CN105238315B - A kind of silicon-modified epoxy packaging plastic - Google Patents
A kind of silicon-modified epoxy packaging plastic Download PDFInfo
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- CN105238315B CN105238315B CN201510816804.3A CN201510816804A CN105238315B CN 105238315 B CN105238315 B CN 105238315B CN 201510816804 A CN201510816804 A CN 201510816804A CN 105238315 B CN105238315 B CN 105238315B
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Abstract
The present invention provides a kind of silicon-modified epoxy packaging plastic, include the raw material of following parts by weight, 7 12 parts of bisphenol-A epoxy resin, 30 45 parts of cycloaliphatic epoxy resin, 38 parts of silicon-modified epoxy oligomer, 46 60 parts of crosslinking agent, 0.2 0.5 parts of accelerator, 0.2 0.5 parts of antioxidant, 13 parts of bonding agent；The good silicon-modified epoxy packaging plastic of a kind of excellent in mechanical performance, water repellency has been made in the present invention.
Description
Technical field
It is outdoor more particularly, to a kind of RGB the present invention relates to a kind of silicon-modified epoxy packaging plastic and preparation method thereof
Screen silicon-modified epoxy packaging plastic and preparation method thereof.
Background technology
The RGB early stages of development are that the lamp of three kinds of colors of RGB is inserted in the pixel that a RGB is formed on PCB, and the later stage is
Through that is, three-in-one Outdoor Full-color Display, can comparatively improve production efficiency by tri- kinds of chip packages of RGB in a lamp bead
And cost of manufacture.But single lamp RGB or three-in-one RGB are limited by the diameter of lamp bead in the presence of a spacing, can only do at present
To P6, it is difficult to accomplish more highdensity outdoor display screen.Barrier propterty is good, but visual angle is bad accurate fixed, typically in 100-110
Between, so being adapted to the big-pitch screen for doing outdoor.
Three-in-one is one kind of LED display SMD technologies, is referred to the LED wafer encapsulation of tri- kinds of different colours of RGB
According to certain pitch packages, the in same colloid is regarded SMT lamps using the whole screen of full-color LED display screen of three-in-one SMD technologies
Angle is larger with respect to DIP, and surface can do light diffusing reflection processing, and the effect drawn does not have a graininess, and even color is good.From color
For, three-in-one full-color color-division is easy compared with Three kinds of hors d'oeuvres one, and color saturation is high.Three-in-one lighted with entire surface, institute
It is more uniformly distributed with three-in-one color on the whole.It is more prone to control in terms of three-in-one integral smoothness.Always high definition LED shows
Standard technique used by display screen.
The early stage of development, because manufacturing process is complicated, maintenance difficult, cause cost very high, be generally used for high-end LED
Show product.Recent years is set automatically due to the fast development of three-in-one technology and updating for production technology, a large amount of use
Standby, SMD development is at full speed, cost reduce a lot, be current LED indoor display screen main product.And have started to open air
Display screen market penetration, but brightness and outdoor water-proof, protection against the tide, dust-proof, antistatic, the anti-oxidant letter for being always it and being difficult to go beyond
Ditch.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of environmental protection, the RGB outdoor-screens of excellent performance are changed with organosilicon
Property epoxy packages glue and preparation method thereof.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：
Silicon-modified epoxy packaging plastic, include the raw material of following parts by weight, bisphenol-A epoxy resin 7-12
Part, cycloaliphatic epoxy resin 30-45 parts, silicon-modified epoxy oligomer 3-8 parts, crosslinking agent 46-60 parts, accelerator 0.2-
0.5 part, antioxidant 0.2-0.5 parts, bonding agent 1-3 parts.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the range of viscosities of the bisphenol-A epoxy resin is in 1800-2500mPa.s, epoxide equivalent
210-220 grams/equivalent.
Further, the range of viscosities of the cycloaliphatic epoxy resin is in 35000-40000mPa.s, epoxide equivalent 140-
160 grams/equivalent.
Further, the structure of the silicon-modified epoxy oligomer is：
Wherein, n=2-4.
Further, the crosslinking agent is one kind in both methyl hexahydrophthalic anhydride, methyl tetrahydro phthalic anhydride.
Further, the bonding agent is γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane.
Further, the accelerator is the carbon -7- alkene of 1,8- diazabicylos 11.
Further, the antioxidant is 2,6- di-tert-butyl-4-methy phenols.
Silicon-modified epoxy packaging plastic preparation method of the present invention, including：Crosslinking agent 46-60 parts are added into agitator tank,
Carbon -7- alkene 0.2-0.5 the parts of 1,8- diazabicylos 11,2,6- di-tert-butyl-4-methy phenol 0.2-0.5 are added thereto
Part, 60 DEG C are warming up to, is dispersed with stirring, nitrogen protection drops to room temperature, then bisphenol-A epoxy resin is added into agitator tank
7-12 parts, cycloaliphatic epoxy resin 30-45 parts, silicon-modified epoxy oligomer 3-8 parts, γ-(2,3- the third oxygen of epoxy) propyl group
Trimethoxy silane 1-3 parts, stirred under nitrogen atmosphere is uniform, packs and is preserved at -40 DEG C.
The beneficial effects of the invention are as follows：The good silicon-modified epoxy envelope of a kind of excellent in mechanical performance, water repellency has been made
Fill glue.
Embodiment
The principles and features of the present invention are described below, and the given examples are served only to explain the present invention, is not intended to limit
Determine the scope of the present invention.
Embodiment 1
50 parts of crosslinking agent is added into agitator tank, adds 1,8- diazabicylos 11,0.4 part of carbon -7- alkene thereto, 2,
0.4 part of 6- di-tert-butyl-4-methy phenols, are warming up to 60 DEG C, are dispersed with stirring, and nitrogen protection drops to room temperature, then to agitator tank
Middle 10 parts of addition bisphenol-A epoxy resin (1900mPa.s), 36 parts of cycloaliphatic epoxy resin (36000mPa.s) is organic
5 parts of Si modification Epoxy oligomer (n=3), γ-(2,3- the third oxygen of epoxy) 2 parts of propyl trimethoxy silicane, stirred under nitrogen protection
Mix uniformly, pack and preserved at -40 DEG C.
Embodiment 2
53 parts of crosslinking agent is added into agitator tank, adds 1,8- diazabicylos 11,0.3 part of carbon -7- alkene thereto, 2,
0.3 part of 6- di-tert-butyl-4-methy phenols, are warming up to 60 DEG C, are dispersed with stirring, and nitrogen protection drops to room temperature, then to agitator tank
Middle 12 parts of addition bisphenol-A epoxy resin (2100mPa.s), 38 parts of cycloaliphatic epoxy resin (37000mPa.s) is organic
6 parts of Si modification Epoxy oligomer (n=4), γ-(2,3- the third oxygen of epoxy) 2 parts of propyl trimethoxy silicane, stirred under nitrogen protection
Mix uniformly, pack and preserved at -40 DEG C.
Embodiment 3
58 parts of crosslinking agent is added into agitator tank, adds 1,8- diazabicylos 11,0.5 part of carbon -7- alkene thereto, 2,
0.5 part of 6- di-tert-butyl-4-methy phenols, are warming up to 60 DEG C, are dispersed with stirring, and nitrogen protection drops to room temperature, then to agitator tank
Middle 9 parts of addition bisphenol-A epoxy resin (2500mPa.s), 40 parts of cycloaliphatic epoxy resin (35000mPa.s), organosilicon
4 parts of modified epoxy oligomer (n=2), γ-(2,3- the third oxygen of epoxy) 1 part of propyl trimethoxy silicane, stirred under nitrogen atmosphere
Uniformly, pack and preserved at -40 DEG C.
Embodiment 4
60 parts of crosslinking agent is added into agitator tank, adds 1,8- diazabicylos 11,0.5 part of carbon -7- alkene thereto, 2,
0.5 part of 6- di-tert-butyl-4-methy phenols, are warming up to 60 DEG C, are dispersed with stirring, and nitrogen protection drops to room temperature, then to agitator tank
Middle 12 parts of addition bisphenol-A epoxy resin (1800mPa.s), 44 parts of cycloaliphatic epoxy resin (40000mPa.s) is organic
8 parts of Si modification Epoxy oligomer (n=4), γ-(2,3- the third oxygen of epoxy) 3 parts of propyl trimethoxy silicane, stirred under nitrogen protection
Mix uniformly, pack and preserved at -40 DEG C.
Embodiment 5
52 parts of crosslinking agent is added into agitator tank, adds 1,8- diazabicylos 11,0.3 part of carbon -7- alkene thereto, 2,
0.3 part of 6- di-tert-butyl-4-methy phenols, are warming up to 60 DEG C, are dispersed with stirring, and nitrogen protection drops to room temperature, then to agitator tank
Middle 8 parts of addition bisphenol-A epoxy resin (2000mPa.s), 38 parts of cycloaliphatic epoxy resin (39000mPa.s), organosilicon
4 parts of modified epoxy oligomer (n=2), γ-(2,3- the third oxygen of epoxy) 2 parts of propyl trimethoxy silicane, stirred under nitrogen atmosphere
Uniformly, pack and preserved at -40 DEG C.
Embodiment 1-5 test results see the table below
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (5)
1. a kind of silicon-modified epoxy packaging plastic, it is characterised in that including adding 50 parts of crosslinking agent into agitator tank, thereto
1,8- diazabicylos 11,0.4 part of carbon -7- alkene is added, 2,6- 0.4 part of di-tert-butyl-4-methy phenols, 60 DEG C is warming up to, stirs
Mix scattered, nitrogen protection drops to room temperature, then bisphenol-A epoxy resin is added into agitator tank, viscosity 1900mPa.s10
Part, cycloaliphatic epoxy resin viscosity 36000mPa.s36 parts, 5 parts of silicon-modified epoxy oligomer, γ-(2,3- epoxies third
Oxygen) 2 parts of propyl trimethoxy silicane, stirred under nitrogen atmosphere is uniform, packs and is preserved at -40 DEG C；Wherein, the organosilicon
The structure of modified epoxy oligomer is：
Wherein, n=3.
2. a kind of silicon-modified epoxy packaging plastic, it is characterised in that including adding 53 parts of crosslinking agent into agitator tank, thereto
1,8- diazabicylos 11,0.3 part of carbon -7- alkene is added, 2,6- 0.3 part of di-tert-butyl-4-methy phenols, 60 DEG C is warming up to, stirs
Mix scattered, nitrogen protection drops to room temperature, then bisphenol-A epoxy resin is added into agitator tank, viscosity 2100mPa.s
12 parts, cycloaliphatic epoxy resin, 38 parts of viscosity 37000mPa.s, 6 parts of silicon-modified epoxy oligomer, γ-(2,3- epoxies
Third oxygen) 2 parts of propyl trimethoxy silicane, stirred under nitrogen atmosphere is uniform, packs and is preserved at -40 DEG C；Wherein, it is described organic
The structure of Si modification Epoxy oligomer is：
Wherein, n=4.
3. a kind of silicon-modified epoxy packaging plastic, it is characterised in that 58 parts of crosslinking agent is added into agitator tank, is added thereto
1,8- diazabicylo 11,0.5 part of carbon -7- alkene, 2,6- 0.5 part of di-tert-butyl-4-methy phenols, 60 DEG C are warming up to, stirring point
Dissipate, nitrogen protection drops to room temperature, then bisphenol-A epoxy resin is added into agitator tank, viscosity 2500mPa.s9 parts, fat
Ring race epoxy resin, viscosity 35000mPa.s40 parts, 4 parts of silicon-modified epoxy oligomer, γ-(2,3- the third oxygen of epoxy) third
1 part of base trimethoxy silane, stirred under nitrogen atmosphere is uniform, packs and is preserved at -40 DEG C；Wherein, it is described organic-silicon-modified
The structure of Epoxy oligomer is：
Wherein, n=2.
4. a kind of silicon-modified epoxy packaging plastic, it is characterised in that 60 parts of crosslinking agent is added into agitator tank, is added thereto
1,8- diazabicylo 11,0.5 part of carbon -7- alkene, 2,6- 0.5 part of di-tert-butyl-4-methy phenols, 60 DEG C are warming up to, stirring point
Dissipating, nitrogen protection drops to room temperature, then bisphenol-A epoxy resin is added into agitator tank, 12 parts of viscosity 1800mPa.s,
Cycloaliphatic epoxy resin, viscosity 40000mPa.s44 parts, 8 parts of silicon-modified epoxy oligomer, γ-(2,3- the third oxygen of epoxy)
3 parts of propyl trimethoxy silicane, stirred under nitrogen atmosphere is uniform, packs and is preserved at -40 DEG C；Wherein, the organosilicon changes
The structure of property Epoxy oligomer is：
Wherein, n=4.
5. a kind of silicon-modified epoxy packaging plastic, it is characterised in that 52 parts of crosslinking agent is added into agitator tank, is added thereto
1,8- diazabicylo 11,0.3 part of carbon -7- alkene, 2,6- 0.3 part of di-tert-butyl-4-methy phenols, 60 DEG C are warming up to, stirring point
Dissipating, nitrogen protection drops to room temperature, then bisphenol-A epoxy resin is added into agitator tank, 8 parts of viscosity 2000mPa.s,
Cycloaliphatic epoxy resin, 38 parts of viscosity 39000mPa.s, 4 parts of silicon-modified epoxy oligomer, γ-(2,3- the third oxygen of epoxy)
2 parts of propyl trimethoxy silicane, stirred under nitrogen atmosphere is uniform, packs and is preserved at -40 DEG C；Wherein, the organosilicon changes
The structure of property Epoxy oligomer is：
Wherein, n=4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510816804.3A CN105238315B (en) | 2015-11-20 | 2015-11-20 | A kind of silicon-modified epoxy packaging plastic |
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| CN201510816804.3A CN105238315B (en) | 2015-11-20 | 2015-11-20 | A kind of silicon-modified epoxy packaging plastic |
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| CN105238315A CN105238315A (en) | 2016-01-13 |
| CN105238315B true CN105238315B (en) | 2018-02-06 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105838303B (en) * | 2016-03-31 | 2019-03-12 | 航天材料及工艺研究所 | A kind of epoxy resin moisture-proof adhesive and preparation method |
| CN109593480A (en) * | 2018-12-04 | 2019-04-09 | 烟台德邦科技有限公司 | A kind of high brightness high reliability RGB epoxy packages glue |
| CN110283561B (en) * | 2019-05-30 | 2021-09-10 | 天津德高化成科技有限公司 | Packaging resin composition for LED display screen patch type discrete device and application thereof |
| CN110684506A (en) * | 2019-11-21 | 2020-01-14 | 江门大光明粘胶有限公司 | Mildew-proof glue and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101186796A (en) * | 2007-12-06 | 2008-05-28 | 上海交通大学 | Method for preparing epoxy resin adhesive |
| CN104745132A (en) * | 2015-03-17 | 2015-07-01 | 深圳市九晟光电通讯科技有限公司 | Epoxy resin adhesive for outdoor patch light beads and method for preparing epoxy resin adhesive for outdoor patch light beads |
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2015
- 2015-11-20 CN CN201510816804.3A patent/CN105238315B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101186796A (en) * | 2007-12-06 | 2008-05-28 | 上海交通大学 | Method for preparing epoxy resin adhesive |
| CN104745132A (en) * | 2015-03-17 | 2015-07-01 | 深圳市九晟光电通讯科技有限公司 | Epoxy resin adhesive for outdoor patch light beads and method for preparing epoxy resin adhesive for outdoor patch light beads |
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Effective date of registration: 20190411 Address after: 264006 Kaifeng Road 3-3 Renewable Resource Processing Demonstration Zone, Yantai Development Zone, Shandong Province Patentee after: Yantai Darbond Technology Co., Ltd. Address before: No. 98 Jinshajiang Road, Yantai Development Zone, Shandong Province, 264000 Patentee before: Yantai Debang Advanced Silicon Materials Co.,Ltd. |
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Granted publication date: 20180206 Termination date: 20191120 |