CN105246259A - Negative film combination production system for printed circuit board and printed circuit board processing method - Google Patents
Negative film combination production system for printed circuit board and printed circuit board processing method Download PDFInfo
- Publication number
- CN105246259A CN105246259A CN201510646665.4A CN201510646665A CN105246259A CN 105246259 A CN105246259 A CN 105246259A CN 201510646665 A CN201510646665 A CN 201510646665A CN 105246259 A CN105246259 A CN 105246259A
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- China
- Prior art keywords
- equipment
- circuit board
- printed circuit
- pcb
- docking facilities
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a negative film combination production system for a printed circuit board. The negative film combination production system for the printed circuit board comprises copper deposition equipment, panel plating equipment, exposure and development equipment, etching equipment, film stripping equipment and a plurality of docking assemblies, which are in linear docking connection, wherein the copper deposition equipment, the panel plating equipment, the exposure and development equipment, the etching equipment and the film stripping equipment are in docking connection through the docking assemblies in sequence; and the docking assemblies are used for achieving automatic continuous transportation of workpieces between two pieces of adjacent equipment. The invention further provides a printed circuit board processing method on the basis of the negative film combination production system for the printed circuit board. The negative film combination production system for the printed circuit board provided by the invention has the advantages of high production efficiency, low production cost and small floor area.
Description
Technical field
The present invention relates to print circuit plates making field, particularly relate to a kind of printed circuit board (PCB) negative film combinations produce system for the production of printed circuit board (PCB) and printed circuit board (PCB) processing method.
Background technology
Along with the fast development of electronic technology, printed circuit board (PCB) is widely used in every field, all comprises corresponding printed circuit board (PCB) in nearly all electronic equipment.In order to meet the demand of the printed circuit board (PCB) of sustainable growth, printed circuit board (PCB) manufacturing enterprise and production equipment manufacturing enterprise enhance productivity by improving production equipment automaticity.Negative film production technology is the major processes that printed circuit board (PCB) is produced, and comprises heavy copper, plating, exposure imaging, etches and move back the techniques such as film.Each technique in negative film production technology is all completed by different printed circuit board (PCB) production equipments, comprises heavy copper equipment, electroplating device, exposure imaging equipment, etching machines and moves back film device etc.The docking realizing printed circuit board (PCB) each link production equipment is significant for the automated production of printed circuit board (PCB).
At present, because printed circuit board (PCB) each link production equipment has horizontal or rectilinear, and the usual volume of electroplating device is larger, the docking that usually only can realize exposure imaging equipment, etching machines in negative film production process equipment and move back film device is connected, and causes printed circuit board (PCB) each link production equipment automaticity low.In printed circuit board (PCB) production process, normally shifted cannot dock connected equipment room by printed circuit board (PCB) by manual type, make the production cost of printed circuit board (PCB) high, production efficiency is low; In addition, because each link production equipment cannot achieve a butt joint connected, cause installing space large, the selection for production site requires high.
Therefore, be necessary to provide a kind of new printed circuit board (PCB) negative film combinations produce system and printed circuit board (PCB) processing method to solve the problem.
Summary of the invention
The technical issues that need to address of the present invention are to provide that a kind of production efficiency is high, relative cost is low, floor space is little and realize the printed circuit board (PCB) negative film combinations produce system of automation completely.
The invention provides a kind of printed circuit board (PCB) negative film combinations produce system.Described printed circuit board (PCB) negative film combinations produce system comprises linearly type and docks connected heavy copper equipment, panel plating equipment, exposure imaging equipment, etching machines, moves back film device and multiple docking facilities.Described heavy copper equipment, described panel plating equipment, described exposure imaging equipment, described etching machines and described in move back film device and be connected by the docking of described docking facilities successively, described docking facilities transmits at the Automatic continuous of described two adjacent equipment rooms for realizing workpiece.
Preferably, described panel plating equipment is vertical continuous electroplating device.
Preferably, described docking facilities is respectively the combination of mechanical arm or conveyer belt or described mechanical arm and described conveyer belt.
Preferably, described docking facilities is whirligig, and its anglec of rotation is the multiple of 90 degree.
In addition, based on described printed circuit board (PCB) negative film combinations produce system, the present invention also provides a kind of printed circuit board (PCB) processing method.Described printed circuit board (PCB) processing method comprises the steps: to provide printed circuit board (PCB) and described printed circuit board (PCB) negative film combinations produce system, described printed circuit board (PCB) negative film combinations produce system comprises the described heavy copper equipment that linearly type docking is connected, described panel plating equipment, described exposure imaging equipment, described etching machines, describedly move back film device and multiple described docking facilities, described heavy copper equipment, described panel plating equipment, described exposure imaging equipment, described etching machines and described in move back film device and be connected by the docking of described docking facilities successively, docking facilities described in each is arranged between two neighbouring devices, printed circuit board (PCB) is processed, described printed circuit board (PCB) is entered by described heavy copper equipment feeding mouth, described printed circuit board (PCB) is transferred to the feeding mouth of subsequent processing equipment by multiple described docking facilities respectively from the discharging opening of a upper processing apparatus of two neighbouring devices, realize straight line by described docking facilities to connect, described printed circuit board (PCB) successively through described heavy copper equipment, described panel plating equipment, described exposure imaging equipment, described etching machines and described in move back film device, complete heavy copper, panel plating, exposure imaging, etch and move back film.
Compared with correlation technique, the docking of printed circuit board (PCB) negative film combinations produce system of the present invention by adopting docking facilities to realize each process equipment in printed circuit board (PCB) negative film production technology, make described printed circuit board (PCB) negative film combinations produce system automation degree high, while enhancing productivity, reduce production cost; In addition, described printed circuit board (PCB) negative film combinations produce system is linear structure, has the little and fabricating yard of compact conformation, floor space and requires low advantage.
Accompanying drawing explanation
Fig. 1 is the structural representation of printed circuit board (PCB) negative film combinations produce system of the present invention.
Embodiment
Below in conjunction with drawings and embodiments, the invention will be further described.
Refer to Fig. 1, Fig. 1 is the structural representation of printed circuit board (PCB) negative film combinations produce system of the present invention.Described printed circuit board (PCB) negative film combinations produce system 1 comprises linearly type and docks connected heavy copper equipment 11, panel plating equipment 13, exposure imaging equipment 15, etching machines 17, moves back film device 19 and docking facilities 10.Described heavy copper equipment 11, described panel plating equipment 13, described exposure imaging equipment 15, described etching machines 17 and described in move back film device 19 and docked by described docking facilities 10 successively and be connected, described docking facilities 10 is arranged between two neighbouring devices, and described docking facilities 10 transmits at the Automatic continuous of described two adjacent equipment rooms for realizing workpiece.
Concrete, described docking facilities 10 has multiple, wherein, comprises docking facilities 1013, docking facilities 1035, docking facilities 1057 and docking facilities 1079.The discharging opening of described heavy copper equipment 11 is docked with the feeding mouth of described panel plating equipment 13 by described docking facilities 1013 and is connected, the discharging opening of described panel plating equipment 13 is docked with the feeding mouth of described exposure imaging device 15 by described docking facilities 1035 and is connected, the discharging opening of described exposure imaging equipment 15 is docked with the feeding mouth of described etching machines 17 by described docking facilities 1057 and is connected, and the discharging opening of described etching machines 17 to be docked with the described feeding mouth moving back film device 19 by described docking facilities 1079 and is connected.
In the present embodiment, described panel plating equipment 13 is vertical continuous electroplating device, described vertical continuous electroplating device is linear pattern and compact conformation, easy realization is connected with the docking of described heavy copper equipment 11, described exposure imaging equipment 13, makes described printed circuit board (PCB) negative film combinations produce system 1 be linear structure.
Described docking facilities 10 can adopt any one of the combination of mechanical arm or conveyer belt or mechanical arm and conveyer belt respectively, thus realizes the automatic transmission of printed circuit board (PCB) between two neighbouring devices.Described docking facilities 10 is whirligig, and its anglec of rotation is the multiple of 90 degree.The multiple of so-called 90 degree herein means 90 degree, 180 degree and 270 degree because 0 degree is equivalent to not have rotation, and other multiple all with 90 degree, 180 degree and 270 degree are in like manner.
Compared with correlation technique, the docking that described printed circuit board (PCB) negative film combinations produce system 1 of the present invention realizes each process equipment in printed circuit board (PCB) negative film production technology by the described docking facilities 10 of employing is connected, make described printed circuit board (PCB) negative film combinations produce system 1 automaticity high, while enhancing productivity, reduce production cost; In addition, described printed circuit board (PCB) negative film combinations produce system 1 is linear structure, has the little and fabricating yard of compact conformation, floor space and requires low advantage.
In addition, based on described printed circuit board (PCB) negative film combinations produce system 1, the invention provides a kind of printed circuit board (PCB) processing method, comprising:
S1, printed circuit board (PCB) (not shown) and described printed circuit board (PCB) negative film combinations produce system 1 are provided, described printed circuit board (PCB) negative film combinations produce system 1 comprises the described heavy copper equipment 11 that linearly type docking is connected, described panel plating equipment 13, described exposure imaging equipment 15, described etching machines 17, describedly move back film device 19 and described docking facilities 10, described docking facilities 10 has multiple, described heavy copper equipment 11, described panel plating equipment 13, described exposure imaging equipment 15, described etching machines 17 and described in move back film device 19 and docked by described docking facilities 10 successively and be connected, described docking facilities 10 is arranged between two neighbouring devices,
S2, printed circuit board (PCB) is processed, described printed circuit board (PCB) is entered by described heavy copper equipment 11 feeding mouth, described docking facilities 10 by described printed circuit board (PCB) respectively from two neighbouring devices the discharging opening of the equipment of a upper operation be transferred to the feeding mouth of subsequent processing equipment, realize straight line by described docking facilities 10 to connect, described printed circuit board (PCB) is successively through described heavy copper equipment 11, described panel plating equipment 13, described exposure imaging equipment 15, described etching machines 17 and described in move back film device 19, and sent out by the described film device 19 that moves back, complete heavy copper, panel plating, exposure imaging, etch and move back film.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. a printed circuit board (PCB) negative film combinations produce system, it is characterized in that: comprise linearly type and dock connected heavy copper equipment, panel plating equipment, exposure imaging equipment, etching machines, move back film device and multiple docking facilities, described heavy copper equipment, described panel plating equipment, described exposure imaging equipment, described etching machines and described in move back film device and be connected by the docking of described docking facilities successively, described docking facilities transmits at the Automatic continuous of described two adjacent equipment rooms for realizing workpiece.
2. printed circuit board (PCB) negative film combinations produce system according to claim 1, is characterized in that: described panel plating equipment is vertical continuous electroplating device.
3. printed circuit board (PCB) negative film combinations produce system according to claim 1 and 2, is characterized in that: described docking facilities is respectively the combination of mechanical arm or conveyer belt or described mechanical arm and described conveyer belt.
4. printed circuit board (PCB) negative film combinations produce system according to claim 3, it is characterized in that: described docking facilities is whirligig, its anglec of rotation is the multiple of 90 degree.
5. a printed circuit board (PCB) processing method, comprises the steps:
Printed circuit board (PCB) and printed circuit board (PCB) negative film combinations produce system are provided, described printed circuit board (PCB) negative film combinations produce system comprises linearly docks connected heavy copper equipment, panel plating equipment, exposure imaging equipment, etching machines, moves back film device and multiple docking facilities, described heavy copper equipment, described panel plating equipment, described exposure imaging equipment, described etching machines and described in move back film device and be connected by the docking of described docking facilities successively, docking facilities described in each is arranged between two neighbouring devices;
Printed circuit board (PCB) is processed, described printed circuit board (PCB) is entered by described heavy copper equipment feeding mouth, described printed circuit board (PCB) is transferred to the feeding mouth of subsequent processing equipment by described docking facilities respectively from the discharging opening of a upper processing apparatus of two neighbouring devices, realize straight line by described docking facilities to connect, described printed circuit board (PCB) successively through described heavy copper equipment, described panel plating equipment, described exposure imaging equipment, described etching machines and described in move back film device, complete heavy copper, panel plating, exposure imaging, etch and move back film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510646665.4A CN105246259A (en) | 2015-09-30 | 2015-09-30 | Negative film combination production system for printed circuit board and printed circuit board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510646665.4A CN105246259A (en) | 2015-09-30 | 2015-09-30 | Negative film combination production system for printed circuit board and printed circuit board processing method |
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| Publication Number | Publication Date |
|---|---|
| CN105246259A true CN105246259A (en) | 2016-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510646665.4A Pending CN105246259A (en) | 2015-09-30 | 2015-09-30 | Negative film combination production system for printed circuit board and printed circuit board processing method |
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| CN (1) | CN105246259A (en) |
Citations (8)
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| CN201873354U (en) * | 2010-11-12 | 2011-06-22 | 汕头超声印制板（二厂）有限公司 | PCB loading and unloading machine |
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| CN103841773A (en) * | 2012-11-20 | 2014-06-04 | 深南电路有限公司 | Method and device for electroplating blind holes |
| CN104291112A (en) * | 2013-07-17 | 2015-01-21 | 深南电路有限公司 | Automatic discharging conveyer and discharging conveying method |
| CN204206616U (en) * | 2014-10-09 | 2015-03-11 | 江苏博敏电子有限公司 | A kind of processing printed circuit panel assembly |
| CN205124137U (en) * | 2015-09-30 | 2016-03-30 | 东莞市威力固电路板设备有限公司 | Printed circuit board negative combination production system |
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2015
- 2015-09-30 CN CN201510646665.4A patent/CN105246259A/en active Pending
Patent Citations (8)
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| CN201873354U (en) * | 2010-11-12 | 2011-06-22 | 汕头超声印制板（二厂）有限公司 | PCB loading and unloading machine |
| CN103132127A (en) * | 2011-12-05 | 2013-06-05 | 华通电脑股份有限公司 | Electroplating rack pinch current monitoring device and method thereof |
| CN103841773A (en) * | 2012-11-20 | 2014-06-04 | 深南电路有限公司 | Method and device for electroplating blind holes |
| CN203301867U (en) * | 2013-05-17 | 2013-11-20 | 梅州华盛电路板有限公司 | Ultra-thin vibration motor base material circuit board processing system |
| CN104291112A (en) * | 2013-07-17 | 2015-01-21 | 深南电路有限公司 | Automatic discharging conveyer and discharging conveying method |
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Application publication date: 20160113 |