CN105256165A - Method for preparing nano-porous copper through Cu-Al alloy slightly doped with Ni/Ti - Google Patents
Method for preparing nano-porous copper through Cu-Al alloy slightly doped with Ni/Ti Download PDFInfo
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- CN105256165A CN105256165A CN201510733214.4A CN201510733214A CN105256165A CN 105256165 A CN105256165 A CN 105256165A CN 201510733214 A CN201510733214 A CN 201510733214A CN 105256165 A CN105256165 A CN 105256165A
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Abstract
The invention provides a method for preparing nano-porous copper through Cu-Al alloy slightly doped with Ni/Ti. According to the method, the Cu-Al alloy is doped with a trace of Ni or Ti, the Cu-Al alloy is slightly modified in the dealloying process, and therefore the structure and distribution of pores of the porous copper can be adjusted effectively, the porosity is improved, the pores are adjusted to be distributed evenly, and the electrochemical performance of the nano-porous copper is further improved. Besides, the Cu-Al alloy does not need to be further processed in the early-stage procedure, the preparation process and the modification technology are simple, and popularization and industrialization are facilitated. In addition, the production cost is not increased, and the universality is better.
Description
Technical field
The present invention relates to new forms of energy technical field of nanometer material preparation, be specifically related to the method for the Cu-Al reasonable offer nano porous copper of a kind of micro-Ni doped/Ti.
Background technology
In recent years, the rise and development of nanosecond science and technology and nano material makes a class novel metal nano structural material-nano porous metal (hole wall is in nanoscale, and 1 to 100nm) receive increasing concern.Because nano porous metal has even porous structure, so there is the key property such as high-specific surface area, low density, nano porous metal material is applied on a large scale at material neighborhood.
Nano porous metal material can be prepared by different alloy systems.Calendar year 2001, J.Erlebacher, by corrosion Au-Ag reasonable offer nano-porous gold, makes de-alloy (dealloying) legal system obtain extensive concern for metal nano vesicular structure.Subsequently, all occur that lot of documents report is as the preparation of the noble metal nano porous materials such as Au, Ag, Pd, Pt both at home and abroad.These nano-porous materials all kinds of high efficient energy sources store and switch technology as fields such as lithium ion battery, ultracapacitor, Proton Exchange Membrane Fuel Cellss in obtain and study application widely.But higher production cost limits nanoporous precious metal industrial application widely.
Compared with nanoporous precious metal, nano porous copper is a kind of very attractive, cheap nano-porous materials.So far, the correlative study of nano porous copper is mainly passed through Zn-Cu, Mn-Cu, the Binary Alloy Systems such as Zr-Cu, Mg-Cu carry out de-alloy treatment and prepare nano porous copper, but these methods have some shortcoming following: 1. matrix alloy preparation is complicated, 2. price is higher, 3. the pore size of the nano porous copper prepared is uneven, and then causes its chemical property not good, cannot produce a desired effect.
For arriving desired result, carried out various modification experiment to nanoporous copper product, although there is certain effect of optimization, its modified technique is complicated, and cost is higher and be difficult to widespread use.Under the development trend of nanoporous copper product high electrochemical performance, simple preparation technology, low cost, market active demand one has electrochemical performance, preparation technology's simple low cost nanoporous copper product.How to realize premised on high electrochemical performance, obtain that technique is simple, low cost can the nanoporous copper product of widespread use be problem demanding prompt solution in current nano porous copper investigation of materials.
At present, the achievement in research of nanoporous copper product is as follows:
Hebei University of Technology, in CN103343253B patent, discloses a kind of method preparing nano porous copper, and it is simple that this material has technique, the feature that cost is low.But, the starting material that this patent adopts are amorphous ribbon, prepare amorphous ribbon, just require that corresponding mother alloy system has very high amorphous formation ability, this point compare and alloy strip, to original mother alloy choose and follow-up fusing quick-quenching prepare alloy thin band preparation technology require higher.
Xi'an Communications University is in CN104624200A patent, and disclose a kind of preparation method of nanoporous cupric oxide loaded metal catalytic material, the method prepares nanoporous cupric oxide loaded nano-precious metal particles, has good catalytic oxidation performance advantage.But the method for modifying of this patent to nano porous copper is after carrying out de-alloy to the X alloy strip containing precious metal, be placed in the air roasting 1 ~ 3 hour of 300 ~ 900 DEG C.In virgin alloy preparation process, add a small amount of precious metal add preparation cost to a certain extent, and precious metal also has a certain amount of loss in follow-up de-alloy process.High-temperature roasting modifying process subsequently requires higher to processing condition, is unfavorable for practical application.
Above-mentioned patent optimizes modified Nano Porous Cu material by different methods, but still there are following two remarkable shortcomings: the preparation of (1) starting materials requires higher (amorphous ribbon), processing condition are harsh, this greatly limits its application industrially; (2) modification technology complexity (high-temperature roasting) and introduce other subsidiary material (precious metal interpolation) to some extent, improves preparation cost.
To sum up, lack preparation technology and modification technology in the market simple, production cost is low, possesses electrochemical performance nanoporous copper product simultaneously.Therefore, develop a kind of by simple preparation technology and modification technology method obtain high electrochemical performance, lower production cost, widespread use the investigation and application of nanoporous copper product to current nanometer perforated electrodes material there is meaning of crucial importance.
Summary of the invention
The present invention carries out to solve above-mentioned problem, and object is the preparation method of the nano porous copper providing a kind of high electrochemical performance, lower production cost.
The invention provides the method for the Cu-Al reasonable offer nano porous copper of a kind of micro-Ni doped/Ti, comprise the steps:
I) according to target alloy (Cu
40al
60)
100-xy
xthe per-cent of middle composed atom quantitatively takes Ni metal, Al, Y raw material that purity is 99.99%, and metal Y is W metal or Ti, 0≤x≤5;
Ii) by step I) in load weighted raw metal be positioned in high-frequency induction smelting furnace, be first evacuated to 5 × 10 in described high-frequency induction smelting furnace
-2below Pa, then be filled with appropriate shielding gas, raw metal described in last heat fused, constant temperature certain hour, make described raw metal melting even, pour in casting mold copper mold subsequently, cooling obtains alloy pig;
Iii) by step I i) in the alloy pig that obtains broken, and by after the alloy pig melting after described fragmentation, adopt single-roller rapid quenching with quenching to be sprayed onto in rotary copper roller by aluminium alloy and prepares alloy strip, the Components Chemical formula of described alloy strip is (Cu
40al
60)
100-xy
x;
Iv) get step I ii) in the alloy strip of preparation add in de-alloy solution under water bath condition, de-alloy solution is the acid solution of in advance exhaust, and the alloy strip after de-alloy is nano porous copper;
V) nano porous copper adopts and goes ultrapure water clean, preserves in a vacuum after drying at room temperature.
In the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti provided by the invention, such feature can also be had: wherein, step I) in metal Y be W metal.
In the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti provided by the invention, such feature can also be had: wherein, step I i) in shielding gas be argon gas.
In the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti provided by the invention, such feature can also be had: wherein, step I i) in certain hour be 30min.
In the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti provided by the invention, such feature can also be had: wherein, step I ii) in broken alloy pig load the silica tube of lower ending opening, be placed in the melting of casting equipment ruhmkorff coil.
In the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti provided by the invention, such feature can also be had: wherein, step I ii) in adopt single-roller rapid quenching with quenching to be sprayed onto by aluminium alloy in rotary copper roller that rotating speed is 35 ~ 45m/s to prepare alloy strip, alloy strip width is 4 ~ 6mm, thickness is 20 ~ 30 μm.
In the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti provided by the invention, such feature can also be had: wherein, step I v) in de-alloy solution be the acid solution passing into pure nitrogen gas exhaust certain hour in advance.
In the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti provided by the invention, can also have such feature: wherein, de-alloy solution is the concentration passing into pure nitrogen gas exhaust is in advance the HCl aqueous solution of 2M.
In the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti provided by the invention, such feature can also be had: wherein, step I v) in water bath heating temperature be 85 ~ 95 DEG C.
The effect of invention
The invention provides the method for the Cu-Al reasonable offer nano porous copper of a kind of micro-Ni doped/Ti: micro-Ni or Ti is doped in Cu-Al alloy by the present invention, in de-alloy process, micromodification is carried out to Cu-Al alloy, can effectively regulate Porous Cu aperture structure and distribution, improve porosity adjustment aperture to be uniformly distributed, and then improve the chemical property of nano porous copper.And without the need to processing further Cu-Al alloy in the present invention's process in early stage, preparation technology and modification technology simply, are conducive to promoting and carry out industrialization.In addition, the present invention does not improve production cost yet, and universality is better.
Accompanying drawing explanation
Fig. 1 is the alloy strip (Cu prepared in embodiments of the invention one
40al
60)
100-ani
athe X-ray diffractogram of (a=1,2,3,4,5);
Fig. 2 is the scanning electron microscope (SEM) photograph of the nano porous copper prepared in embodiments of the invention one;
Fig. 3 is that nano porous copper obtained in embodiments of the invention one is at 0.5mol/LNaOH and 0.5mol/LCH
3cyclic voltammogram in OH mixing solutions;
Fig. 4 is the alloy strip (Cu prepared in embodiments of the invention two
40al
60)
100-ati
athe X-ray diffractogram of (a=1,2,3,4,5);
Fig. 5 is the scanning electron microscope (SEM) photograph of the nano porous copper prepared in embodiments of the invention two; And
Fig. 6 is that nano porous copper obtained in embodiments of the invention two is at 0.5mol/LNaOH and 0.5mol/LCH
3cyclic voltammogram in OH mixing solutions.
Embodiment
The technique means realized to make the present invention, creation characteristic, reach object and effect is easy to understand, following examples are specifically addressed the method for the Cu-Al reasonable offer nano porous copper of the micro-Ni doped/Ti of the present invention by reference to the accompanying drawings.
Embodiment one
I) according to target alloy (Cu
40al
60)
100-ay
athe per-cent of middle composed atom quantitatively takes Ni metal, Al, X raw material that purity is 99.99%, and metal Y is W metal, and subscript x is the atomic percentage conc of each corresponding element, x=1,2,3,4,5;
Ii) by step I) in load weighted raw metal be positioned in high-frequency induction smelting furnace, be first evacuated to 5 × 10 in high-frequency induction smelting furnace
-2below Pa, then be filled with appropriate shielding gas argon gas, last heat fused raw metal, after raw metal fusing, constant temperature 30min makes raw metal melting even, pours the rear ingot of casting mold copper mold cooling subsequently into;
Iii) by step I i) in the alloy pig that obtains broken, and the alloy pig after fragmentation is loaded the silica tube of lower ending opening, be placed in the melting of casting equipment ruhmkorff coil, after alloy molten, adopt single-roller rapid quenching with quenching to be sprayed onto by aluminium alloy in rotary copper roller that rotating speed is 35 ~ 45m/s and prepare alloy strip, alloy strip width is 4 ~ 6mm, thickness is 20 ~ 30 μm, and the Components Chemical formula of alloy strip is (Cu
40al
60)
100-xy
x;
Iv) get step I ii) in the alloy strip of preparation to add in de-alloy solution corrode 2 ~ 5h under 85 ~ 95 DEG C of condition of water bath heating, alloy strip after de-alloy is nano porous copper, the HCl aqueous solution of de-alloy solution to be the concentration passing into pure nitrogen gas exhaust 60min be in advance 1 ~ 2M;
V) nano porous copper adopts and goes ultrapure water clean, preserves in a vacuum after drying at room temperature.
Above-mentioned obtained carrying out is detected as follows:
Fig. 1 is the alloy strip (Cu prepared in the present embodiment one
40al
60)
100-ani
athe X-ray diffractogram of (a=1,2,3,4,5).
As shown in Figure 1, adopt X-ray diffraction method determination step iii) the middle alloy strip prepared, analyze the phase composite of alloy strip, gained spectral line is the diffraction peak of alloy thin band.Find by analysis, alloy thin band is by Al
2cu and Al
4cu
9two phase composites.Our experiment before shows Al
2cu and Al
4cu
9all can realize removal alloying completely, retain Porous Cu structure, this also further illustrates after alloy strip of the present invention takes off alloy can form co-continuous nanoporous steel structure.
Fig. 2 is the scanning electron microscope (SEM) photograph of the nano porous copper prepared in the present embodiment one.
As shown in Figure 2, scanning electron microscope microscopic examination step I v is adopted) middle nano porous copper sample interior tissue topography.The Cu-Al alloy strip of Ni doped can form bicontinuous structure nano porous copper after de-alloy, and average pore size is 70 ± 10nm about, average band size about 95 ± 15nm.
Fig. 3 is that nano porous copper obtained in the present embodiment one is at 0.5mol/LNaOH and 0.5mol/LCH
3cyclic voltammogram in OH mixing solutions.
Adopt three-electrode system, cyclic voltammetry measuring process iv) chemical property of nano porous copper that obtains.Test soln: 0.5mol/LNaOH solution, 0.5mol/LNaOH and 0.5mol/LCH
3oH mixing solutions; Sweep voltage :-0.25 ~ 1.25V; Scanning speed: 10mVs
-1.As shown in Figure 3, compared with the nano porous copper (NPC) prepared with the Cu-Al alloy strip of the Ni that undopes, the peak current density of the NPC for preparing of the Cu-Al alloy strip of a small amount of Ni doped electrooxidation methyl alcohol in the basic conditions significantly promotes, and the highlyest promotes 3.5 times.In the process of flyback, occurred peak current the 2nd oxidation peak to methyl alcohol upwards, this shows that the NPC that the Cu-Al alloy strip of Ni doped is prepared has higher catalytic activity.As can be seen here, in Cu-Al alloy strip, a small amount of Ni doped can improve the methanol electro-oxidizing performance of the NPC prepared; And this method of modifying is simply efficient, obtained material has good chemical property.
Embodiment two
I) according to target alloy (Cu
40al
60)
100-ay
athe per-cent of middle composed atom quantitatively takes Ni metal, Al, X raw material that purity is 99.99%, and metal Y is metal Ti, and subscript x is the atomic percentage conc of each corresponding element, x=1,2,3,4,5;
Ii) by step I) in load weighted raw metal be positioned in high-frequency induction smelting furnace, be first evacuated to 5 × 10 in high-frequency induction smelting furnace
-2below Pa, then be filled with appropriate shielding gas argon gas, last heat fused raw metal, after raw metal fusing, constant temperature 30min makes raw metal melting even, pours the rear ingot of casting mold copper mold cooling subsequently into;
Iii) by step I i) in the alloy pig that obtains broken, and the alloy pig after fragmentation is loaded the silica tube of lower ending opening, be placed in the melting of casting equipment ruhmkorff coil, after alloy molten, adopt single-roller rapid quenching with quenching to be sprayed onto by aluminium alloy in rotary copper roller that rotating speed is 35 ~ 45m/s and prepare alloy strip, alloy strip width is 4 ~ 6mm, thickness is 20 ~ 30 μm, and the Components Chemical formula of alloy strip is (Cu
40al
60)
100-xy
x;
Iv) get step I ii) in the alloy strip of preparation to add in de-alloy solution corrode 2 ~ 5h under 85 ~ 95 DEG C of condition of water bath heating, alloy strip after de-alloy is nano porous copper, the HCl aqueous solution of de-alloy solution to be the concentration passing into pure nitrogen gas exhaust 60min be in advance 1 ~ 2M;
V) nano porous copper adopts and goes ultrapure water clean, preserves in a vacuum after drying at room temperature.
Above-mentioned obtained carrying out is detected as follows:
Fig. 4 is the alloy strip (Cu prepared in the present embodiment two
40al
60)
100-ati
athe X-ray diffractogram of (a=1,2,3,4,5).
As shown in Figure 4, adopt X-ray diffraction method determination step iii) the middle alloy strip prepared, analyze the phase composite of alloy strip, gained spectral line is the diffraction peak of alloy thin band.Find by analysis, alloy thin band is by Al
2cu and Al
4cu
9two phase composites.Our experiment before shows Al
2cu and Al
4cu
9all can realize removal alloying completely, retain Porous Cu structure, this also further illustrates after alloy strip of the present invention takes off alloy can form co-continuous nanoporous steel structure.
Fig. 5 is the scanning electron microscope (SEM) photograph of the nano porous copper prepared in the present embodiment two.
As shown in Figure 5, adopt scanning electron microscope microscopic examination step I v) middle nano porous copper sample interior tissue topography, obtain: the Cu-Al alloy strip of doped Ti can form bicontinuous structure nano porous copper after de-alloy, average pore size is 85 ± 15nm about, average band size about 117 ± 22nm.
Fig. 6 is that nano porous copper obtained in the present embodiment two is at 0.5mol/LNaOH and 0.5mol/LCH
3cyclic voltammogram in OH mixing solutions.
Adopt three-electrode system, cyclic voltammetry measuring process iv) chemical property of nano porous copper that obtains.Test soln: 0.5mol/LNaOH solution, 0.5mol/LNaOH and 0.5mol/LCH
3oH mixing solutions; Sweep voltage :-0.25 ~ 1.25V; Scanning speed: 10mVs
-1.As shown in Figure 6, compared with the nano porous copper (NPC) prepared with the Cu-Al alloy strip of the Ti that undopes, the peak current density of the NPC for preparing of the Cu-Al alloy strip of a small amount of doped Ti electrooxidation methyl alcohol is in the basic conditions significantly improved, and the highlyest promotes 2.4 times.As can be seen here, in Cu-Al alloy strip, a small amount of doped Ti can improve the methanol electro-oxidizing performance of the NPC prepared; And this method of modifying is simply efficient, obtained material has good chemical property.
The effect of embodiment and effect
Present embodiments provide the method for the Cu-Al reasonable offer nano porous copper of a kind of micro-Ni doped/Ti: micro-Ni or Ti is doped in Cu-Al alloy by the present embodiment, in de-alloy process, micromodification is carried out to Cu-Al alloy, can effectively regulate Porous Cu aperture structure and distribution, improve porosity adjustment aperture to be uniformly distributed, and then improve the chemical property of nano porous copper.And without the need to processing further Cu-Al alloy in the present embodiment process in early stage, preparation technology and modification technology simply, are conducive to promoting and carry out industrialization.In addition, the present embodiment does not improve production cost yet, and universality is better.
Above embodiment be only the present invention conceive under basic explanation, do not limit the invention.And according to any equivalent transformation that technical scheme of the present invention is done, all belong to protection scope of the present invention.
Claims (9)
1. a method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti, comprises the steps:
I) according to target alloy (Cu
40al
60)
100-xy
xthe per-cent of middle composed atom quantitatively takes Ni metal, Al, Y raw material that purity is 99.99%, and metal Y is W metal or Ti, 0≤x≤5;
Ii) by step I) in load weighted raw metal be positioned in high-frequency induction smelting furnace, be first evacuated to 5 × 10 in described high-frequency induction smelting furnace
-2below Pa, then be filled with appropriate shielding gas, raw metal described in last heat fused, constant temperature certain hour, make described raw metal melting even, pour in casting mold copper mold subsequently, cooling obtains alloy pig;
Iii) by step I i) in the alloy pig that obtains broken, and by after the alloy pig melting after described fragmentation, adopt single-roller rapid quenching with quenching to be sprayed onto in rotary copper roller by aluminium alloy and prepares alloy strip, the Components Chemical formula of described alloy strip is (Cu
40al
60)
100-xy
x;
Iv) get step I ii) in the alloy strip of preparation add in de-alloy solution under water bath condition, de-alloy solution is the acid solution of in advance exhaust, and the alloy strip after de-alloy is nano porous copper;
V) described nano porous copper adopts and goes ultrapure water clean, preserves in a vacuum after drying at room temperature.
2. the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti according to claim 1, is characterized in that:
Wherein, step I) described in metal Y be W metal.
3. the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti according to claim 1, is characterized in that:
Wherein, step I i) in shielding gas be argon gas.
4. the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti according to claim 1, is characterized in that:
Wherein, step I i) in certain hour be 30min.
5. the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti according to claim 1, is characterized in that:
Wherein, step I ii) in broken alloy pig load the silica tube of lower ending opening, be placed in the melting of casting equipment ruhmkorff coil.
6. the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti according to claim 1, is characterized in that:
Wherein, step I ii) in adopt single-roller rapid quenching with quenching to be sprayed onto by aluminium alloy rotary copper roller that rotating speed is 35 ~ 45m/s prepares alloy strip, described alloy strip width is 4 ~ 6mm, thickness is 20 ~ 30 μm.
7. the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti according to claim 1, is characterized in that:
Wherein, step I v) described in de-alloy solution be the acid solution passing into pure nitrogen gas exhaust certain hour in advance.
8. the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti according to claim 7, is characterized in that:
Wherein, de-alloy solution is the concentration passing into pure nitrogen gas exhaust is in advance the HCl aqueous solution of 2M.
9. the method for the Cu-Al reasonable offer nano porous copper of micro-Ni doped/Ti according to claim 1, is characterized in that:
Wherein, step I v) in water bath heating temperature be 85 ~ 95 DEG C.
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CN108295854A (en) * | 2018-01-30 | 2018-07-20 | 河北工业大学 | A kind of multi-stage porous nano porous copper load nano cuprous oxide wire composite material and preparation method |
CN108597892A (en) * | 2018-04-28 | 2018-09-28 | 河北工业大学 | A kind of nano porous copper load copper-based oxide composite of morphology controllable and preparation method and application |
CN111826544A (en) * | 2020-06-18 | 2020-10-27 | 西安工程大学 | Preparation method of cellular nano-porous Ag-Ni conductive powder |
CN114150317A (en) * | 2021-12-09 | 2022-03-08 | 上海大学 | Preparation method of oxidation-resistant copper-based surface enhanced Raman scattering substrate |
CN114453587A (en) * | 2021-12-31 | 2022-05-10 | 西安理工大学 | Preparation method of nano porous copper-nickel alloy |
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CN108295854A (en) * | 2018-01-30 | 2018-07-20 | 河北工业大学 | A kind of multi-stage porous nano porous copper load nano cuprous oxide wire composite material and preparation method |
CN108193255B (en) * | 2018-01-30 | 2019-09-06 | 河北工业大学 | A kind of supported porous cuprous nano piece composite material and preparation method of nano porous copper |
CN108597892A (en) * | 2018-04-28 | 2018-09-28 | 河北工业大学 | A kind of nano porous copper load copper-based oxide composite of morphology controllable and preparation method and application |
CN108597892B (en) * | 2018-04-28 | 2019-12-27 | 河北工业大学 | Nano-porous copper-loaded copper-based oxide composite material with controllable morphology as well as preparation method and application thereof |
CN111826544A (en) * | 2020-06-18 | 2020-10-27 | 西安工程大学 | Preparation method of cellular nano-porous Ag-Ni conductive powder |
CN114150317A (en) * | 2021-12-09 | 2022-03-08 | 上海大学 | Preparation method of oxidation-resistant copper-based surface enhanced Raman scattering substrate |
CN114453587A (en) * | 2021-12-31 | 2022-05-10 | 西安理工大学 | Preparation method of nano porous copper-nickel alloy |
CN114453587B (en) * | 2021-12-31 | 2024-02-27 | 西安理工大学 | Preparation method of nano porous copper-nickel alloy |
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Application publication date: 20160120 |