CN105244292B - The method of plastic package die and removal excessive glue with irregular shape tooth socket - Google Patents
The method of plastic package die and removal excessive glue with irregular shape tooth socket Download PDFInfo
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- CN105244292B CN105244292B CN201510739604.2A CN201510739604A CN105244292B CN 105244292 B CN105244292 B CN 105244292B CN 201510739604 A CN201510739604 A CN 201510739604A CN 105244292 B CN105244292 B CN 105244292B
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- tooth socket
- excessive glue
- irregular shape
- plastic package
- package die
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
A kind of method that the present invention provides the plastic package die with irregular shape tooth socket and removes excessive glue, the plastic package die includes a die ontology and at least one tooth socket, the surrounding in the die ontology is arranged in the tooth socket, pin for accommodating lead frame, every a side of each tooth socket is recessed to the pin direction far from the lead frame, forms recessed portion so that the tooth socket forms irregular shape, to increase tooth socket area, and then increase the area of the useless modeling of punching.The advantage of the invention is that：It is designed using irregular type tooth socket, increases tooth socket area so that the width of side excessive glue also increases, and then increases punching and give up the area of mould removal side excessive glue, maintains that joint face between excessive glue and lead frame and product ontology is constant, and cohesive force is constant；Being given up using punching, mould removal side is useless to mould the feasible and effective mode that becomes, and because width is enough, pin will not be injured during this.
Description
Technical field
The present invention relates to field of semiconductor package more particularly to a kind of plastic package dies and removal with irregular shape tooth socket
The method of excessive glue.
Background technology
It is the schematic diagram after plastic packaging referring to Fig. 1.The plastic package die 11 of traditional pin class product has a tooth socket 12,
Frame 10 is placed in mold 11, and the tooth socket 12 of the mold 11 is used to accommodate the pin 13 of the frame 10, and mold 11 will ensure
Frame 10 can normally enter slot in plastic packaging, thus design when mold 11 side and frame 10 between will there are 0.03mm ~
Therefore the gap of 0.08mm has a gap h between tooth socket 12 and pin 13.Due to the presence of gap h, if when encapsulation
There is excessive glue, then excessive glue is just flowed out from the side of frame 10, and causing pin and its periphery, there are scrap rubbers.If the scrap rubber can not be effective
Removal, then can influence the welding performance of product.
There are two ways to existing removal excessive glue, when the method that traditional removal excessive glue is used after plastic packaging, such as
Excessive glue is removed using punching tool, but this kind of method can not effectively remove excessive glue, can influence the welding performance of product；Second is that
Excessive glue is removed using laser cutting after plastic packaging, although this method can thoroughly remove excessive glue, efficiency is low, laser equipment
Input cost is high.
A kind of method reducing excessive glue range is also provided in the prior art, i.e., increases resistance adhesive tape on frame, is overflow with controlling
Glue range is hindering although this method can control excessive glue within adhesive tape, and resistance adhesive tape is close with a distance from ontology, and space is not enough set
The resistance glue of product surrounding is counted, and the pin of product can leave protrusion in side, influence appearance.
Invention content
The technical problem to be solved by the invention is to provide a kind of plastic package dies with irregular shape tooth socket and removal to overflow
The method of glue can increase tooth socket area, and then increase the area of the useless mould removal side excessive glue of punching so that rush mold of giving up
Tool can more effectively remove side excessive glue.
To solve the above-mentioned problems, the present invention provides a kind of plastic package dies with irregular shape tooth socket, including a mould
The surrounding in the die ontology is arranged in tool ontology and at least one tooth socket, the tooth socket, the pin for accommodating lead frame,
Every a side of each tooth socket is recessed to the pin direction far from the lead frame, forms recessed portion so that the tooth
Slot forms irregular shape, to increase tooth socket area, and then increases the area of the useless modeling of punching.
Further, the shortest distance of pin of each tooth socket side to the lead frame is more than or equal to 0.1mm.
Further, the recessed portion of every a side of each tooth socket is trapezoidal.
Further, the recessed portion of every a side of each tooth socket is triangle.
Further, the recessed portion shape of two sides of each tooth socket is identical.
Further, the two neighboring recessed portion perforation of two neighboring tooth socket rushes useless modeling area to increase.
It is overflow using removal side after the above-mentioned plastic package die encapsulation with irregular shape tooth socket the present invention also provides a kind of
The method of glue, side excessive glue is directly removed using the useless mould of punching, wherein the punching is given up, mould covers each tooth socket side
The recessed portion on side rushes useless modeling area to increase.
Further, after removing side excessive glue, residual excessive glue is within distance packaged ontology 0.1mm.
Further, after removing side excessive glue, residual excessive glue fracture forms 0 ~ 85 degree of angle.
The advantage of the invention is that：
（1）It is designed using irregular type tooth socket, increases tooth socket area so that the width of side excessive glue also increases, in turn
The area for increasing the useless mould removal side excessive glue of punching, maintains joint face between excessive glue and lead frame and product ontology
Constant, cohesive force is constant.
（2）The design of irregular type tooth socket makes the width of excessive glue increase to 0.2mm or more, uses the useless mould of punching（It is minimum
0.1 mm of distance）The useless modeling in removal side becomes feasible and effective mode, and because width is enough, will not be during this
Injure pin.
（3）Using the mold of irregular type tooth socket, the excessive glue of product can be controlled in tooth after going useless modeling and water knife to remove scrap rubber
Slot irregularity area above, to be effectively removed excessive glue.
Description of the drawings
Fig. 1 is the schematic diagram of existing plastic package die；
Fig. 2 is the structural schematic diagram for the plastic package die that the present invention has irregular shape tooth socket；
Fig. 3 is another structural schematic diagram for the plastic package die that the present invention has irregular shape tooth socket；
Fig. 4 be the present invention have irregular shape tooth socket plastic package die plastic packaging after using punching give up mould removal side excessive glue
Schematic diagram.
Specific implementation mode
Below in conjunction with the accompanying drawings to the plastic package die provided by the invention with irregular shape tooth socket and the method for removing excessive glue
Specific implementation mode elaborate.
Plastic package die of the present invention does not include lead frame, schematically shows lead frame in attached drawing, is merely to illustrate
The position relationship of plastic package die and lead frame of the present invention, and innovative point in order to further illustrate the present invention, Fig. 2 are to have moulded
The pin of the schematic diagram being honored as a queen, lead frame is exposed outside.
Referring to Fig. 2, it includes a die ontology 21 and at least one tooth that the present invention, which has the plastic package die of irregular shape tooth socket,
Slot 22.The surrounding in the die ontology 21 is arranged in the tooth socket 22, the pin 23 for accommodating lead frame 20.According to difference
The quantity of the lead frame 20 of type, the tooth socket 22 is different, and the present invention is without limiting.
Every a side of each tooth socket 22 is recessed to the pin direction far from the lead frame, forms recessed portion
24 so that the gap h between tooth socket 22 and pin 23 increases, and the tooth socket 22 forms irregular shape, to increase tooth socket 22
Area.The present invention does not limit the shape of the recessed portion 24, as long as the area of the useless modeling of punching can be increased, for example, with reference to
The recessed portion 24 of Fig. 2, each 22 side of the tooth socket are trapezoidal, or referring to Fig. 3, the recessed portion 24 of each 22 side of the tooth socket
For triangle.Preferably, the two neighboring recessed portion 24 of two neighboring tooth socket 22 can penetrate through, to further increase the useless modeling face of punching
Product.Further, the shape of the recessed portion of two sides of each tooth socket 22 is identical, removal side excessive glue is better achieved
Purpose.
Every a side of each tooth socket 22 is recessed to the pin direction far from the lead frame, forms recessed portion
24 so that the area of tooth socket 22 increases, and the increase of 22 area of tooth socket makes the width of plastic packaging side excessive glue increase, and maintains
Joint face is constant between excessive glue and lead frame 20 and product ontology 25, and cohesive force is constant.Excessive glue width increases, useless using punching
When mould carries out rushing useless modeling, the area for rushing the excessive glue for mould covering of giving up increases, and then increases the area of the useless modeling of punching, useless in punching
It can be effectively removed excessive glue in the accuracy rating of mould, remaining excessive glue is controlled to the distance close in distance product ontology 25
It is interior, the welding performance of pin 23 is not interfered with, and pin 23 will not be injured.
Further, the shortest distance of pin 23 of each 22 side of the tooth socket to the lead frame is more than or equal to
0.1mm, so that the product of removal side excessive glue, remaining excessive glue can not interfere within distance product ontology 0.1mm
Pin welding performance, side excessive glue can control the area above (within ontology 0.1mm) in tooth socket irregularity, because never
It is risen at rule, following region excessive glue can use the useless mould of punching to ensure 100% removal.
After there is the product ontology 25 of the plastic package die plastic packaging of irregular shape tooth socket to remove side excessive glue using the present invention, production
Product ontology 25 has small side excessive glue to remain with 23 junction of pin（It individual pin sides may random noresidue excessive glue）, side
The shape size of small excessive glue is irregular, and not at same level, and side residual excessive glue fracture forms about 0 ~ 85 degree of angle,
And pin is without the protrusion cut off in the prior art when hindering adhesive tape.
The method of removal side excessive glue is rushed to use after using the present invention to have the plastic package die encapsulation of irregular shape tooth socket
Useless mould directly removes side excessive glue, and referring to Fig. 4, wherein the punching is given up, mould 26 covers the recessed of each tooth socket side
It is sunken, useless modeling area is rushed with increase, the shape for rushing the position that useless mould 26 can be punched as needed is adjusted, to adapt to
Different molds.The punching gives up mould 26 as the useless mould of existing punching, and the present invention does not repeat.
Further, using punching give up mould 26 remove side excessive glue after, residual excessive glue distance packaged ontology 0.1mm it
Interior, residual excessive glue fracture forms 0 ~ 85 degree of angle, effectively removes excessive glue so that excessive glue does not interfere with the weldability of pin
Energy.
Side excessive glue is removed after the plastic package die encapsulation using the present invention with irregular shape tooth socket, the advantage is that：Have
Effect removal pin side excessive glue；It can be going pin side excessive glue to be bundled in the mold of cast gate, without additional used device；
Product design can remain consistent with traditional design, and without protrusion, the excessive glue of side can be in tooth socket irregularity for pin side
Area above；It is compared with laser cutting mode, it is efficient, without additional input.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (9)
1. a kind of plastic package die with irregular shape tooth socket, including a die ontology and at least one tooth socket, the tooth socket are set
The surrounding in the die ontology is set, the pin for accommodating lead frame, which is characterized in that every side of each tooth socket
While being recessed to the pin direction far from the lead frame, recessed portion is formed so that the tooth socket forms irregular shape, with
Increase tooth socket area, and then increases the area of the useless modeling of punching.
2. the plastic package die according to claim 1 with irregular shape tooth socket, which is characterized in that each tooth socket side
While the shortest distance to the pin of the lead frame is more than or equal to 0.1mm.
3. the plastic package die according to claim 1 with irregular shape tooth socket, which is characterized in that each tooth socket
The recessed portion per a side is trapezoidal.
4. the plastic package die according to claim 1 with irregular shape tooth socket, which is characterized in that each tooth socket
The recessed portion per a side is triangle.
5. the plastic package die according to claim 1 with irregular shape tooth socket, which is characterized in that each tooth socket
The recessed portion shape of two sides is identical.
6. the plastic package die according to claim 1 with irregular shape tooth socket, which is characterized in that two neighboring tooth socket
Two neighboring recessed portion perforation rushes useless modeling area to increase.
7. using the method for removing side excessive glue after the plastic package die encapsulation described in claim 1 with irregular shape tooth socket,
It is characterized in that, directly removing side excessive glue using the useless mould of punching, wherein the punching is given up, mould covers each tooth socket
The recessed portion of side rushes useless modeling area to increase.
8. the method for removal side excessive glue according to claim 7, which is characterized in that after removal side excessive glue, residual is overflow
Glue is within distance packaged ontology 0.1mm.
9. the method for removal side excessive glue according to claim 7, which is characterized in that after removal side excessive glue, residual is overflow
Glue fracture forms 0 ~ 85 degree of angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510739604.2A CN105244292B (en) | 2015-11-04 | 2015-11-04 | The method of plastic package die and removal excessive glue with irregular shape tooth socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510739604.2A CN105244292B (en) | 2015-11-04 | 2015-11-04 | The method of plastic package die and removal excessive glue with irregular shape tooth socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105244292A CN105244292A (en) | 2016-01-13 |
| CN105244292B true CN105244292B (en) | 2018-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510739604.2A Active CN105244292B (en) | 2015-11-04 | 2015-11-04 | The method of plastic package die and removal excessive glue with irregular shape tooth socket |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6499105B2 (en) * | 2016-03-11 | 2019-04-10 | 東芝メモリ株式会社 | Mold |
| CN109676861A (en) * | 2018-12-26 | 2019-04-26 | 长电科技（宿迁）有限公司 | A kind of encapsulating mold structure and process for conveniently removing flash |
| CN110421791A (en) * | 2019-06-28 | 2019-11-08 | 长电科技（宿迁）有限公司 | A kind of encapsulating mold structure and process for conveniently removing flash |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1354511A (en) * | 2000-11-17 | 2002-06-19 | 矽品精密工业股份有限公司 | Semiconductor package whose package sealant possesses shoulder portion and mould for packaging said semiconductor package |
| JP2004249538A (en) * | 2003-02-19 | 2004-09-09 | Mitsubishi Rayon Co Ltd | Mold for manufacturing light guide plate and light guide plate manufacturing method |
| CN101281900A (en) * | 2007-04-04 | 2008-10-08 | 日月光半导体制造股份有限公司 | Systematism package with structure for preventing ball pad from pollution as well as manufacturing method thereof |
| CN203254606U (en) * | 2013-04-28 | 2013-10-30 | 四川明泰电子科技有限公司 | DIP (dual-in-line package) lead frame plastic package mold |
| CN205122540U (en) * | 2015-11-04 | 2016-03-30 | 上海凯虹电子有限公司 | Plastic envelope mould with tooth's socket irregularly appears |
-
2015
- 2015-11-04 CN CN201510739604.2A patent/CN105244292B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1354511A (en) * | 2000-11-17 | 2002-06-19 | 矽品精密工业股份有限公司 | Semiconductor package whose package sealant possesses shoulder portion and mould for packaging said semiconductor package |
| JP2004249538A (en) * | 2003-02-19 | 2004-09-09 | Mitsubishi Rayon Co Ltd | Mold for manufacturing light guide plate and light guide plate manufacturing method |
| CN101281900A (en) * | 2007-04-04 | 2008-10-08 | 日月光半导体制造股份有限公司 | Systematism package with structure for preventing ball pad from pollution as well as manufacturing method thereof |
| CN203254606U (en) * | 2013-04-28 | 2013-10-30 | 四川明泰电子科技有限公司 | DIP (dual-in-line package) lead frame plastic package mold |
| CN205122540U (en) * | 2015-11-04 | 2016-03-30 | 上海凯虹电子有限公司 | Plastic envelope mould with tooth's socket irregularly appears |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105244292A (en) | 2016-01-13 |
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