CN105225968B - It automates chip and separates attaching method - Google Patents
It automates chip and separates attaching method Download PDFInfo
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- CN105225968B CN105225968B CN201510657357.1A CN201510657357A CN105225968B CN 105225968 B CN105225968 B CN 105225968B CN 201510657357 A CN201510657357 A CN 201510657357A CN 105225968 B CN105225968 B CN 105225968B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Abstract
The present invention provides a kind of automation chip separation attaching method, comprising: step A: initialization current production serial number m=0, chip level n=1 go to step B；Step B: it picks up the n-th level chip on the wafer and mounts onto m product, go to step C；Step C: judging whether there remains the n-th level chip on the wafer, if remaining, by m plus 1, goes to step B；If not remaining, by n plus 1, B is gone to step.Automation chip provided by the invention separates attaching method, by the way that the chip on wafer is carried out classification pickup and directly in attachment to product, reduces the operation such as the manual grading skill of chip and packaging, transport, fractionation, reduce manual intervention degree, it uses manpower and material resources sparingly, improves production efficiency.
Description
Technical field
The present invention relates to a kind of separation of semiconductor chip and attachment fields more particularly to a kind of separation of automation chip to paste
Dress method.
Background technique
Currently, a large amount of semiconductor chip is encapsulated in the semiconductor module of such as IGBT module one kind, and the same mould
Various electrical functionalities in block between different chips are constantly present difference, when module works normally, between this electrical functionality
Difference will cause certain chips occur electric current relatively concentrate, generate heat it is more serious or open the turn-off time it is inconsistent the problems such as, it is long-term high
Load running will result in chip failure or even module global failure, so that the reliability and safety using side are influenced, so
Semiconductor chip will do it the test of different electrical functionalities in the final stage of production to ensure the functionality of product, utilize these
Test result can form a kind of data file wafer figure (wafer map) in conjunction with the shape of wafer, and wafer figure divides chip
For different grades, by the way that the chip package of grade of the same race can be prevented chip chamber to the full extent into the same module
Existing electrical functionality difference bring adverse effect, and patch process is classified chip as in semiconductor packaging industry
With the direct process of attachment, it is responsible for important function.
Existing chip sorter and mounting method are chip separation attachment, chip separation attachment need first manually by chip from
It is removed on wafer with sucking pen, then different grades of chip is placed into different carriers according to wafer figure, then by packet
The processes such as dress and transport finally again mount chip into product according to grade, are a kind of typical separation attachment as shown in Figure 1
Method, the mounted major defect of existing separation are:
1) after separating chip from wafer, no matter transport and store using what mode, this process core
It is unavoidable between piece and carrier to generate friction even collision, chip can be caused to wear, it, can if abrasion is more serious
Cause chip rejection；If environment or carrier are not clean enough, chip can also be polluted, thus to subsequent welding, bonding
Have an adverse effect etc. each process.
2) manual intervention degree is higher, needs to expend more man power and material, and artificial separating chips larger workload relies on
The proficiency of personnel and degree is concentrated, be easy to be influenced by external and internal factor, so that chip sorter error occur
The problems such as, it is unfavorable for being mass produced；Artificial separation is needed using the factory services such as the tools such as sucking pen, carrier and vacuum, compressed gas
Resource, the personnel that are also required to after separation, which pack, transport, splitting etc., to be operated, and is spent human and material resources.
Summary of the invention
The present invention provides a kind of automation chip separation attaching method, to solve chip separation in the prior art and patch
Dress separately carries out, and manual intervention degree is higher, needs the problem of expending more man power and material.
One aspect of the present invention provides a kind of automation chip separation attaching method, comprising:
Step A: initialization current production serial number m=0, chip level n=1 go to step B；
Step B: it picks up the n-th level chip on wafer and mounts onto m product, go to step C；
Step C: judging whether there remains the n-th level chip on wafer, if remaining, by m plus 1, goes to step B；If not remaining,
By n plus 1, B is gone to step.
Further, step B is specifically included:
Step b1: judging whether there is the n-th level chip on wafer, if so, going to step b2；
Step b2: judge whether m product needs the n-th level chip, if desired, the n-th grade core is then picked up from wafer
Piece is simultaneously mounted onto m product, goes to step C.
Further, step A further include: chip level type N on initialization wafer；
In step C, if not remaining, by n plus 1, B is gone to step, is specifically included:
Step c1: judging whether n is less than chip level type N, if being less than, n is added 1, goes to step B；If being not less than, stream
Journey terminates.
Further, working area is set, chip each a that N kind grade is placed in working area；
After stepb, before step c1, further include,
Step c0: judge whether m product also needs the n-th level chip, if desired, then pick up n-th etc. in working area
Grade chip is simultaneously mounted onto m product, goes to step c1.
Further, working area has multiple, and each working area stores a kind of level chip.
Another aspect of the present invention provides a kind of automation chip separation attaching method, comprising:
Step A2: initialization current wafer m2=0, chip level n2=1 go to step B2；
Step B2: the n-th 2 level chips on m2 wafer are picked up and are mounted onto product, C2 is gone to step；
Step C2: judge whether to there remains the n-th 2 level chips on m2 wafer if remaining and, by n2 plus 1, go to step B2；
If not remaining, by m2 plus 1, B2 is gone to step.
Further, step B2 is specifically included:
Step b1 ': judge whether product needs the n-th 2 level chips, if desired, go to step b2 '；
Step b2 ': judging whether to have on m2 wafer the n-th 2 level chips, if so, then picking up the n-th 2 from m2 wafer
Level chip is simultaneously mounted onto product, goes to step C2.
Further, step A2 further include: chip level type N2 on initialization wafer；In step C2, if remaining, by n2
Add 1, go to step B2, specifically includes:
Step c1 ': judging whether n2 is less than chip level type N2, if being less than, n2 is added 1, goes to step B2；If not small
In process terminates.
Further, working area is set, and after step B2 ', before step c1 ', further includes,
Step c0 ': the n-th 2 level chips are picked up from m2 wafer and are placed into working area, go to step c1 '.
Further, working area has multiple, and each working area stores a kind of level chip.
Automation chip provided by the invention separates attaching method, by the way that the chip on wafer is carried out classification pickup and straight
Attachment is connect to product, reduces the operation such as the manual grading skill of chip and packaging, transport, fractionation, reduces manual intervention degree,
It uses manpower and material resources sparingly, improves production efficiency.
Detailed description of the invention
The invention will be described in more detail below based on embodiments and refering to the accompanying drawings.Wherein:
Fig. 1 is typically to separate attaching method flow diagram in the prior art；
Fig. 2 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention one；
Fig. 3 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention two；
Fig. 4 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention three；
Fig. 5 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention four；
Fig. 6 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention five；
Fig. 7 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention six.
In the accompanying drawings, identical component uses identical appended drawing reference.The attached drawing is not drawn according to the actual ratio.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings.
Embodiment one
Fig. 2 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention one, such as Fig. 2 institute
Show, automation chip of the invention separates attaching method, comprising:
Step A: initialization current production serial number m=0, chip level n=1 go to step B.
Specifically, wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore claim
For wafer；The production of semiconductor chip is to be fabricated into circuit on wafer by the physico-chemical process of various complexity, is producing
Final stage carry out the test of different electrical functionalities to ensure the functionality of product, and utilize these test results in conjunction with crystalline substance
Figure caused by round shape is exactly wafer figure.Wafer figure as unit of chip, by test result different colours, shape or
Code is indicated on the position of each chip, and the chip of mark same color, shape or code is same grade.By current production
Serial number be initialized as 0, chip level is initialized as 1, i.e. chip level is mounted since the 1st grade, can also according to the actual situation,
Setting is mounted since the 2nd grade or 3rd level, and details are not described herein.
Step B: it picks up the n-th level chip on wafer and mounts onto m product, go to step C.
Product is mounted specifically, successively picking up different grades of chip on wafer.As first picked up the 1st grade core
Piece, then the 2nd level chip is picked up, and so on, it has all been picked up until by chip all on wafer.
Step C: judging whether there remains the n-th level chip on wafer, if remaining, goes to step E；If not remaining, go to step
F。
Specifically, due in step B, if the n-th level chip number is not less than the n-th grade core needed for m product on wafer
The piece number then has remaining n-th level chip on wafer, conversely, the n-th level chip on wafer can be taken, on wafer not
Remaining n-th level chip, specifically any situation is judged, therefore, judges whether there remains in step C on wafer
N-th level chip goes to step E if remaining；If not remaining, F is gone to step.Step E: by m plus 1, B is gone to step.Specifically, judgement
Whether there remains the n-th level chip on wafer, if remaining, by m plus 1, i.e., after m product has been mounted the n-th level chip, changes
M+1 product is mounted, and B is gone to step.
Step F: if not remaining, by n plus 1, B is gone to step.Specifically, judge whether there remains the n-th level chip on wafer,
If not remaining, by n plus 1, i.e., the (n+1)th level chip on wafer be picked up, go to step B.
Automation chip provided by the invention separates attaching method, by the way that the chip on wafer is carried out classification pickup and straight
Attachment is connect to product, reduces the operation such as the manual grading skill of chip and packaging, transport, fractionation, reduces manual intervention degree,
It uses manpower and material resources sparingly, improves production efficiency, meanwhile, this method is by preferentially picking up the chip on wafer and pasting according to grade
It is attached on product, the chip on wafer, which has not picked up, does not change next wafer, can reduce chip on wafer to the full extent
Waste, economize on resources.
Embodiment two
Fig. 3 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention two, such as Fig. 3 institute
Show, automation chip of the invention separates attaching method, comprising:
Step 101: chip level type N, product sum M, current production m=0 on initialization wafer, chip level n=
1。
Specifically, chip level type N, that is, different colours number, different shape number or different code indicate number, herein
Chip level type N can be the chip level species number for a wafer, can also be the chip level for a collection of wafer
Species number can specifically be selected according to the actual situation, be for a collection of wafer with chip level type N in the present embodiment
Chip level species number for be illustrated.The product number of product sum M, that is, to be mounted.In addition, by the serial number of current production
Be initialized as 0, chip level is initialized as 1, i.e. chip level is mounted since the 1st grade, can also according to the actual situation, be arranged from
2nd grade or 3rd level start to mount, and details are not described herein.
Step 102: judging whether there is the n-th level chip on wafer, if so, going to step 103；If no, going to step 105.
Specifically, first determining whether there is the n-th grade core on wafer when preparation mounts the n-th level chip to product
Piece, because chip level categories N is the chip level species number for a collection of wafer in the present embodiment, in this wafer
Certain level chip occurred, may not occur in another wafer, so also needing to whether there is the n-th grade on wafer
Chip is judged, if so, going to step 103；If no, going to step 105.
Step 103: judging whether m product needs the n-th level chip, if desired, go to step 106；If not needing, turn step
Rapid 107.
Specifically, because the n-th level chip may do not needed, or for having mounted n-th for certain products
The product of level chip also no longer needs the n-th level chip, so also to judge m when there is the n-th level chip on wafer
Whether product needs the n-th level chip, if desired, goes to step 106；If not needing, 107 are gone to step.
Step 104: judging whether there remains the n-th level chip on wafer, if remaining, turn 107；If not remaining, turn to walk
Rapid 105.
Specifically, when there is the n-th level chip on wafer, and when m product the n-th level chip of needs, it is picked up from wafer
It takes the n-th level chip and mounts onto m product, since m product may may require that multiple n-th level chips, so needing
Needed for judging whether the n-th level chip on wafer meets m product, therefore the n-th level chip is picked up from wafer and is being pasted
After being attached on m product, judge that the n-th level chip on wafer is by whether there remains the n-th level chip on wafer
Needed for no satisfaction m product, if remaining, turn 107 and execute；If not remaining, 105 execution are gone to step.
Step 105: judging whether n is less than chip level type N and goes to step 108 if being less than；If being not less than, process knot
Beam.
Specifically, going to step 105, there are two types of situations, the first situation is: when there is no the n-th level chip on wafer,
Due to needing to discuss at this time to the (n+1)th level chip, so need to first determine whether n is less than chip level type N, if
It is less than, goes to step 108 execution；If being not less than, process terminates.
Second situation is: when there is the n-th level chip on wafer, and when m product the n-th level chip of needs, from crystalline substance
The n-th level chip is picked up on circle and is mounted onto m product, since m product may may require that multiple n-th level chips, institute
Needed for whether meeting m product with the n-th level chip needed to judge on wafer, therefore the n-th grade core is picked up from wafer
After on piece and attachment to m product, the n-th grade on wafer is judged by whether there remains the n-th level chip on wafer
Needed for whether chip meets m product, if not remaining, illustrate that the n-th level chip on wafer at this time has run out, next needs
(n+1)th level chip judged, therefore judge whether n is less than chip level type N, if being less than, that is, illustrate n at this time
It is also less than chip greatest level, can also continue to judge the chip of lower level, go to step 108 and continue to execute；If no
It is less than, illustrates that n at this time has arrived chip greatest level, the gradational chip of institute has judged to finish, and process terminates.
Step 106: picking up the n-th level chip from wafer and mount onto m product, go to step 104.
Specifically, when there is the n-th level chip on wafer, and when m product the n-th level chip of needs, it can be directly from crystalline substance
The n-th level chip is picked up on circle and is mounted onto m product, goes to step 104.
Step 107: by m plus 1, going to step 103.
Specifically, going to step 107 there are two types of situation, the first situation is: when having the n-th level chip, and m on wafer
It when product does not need the n-th level chip, needs to analyze m+1 product, step 107 execution can be gone at this time.
Second situation is: when there is the n-th level chip on wafer, and when m product needs the n-th level chip, from wafer
The n-th level chip of upper pickup is simultaneously mounted onto m product, since m product may may require that multiple n-th level chips, so
Needed for needing to judge whether the n-th level chip on wafer meets m product, therefore, the n-th level chip is picked up from wafer
And after mounting onto m product, the n-th grade core on wafer is judged by whether there remains the n-th level chip on wafer
Needed for whether piece meets m product, if remaining, illustrate that m product has been completed the attachment to the n-th level chip, at this point, can
The attachment that m+1 product continues the n-th level chip is changed, i.e., m is added 1, goes to step 103 execution.
Further, in step 107, increase the step of judging m value, if the value of m is equal to product sum M -1
(because the serial number of m is since 0, the maximum value of m can be only M-1), illustrates that the value of m at this time cannot be further added by, needs
Terminate process；If the value of m is less than product sum M -1, illustrates that the value of m at this time can also increase, then m is added 1, go to step 103 execution.
Further, in step 107, judge that m adds whether 1 value is greater than M-1, if more than then adding 1 value to take M m
Then the remainder values are assigned to m, go to step 103 by remainder；If being not more than, m is added 1, goes to step 103.It can guarantee and work as in this way
When having the n-th level chip on wafer, one time whether the n-th level chip can be needed to all product inquiries.
Further, a counter can be set in step 107, which continuously jumps to from step 103
The number of step 107, if intermediate once jump to step 106, counter O reset, when counters count from step 103
When number reaches product sum M, process this terminate.When reaching product sum M due to the number when counters count, show at this time
All products have been traversed once, have occurred endless loop in order to prevent, that is, has traversed all products and does not need the n-th level chip
When, process can be terminated into the analysis to the (n+1)th level chip, that is, go to step 105 execution.
Step 108: by n plus 1, going to step 102.
Specifically, when there is the n-th level chip on wafer, and when m product the n-th level chip of needs, it is picked up from wafer
It takes the n-th level chip and mounts onto m product, since m product may may require that multiple n-th level chips, so needing
Needed for judging whether the n-th level chip on wafer meets m product, therefore the n-th level chip is picked up from wafer and is being pasted
After being attached on m product, judge that the n-th level chip on wafer is by whether there remains the n-th level chip on wafer
Needed for no satisfaction m product, if not remaining, illustrate that the n-th level chip on wafer at this time has run out, next needs to
N+1 level chip is judged, therefore judges whether n is less than chip level type N, if being less than, that is, illustrates that n at this time is also less than
Chip greatest level can also continue to judge the chip of lower level, by n plus 1, go to step 102 and continue to execute.
Automation chip provided by the invention separates attaching method, by the way that the chip on wafer is carried out classification pickup and straight
Attachment is connect to product, reduces the operation such as the manual grading skill of chip and packaging, transport, fractionation, reduces manual intervention degree,
It uses manpower and material resources sparingly, improves production efficiency, meanwhile, this method is by preferentially picking up the chip on wafer and pasting according to grade
It is attached on product, the chip on wafer, which has not picked up, does not change next wafer, can reduce chip on wafer to the full extent
Waste, economize on resources.
Embodiment three
The present embodiment is the supplementary explanation carried out on the basis of the above embodiments.
Fig. 4 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention three, such as Fig. 4 institute
Show, automation chip of the invention separates attaching method, comprising:
Step 101 ': chip level type N, product sum M, current production m=0 on initialization wafer, chip level n=
1。
Step 102 ': judge whether there is the n-th level chip on wafer, if so, going to step 103 '；If no, going to step
105’。
Step 103 ': judge whether m product needs the n-th level chip, if desired, go to step 106 '；If not needing, turn
Step 107 '.
Above-mentioned steps 101 ' -103 ' are consistent with the step 101-103 in embodiment two, and for details, reference can be made to phases in embodiment two
The record answered, details are not described herein.
Step 104 ': judge whether there remains the n-th level chip on wafer, if remaining, turns 107 '；If not remaining, turn
Step 105 '.
This step is the supplementary explanation carried out on the basis of step 104.
Further, working area is set, chip each a that N kind grade is placed in working area；If without residue on wafer
N-th level chip, then go to step 105 ', specifically includes:
Step 109 ': judge whether m product also needs the n-th level chip, if desired, go to step 110 '；If not needing,
Go to step 105 '.
It goes to step 110 ': picking up the n-th level chip in working area and mount onto m product, go to step 105 '.
Specifically, setting working area, chip each a that N kind grade is placed in working area, the value of a can be 5 or 10,
It can specifically be configured according to the actual situation.Be arranged working area can also be in initial phase, i.e. step 101 ' in setting.
If there are two types of situations at this time, the first situation is that the n-th level chip is rigid without the n-th level chip of residue on wafer
M product has been mounted well, and second situation is that the n-th level chip has not enough mounted m product, until then which kind of situation, also needs
Continue to judge, that is, judges whether m product also needs the n-th level chip, if desired, illustrate to meet above-mentioned second situation,
The n-th level chip in working area is picked up at this time and is mounted onto m product, 105 ' execution are gone to step, if not needing, is illustrated full
The first above-mentioned situation of foot directly goes to step 105 ' execution at this time.
Further, the value of a is the total quantity of each level chip needed for M product, i.e., a is taken a kind of extreme case
All chips that maximum value, i.e. M product need all are same grades, are each level chip needed for M product by a value
Total quantity, it is ensured that when not having qualified chip on wafer in any case, can all be picked up from working area corresponding
Chip is simultaneously mounted onto m product.
Further, working area has N number of, and each working area stores a kind of level chip.The chip of every kind of grade is separated
Storage can facilitate identification when picking up, the quantity for each level chip that working area more intuitive can also be watched to store,
Convenient for accordingly adding.
Step 105 ': judge whether n is less than chip level type N and goes to step 108 ' if being less than；If being not less than, process knot
Beam.
Step 106 ': the n-th level chip is picked up from wafer and is mounted onto m product, goes to step 104 '.
Above-mentioned steps 105 ' -106 ' are consistent with the step 105-106 in embodiment one, and for details, reference can be made to phases in embodiment one
The record answered, details are not described herein.
Step 107 ': by m plus 1, go to step 103 '.
This step is the supplementary explanation carried out on the basis of step 107.
Further, in step 107 ' in, increase the step of judging m value, if the value of m is equal to product sum M -1
(because the serial number of m is since 0, the maximum value of m can be only M-1), illustrates that the value of m at this time cannot be further added by, needs
Terminate the process, at this time pick up the n-th level chip on wafer and be placed in working area, then goes to step 105 ' execution；
If the value of m is less than product sum M -1, illustrates that the value of m at this time can also increase, then m is added 1, goes to step 103 ' execution.
Further, can be in step 107 ' in a counter is set, the counters count is from step 103 ' continuously jump
To step 107 ' number, if centre once from step 103 ' jump to step 106 ', counter O reset, when counter is united
When the number of meter reaches product sum M, process this terminate.When reaching product sum M due to the number when counters count, show
All products have been traversed once at this time, have occurred endless loop in order to prevent, that is, has traversed all products and does not need the n-th grade core
When piece, the n-th level chip on wafer is picked up and is placed in working area, subsequently into the analysis to the (n+1)th level chip,
Go to step 105 ' execution.
Step 108 ': by n plus 1, go to step 102 '.
This step and step 108 are consistent.
Automation chip provided by the invention separates attaching method, by the way that the chip on wafer is carried out classification pickup and straight
Attachment is connect to product, reduces the operation such as the manual grading skill of chip and packaging, transport, fractionation, reduces manual intervention degree,
It uses manpower and material resources sparingly, improves production efficiency, meanwhile, this method is by preferentially picking up the chip on wafer and pasting according to grade
It is attached on product, the chip on wafer, which has not picked up, does not change next wafer, if all products of the chip on wafer are not
When needing again, which can be picked up and be placed in working area, the waste of chip on wafer can be reduced to the full extent, saved
Resource.
Example IV
Fig. 5 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention four, such as Fig. 5 institute
Show, automation chip of the invention separates attaching method, comprising:
Step A2: initialization current wafer m2=0, chip level n2=1 go to step B2.
Specifically, the serial number of current wafer is initialized as 0, chip level is initialized as 1, i.e., chip level is from the 1st grade
Start to mount, can also be arranged and be mounted since the 2nd grade or 3rd level, details are not described herein according to the actual situation.
Step B2: the n-th 2 level chips on m2 wafer are picked up and are mounted onto product, C2 is gone to step.
Product is mounted specifically, successively picking up different grades of chip on m2 wafer.As first picked up m2 crystalline substance
The 1st level chip on circle, the 1st level chip on m2+1 wafer, and so on, until meeting product to the 1st grade core
Needed for piece, until meeting the needs of product is to all level chips.
Step C2: judge whether to there remains the n-th 2 level chips on m2 wafer if remaining and go to step D2；If not remaining,
Go to step E2.
Specifically, due in step B2, if the n-th 2 level chip numbers are not less than needed for product the n-th 2 etc. on m2 wafer
Grade chip-count then has remaining the n-th 2 level chip on m2 wafer, conversely, the n-th 2 level chips on m2 wafer can quilt
It takes, not remaining the n-th 2 level chip on m2 wafer, specifically any situation is judged, therefore, in step C2
Judge whether to there remains the n-th 2 level chips on m2 wafer and goes to step D2 if remaining；If not remaining, E2 is gone to step.
Step D2: by n2 plus 1, B2 is gone to step.Specifically, judge whether to there remains the n-th 2 level chips on m2 wafer,
If remaining, by n2 plus 1, i.e., after product has been mounted the n-th 2 level chips, the n-th 2+1 level chip is changed to be mounted, is gone to step
B2。
Step E2: by m2 plus 1, B2 is gone to step.Specifically, judge whether to there remains the n-th 2 level chips on m2 wafer,
If not remaining, by m2 plus 1, i.e., the n-th level chip on m2 wafer be picked up, go to step B2.
Automation chip provided by the invention separates attaching method, picks up the chip on wafer by classification and directly mounts
Onto product, reduces the operation such as the manual grading skill of chip and packaging, transport, fractionation, reduce manual intervention degree, save people
Power material resources improve production efficiency, meanwhile, this method by preferentially meeting product on wafer the needs of different stage chip,
Chip on wafer is classified pickup according to product demand and is mounted, is carried out again after being completed to a product attachment next
The attachment of a product, it is ensured that the integrality of product attachment avoids the attachment for omitting certain chips during attachment, causes to produce
Product defect.
Embodiment five
Fig. 6 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention five, such as Fig. 6 institute
Show, automation chip of the invention separates attaching method, comprising:
Step 201: initializing chip level type N2, wafer sum M 2, current wafer m2=0, chip level n2=1.
Specifically, the chip level type N meaning in chip level type N2 and one step 101 of embodiment is consistent, wafer
Sum M 2 can be configured according to the actual situation, initialize current wafer m2 serial number 0, and chip level n2 is 1.
Step 202: judging whether product needs the n-th 2 level chips, if desired, go to step 203；If not needing, go to step
205。
Specifically, when preparation is to product the n-th 2 level chip of attachment, first determine whether product needs the n-th 2 grade cores
Piece, if desired, go to step 203；If not needing, 205 are gone to step.
Step 203: judging whether to have on m2 wafer the n-th 2 level chips, if so, going to step 206；If no, going to step
207。
Specifically, when judging that product needs the n-th 2 level chip, not necessarily there are the n-th 2 level chips, institute on m2 wafer
Also to need to judge whether to have on m2 wafer the n-th 2 level chips, if not having, to go to step 207 if so, going to step 206 at this time.
Step 204: judging whether to there remains the n-th 2 level chips on m2 wafer if not remaining and go to step 207；If surplus
It is remaining, then go to step 205.
Specifically, when product needs the n-th 2 level chips, and when having the n-th 2 level chip on m2 wafer, from m2 wafer
It is upper to pick up the n-th 2 level chips and mount onto product, since product may may require that multiple the n-th 2 level chips, so from
After picking up the n-th 2 level chips on m2 wafer and mounting onto product, it is also necessary to judge whether to there remains the on m2 wafer
N2 level chip goes to step 207 if not remaining；If remaining, 205 are gone to step.
Step 205: judging whether n2 is less than chip level type N2 and goes to step 208 if being less than；If being not less than, process knot
Beam.
Specifically, going to step 205 there are two types of situation, the first situation is: when product does not need the n-th 2 level chip,
Due to needing to discuss at this time to the n-th 2+1 level chip, so needing to first determine whether n2 is less than chip level type
N2 goes to step 208 execution if being less than；If being not less than, process terminates.
Second situation is: when product needs the n-th 2 level chips, and when having the n-th 2 level chip on m2 wafer, from the
The n-th 2 level chips are picked up on m2 wafer and are mounted onto product, since product may may require that multiple the n-th 2 level chips, institute
After picking up the n-th 2 level chips from m2 wafer and mounting onto product, it is also necessary to whether also to judge on m2 wafer
Remaining the n-th 2 level chip then can analyze at this time the other chip of next stage, therefore is sentenced if judging result is that there remains
Whether disconnected n2 is less than chip level type N2, if being less than, that is, illustrates that n2 at this time is also less than chip greatest level, can also continue to
The chip of lower level is judged, 208 is gone to step and continues to execute；If being not less than, illustrate that n2 at this time has arrived chip maximum
Grade, the gradational chip of institute have judged to finish, and process terminates.
Step 206: picking up the n-th 2 level chips from m2 wafer and mount onto product, go to step 204.
Specifically, when product needs the n-th 2 level chips, and when having the n-th 2 level chip on m2 wafer, directly from m2 crystalline substance
The n-th 2 level chips are picked up on circle and are mounted onto product, and 204 execution are gone to step.
Step 207: by m2 plus 1, going to step 203.
Specifically, going to step 207 there are two types of situation, the first situation is: when product needs the n-th 2 level chips, and the
It when there is no the n-th 2 level chip on m2 wafer, needs to analyze m2+1 wafer, step 107 execution can be gone at this time.
Second situation is: when product needs the n-th 2 level chips, and when having the n-th 2 level chip on m2 wafer, from the
The n-th 2 level chips are picked up on m2 wafer and are mounted onto product, since product may may require that multiple the n-th 2 level chips, institute
After picking up the n-th 2 level chips from m2 wafer and mounting onto product, it is also necessary to whether also to judge on m2 wafer
Remaining the n-th 2 level chip, if judging result be it is not remaining, then current wafer can be replaced with to next wafer at this time, i.e., by m2
Add 1, then goes to step 203 execution.
Further, in step 207, increase the step of judging m2 value, if the value of m2 is equal to wafer sum M 2-
1 (because the serial number of m2 is since 0, the maximum value of m2 can be only M2-1), illustrates that the value of m2 at this time cannot be further added by,
It needs to terminate process；If the value of m2 is less than wafer sum M 2-1, illustrates that the value of m2 at this time can also increase, then m2 is added 1, gone to step
203 execute.
Further, in step 207, judge that m2 adds whether 1 value is greater than M2-1, if more than m2 then to be added to 1 value pair
M2 takes the remainder, and the remainder values are then assigned to m2, go to step 203；If being not more than, m2 is added 1, goes to step 203.In this way may be used
Guarantee when product needs the n-th 2 level chip, whether can inquire to all wafers there are the n-th 2 level chips for one time.
Further, a counter can be set in step 207, which continuously jumps to from step 203
The number of step 207, if intermediate once jump to step 206, counter O reset, when counters count from step 203
When number reaches product sum M 2, process this terminate.When reaching product sum M 2 due to the number when counters count, show this
When all wafers have been traversed once, occur endless loop in order to prevent, that is, traverse all wafers without the n-th level chip
When, it is able to enter the analysis to the (n+1)th level chip, goes to step 105 execution.
Step 208: by n2 plus 1, going to step 202.
Specifically, judging whether n2 is less than chip level type N2, if being less than, that is, illustrate that n2 at this time is also less than chip most
Big grade can also continue to judge the chip of lower level, n2 added 1 at this time, goes to step 102 and continue to execute.
Automation chip provided by the invention separates attaching method, picks up the chip on wafer by classification and directly mounts
Onto product, reduces the operation such as the manual grading skill of chip and packaging, transport, fractionation, reduce manual intervention degree, save people
Power material resources improve production efficiency, meanwhile, this method by preferentially meeting product on wafer the needs of different stage chip,
Chip on wafer is classified pickup according to product demand and is mounted, is carried out again after being completed to a product attachment next
The attachment of a product, it is ensured that the integrality of product attachment avoids the attachment for omitting certain chips during attachment, causes to produce
Product defect.
Embodiment six
The present embodiment is the supplementary explanation carried out on the basis of the above embodiments.
Fig. 7 is the flow diagram that attaching method is separated according to the automation chip of the embodiment of the present invention six, such as Fig. 7 institute
Show, automation chip of the invention separates attaching method, comprising:
Step 201 ': initialize chip level type N2, wafer sum M 2, current wafer m2=0, chip level n2=1.
Step 201 in this step and embodiment three is consistent, for details, reference can be made to recording accordingly in embodiment three, herein not
It repeats again.
Step 202 ': judge whether product needs the n-th 2 level chips, if desired, go to step 203 '；If not needing, turn step
Rapid 205 '.
This step is the supplementary explanation carried out on the basis of step 202.
Further, if product does not need the n-th 2 level chips, 205 ' are gone to step, specifically: if product does not need the n-th 2
Level chip goes to step 209 '.
Further, working area has N2, and each working area stores a kind of level chip.
Step 203 ': judge whether to have on m2 wafer the n-th 2 level chips, if so, going to step 206 '；If no, turning step
Rapid 207 '.
Step 204 ': judge whether product also needs the n-th 2 level chips, if desired, go to step 207 '；If not needing,
Go to step 205 '.
Step 205 ': judge whether n2 is less than chip level type N2 and goes to step 208 ' if being less than；If being not less than, process
Terminate.
Step 206 ': the n-th 2 level chips are picked up from m2 wafer and are mounted onto product, go to step 204 '.
Step 207 ': by m2 plus 1, go to step 203 '.
Step 208 ': by n2 plus 1, go to step 202 '.
Above-mentioned steps 203 ' -208 ' are consistent with the step 203-208 in embodiment three, and for details, reference can be made to phases in embodiment three
The record answered, details are not described herein.
Go to step 209 ': setting working area is picked up the n-th 2 level chips on m2 wafer to working area, is gone to step
205’。
Specifically, going to step 209 ' there are two types of situation, the first situation is: when product does not need the n-th 2 level chips
When, pick up the n-th 2 level chips on m2 wafer into working area, as whether have on m2 wafer the n-th 2 level chips this
When do not consider, if so, picking up the n-th 2 level chips on m2 wafer into working area, go to step 205 '；If no, picking up
For sky, 205 ' are gone to step.
Second situation is: when product needs the n-th 2 level chips, and when having the n-th 2 level chip on m2 wafer, from the
Pick up the n-th 2 level chips on m2 wafer and mount onto product, picked up from m2 wafer the n-th 2 level chips and mount to
After on product, if there remains the n-th 2 level chips on m2 wafer, the n-th 2 level chips on m2 wafer are picked up to temporary
Area goes to step 205 '.
Automation chip provided by the invention separates attaching method, picks up the chip on wafer by classification and directly mounts
Onto product, reduces the operation such as the manual grading skill of chip and packaging, transport, fractionation, reduce manual intervention degree, save people
Power material resources improve production efficiency, meanwhile, this method by preferentially meeting product on wafer the needs of different stage chip,
Chip on wafer is classified pickup according to product demand and is mounted, is carried out again after being completed to a product attachment next
The attachment of a product, it is ensured that the integrality of product attachment avoids the attachment for omitting certain chips during attachment, causes to produce
Product defect.In addition, chip is picked up into working area when product does not need the chip of certain grade on wafer, it can be utmostly
The waste of chip, economizes on resources on upper reduction wafer.
Although by reference to preferred embodiment, invention has been described, the case where not departing from the scope of the present invention
Under, various improvement can be carried out to it and can replace component therein with equivalent.Especially, as long as there is no structures to rush
Prominent, items technical characteristic mentioned in the various embodiments can be combined in any way.The invention is not limited to texts
Disclosed in specific embodiment, but include all technical solutions falling within the scope of the claims.
Claims (4)
1. a kind of automation chip separates attaching method characterized by comprising
Step A: initialization current production serial number m=0, chip level n=1 go to step B；
Step B: it picks up the n-th level chip on wafer and mounts onto m product, go to step C；
Step C: judging whether there remains the n-th level chip on the wafer, if remaining, by m plus 1, goes to step B；
If not remaining, the following steps are executed:
Working area is set, chip each a that N kind grade is placed in the working area；
Step c0: judge whether the m product also needs n-th level chip, if desired, then pick up in the working area
N-th level chip and mount on the m product, if not needing, go to step c1；
Step c1: judging whether n is less than chip level type N, if being less than, n is added 1, goes to step B；If being not less than, process knot
Beam；
The step B is specifically included:
Step b1: judging whether there is the n-th level chip on the wafer, if so, going to step b2；
Step b2: judge whether m product needs the n-th level chip, if desired, described n-th etc. is then picked up from the wafer
Grade chip is simultaneously mounted onto the m product, goes to step C；
The step A further include: chip level type N on initialization wafer.
2. automation chip according to claim 1 separates attaching method, which is characterized in that the working area have it is multiple,
Each working area stores a kind of level chip.
3. a kind of automation chip separates attaching method characterized by comprising
Step A2: initialization current wafer m2=0, chip level n2=1 go to step B2；
Step B2: the n-th 2 level chips are picked up on the m2 wafer and are mounted onto product, C2 is gone to step；
Step C2: judge whether to there remains the n-th 2 level chips on the m2 wafer if remaining and execute the following steps:
Working area is set；
Step c0 ': the n-th 2 level chip is picked up from the m2 wafer and is placed into the working area, goes to step c1 '；
Step c1 ': judging whether n2 is less than chip level type N2, if being less than, n2 is added 1, goes to step B2；If being not less than,
Process terminates；
If not remaining, by m2 plus 1, B2 is gone to step；
The step B2 is specifically included:
Step b1 ': judge whether the product needs the n-th 2 level chips, if desired, go to step b2 '；
Step b2 ': judge whether to have on the m2 wafer the n-th 2 level chips, if so, then picking up from the m2 wafer
The n-th 2 level chip is simultaneously mounted onto the product, goes to step C2；
The step A2 further include: chip level type N2 on initialization wafer.
4. automation chip according to claim 3 separates attaching method, which is characterized in that the working area have it is multiple,
Each working area stores a kind of level chip.
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| CN1722398A (en) * | 2004-06-04 | 2006-01-18 | 因芬尼昂技术股份公司 | Method for arraying chip of first lining to second lining |
| CN102386286A (en) * | 2010-08-31 | 2012-03-21 | 隆达电子股份有限公司 | Chip transferring method and chip transferring equipment |
| CN103295035A (en) * | 2013-05-08 | 2013-09-11 | 华中科技大学 | Method and device for online detecting RFID electronic tag |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6861608B2 (en) * | 2002-05-31 | 2005-03-01 | Texas Instruments Incorporated | Process and system to package residual quantities of wafer level packages |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722398A (en) * | 2004-06-04 | 2006-01-18 | 因芬尼昂技术股份公司 | Method for arraying chip of first lining to second lining |
| CN102386286A (en) * | 2010-08-31 | 2012-03-21 | 隆达电子股份有限公司 | Chip transferring method and chip transferring equipment |
| CN103295035A (en) * | 2013-05-08 | 2013-09-11 | 华中科技大学 | Method and device for online detecting RFID electronic tag |
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