CN105242433B - A kind of curved-surface display module and electronic equipment - Google Patents
A kind of curved-surface display module and electronic equipment Download PDFInfo
- Publication number
- CN105242433B CN105242433B CN201510691088.0A CN201510691088A CN105242433B CN 105242433 B CN105242433 B CN 105242433B CN 201510691088 A CN201510691088 A CN 201510691088A CN 105242433 B CN105242433 B CN 105242433B
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- chip
- film
- curved
- connecting portion
- display module
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
Abstract
The present invention provides a kind of curved-surface display module, including curved face display panel, chip on film and flexible PCB, the curved face display panel is stacked with the flexible PCB and sets, the curved face display panel is equipped with first connecting portion, the flexible PCB is corresponding with the first connecting portion to be equipped with second connecting portion, the chip on film includes the both ends being oppositely arranged and connects the both sides at the both ends, one end of the chip on film is electrically connected to the first connecting portion, the other end of the chip on film is electrically connected with the second connecting portion, the both sides of the chip on film are equipped with notch.In the present invention in a manner that opening is set in chip on film both sides, the function of improving chip on film stress concentration at both sides in curved-surface display module is realized, the undesirable probability of circuit telomere is reduced so as to reach, improves the technique effect of curved-surface display module stability.
Description
Technical field
The present invention relates to display technology fields, and in particular to a kind of curved-surface display module and the application curved-surface display module
Electronic equipment.
Background technology
Liquid crystal display (Liquid Crystal Display, LCD) is due to frame stabilization, image fidelity, elimination
The advantages that space and saving energy consumption, is saved in radiation, has occupied the leading position of plane display field.Liquid-crystal apparatus includes
Backlight module and curved face display panel, curved face display panel are equipped with a plurality of crisscross scan line and data cable, scan line
Or data cable extends to curved face display panel edge, lead is formed, for being connected with the external circuit board.Due to scan line and data
The substantial amounts of line using traditional welding procedure processing difficulties, therefore can generally use mantle flip chip bonding techniques, using heat
The mode of conjunction is overlayed, by anisotropic conductive adhesive paste (Anisotropic Conductive Film, ACF) by chip on film (Chip
On Flex, or, Chip On Film, COF) conducting terminal fixation is bonded with the conducting terminal of data cable or scan line, formed
Electrical connection.
The ever-present problem of chip on film of the prior art is exactly：Chip on film fracture is bad to be constantly in height
Hair-like state.Especially for flexible displays, the Main of flexible displays is by the main mechanicals supporting part such as backboard at present
Part brake forming, liquid crystal panel is placed on it, so as to which physical bending be presented.And chip on film is as connection liquid crystal panel
End and the circuit drives carrier at flexible PCB end, rectangular shape is necessarily present with distortion and pulls, therefore it is easy to appear flips
Film breaks damage, so as to cause circuit breaker bad.Since stress bending is the extraneous factor that chip on film is broken,
It is basic reason that chip on film is broken that chip on film Resisting fractre itself is indifferent.
The content of the invention
It can effectively prevent that chip on film fracture is bad it is an object of the invention to provide one kind, it is bad to reduce circuit breaker
The curved-surface display module of the probability of generation.
Another object of the present invention is to provide a kind of electronic equipment using above-mentioned curved-surface display module.
To achieve these goals, embodiment of the present invention provides following technical solution：
The present invention provides a kind of curved-surface display module, described including curved face display panel, chip on film and flexible PCB
Curved face display panel is stacked with the flexible PCB and sets, and the curved face display panel is equipped with first connecting portion, the flexibility
Circuit board is corresponding with the first connecting portion to be equipped with second connecting portion, and the chip on film includes the both ends being oppositely arranged and company
Connect the both sides at the both ends, one end of the chip on film is electrically connected to the first connecting portion, the chip on film it is another
One end is electrically connected with the second connecting portion, and the both sides of the chip on film are equipped with notch.
Wherein, the notch is arc-shaped, and notch depth is incremented by from both ends to center.
Wherein, the notch is rectangular.
Wherein, the chip on film surface is provided with multiple in strip distribution and ditch not vertical with chip on film both sides
Slot.
Wherein, filler is filled in the groove.
Wherein, the filler is silicon.
Wherein, the chip on film surface is provided with the groove in net distribution.
Wherein, filler is filled in the groove.
Wherein, the filler is silicon.
The present invention also provides a kind of electronic equipment, including the curved-surface display module described in above-mentioned any one.
The embodiment of the present invention has the following advantages that or advantageous effect：
In the present invention by way of setting opening in chip on film both sides, realizing improves flip in curved-surface display module
The function of film stress concentration at both sides reduces the undesirable probability of circuit telomere so as to reach, it is steady to improve curved-surface display module
Qualitatively technique effect.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is curved-surface display modular structure schematic diagram of the present invention；
Fig. 2 is chip on film stress simulation figure；
Fig. 3 is first example structure schematic diagram for having the chip on film described in Fig. 1；
Fig. 4 is second example structure schematic diagram for having the chip on film described in Fig. 1；
Fig. 5 is the 3rd example structure schematic diagram for having the chip on film described in Fig. 1；
Fig. 6 is the 4th example structure schematic diagram for having the chip on film described in Fig. 1.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment belongs to the scope of protection of the invention.
As shown in Figure 1, the curved-surface display module of the present invention includes curved face display panel 10, chip on film 20 and flexible circuit
Plate 80, the construction that curved face display panel 10 is TFT substrate 11 and filter substrate 12 is bonded, a part for TFT substrate 11
It is exposed to 12 outside of filter substrate.Also, curved face display panel 11 is between TFT substrate 11 and filter substrate 12
There is liquid crystal layer 13 in gap.In addition, curved face display panel 11 is by showing that the display area of picture is shown with this according to picture signal
Show that the region i.e. non-display area beyond region is formed.In TFT substrate 11, be not stacked filter substrate 12 part (
The part exactly exposed) it is equivalent to non-display area.
TFT substrate 11 is formed by switch element (TFT elements), pixel electrode etc., wherein switch electrode (TFT elements)
It is to be separately positioned on for matrix wiring, the pixel of the clathrate being each made of scan line, signal wire on glass substrate.
Filter substrate 12 is formed by common electrode, color-filter layer etc..It is respectively equipped in the non-display area of TFT substrate 11 multiple negative
It blames to scan line (not shown) the gate drivers IC (not shown) that line scans in order and provides figure to signal wire is (not shown)
As the source electrode driver IC of data-signal.First connecting portion 110 is additionally provided on the non-display area of TFT substrate 11.
The flexible PCB 80 is stacked with the curved face display panel 10, and the specific flexible PCB 80 is set
Put close to the one side of the TFT substrate 11, on the flexible PCB 80 with first connecting portion 110 in the TFT substrate 11
Corresponding position is equipped with second connecting portion 810.In other words, the first connecting portion 110 and the second connecting portion 810
It is arranged on same side.It is connected between the flexible PCB 80 and the curved face display panel 10 by chip on film 20.Specifically
, the chip on film 20 includes the both ends being oppositely arranged and connects the both sides at the both ends, 20 one end of chip on film electricity
Property is connected to the first connecting portion 110, and the other end of the chip on film 20 is electrically connected with the second connecting portion 810.
Specifically, the both sides of the chip on film 20 are equipped with opening.Reason for doing so is that curved face display panel 10 presents physical
Bending, therefore first connecting portion 110 is also curvilinear, and thus the chip on film 20 of rectangular shape is necessarily present with distortion and draws
It pulls.Referring to Fig. 2, Fig. 2 is chip on film stress simulation figure.It is found by analysis, under 10 flexuosity of curved face display panel,
The stress of chip on film 20 is concentrated mainly on close to the both sides (i.e. color bosom) of curved face display panel 10, it is therefore desirable to covered
The both sides of brilliant film 20 are equipped with notch, to reduce stress concentration phenomenon, so as to reduce chip on film 20 occur breaking etc. it is undesirable
Risk.Specifically refer to following examples.
Embodiment one
Please refer to Fig. 3, in the embodiment of of the invention first, the notch 210 is generally curved, the depth of notch
Degree, from both ends to center at be incremented by.The notch 210 of both sides and the center symmetric setting of chip on film 20.In other words, it is described to cover
Width among brilliant film 20 is less than the width at the both ends being connected with curved face display panel and flexible PCB, and width is by centre
It is incremented by both ends.
Further, multiple grooves 215 in strip distribution are provided on the surface of chip on film 20.What is be arranged such is good
Be in, due to chip on film 20 fracture damage majority be happened at the direction parallel with the side at the both ends of chip on film 20,
Therefore, chip on film 20 provided in this embodiment is by setting 215 chip on film 20 of groove in side parallel with the side at both ends
To stress not on a horizontal line, avoid stress concentration phenomenon, so as to improve 20 bend resistance ability of chip on film, and
The structure is not influencing the flexibility of chip on film 20, so as to avoid due to chip on film 20 fracture damage caused by circuit break
Road is bad.
Further, the groove 215 and the angle of the side of the chip on film 20 are acute angle.I.e. described groove not with
The both sides of chip on film 20 are vertical.
Further, chip on film 20 provided in this embodiment by being with the addition of filling out for similar bead structures in the trench
Object (unnumbered) is filled, more adds the bend resistance ability of chip on film 20, so as to further avoid due to chip on film 20
The circuit breaker caused by damage that fractures is bad.
Further, filler is megohmite insulant, and such as the semiconductor Si races element of better softness, preferred filler is
Silicon.
Embodiment two
Referring to Fig. 4, the present embodiment and the distinctive points of embodiment one are, the surface of chip on film 20 is provided with intersection
In several first grooves 225 and second groove 226 of net structure.Due to chip on film 20 fracture damage majority be happened at
The parallel direction in the side at the both ends of chip on film 20.Therefore, chip on film 20 provided in this embodiment is by setting in netted
Several first grooves 225 and second groove 226 of structure so that chip on film 20 the side parallel direction with both ends stress not
On a horizontal line, stress concentration phenomenon is avoided, makes the more bend resistance of chip on film 20, so as to enhance chip on film 20
The tensile capacity of upper conducting wire, and the structure is not interfering with the flexible of chip on film 20 while is enhancing chip on film 20
Bend resistance ability, so as to avoid due to chip on film 20 fracture damage caused by circuit breaker it is bad.
Further, chip on film 20 provided in this embodiment by being with the addition of filling out for similar bead structures in the trench
Object is filled, more adds the bend resistance ability of chip on film 20, so as to further avoid since chip on film 20 fractures damage
Caused by circuit breaker it is bad.
Further, filler is megohmite insulant, and such as the semiconductor Si races element of better softness, preferred filler is
Silicon.
Embodiment three
Referring to Fig. 5, in the 3rd embodiment of the present invention, the notch 230 can also be rectangle, and notch 230 is set
Between both ends.The notch 230 of both sides and the center of chip on film 20 are centrosymmetric setting.In other words, the flip is thin
Width among film 20 is less than the width at the both ends being connected with curved face display panel and flexible PCB.
Further, multiple grooves 235 in strip distribution are provided on the surface of chip on film 20.Due to chip on film
The 20 damage majority that fractures is happened at the direction parallel with the side at the both ends of chip on film 20, therefore, provided in this embodiment
Chip on film 20 is by setting 235 chip on film 20 of groove in the stress of the side parallel direction with both ends not in a level
On face, stress concentration phenomenon is avoided, so as to improve 20 bend resistance ability of chip on film, is led so as to enhance in chip on film 20
The tensile capacity of line, and the structure is not interfering with the flexible of chip on film 20, while enhance chip on film 20
Bend resistance ability, so as to avoid due to chip on film 20 fracture damage caused by circuit breaker it is bad.
Further, the groove is obliquely installed, i.e., described groove and the both sides out of plumb of the chip on film 20.
Further, chip on film 20 provided in this embodiment by being with the addition of filling out for similar bead structures in the trench
Object (unnumbered) is filled, more adds the bend resistance ability of chip on film 20, so as to further avoid due to chip on film 20
The circuit breaker caused by damage that fractures is bad.
Further, filler is megohmite insulant, and such as the semiconductor Si races element of better softness, preferred filler is
Silicon.
Example IV
Referring to Fig. 6, the distinctive points of the present invention and the 3rd embodiment are, the surface of chip on film 20 is provided with friendship
Fork is in several first grooves 245 of net structure and second groove 246.Since the damage majority that fractures of chip on film 20 is happened at
The direction parallel with the side at the both ends of chip on film 20.Therefore, chip on film 20 provided in this embodiment is by setting in net
Several first grooves 245 and second groove 246 of shape structure so that chip on film 20 is in the stress of the side parallel direction with both ends
Not on a horizontal line, stress concentration phenomenon is avoided, makes 20 bend resistance of chip on film, so as to enhance in chip on film 20
The tensile capacity of conducting wire, and the structure is not interfering with the flexible of chip on film 20 while is enhancing chip on film 20
Bend resistance ability, so as to avoid due to chip on film 20 fracture damage caused by circuit breaker it is bad.
Further, chip on film 20 provided in this embodiment by being with the addition of filling out for similar bead structures in the trench
Object (unnumbered) is filled, more adds the bend resistance ability of chip on film 20, so as to further avoid due to chip on film 20
The circuit breaker caused by damage that fractures is bad.
Further, filler is megohmite insulant, and such as the semiconductor Si races element of better softness, preferred filler is
Silicon.
The present invention also provides a kind of electronic equipment using above-mentioned curved-surface display module, the electronic equipment can be hand
Any electronics with display function such as machine, tablet computer, television set, display, laptop, Digital Frame, navigator
Equipment.
Embodiments described above does not form the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical solution
Within enclosing.
Claims (4)
1. a kind of curved-surface display module, which is characterized in that described including curved face display panel, chip on film and flexible PCB
Curved face display panel is stacked with the flexible PCB and sets, and the curved face display panel is equipped with first connecting portion, the flexibility
Circuit board is corresponding with the first connecting portion to be equipped with second connecting portion, and the chip on film includes the both ends being oppositely arranged and company
Connect the both sides at the both ends, one end of the chip on film is electrically connected to the first connecting portion, the chip on film it is another
One end is electrically connected with the second connecting portion, and the both sides of the chip on film are equipped with notch, and the notch is arc-shaped, and notch is deep
Degree is incremented by from both ends to center or the notch is rectangular；The chip on film surface be provided with it is multiple in strip be distributed and not
The groove vertical with the both sides of chip on film；Or the chip on film surface is provided with the groove in net distribution.
2. curved-surface display module as described in claim 1, which is characterized in that filler is filled in the groove.
3. curved-surface display module as claimed in claim 2, which is characterized in that the filler is silicon.
4. a kind of electronic equipment, which is characterized in that including the curved-surface display module described in claim 1-3 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510691088.0A CN105242433B (en) | 2015-10-22 | 2015-10-22 | A kind of curved-surface display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510691088.0A CN105242433B (en) | 2015-10-22 | 2015-10-22 | A kind of curved-surface display module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105242433A CN105242433A (en) | 2016-01-13 |
| CN105242433B true CN105242433B (en) | 2018-05-25 |
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| CN201510691088.0A Active CN105242433B (en) | 2015-10-22 | 2015-10-22 | A kind of curved-surface display module and electronic equipment |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019080006A1 (en) * | 2017-10-25 | 2019-05-02 | 深圳市大疆创新科技有限公司 | Flexible circuit board and electronic device |
| TWI641896B (en) * | 2017-11-09 | 2018-11-21 | 友達光電股份有限公司 | Flexible electronic device |
| CN108091263A (en) * | 2017-12-14 | 2018-05-29 | 武汉华星光电半导体显示技术有限公司 | Flexible display and its driving element |
| CN112951872B (en) * | 2018-04-18 | 2023-05-12 | 友达光电股份有限公司 | Borderless display device, borderless display panel and manufacturing method thereof |
| CN110061028B (en) * | 2018-05-08 | 2021-03-23 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
| CN109814313B (en) * | 2019-03-25 | 2022-04-22 | 京东方科技集团股份有限公司 | Display module assembly and mobile terminal |
| CN110930884B (en) * | 2019-12-20 | 2021-10-01 | 京东方科技集团股份有限公司 | Display module and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1152721A (en) * | 1995-01-13 | 1997-06-25 | 精工爱普生株式会社 | Liquid crystal display and making method |
| US7168961B2 (en) * | 2004-08-07 | 2007-01-30 | Hon Hai Precision Industry Co., Ltd. | Expansible interface for modularized printed circuit boards |
| CN101165553A (en) * | 2006-10-16 | 2008-04-23 | 龙腾光电（控股）有限公司 | Mounting film for liquid crystal drive chip and method for manufacturing the same |
| CN102438394A (en) * | 2011-09-28 | 2012-05-02 | 四川虹欧显示器件有限公司 | Flexible circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150070567A (en) * | 2013-12-17 | 2015-06-25 | 삼성디스플레이 주식회사 | Display device |
-
2015
- 2015-10-22 CN CN201510691088.0A patent/CN105242433B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1152721A (en) * | 1995-01-13 | 1997-06-25 | 精工爱普生株式会社 | Liquid crystal display and making method |
| US7168961B2 (en) * | 2004-08-07 | 2007-01-30 | Hon Hai Precision Industry Co., Ltd. | Expansible interface for modularized printed circuit boards |
| CN101165553A (en) * | 2006-10-16 | 2008-04-23 | 龙腾光电（控股）有限公司 | Mounting film for liquid crystal drive chip and method for manufacturing the same |
| CN102438394A (en) * | 2011-09-28 | 2012-05-02 | 四川虹欧显示器件有限公司 | Flexible circuit board |
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| CN105242433A (en) | 2016-01-13 |
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