CN105278132A - Matrix circuit board and method for manufacturing display device - Google Patents
Matrix circuit board and method for manufacturing display device Download PDFInfo
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- CN105278132A CN105278132A CN201410403734.4A CN201410403734A CN105278132A CN 105278132 A CN105278132 A CN 105278132A CN 201410403734 A CN201410403734 A CN 201410403734A CN 105278132 A CN105278132 A CN 105278132A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 72
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- 239000004020 conductor Substances 0.000 claims abstract description 115
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 230000010354 integration Effects 0.000 claims description 13
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- 238000007641 inkjet printing Methods 0.000 claims description 7
- 238000009826 distribution Methods 0.000 abstract description 2
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 239000004973 liquid crystal related substance Substances 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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Abstract
A method of manufacturing a matrix circuit substrate includes the steps of: taking a substrate body, wherein the substrate body is provided with a first surface and a second surface which are opposite, and the side wall is positioned between the first surface and the second surface; forming a plurality of electrodes and arranging the electrodes on the first surface in a staggered manner; forming a first conductive material on the side wall, wherein the distribution area of the first conductive material on the side wall is larger than the sectional area of the electrode; and electrically connecting the first conductive material to the at least one electrode.
Description
Technical field
The present invention is about a kind of manufacture method of matrix circuit board.
Background technology
Along with the progress of science and technology, various information equipment is constantly weeded out the old and bring forth the new, the display device of especially various types of display device or touch, and it is applied to various electronic installation, such as mobile phone, flat computer, ultra-thin pen electricity, e-book etc.No matter and be the part of display device or touch control layer, be all made up of matrix circuit board (matrixcircuitsubstrate).
Generally speaking, matrix circuit board is the electrode with the distribution that is staggered, and is electrically connected by a flexible circuit board (FlexiblePrintCircuit, FPC) and drive circuit board, and is connected with the control chip of outside.With display device, be connected with outside control chip by flexible circuitry plate, the luminescence of each picture element of display panel can be controlled with display frame.In addition, with the display device of touch, need by a flexible circuit board with except being electrically connected with driving circuit except the matrix circuit board of display panel, the matrix circuit board of touch control layer must be electrically connected with an other flexible circuit board equally again, be connected, with the electrode start of touch control electrode layer with outside control chip through flexible circuit board equally.
But drive circuit board has certain volume, its configuration mode is the main cause of the volume size for affecting display device and display panel.Known techniques is back side drive circuit board being arranged at display panel, and is electrically connected electrode and drive circuit board, to save the space of display device entirety with flexible circuit board.But in known techniques, one must be reserved at the periphery of matrix circuit board and engage (OuterLeadBonding for outer pin, OLB) space, namely be arranged in electrode staggered on matrix circuit board extend respectively and be concentrated to the space engaged for outer pin, to be electrically connected with flexible circuit board.
But, the periphery of matrix circuit board the space that engages of the outer pin of confession reserved, and then the border width of display device is increased, vision official sense just make display device light and handy not, attractive in appearance, and display panel and contact panel need a flexible circuit board respectively, therefore the volume of touch control display apparatus can be caused to increase.But current user is but more be tending towards frivolous for the demand of display device or touch control display device.
Therefore, how to provide the manufacture method of a kind of matrix circuit board and display device, can by the manufacture method of its novelty, make the matrix circuit board made and display device can have narrow side frame district, to form more frivolous structure, become one of important topic.
Summary of the invention
Object of the present invention, can by the manufacture method of its novelty for providing the manufacture method of a kind of matrix circuit board and display device, makes the matrix circuit board made and display device can have narrow side frame district, to form more frivolous structure.
The present invention proposes a kind of manufacture method of matrix circuit board, comprises the following steps: get a substrate body, and wherein substrate body has a relative first surface and a second surface, and sidewall is between first surface and second surface; Form plural electrode, and interconnected in first surface; Form one first conductive material in sidewall, and the first conductive material is greater than the sectional area of electrode in the laying area of sidewall; And the first conductive material is electrically connected at least one electrode.
In one embodiment of this invention, the first conductive material extends to second surface.
In one embodiment of this invention, wherein the manufacture method of matrix circuit board more comprises: engage one and be electrically connected part to sidewall, electric connection part is made to be electrically connected at this first conductive material, with when a control circuit is engaged to substrate body, control circuit is electrically connected the first conductive material through electric connection part.
In one embodiment of this invention, wherein the manufacture method of matrix circuit board more comprises: arrange a control integration circuit in second surface, and be electrically connected with the first conductive material.
In one embodiment of this invention, the first conductive material is formed at sidewall in the mode of evaporation, sputter, plating, printing, ink-jet or coating.
In one embodiment of this invention, wherein the manufacture method of matrix circuit board more comprises: the periphery of cutting substrate body is to form sidewall.
In one embodiment of this invention, wherein the manufacture method of matrix circuit board more comprises: the sidewall of grinding base plate body.
In one embodiment of this invention, the end of electrode is positioned at the intersection of first surface and sidewall.
In one embodiment of this invention, wherein the manufacture method of matrix circuit board more comprises: form at least one second conductive material in substrate body, and the second conductive material and electrode and the first conductive material are electrically connected.
In one embodiment of this invention, the second conductive material is formed at substrate body in the mode of evaporation, sputter, plating, printing, ink-jet or coating.
The present invention separately proposes a kind of manufacture method of display device, comprises the following steps: get a substrate body, and wherein substrate body has a relative first surface and a second surface, and sidewall is between first surface and second surface; Form plural electrode, and interconnected in first surface; Form one first conductive material in sidewall, and the first conductive material is greater than the sectional area of electrode in the laying area of sidewall; First conductive material is electrically connected at least one electrode, to form a matrix circuit board; And a display medium is set in the side of matrix circuit board, matrix circuit board drives display medium.
In one embodiment of this invention, the first conductive material extends to second surface.
In one embodiment of this invention, wherein the manufacture method of display device more comprises: engage one and be electrically connected part to sidewall, electric connection part is made to be electrically connected at the first conductive material, with when a control circuit is engaged to matrix circuit board, control circuit is electrically connected the first conductive material through electric connection part.
In one embodiment of this invention, wherein the manufacture method of display device more comprises: arrange a control integration circuit in second surface, and be electrically connected with the first conductive material.
In one embodiment of this invention, wherein the manufacture method of display device more comprises: arrange a subtend substrate in the opposite side of substrate body.
In one embodiment of this invention, wherein the manufacture method of display device more comprises: the first conductive material is electrically connected subtend substrate.
From the above, in the manufacture method of matrix circuit board of the present invention and display device, by formation first conductive material in the sidewall of the substrate body of matrix circuit board, make to be electrically connected part and can be electrically connected at the first conductive material in the direction parallel with sidewall, in other words, be electrically connected part and directly can be arranged at sidewall by being electrically connected with the first conductive material.Therefore be the first surface being arranged at substrate body compared to the electric connection part of known techniques, the first conductive material is arranged at the design of sidewall by matrix circuit board of the present invention, more can reach the use the effect with narrow side frame district that reduce space.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the manufacture method of the matrix circuit board of first embodiment of the invention.
Fig. 2 A is for the substrate body shown in Fig. 1 is in the partial schematic diagram of step S20.
Fig. 2 B is the enlarged schematic partial view of the substrate body shown in Fig. 2 A.
Fig. 3 A is for the substrate body shown in Fig. 1 is in the partial schematic diagram of step S30.
Fig. 3 B is the enlarged schematic partial view of the substrate body shown in Fig. 3 A.
The schematic diagram of another enforcement aspect that Fig. 4 is the substrate body shown in Fig. 2 B.
Fig. 5 is the schematic flow sheet of the manufacture method of the matrix circuit board of second embodiment of the invention.
Fig. 6 A is the schematic flow sheet of the manufacture method of the matrix circuit board of third embodiment of the invention.
The schematic diagram of the matrix circuit board that Fig. 6 B is formed for the manufacture method shown in foundation Fig. 6 A.
Fig. 7 A is the schematic flow sheet of the manufacture method of the matrix circuit board of fourth embodiment of the invention.
The diagrammatic cross-section of the matrix circuit board that Fig. 7 B is formed for the manufacture method shown in foundation Fig. 7 A.
Fig. 8 A is the schematic flow sheet of the manufacture method of the matrix circuit board of fifth embodiment of the invention.
The diagrammatic cross-section of the matrix circuit board that Fig. 8 B is formed for the manufacture method shown in foundation Fig. 8 A.
Another embodiment schematic diagram that Fig. 8 C is the matrix circuit board shown in Fig. 8 B.
Fig. 9 is the schematic flow sheet of the manufacture method of the display device of one embodiment of the invention.
Figure 10 is the diagrammatic cross-section of a kind of display device of one embodiment of the invention.
Figure 11 is the diagrammatic cross-section of a kind of display device of another embodiment of the present invention.
Embodiment
Hereinafter with reference to relevant drawings, the manufacture method of matrix circuit board according to present pre-ferred embodiments and display device is described, wherein identical assembly is illustrated with identical reference marks.The graphic of the present invention's all enforcement aspect is only signal, does not represent full-size(d) and ratio.
Fig. 1 is the schematic flow sheet of the manufacture method of the matrix circuit board of first embodiment of the invention, as shown in Figure 1, the present embodiment matrix circuit board 1 (please refer to shown in Fig. 3 A) manufacture method mainly comprises the following steps: get a substrate body, wherein substrate body has a relative first surface and a second surface, and sidewall is (step S10) between first surface and second surface; Form plural electrode, and interconnected in first surface (step S20); Form one first conductive material in sidewall, and the first conductive material is greater than the sectional area (step S30) of electrode in the laying area of sidewall; And the first conductive material is electrically connected at least one electrode (step S40).
Fig. 2 A is for the substrate body shown in Fig. 1 is in the partial schematic diagram of step S20, Fig. 2 B is the enlarged schematic partial view of the substrate body shown in Fig. 2 A, wherein for asking accompanying drawing short and sweet, Fig. 2 B only shows the electrode 12 in one direction, and please also refer to shown in Fig. 1, Fig. 2 A and Fig. 2 B.In step S10, be get a substrate body 11, and in step S20, form plural electrode 12, therefore that shown in Figure 2 is the substrate body 11 after forming electrode 12.Wherein, substrate body 11 has relative first surface 111 and a second surface 112, and sidewall 113 is between first surface 111 and second surface 112, and electrode 12 is interconnected in first surface 111.If the material of the matrix circuit board of the present embodiment 1 can comprise the material of resin, metal, pottery, glass, plastics or other printing opacity, it can be applicable to various display device (panel), such as display panels (LiquidCrystalDisplay, LCD) TFT substrate, light emitting diode (LED) display panel or Organic Light Emitting Diode (OLED) display panel, Electronic Paper (book) or the touch base plate etc. of contact panel, and electrode 12 can be data line (dataline) wherein or sweep trace (scanline).If the matrix circuit board of the present embodiment 1 is applied to touch base plate, then electrode 12 can for forming the sensing electrode (X-Ytouchsensor) of X-Y matrix.
Fig. 3 A is for the substrate body shown in Fig. 1 is in the partial schematic diagram of step S30, and Fig. 3 B is the enlarged schematic partial view of the substrate body shown in Fig. 3 A, and Fig. 3 B equally only shows the electrode 12 in one direction, please also refer to shown in Fig. 1, Fig. 3 A and Fig. 3 B.In step S30, form one first conductive material 13 in sidewall 113, specifically, first conductive material 13 can such as but not limited to evaporation (evaporation), sputter (sputter), plating (electro-plating), printing (printing), ink-jet (inkjeting) or coating (coating, dispensing) mode be formed at sidewall 113.In addition, the electrode 12 of the present embodiment and the first conductive material 13 can be for example and without limitation to indium tin oxide (indium-tinoxide, or indium-zinc oxide (indium-zincoxide ITO), IZO), metal, Graphene or other conductive material, certainly, first conductive material 13 can be identical or not identical with the material of electrode 12, and its material can be for example and without limitation to indium tin oxide or indium-zinc oxide.
In the present embodiment, one end 121 of electrode 12 is the intersections 114 being positioned at first surface 111 and sidewall 113, therefore when the first conductive material 13 is formed at sidewall 113 (step S30), the first conductive material 13 is just electrically connected electrode 12 (step S40) simultaneously.In other words, under the enforcement aspect being positioned at intersection 114 in the end 121 of electrode 12, step S30 and step S40 can complete simultaneously, to form the matrix circuit board 1 of the present embodiment, and forms the first conductive material 13 matrix circuit board 1 directly in electrical contact with electrode 12.In addition, the first conductive material 13 is one of them electrode 12 corresponding and is formed at sidewall 113, and in the present embodiment, forms plural first conductive material 13 with the end 121 of the corresponding each electrode 12 of difference in sidewall 113.Certainly, in other embodiment, also by use unilateal conduction material as the first conductive material, and can form the aspect of the corresponding plural electrode of single first conductive material in sidewall, the present invention is not as limit.
Preferably, first conductive material 13 is greater than the sectional area A of electrode 12 in the laying area of sidewall 113, specifically, the present embodiment is after substrate body 11 configures electrode 12 (as shown in Figure 2 B), the end 121 of electrode 12 is positioned at intersection 114, and the sectional area A of electrode 12 is exposed in intersection 114 in end 121.Then, again the first conductive material 13 is formed at sidewall 113 (as Fig. 3 B) in the mode of plating, make the first conductive material 13 can be directly in electrical contact with electrode 12, and each first conductive material 13 be greater than the sectional area A of each electrode 12 in the laying area of sidewall 113.In other words, each first conductive material 13 is in the laying area of sidewall 113, and namely the first conductive material 13 is covered in the area of end 121 from sidewall 113, and it is greater than the sectional area A of end 121.And the first conductive material 13 is set by the sidewall 113 of matrix circuit board 1, each first conductive material 13 is greater than the sectional area A of each electrode 12 in the laying area of sidewall 113, the width (even can not having OLB region) of OLB can be reduced, therefore be the first surface being arranged at substrate body compared to the electric connection part of known techniques, first conductive material 13 is arranged at the design of sidewall 113 by the matrix circuit board 1 of the present embodiment, more can reach the use the effect with narrow side frame district that reduce space.
Certainly, in other embodiment, the first conductive material and electrode can also be indirectly in electrical contact, as shown in Figure 4, and the schematic diagram of another enforcement aspect that Fig. 4 is the substrate body shown in Fig. 2 B.In other words, the substrate body 11a shown in Fig. 4, it is that another after the electrode 12a of step S20 is configured at first surface 111a implements aspect, and wherein, the end 121a of electrode 12a and intersection 114a has a segment distance S.Under this kind of aspect, by grinding or the mode of cutting, end 121a can be exposed to intersection 114a.Specifically, Fig. 5 is the schematic flow sheet of the manufacture method of the matrix circuit board of second embodiment of the invention, and the substrate body 11a shown in Fig. 4 can be made matrix circuit board 1 as shown in Figure 3A according to the manufacture method shown in Fig. 5, therefore please also refer to shown in Fig. 4 and Fig. 5, if the end 121a of electrode 12a and intersection 114a has a segment distance S, then preferably, the manufacture method of matrix circuit board 1 more comprises step S22: the periphery of cutting substrate body 11a is to form sidewall 113a.In other words, the position of the end 121a of counter electrode 12a, and by the periphery of cutting substrate body 11a to remove distance S, sidewall 113a is made to be formed at the position of the end 121a near electrode 12a, and then make the end 121a of electrode 12a can be positioned at the intersection 114a of first surface 111a and sidewall 113a, namely form the configuration relation of substrate body as shown in Figure 2 B 11 and electrode 12.
And preferably, the manufacture method of matrix circuit board 1 more can comprise step S24: the sidewall 113a of grinding base plate body 11a, make sidewall 113a more smooth, in order to step S30, the first conductive material 13a is formed at sidewall 113a (as shown in Figure 3 B).Certainly, step S22 and step S24 is separate step, and in other embodiment, also can omit step S22, directly in the mode of grinding, makes the end 121a of intersection 114a near electrode 12a of first surface 111a and sidewall 113a.In addition, if substrate body as shown in Figure 2 11, after electrode 12 configures (step S20), the contiguous intersection 114 in its end 121, even if the step (step S22) of cutting substrate body 11 need not be carried out, still can the sidewall 113 (step S24) of grinding base plate body 11, make more smooth the carrying out in order to subsequent step of sidewall 113.
In addition, the substrate body 11a shown in Fig. 4, also can use other conductive material to fill up the distance S of end 121a and intersection 114a, makes the first conductive material 13a and electrode 12a in electrical contact in an indirect way.Fig. 6 A is the schematic flow sheet of the manufacture method of the matrix circuit board of third embodiment of the invention, and the schematic diagram of the matrix circuit board that Fig. 6 B is formed for the manufacture method shown in foundation Fig. 6 A, please also refer to shown in Fig. 6 A and Fig. 6 B.Specifically be, the manufacture method of the matrix circuit board 1a of the 3rd embodiment, it is applied to the substrate body 11a shown in Fig. 4 and makes matrix circuit board 1a, therefore continue to use the label of the substrate body 11a of Fig. 4.Wherein, the manufacture method of the matrix circuit board 1a of the 3rd embodiment is manufacture method based on the first embodiment and more comprises step S26: form at least one second conductive material 14a in substrate body 11a, the second conductive material 14a is electrically connected with electrode 12a and the first conductive material 13a.Wherein, the material of the second conductive material 14a can be identical with the first conductive material 13a or not identical, and equally can such as but not limited to the mode of evaporation, sputter, plating, printing, ink-jet or coating, second conductive material 14a is corresponded to distance S and be formed at substrate body 11a, makes electrode 12a and the first conductive material 13a can by other the second conductive material 14a configured to be indirectly electrically connected.
No matter and be the matrix circuit board 1 according to first and second embodiment manufacture aforesaid, or the matrix circuit board 1a of foundation the 3rd embodiment manufacture, all can connect other electric devices in addition, with the conducting of the electrode 12 (12a) of gating matrix circuit substrate 1 (1a), and the same step connecting other electric devices that more comprises for the manufacture method based on the first embodiment illustrates below.
Fig. 7 A is the schematic flow sheet of the manufacture method of the matrix circuit board of fourth embodiment of the invention, and the diagrammatic cross-section of the matrix circuit board that Fig. 7 B is formed for the manufacture method shown in foundation Fig. 7 A, please also refer to shown in Fig. 7 A and Fig. 7 B.The first conductive material 13b is formed in sidewall 113b in step S30, and step S40 is by after the first conductive material 13b electric connection at least one electrode 12b, more step S50 can be comprised: engage one and be electrically connected part 15b to sidewall 113b, electric connection part 15b is made to be electrically connected at the first conductive material 13b, with when a control circuit 16b is engaged to substrate body 11b, control circuit 16b is electrically connected the first conductive material 13b through electric connection part 15b.In other words, electric connection part 15b is engaged to sidewall 113b, makes electric connection part 15b be electrically connected at the first conductive material 113b, and be electrically connected part 15b can corresponding multiple first conductive material 13b simultaneously.Therefore, the one end being electrically connected part 15b is electrically connected at the first conductive material 13b, and the other end being electrically connected part 15b is electrically connected at control circuit 16b, and control circuit 16b is arranged at the second surface 112b of substrate body 11b, and the conducting of each electrode 12b on gating matrix circuit substrate 1b.
Wherein, be electrically connected part 15b and can be for example and without limitation to data remittance drainage, soft printed circuit (FlexiblePrintCircuit, FPC) plate, electroconductive elastic sheet or Rigid Flex, the device that can be applied to according to matrix circuit board 1 and choice for use.Control circuit 16b can such as but not limited to printed circuit board (PCB) (Printedcircuitboard, PCB), glass circuit board or circuit box etc.And the first conductive material 13b arranges the matrix circuit board 1b of sidewall 113b, more conveniently can be electrically connected the operation that part 15b is arranged at sidewall 113b, reduce the wrong contraposition being electrically connected part 15b.
Fig. 8 A is the schematic flow sheet of the manufacture method of the matrix circuit board of fifth embodiment of the invention, and the diagrammatic cross-section of the matrix circuit board that Fig. 8 B is formed for the manufacture method shown in foundation Fig. 8 A, please also refer to shown in Fig. 8 A and Fig. 8 B.In the present embodiment, be the electric connection part 15b and the control circuit 16b that substitute the 4th embodiment with control integration circuit 17c, to control the conducting of each electrode 12c.As shown in Figure 8 A, the first conductive material 13c is formed in sidewall 113c in step S30, and step S40 is by after the first conductive material 13c electric connection at least one electrode 12c, more step S52 can be comprised: a control integration circuit 17c is set in second surface 112c, and is electrically connected with the first conductive material 13c.Specifically, in the present embodiment, first conductive material 13c extends to second surface 112c, and control integration circuit 17c can engage (ChipOnGlass by crystal grain with glass, COG) technology, control integration circuit 17c is directly arranged at the second surface 112c of substrate body 11c, and is directly electrically connected with the first conductive material 13c.In addition, another embodiment schematic diagram that Fig. 8 C is the matrix circuit board shown in Fig. 8 B, as shown in Figure 8 C, after first conductive material 13d extends to second surface 112d, more can be covered on the second surface 112d of part, and control integration circuit 17d directly can be arranged at the second surface 112d of substrate body 11d, to be directly electrically connected with the first conductive material 13d, to control the conducting of each electrode 12d.
In addition, the present invention separately proposes a kind of manufacture method of display device, Fig. 9 is the schematic flow sheet of the manufacture method of the display device of one embodiment of the invention, as shown in Figure 9, the manufacture method of display device is mainly and arranges a display medium in the side of a matrix circuit board, and matrix circuit board drives display medium (step S60).Wherein, arbitrary matrix circuit board 1 (1a ~ 1d) that matrix circuit board can be formed for the manufacture method of the matrix circuit board according to the aforementioned first to the 5th embodiment, the display device D1 (as Figure 10) formed after carrying out step S60 for the matrix circuit board 1b of the 4th embodiment below illustrates.
Figure 10 is the diagrammatic cross-section of a kind of display device of one embodiment of the invention, please also refer to shown in Fig. 9 and Figure 10.After matrix circuit board 1b has manufactured, display medium 2 is arranged in the side of matrix circuit board 1b in step S60, in other words, the present embodiment is driving display medium 2 luminescence for the matrix circuit board 1b of the first embodiment as display device D1, therefore the associated component feature of matrix circuit board 1b and connection relationship thereof can with reference to aforementioned.Display medium 2 can such as but not limited to liquid crystal material, inorganic light-emitting diode, Organic Light Emitting Diode, fluorophor, electrophoretic substance or electroluminescent material (ElectroLuminescent, EL) or quantum dot (QuantumDot).And the display medium 2 of the present embodiment is liquid crystal material, and display device D1 illustrates for display panels (LCD).And in other embodiment, display device can also such as LED display panel or organic LED display panel or Electronic Paper (book) etc.
Preferably, as shown in Figure 9, the manufacture method of display device more can comprise step S62, arranges a subtend substrate 3 in the opposite side of substrate body 1b.In the present embodiment, subtend substrate 3 is a colored or monochromatic optical filtering substrate, in this, with colorized optical filtering (ColorFilter, CF) substrate is example, and matrix circuit board 1b can be thin film transistor (TFT) (Thin-FilmTransistor, TFT) substrate, electrode 12b then can be data line or sweep trace, and data line or sweep trace can be only had to have be electrically connected with the first conductive material 13b, data line and sweep trace all can certainly have and be electrically connected with the first conductive material 13b.In other embodiment, subtend substrate 3 can also be the base plate for packaging of organic LED display panel or the top substrate of Electronic Paper (book), and the present embodiment is not as limit.Display device D1 more can arrange connecting piece 4 in addition, such as, be frame glue, in order to connection matrix circuit substrate 1 and subtend substrate 3, and then matrix circuit board 1, subtend substrate 3 and connecting piece 4 are formed can the space of accommodating display medium 2.And in more arranging backlight module 5, as the light source of display device D1, and can such as but not limited to cold cathode fluorescent tube (ColdCathodeFluorescentLamp, CCFL), thermic cathode fluorimetric pipe (HotCathodeFluorescentLamp, or light emitting diode (Lightemittingdiode, LED) HCFL).Due to connecting piece 4 and the set-up mode of the backlight module 5 energy understanding person that is persond having ordinary knowledge in the technical field of the present invention, repeat no more in this.
Preferably, the first conductive material 13b is extensible is arranged at connecting piece 4 or in a sidewall 31 of subtend substrate 3, to increase the first conductive material 13b and the contact area being electrically connected part 15b, guarantees good electric connection.Therefore, the manufacture method of display device D1 more can comprise: the first conductive material 13b is electrically connected subtend substrate 3.Wherein, in the mode of evaporation, sputter, plating, printing, ink-jet or coating, the first conductive material 13b can be extended to the sidewall 31 of connecting piece 4 and subtend substrate 3 in addition.Certainly, in other embodiment, also display medium, connecting piece and subtend substrate can be arranged at the side without the first conductive material matrix circuit board, and simultaneously the first conductive material is arranged at matrix circuit board, connecting piece and subtend substrate in the lump in the sidewall of the same side in the mode of evaporation, sputter, plating, printing, ink-jet or coating.In addition, in other embodiment, if luminous as the driving display medium of display device for aforesaid matrix circuit board 1, first display medium, connecting piece and subtend substrate can be arranged at the side of matrix circuit board equally, in after rejoin be electrically connected part to sidewall, make electric connection part be electrically connected at the first conductive material, or control integration circuit be set in second surface, and be electrically connected with the first conductive material, the present invention is not as limit.
Figure 11 is the diagrammatic cross-section of a kind of display device of another embodiment of the present invention, please refer to shown in Figure 11.The present embodiment is driving display medium 2 luminescence for the matrix circuit board 1d of the 5th embodiment as display device D1, and its manufacture method as hereinbefore, does not add in this and repeats.And specifically, the matrix circuit board 1d due to the present embodiment is applied to the display device D2 with backlight module 5, therefore the matrix circuit board 1d of the present embodiment is with the conducting of integrated circuit 17d control electrode 12d.And this kind first conductive material 13d extends to second surface 112d, make wherein one end of electric connection part 15d directly can be arranged at this side of second surface 112d, and be electrically connected with the first conductive material 13d, the other end is then electrically connected with control circuit 16d, and display device D2 more can be made to have narrower frame.Certainly, in other embodiment, display device can also substitute electric connection part and control circuit, directly with the conducting of control integration control circui electrode by control integration circuit, and preferably, be applied to without the need to arranging in the organic LED display panel of backlight module.
In sum, in the manufacture method of matrix circuit board of the present invention and display device, by formation first conductive material in the sidewall of the substrate body of matrix circuit board, make to be electrically connected part and can be electrically connected at the first conductive material in the direction parallel with sidewall, in other words, be electrically connected part and directly can be arranged at sidewall by being electrically connected with the first conductive material.Therefore be the first surface being arranged at substrate body compared to the electric connection part of known techniques, the first conductive material is arranged at the design of sidewall by matrix circuit board of the present invention, more can reach the use the effect with narrow side frame district that reduce space.
In addition, the first conductive material extends to the second surface of substrate body, electric connection part or control integration circuit more can be made to be arranged at the second surface of substrate body, to form narrower rim area.
The foregoing is only illustrative, but not be restricted person.Anyly do not depart from spirit of the present invention and category, and equivalent modifications or change are carried out to it, all should be contained in appended claim.
Claims (16)
1. a manufacture method for matrix circuit board, comprises the following steps:
Get a substrate body, wherein this substrate body has a relative first surface and a second surface, and this sidewall is between this first surface and this second surface;
Form plural electrode, and interconnected in this first surface;
Form one first conductive material in this sidewall, and this first conductive material is greater than the sectional area of this electrode in the laying area of this sidewall; And
This first conductive material is electrically connected at least one this electrode.
2. the manufacture method of matrix circuit board as claimed in claim 1, wherein this first conductive material extends to this second surface.
3. matrix circuit board manufacture method as claimed in claim 1 or 2, more comprises:
Engage one and be electrically connected part to this sidewall, make this electric connection part be electrically connected at this first conductive material, with when a control circuit is engaged to this substrate body, this control circuit is electrically connected this first conductive material through this electric connection part.
4. the manufacture method of matrix circuit board as claimed in claim 1 or 2, more comprises:
One control integration circuit is set in this second surface, and is electrically connected with this first conductive material.
5. the manufacture method of matrix circuit board as claimed in claim 1, wherein this first conductive material is formed at this sidewall in the mode of evaporation, sputter, plating, printing, ink-jet or coating.
6. the manufacture method of matrix circuit board as claimed in claim 1, more comprises:
Cut the periphery of this substrate body to form this sidewall.
7. the manufacture method of matrix circuit board as claimed in claim 1, more comprises:
Grind this sidewall of this substrate body.
8. the manufacture method of matrix circuit board as claimed in claims 6 or 7, wherein this end of this electrode is positioned at the intersection of this first surface and this sidewall.
9. the manufacture method of matrix circuit board as claimed in claim 1, more comprises:
Form at least one second conductive material in this substrate body, make this second conductive material be electrically connected with this electrode and this first conductive material.
10. the manufacture method of matrix circuit board as claimed in claim 9, wherein this second conductive material is formed at this substrate body in the mode of evaporation, sputter, plating, printing, ink-jet or coating.
The manufacture method of 11. 1 kinds of display device, comprises the following steps:
Get a substrate body, wherein this substrate body has a relative first surface and a second surface, and this sidewall is between this first surface and this second surface;
Form plural electrode, and interconnected in this first surface;
Form one first conductive material in this sidewall, and this first conductive material is greater than the sectional area of this electrode in the laying area of this sidewall;
This first conductive material is electrically connected at least one this electrode, to form a matrix circuit board; And
Arrange a display medium in the side of this matrix circuit board, this matrix circuit board drives this display medium.
The manufacture method of 12. display device as claimed in claim 11, wherein this first conductive material extends to this second surface.
The manufacture method of 13. display device as described in claim 11 or 12, more comprises:
Engage one and be electrically connected part to this sidewall, make this electric connection part be electrically connected at this first conductive material, with when a control circuit is engaged to this substrate body, this control circuit is electrically connected this first conductive material through this electric connection part.
The manufacture method of 14. display device as described in claim 11 or 12, more comprises:
One control integration circuit is set in this second surface, and is electrically connected with this first conductive material.
The manufacture method of 15. display device as claimed in claim 11, more comprises: arrange a subtend substrate in the opposite side of this substrate body.
The manufacture method of 16. display device as claimed in claim 15, more comprises: this first conductive material is electrically connected this subtend substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103118698A TW201517728A (en) | 2013-10-25 | 2014-05-28 | Manufacturing method of matrix circuit substrate and display apparatus |
| TW103118698 | 2014-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105278132A true CN105278132A (en) | 2016-01-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410403734.4A Pending CN105278132A (en) | 2014-05-28 | 2014-08-15 | Matrix circuit board and method for manufacturing display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105278132A (en) |
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| CN109581767A (en) * | 2019-01-16 | 2019-04-05 | 深圳市华星光电半导体显示技术有限公司 | Display module and display device |
| CN112114697A (en) * | 2019-06-20 | 2020-12-22 | 三星显示有限公司 | Display device |
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