
12 thickness (i.e. the thickness of ring wall) is not particularly limited, and for example the ring wall thickness of becket 12 is in the present embodiment
0.5mm just can reach good support strength.In addition, the height of becket 12 is (i.e. along the upper surface with ceramic bases 11
Or the height of the ring wall on the orthogonal direction of lower surface) can be big according to the receiving space of above-mentioned mentioned sealing structure 10
Little and determine it is however generally that, as long as the electronic unit 30 being able to ensure that in receiving space.
In addition, crown cap 13 is arranged on becket 12, for example can be by laser welding by crown cap 13 and becket
12 weld together.Thus, the ceramic bases 11, becket 12 and the crown cap 13 that fit together constitute the close of present embodiment
Seal structure 10.
Here, welding (such as laser welding) skill of the welding (such as soldering) of pottery and metal and metal and metal
Art belongs to well known to a person skilled in the art technology, therefore, in this manual, with regard to pottery and metal and metal with
The solder technology of metal will not be described in great detail.
In the present embodiment, becket 12 and crown cap 13 can by titanium and its alloy, noble metal (include gold, silver and
Platinum group metal (ruthenium, rhodium, palladium, osmium, iridium, platinum)) and its alloy, medical grade (biograde) rustless steel, tantalum, niobium, Nitinol
Or nickel cobalt chrome molybdenum (MP35N) etc. is constituted (Nitinol).Additionally, in the present embodiment, becket 12 and crown cap 13
Can be made up of identical metal material it is also possible to be made up of different metal materials.In addition, becket 12 preferably by titanium or
Titanium alloy material is constituted.Crown cap 13 is it is also preferred that be made up of titanium or titanium alloy material.
Furthermore, in order to simplify manufacturing process, in the sealing structure 10 involved by present embodiment, becket 12 and metal
Lid 13 can also be integrally formed.
In the present embodiment, notwithstanding sealing structure 10 in approximately parallelepiped body shape, but sealing structure 10
Shape is not particularly limited, can be that other regular shapes are for example cylindric, elliptic cylindrical shape, triangle column etc. or
Irregularly shaped (including regular shape and the irregularly shaped shape being combined into).
As shown in Fig. 2 in sealing structure 10 receiving space of sealing structure 10 (specifically), accommodate electronic unit
30.In the present embodiment, electronic unit 30 can be by including such as resistor, electricity in upper making of printed circuit board (PCB) (PCB)
The discrete component such as container or inducer or IC chip (IC) such as special IC (ASIC), electric erasable are only
Read memorizer (EEPROM) etc. and constitute.
In addition, electronic unit 30 is via the metal column 20 being described later on the functional part outside sealing structure 10 (not
Diagram) electrical connection.In the present embodiment, electronic unit 30 for example can play to input signal, stimulus signal or detection letter
Number etc. various signals carry out the effect of signal processing.
As shown in Fig. 2 ceramic bases 11 have upper surface 11a and lower surface 11b.In addition, the upper surface of ceramic bases 11
11a can be substantially parallel to each other each other with lower surface 11b.Ceramic bases 11, becket 12 and 13 groups of crown cap are being filled with structure
When becoming sealing structure 10, first can carry out metal pattern in the upper surface 11a and lower surface 11b of ceramic bases 11 respectively and carry out shape
Become specific connection line.Then, the ceramic bases 11 (for example having the upper surface 11a of connection line) after patterning can example
As engaged (bonding) with electronic unit 30 by welding.Wherein, the step of metal pattern can include metal deposit, light
The Conventional process steps such as carve, etch, because these Conventional process steps belong to known technology, therefore repeating no more here.
Fig. 3 shows the plane graph of the ceramic bases 11 of the sealing structure 10 of built-in type device.Fig. 4 shows shown in Fig. 3
Built-in type device the sectional view of ceramic bases 11 that intercepts along straight line I-I ' of sealing structure 10.
As shown in Figure 3 and Figure 4, ceramic bases 11 have multiple through hole 11c.In the present embodiment, ceramic bases 11 have
There is the through hole 11c being arranged in 5 × 4 arrays.In addition, each through hole 11c insertion ceramic bases 11 reach the upper of ceramic bases 11
Surface 11a and lower surface 11b.In other words, ceramic bases 11 are formed with the through hole 11c of insertion upper surface 11a and lower surface 11b.
Here, the central axis direction of through hole 11c can be substantially vertical with the upper surface 11a and lower surface 11b of ceramic bases 11.In addition,
The central axis direction of through hole 11c can also be formed with the angle of inclination with the upper surface 11a and lower surface 11b of ceramic bases 11.
In the present embodiment, although showing that the quantity of through hole 11c is 20 (5 × 4), the number of through hole 11c
Amount is not particularly limited, and the quantity of through hole 11c can determine according to specific needs, and the such as quantity of through hole 11c can be 1
Individual or more than 2.
Although the diameter in upper surface of through hole 11c is not particularly limited, it is in order at the viewpoint of high density ceramic encapsulation,
Through hole 11c can be more than 0.1mm and below 0.5mm in the diameter of upper surface.
As shown in Figure 3 and Figure 4, it is filled with metal column 20 in through hole 11c.That is, metal column 20 can be solid construction.But
It is that in the present embodiment, metal column 20 can also be the column structure (not shown) of hollow, as long as ensureing in through hole 11c
The upper surface 11a of ceramic bases 11 can be electrically connected by metal column 20 with lower surface 11b.
In addition, in the present embodiment, in the contact interface of metal column 20 and ceramic bases 11, it is formed with concavo-convex knot
Structure.Hereinafter, with reference to Fig. 5, it is described more fully the cylinder 20 of sealing structure 10 and the metal column involved by present embodiment
20 with the contact interface of ceramic bases 11.
Fig. 5 shows the structural representation of the metal column 20 of the sealing structure 10 of built-in type device.As shown in figure 5, at this
In embodiment, metal column 20 is the column structure being made up of post body 20a and post projection 20b.Specifically, as shown in figure 5,
Along post body 20a, (radius is r1) length direction, a part of post body 20a be formed with around post body 20a setting
Post projection 20b (radius be r2).Wherein, the radius r of post body 20a1Radius r less than post projection 20b2.In addition, post body
20a can be integrally formed with post projection 20b.
In the present embodiment, the contact interface in metal column 20 and ceramic bases 11 is formed with concaveconvex structure (at this
In embodiment, the radius r of post projection 20b2Radius r more than post body 20a1), thus, metal column 20 and ceramic bases 11
Contact area greatly increases.Therefore,For the through hole being not changed in compared to the radius of prior art, can more efficiently press down
Controlling the water circulation divides, gas or other compositions leak into outside sealing structure 10 along the contact interface of metal column 20 and ceramic bases 11
Portion, thus, it is possible to improving the biological safety of sealing structure 10 and being chronically implanted reliability.
As the exemplary of high density ceramic encapsulation, the spacing between the adjacent central shaft of metal column 20 and central shaft
Can be for example more than 0.1mm and below 1mm, preferably more than 0.25mm and below 0.5mm.
In addition, metal column 20 can be made up of at least one in platinum, iridium, niobium, tantalum or gold.For biological safety
With the viewpoint being chronically implanted reliability, metal column 20 is preferably made up of platinum, is more preferably made up of more than 99% platinum.
Additionally, post projection 20b is from height (the i.e. radius r of post body 20a projection2With radius r1Difference) be not particularly limited,
But there is the height of significantly outwards (away from post body 20a) projection with respect to the post body 20a of metal column 20.Preferably,
The half of the post body 20a that post projection 20b is metal column 20 from metal column 20 towards the height of outside (away from post body 20a) projection
Footpath r1More than 1/3rd and less than 1/2nd.In this case, post projection 20b in metal column 20 can be with pottery
The ceramic structure of substrate 11 more fully contacts, thus, it is possible to improve the effect that metal column 20 is fitted tightly with ceramic bases 11
Really.
The outfan (not shown) of electronic unit 30 can be electrically connected with metal column 20 via solder or lead, then, then
Electrically connect with the functional part outside sealing structure 10 via metal column 20, thus, electronic unit 30 is capable of and seals
The signal interaction of the functional part outside structure 10.
In addition, in the assembling process of sealing structure 10, such as installing in electronic unit 30 and be welded on ceramic bases 11
After upper, becket 12 welded (such as soldering) and arrives ceramic bases 11, then use the resin such as silica gel, epoxy resin to fill electronics
Gap between part 30 and ceramic bases 11 or other positions, and crown cap 13 is welded (e.g., laser welded) to ceramic base
Bottom 11, thus, obtains the sealing structure 10 involved by present embodiment.
Here, the quantity of metal column 20 is corresponding with the quantity of through hole 11c.In addition, in the present embodiment, although illustrating
Metal column 20 is made up of the post body 20a of generally cylindrical body and post projection 20b of generally cylindrical body, but metal column 20 also may be used
To be other shapes, for example metal column 20 can be made up of (not the post projection of the post body of generally rectangular bodies and generally rectangular bodies
Diagram).Additionally, metal column 20 can also be by the post body of generally cylindrical body and tool cylinder jaggy (such as fan-shaped cylinder
(include continuous and detached sector)) post projection 20b composition.
Hereinafter, with reference to Fig. 6 and Fig. 7 (Fig. 7 (A) to Fig. 7 (E)), explain the sealing knot involved by present embodiment
The manufacture method of the ceramic bases 11 of structure 10.Fig. 6 shows the sealing structure 10 involved by the first embodiment of the present invention
The flow chart of the making step of ceramic bases 11.Fig. 7 (A) to Fig. 7 (E) shows involved by the first embodiment of the present invention
The schematic diagram of the making step of ceramic bases 11 of sealing structure 10.
Manufacture such built-in type device sealing structure 10 ceramic bases 11 when, by the making of metal column 20,
The known method of the making of ceramic paste (paste), the making of ceramic green sheet etc. is making the sealing structure including metal column 20
10 ceramic bases 11.Then, in order that the fitting tightly, through taking off binding agent operation, sintering of metal column 20 and ceramic green sheet
The operations such as operation, complete the making of the ceramic bases 11 of sealing structure 10.
In general, the granule of ceramic powder is thinner, activation degree is higher, then powder body is easy for sintering, and sintering temperature is got over
Low.Therefore, the ceramic paste for ceramic bases 11 in the present invention preferably uses mean diameter is, for example, 10nm's to 100nm
Ceramic powders.Fallen within the range by the mean diameter making ceramic paste such that it is able to make the good ceramic blank of compactness
Piece.
After ceramic paste passes through to be mixed ceramic powders, binding agent, organic carrier etc. with homogeneous mixer, in three-roller
Or carry out in ball mill, rod mill disperseing, knead to make.
Above-mentioned organic carrier is to make resin glue be dissolved in organic carrier obtained from solvent.Made as organic carrier
Resin glue is not particularly limited, and can illustrate the common various binding agent trees such as ethyl cellulose, acrylic resin
Fat.In addition, the solvent that organic carrier is used is it is not also specifically limited, use common solvent such as water, ethanol etc..
Hereinafter, with reference to Fig. 6 and Fig. 7, while the ceramic bases of the sealing structure 10 involved by explanation present embodiment
11 manufacture method.In addition, in Fig. 7 (A) to Fig. 7 (E), understanding for convenience, illustrate only the pottery including 4 metal columns
The schematic diagram of the manufacturing process of substrate 11, but in actual fabrication, can make as needed respective numbers (such as one or
More than two) metal column.
First, prepare metal column 20, in a part for this metal column 20, along metal column 20 length direction be formed with recessed
Male structure (that is, radius is more than the structure of post projection 20b of the radius of post body 20a of metal column 20) (referring to Fig. 7 (A)).Separately
Outward, prepare the ceramic paste (ceramic for constituting the ceramic bases 11 (comprising metal column 20) shown in Fig. 3 and Fig. 4 after burning till
Paste) (step S1).Here, the length of the metal column 20 being prepared is more than the thickness h of the ceramic bases 11 after burning till.For
Be easy to operate viewpoint, the length of the metal column 20 being prepared about burn till after the three times of the thickness h of ceramic bases 11 more than.
In addition, the metal column 20 being prepared for example can be made up of more than 99% platinum.The ceramic paste allocated for example is divided with quality
Aluminium oxide (the Al for more than 96% for the number2O3) it is main constituent,
There is suitable mobility.Additionally, ceramic paste can add the dispersant of proper proportion, binding agent etc..
Then, ready ceramic paste is loaded into the mould 40 (mould of the sealing structure 10 involved by present embodiment
Tool 40 includes lower mould 40a and mold 40b, specifically plays mould 40a here, referring to Fig. 7 (B)), treat that ceramic paste has loaded
After lower mould 40a, metal column 20 is inserted the above-mentioned ceramic paste in lower mould 40a, and by lower mould 40a and mold
40b fits together.
Then, the mould 40 lower mould 40a and mold 40b being assembled stands the stipulated time (such as 60 minutes),
Ceramic paste is made to be fully contacted with metal column 20.In the present embodiment, mold 40b can be along the inwall of lower mould 40a
Mobile in above-below direction (i.e. bottom surface generally perpendicular direction with lower mould 40a).
Here, the shape of the inner space that mold 40b and lower mould 40a combines corresponds roughly to present embodiment
The shape of made sealing structure 10.Therefore, the shape of the inner space that mold 40b and lower mould 40a combines can
Changed with the change of the shape according to made sealing structure 10, such as when sealing structure 10 is generally cylindrical structure
When, the shape of the inner space that mold 40b and lower mould 40a combines also is generally cylindrical structure.
In addition, the position of metal column 20 can be positioned (referring to Fig. 7 by the corresponding aperture on the mould 40 of sealing structure 10
(C)).In addition, in mould 40, metal column 20 is inserted in ceramic paste, and ceramic paste is completely covered metal column 20
Formation have the part (step S2) of concaveconvex structure.Before sintering, the height of ceramic paste e.g., about 1mm～2.5mm.This
In, the degree that ceramic paste covers the concaveconvex structure of metal column 20 is that after guarantee sinters, ceramic body remains able to cover this part,
The height h of the metal column 20 after sintering1Less than ceramic bases 11 thickness h it is preferable that the height h of metal column 201It is about and make pottery
The half of the thickness h of porcelain substrate 11.
Then, in order to form the ceramic bases 11 shown in Fig. 4, under such as 150～350 DEG C of temperature conditionss, using mould
Tool 40 (that is, mold 40b is placed in the ceramic paste of lower mould 40a by compressing for ceramic paste along above-below direction compacting
Body), form the ceramic green sheet (step S3) making needed for ceramic bases 11.In above-mentioned pressing process, such as in ceramic paste
Excessive gas and moisture can from be arranged on lower mould 40a escape orifice (not shown) discharge.Here, the molding side of ceramic green sheet
Method can also be using methods such as currently known gel forming, injection moulding or injection formings.The material that mould 40 is used can
To be selected according to different forming methods.
In the forming process of ceramic green sheet, ceramic paste is contacted with metal column 20 further, thus being conducive to metal column
Form tight structure between 20 and ceramic structure.
Then, the ceramic green sheet with metal column 20 is sintered.In the present embodiment, sintering temperature is, for example,
1300～1650 DEG C, more preferably 1450～1650 DEG C.During ceramic post sintering, the aluminium oxide in glass phase is towards metal column
20 direction starts to shrink at, and so that aluminium oxide is fitted tightly with metal column 20, formed ceramic bases 11 with metal column 20 (referring to
Fig. 7 (D)) (step S4).
Finally, the unnecessary metal column 20 projecting from ceramic bases 11 surface is removed.Alternatively, it is also possible to right as needed
Ceramic bases 11 are polished.Thus, the ceramic bases 11 (referring to Fig. 7 (E)) (step S5) involved by present embodiment are obtained.
Furthermore it is possible to obtained ceramic bases 11 are cut into monolithic.The method of singualtion is not particularly limited, permissible
Enumerate inner circle patterning method, cylindrical patterning method, the crush-cutting process of chopping or the scribing skill in using a kitchen knife in cookery, laser cutting method etc..
In the manufacturing process of above-mentioned sealing structure, condition in de- binding agent operation can be 10 in partial pressure of oxygen～
More than 21atm and 10～below 16atm, and hydrogen concentration is highest in more than 0.1% and less than 4.0% nitrogen hydrogen mixeding gas
Keeping temperature is carried out under conditions of being more than 650 DEG C and less than 850 DEG C.Programming rate, retention time are not particularly limited, for example
Residual carbon amounts is made to be below 0.1wt%.
As the sintering furnace used in sintering circuit, for example, can illustrate lifting type batch-type atmosphere sintering furnace, push rod
Formula stove, band oven etc..
Preferably as sintering condition, such as with the programming rate of 300 DEG C/more than h and 1500 DEG C/below h, during holding
Between be more than 10 minutes and less than 2 hours, atmosphere is nitrogen, hydrogen and vapor coexist under atmosphere and hydrogen concentration is more than 0.1%
And less than 4.0% carried out.
Further optionally, can by such as with the ceramic bases 11 obtained by upper type for example by cylinder grinding, sandblasting etc.
Implement end surface grinding, the mastic of burn-back metal pattern, thus in the upper surface 11a of ceramic bases 11 or lower surface 11b shape
Become connecting lead wire.
Additionally, ceramic bases 11 make after finishing, electronic unit 30 is for example passed through welded and installed in ceramic bases 11,
Becket 12 is soldered to ceramic bases 11, then with silica gel etc. fill gap between electronic unit 30 and ceramic bases 11 or
Other positions, and crown cap 13 is welded (laser welding) to ceramic bases 11, thus, obtain the sealing that air-tightness is improved
Structure 10.
More than, it is illustrated for embodiments of the present invention, but the present invention is at all not limited to above-mentioned embodiment,
Various changes can be carried out to be suitable in the range of without departing from spirit of the invention.
(second embodiment)
Hereinafter, with reference to Fig. 8, the sealing structure 101 of the built-in type device involved by second embodiment of the present invention is described.
Fig. 8 shows the ceramic base of the sealing structure 101 of the built-in type device involved by second embodiment of the present invention
The schematic section at bottom 111.For convenience of description, sealing structure 101 here illustrate only with involved by first embodiment
Built-in type device the different part of sealing structure 10.As shown in figure 8, the implantation involved by second embodiment of the present invention
The ceramic bases 111 of the sealing structure 101 of formula device are close with the built-in type device involved by the first embodiment of the present invention
The difference of the ceramic bases 11 of seal structure 10 is, the metal column 201 in ceramic bases 111 is by post body 201a and two posts
Projection 201b is constituted.
Specifically, in the sealing structure 101 of the built-in type device involved by present embodiment, in present embodiment
In, metal column 201 is the column structure being made up of post body 201a and two post projections 201b.As shown in figure 8, along post body
(radius is r to 201a11) length direction, be formed with different two of a part of post body 201a around post body 201a
(radius is r to two post projections 201b of setting21).Wherein, the radius r of post body 201a11Less than two post projections 201b
Radius r21.In addition, post body 2011a can be integrally formed with two post projections 20b.
In the present embodiment, in the contact interface of metal column 201 and ceramic bases 111, be formed with concaveconvex structure (
In present embodiment, the radius r of two post projections 201b21Radius r more than post body 201a11), thus, metal column 201 with
The contact area of ceramic bases 111 increases further.Therefore,For the through hole being not changed in compared to the radius of prior art,
Moisture, gas or other compositions can be more efficiently suppressed to let out along metal column 201 with the contact interface of ceramic bases 111
Drain to the biological safety that thus also can improve sealing structure 101 outside sealing structure 101 and be chronically implanted reliability.
Although in addition, the ceramic base of the sealing structure 101 of built-in type device involved by second embodiment of the present invention
The metal column 201 at bottom 111 illustrates the situation of only two post projections 201b, it will be understood, however, to one skilled in the art, that this enforcement
Post projection 201b of the ceramic bases 111 of mode can also be the situation of three or more than three.
Although in addition, showing the radius r of two post projections 201b in the present embodiment21Equal, but two posts are dashed forward
The radius playing 201b can also be different.
Additionally, the ceramic bases 111 of the sealing structure 101 of built-in type device involved by second embodiment of the present invention
The ceramic bases 11 of the sealing structure 10 of the built-in type device involved by first embodiment of manufacture method and the present invention
Manufacture method is essentially identical, and it the difference is that only the said structure of prepared metal column 201.
(the 3rd embodiment)
Hereinafter, with reference to Fig. 9, the sealing structure 102 of the built-in type device involved by third embodiment of the present invention is described.
Fig. 9 shows the ceramic base of the sealing structure 102 of the built-in type device involved by third embodiment of the present invention
The schematic section at bottom 112.For convenience of description, sealing structure 102 here illustrate only with involved by first embodiment
Built-in type device the different part of sealing structure 10.As shown in figure 9, the implantation involved by third embodiment of the present invention
The ceramic bases 112 of the sealing structure 102 of formula device are close with the built-in type device involved by the first embodiment of the present invention
The difference of the ceramic bases 11 of seal structure 10 is, the metal column 202 in ceramic bases 112 is dashed forward by post body 202a and screw thread
Play 202b to constitute.
Specifically, in the sealing structure 102 of the built-in type device involved by present embodiment, in present embodiment
In, metal column 202 is the column structure being made up of post body 202a and threaded bosses 202b.As shown in figure 9, along post body
(radius is r to 202a12) length direction, in a part of post body 202a, be formed with the screw thread around post body 202a setting
(radius is r to projection 202b22).Wherein, the radius r of post body 202a12Radius r less than threaded bosses 202b22.In addition, post is originally
Body 202a can be integrally formed with threaded bosses 202b.
In the present embodiment, in the contact interface of metal column 202 and ceramic bases 112, be formed with concaveconvex structure (
In present embodiment, the external diameter r of threaded bosses 202b22Radius r more than post body 202a12), thus, metal column 202 and pottery
The contact area of porcelain substrate 112 increases further, and threaded bosses 202b are easily embedding with the ceramic structure of ceramic bases 112
Close.Therefore,For the through hole being not changed in compared to the radius of prior art, can more efficiently suppress moisture, gas or
Other compositions leak into outside sealing structure 102 along the contact interface of metal column 202 and ceramic bases 112, thus also can
Enough improve the biological safety of sealing structure 102 and be chronically implanted reliability.
Additionally, the ceramic bases 112 of the sealing structure 102 of built-in type device involved by third embodiment of the present invention
The ceramic bases 11 of the sealing structure 10 of the built-in type device involved by first embodiment of manufacture method and the present invention
Manufacture method is essentially identical, and it the difference is that only the said structure of prepared metal column 202.
(the 4th embodiment)
Hereinafter, with reference to Figure 10, the sealing structure of the built-in type device involved by the 4th embodiment of the present invention is described
103.
Figure 10 shows the ceramic base of the sealing structure 103 of the built-in type device involved by third embodiment of the present invention
The schematic section at bottom 113.For convenience of description, sealing structure 103 here illustrate only with involved by first embodiment
Built-in type device the different part of sealing structure 10.As shown in Figure 10, the plant involved by the 4th embodiment of the present invention
Enter the ceramic bases 113 of sealing structure 103 and the built-in type device involved by first embodiment of the present invention of formula device
The difference of the ceramic bases 11 of sealing structure 10 is, the metal column 203 in ceramic bases 113 is recessed by post body 203a and post
Sunken 203b is constituted.
Specifically, in the sealing structure 10 of the built-in type device involved by present embodiment, in the present embodiment,
Metal column 203 is the column structure being made up of post body 203a and post depression 203b.As shown in Figure 10, along post body 203a
(radius is r13) length direction, in a part of post body 203a, be formed with the post depression around post body 203a setting
(radius is r to 203b23).Wherein, the radius r of post body 203a13Radius r more than post depression 203b23.In addition, post body 203a
Can be integrally formed with post depression 203b.
In the present embodiment, in the contact interface of metal column 203 and ceramic bases 113, be formed with concaveconvex structure (
In present embodiment, the radius r of post depression 203b23Radius r less than post body 203a13), thus, metal column 203 and pottery
The contact area of substrate 113 increases further, in addition, the ceramic structure of ceramic bases 113 also can embed metal column 203.Therefore,
For the through hole being not changed in compared to the radius of prior art, can more efficiently suppress moisture, gas or other compositions
Leak into outside sealing structure 103 along the contact interface of metal column 203 and ceramic bases 113, thus also can improve close
The biological safety of seal structure 103 and be chronically implanted reliability.
Although in addition, the ceramic base of the sealing structure 103 of built-in type device involved by the 4th embodiment of the present invention
The metal column 203 at bottom 113 illustrates the situation of only one post depression 203b, it will be understood, however, to one skilled in the art, that this enforcement
The post depression 203b of the ceramic bases 113 of mode can also be two or more situations.
Additionally, the ceramic bases 113 of the sealing structure 103 of the built-in type device involved by the 4th embodiment of the present invention
The ceramic bases 11 of the sealing structure 10 of the built-in type device involved by first embodiment of manufacture method and the present invention
Manufacture method is essentially identical, and it the difference is that only the said structure of prepared metal column 203.
Although being illustrated to the present invention above in association with drawings and embodiments, described above is not configured to
To limit the present invention in any form it will be appreciated that to those skilled in the art, in the essence without departing from the present invention and
In the case of scope, as needed the present invention can be deformed and be changed it is evident that these deformation and change each fall within this
In the scope of the claimed protection of invention.
Claims (5)
1. a kind of manufacture method of the sealing structure of built-in type device it is characterised in that：
Including：
Preparation metal column, and the part in described metal column, the length direction along described metal column is formed with concavo-convex knot
Structure；
Described metal column is injected ceramic paste, and the formation of the described ceramic paste described metal column of covering has described concavo-convex knot
A described part for structure；
Will be compressing for described ceramic paste, form ceramic green sheet；And
Described metal column is sintered together with described ceramic green sheet, is consequently formed the ceramic bases with described metal column.
2. the sealing structure of built-in type device as claimed in claim 1 manufacture method it is characterised in that：
Described ceramic bases are made up of more than 99% aluminium oxide.
3. the sealing structure of built-in type device as claimed in claim 1 or 2 manufacture method it is characterised in that：
The thickness of described ceramic bases is more than 0.25mm and below 0.75mm.
4. the sealing structure of built-in type device as claimed in claim 1 or 2 manufacture method it is characterised in that：
Described metal column is made up of at least one in platinum, iridium, niobium, tantalum or gold.
5. the sealing structure of built-in type device as claimed in claim 1 or 2 manufacture method it is characterised in that：
A diameter of more than 0.1mm of the upper surface in described ceramic bases of described through hole and below 0.5mm.
Priority Applications (2)
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| CN201510737633.5A CN105287047B (en) | 2015-11-03 | 2015-11-03 | The sealing structure of built-in type device and its manufacture method |
| CN201610986403.7A CN106361464B (en) | 2015-11-03 | 2015-11-03 | The sealing structure of built-in type device |
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| CN201510737633.5A CN105287047B (en) | 2015-11-03 | 2015-11-03 | The sealing structure of built-in type device and its manufacture method |
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| CN105749421B (en) * | 2016-02-04 | 2018-10-19 | 深圳先进技术研究院 | The manufacturing method of the artificial retina silicon packaging body of implantable |
| CN105771089B (en) * | 2016-02-04 | 2018-12-28 | 深圳市中科先见医疗科技有限公司 | The manufacturing method of the artificial retina ceramic packaging body of implantable |
| CN109125919B (en) * | 2016-08-01 | 2019-07-26 | 深圳硅基仿生科技有限公司 | The implanted device of stimulating electrode structure and artificial retina with fixation hole |
| CN107913131B (en) * | 2017-12-18 | 2023-08-08 | 深圳先进技术研究院 | Implant packaging structure and sealing cover thereof |
| CN108211118B (en) * | 2017-12-23 | 2021-11-26 | 深圳先进技术研究院 | Implantable package, method of manufacturing the same, and implantable medical device |
| CN111821568A (en) * | 2019-03-30 | 2020-10-27 | 深圳硅基仿生科技有限公司 | Solder body of electronic package |
| CN110015890A (en) * | 2019-04-04 | 2019-07-16 | 河北躬责科技有限公司 | A kind of high density ceramic feedthrough production method |
| CN110039640A (en) * | 2019-04-04 | 2019-07-23 | 河北躬责科技有限公司 | A kind of ceramics feedthrough mold, green body and production method |
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| CN102915977A (en) * | 2011-08-02 | 2013-02-06 | 英飞凌科技股份有限公司 | Circuit substrate, circuit substrate device, and method for manufacturing circuit substrate |
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| US5105811A (en) * | 1982-07-27 | 1992-04-21 | Commonwealth Of Australia | Cochlear prosthetic package |
| US5738270A (en) * | 1994-10-07 | 1998-04-14 | Advanced Bionics Corporation | Brazeless ceramic-to-metal bonding for use in implantable devices |
| US5870272A (en) * | 1997-05-06 | 1999-02-09 | Medtronic Inc. | Capacitive filter feedthrough for implantable medical device |
| US7599743B2 (en) * | 2004-06-24 | 2009-10-06 | Ethicon Endo-Surgery, Inc. | Low frequency transcutaneous energy transfer to implanted medical device |
| US20110048770A1 (en) * | 2009-08-31 | 2011-03-03 | Medtronic Inc. | Injection molded ferrule for cofired feedthroughs |
| JP5501745B2 (en) * | 2009-12-01 | 2014-05-28 | 株式会社ニデック | Visual reproduction assist device |
| DE102011009861B4 (en) * | 2011-01-31 | 2012-09-20 | Heraeus Precious Metals Gmbh & Co. Kg | Process for the preparation of a cermet-containing feedthrough |
| DE102011009865B4 (en) * | 2011-01-31 | 2012-09-20 | Heraeus Precious Metals Gmbh & Co. Kg | Headboard for a medically implantable device |
| US8670829B2 (en) * | 2011-08-02 | 2014-03-11 | Medtronic, Inc. | Insulator for a feedthrough |
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| CN102915977A (en) * | 2011-08-02 | 2013-02-06 | 英飞凌科技股份有限公司 | Circuit substrate, circuit substrate device, and method for manufacturing circuit substrate |
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| CN106361464A (en) | 2017-02-01 |
| CN106361464B (en) | 2018-10-12 |
| CN105287047A (en) | 2016-02-03 |
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Address after: 518000 Area A, 4/F, Building 3, Tingwei Industrial Park, No. 6, Liufang Road, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Silicon Bionics Technology Co.,Ltd. Address before: 518000 Area A, 4/F, Building 3, Tingwei Industrial Park, No. 6, Liufang Road, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN SIBIONICS TECHNOLOGY Co.,Ltd. |