CN105230138B - 电子部件接合装置和电子部件接合方法 - Google Patents

电子部件接合装置和电子部件接合方法 Download PDF

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Publication number
CN105230138B
CN105230138B CN201580000563.3A CN201580000563A CN105230138B CN 105230138 B CN105230138 B CN 105230138B CN 201580000563 A CN201580000563 A CN 201580000563A CN 105230138 B CN105230138 B CN 105230138B
Authority
CN
China
Prior art keywords
electronic component
electrode
circuit board
maintaining part
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580000563.3A
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English (en)
Chinese (zh)
Other versions
CN105230138A (zh
Inventor
内藤健治
川上茂明
上岛直人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Athlete FA Corp
Original Assignee
Athlete FA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Athlete FA Corp filed Critical Athlete FA Corp
Publication of CN105230138A publication Critical patent/CN105230138A/zh
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Publication of CN105230138B publication Critical patent/CN105230138B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/7592—Load or pressure adjusting means, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Operations Research (AREA)
  • Wire Bonding (AREA)
CN201580000563.3A 2014-03-28 2015-02-25 电子部件接合装置和电子部件接合方法 Active CN105230138B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-070053 2014-03-28
JP2014070053 2014-03-28
PCT/JP2015/055441 WO2015146442A1 (ja) 2014-03-28 2015-02-25 電子部品接合装置および電子部品接合方法

Publications (2)

Publication Number Publication Date
CN105230138A CN105230138A (zh) 2016-01-06
CN105230138B true CN105230138B (zh) 2019-07-30

Family

ID=54194975

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580000563.3A Active CN105230138B (zh) 2014-03-28 2015-02-25 电子部件接合装置和电子部件接合方法

Country Status (4)

Country Link
JP (2) JP5964520B2 (ja)
KR (1) KR101775448B1 (ja)
CN (1) CN105230138B (ja)
WO (1) WO2015146442A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3407695B1 (en) * 2016-01-19 2022-06-22 Fuji Corporation Component mounting machine
WO2019171481A1 (ja) * 2018-03-07 2019-09-12 株式会社Ｆｕｊｉ 部品実装システム
JP7207152B2 (ja) 2019-05-16 2023-01-18 株式会社デンソー スリーブはんだ付け装置および電子装置の製造方法
US11776930B2 (en) * 2019-12-16 2023-10-03 Asmpt Singapore Pte. Ltd. Die bond head apparatus with die holder motion table

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1574258A (zh) * 2003-06-03 2005-02-02 松下电器产业株式会社 电子元件安装设备及电子元件安装方法
CN1905981A (zh) * 2004-09-01 2007-01-31 松下电器产业株式会社 控制电子组件装配装置中接触载荷的方法
CN1965401A (zh) * 2004-06-08 2007-05-16 松下电器产业株式会社 元器件安装方法及元器件安装装置
JP2010219334A (ja) * 2009-03-17 2010-09-30 Nec Corp 電子部品製造装置、方法及びプログラム
JP2011254032A (ja) * 2010-06-04 2011-12-15 Shinkawa Ltd 電子部品実装装置及びその方法
CN102959695A (zh) * 2010-06-30 2013-03-06 株式会社新川 电子器件安装装置以及电子器件安装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03246953A (ja) * 1990-02-26 1991-11-05 Toshiba Corp フェイスダウンボンディング装置
JPH0871975A (ja) * 1994-08-30 1996-03-19 Sony Corp 部品装着装置
JPH11121479A (ja) * 1997-10-17 1999-04-30 Fujitsu Ltd 半導体部品の実装方法および実装装置
JP2002231766A (ja) * 2001-02-07 2002-08-16 Kaijo Corp フリップチップボンダーのワークタッチ検出回路
JP5317753B2 (ja) * 2009-02-23 2013-10-16 アルファーデザイン株式会社 ボンダ装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1574258A (zh) * 2003-06-03 2005-02-02 松下电器产业株式会社 电子元件安装设备及电子元件安装方法
CN1965401A (zh) * 2004-06-08 2007-05-16 松下电器产业株式会社 元器件安装方法及元器件安装装置
CN1905981A (zh) * 2004-09-01 2007-01-31 松下电器产业株式会社 控制电子组件装配装置中接触载荷的方法
JP2010219334A (ja) * 2009-03-17 2010-09-30 Nec Corp 電子部品製造装置、方法及びプログラム
JP2011254032A (ja) * 2010-06-04 2011-12-15 Shinkawa Ltd 電子部品実装装置及びその方法
CN102959695A (zh) * 2010-06-30 2013-03-06 株式会社新川 电子器件安装装置以及电子器件安装方法

Also Published As

Publication number Publication date
WO2015146442A1 (ja) 2015-10-01
JPWO2015146442A1 (ja) 2017-04-13
CN105230138A (zh) 2016-01-06
KR20150128909A (ko) 2015-11-18
KR101775448B1 (ko) 2017-09-06
JP5964520B2 (ja) 2016-08-03
JP2016184760A (ja) 2016-10-20

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