CN105224928A - Fingerprint recognition sensing apparatus, electronic equipment and mobile device - Google Patents
Fingerprint recognition sensing apparatus, electronic equipment and mobile device Download PDFInfo
- Publication number
- CN105224928A CN105224928A CN201510650265.0A CN201510650265A CN105224928A CN 105224928 A CN105224928 A CN 105224928A CN 201510650265 A CN201510650265 A CN 201510650265A CN 105224928 A CN105224928 A CN 105224928A
- Authority
- CN
- China
- Prior art keywords
- fingerprint
- sensing apparatus
- sensor assembly
- fingerprint recognition
- recognition sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 108091027981 Response element Proteins 0.000 claims abstract description 54
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 40
- 229910052710 silicon Inorganic materials 0.000 claims description 40
- 239000010703 silicon Substances 0.000 claims description 40
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 230000004044 response Effects 0.000 abstract description 13
- 230000009471 action Effects 0.000 abstract description 2
- 230000000670 limiting effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000002615 epidermis Anatomy 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005352 galvanomagnetic phenomena Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007920 subcutaneous administration Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention discloses a kind of fingerprint recognition sensing apparatus and there is its electronic equipment and mobile device.Fingerprint recognition sensing apparatus comprises: equipment component; Fingerprint sensor assembly, described fingerprint sensor assembly is located at below equipment component, and described fingerprint sensor assembly can be coupled to the user fingerprints of user's finger; To user's finger close to responsive response element, described response element be connected with described equipment component and described response element at least partially higher than described fingerprint sensor assembly.According to the fingerprint recognition sensing apparatus of the embodiment of the present invention, not only have good fingerprint identification function, and response element response is good, control action is good.
Description
Technical field
The present invention relates to identification and detection technology field, more specifically, relate to a kind of fingerprint recognition sensing apparatus and electronic equipment and the mobile device with this fingerprint recognition sensing apparatus.
Background technology
In the related, the equipment component of fingerprint recognition sensing apparatus, fingerprint Identification sensor and the stacked setting of response element.When fingerprint Identification sensor is located between equipment component and response element, user's finger of response element distance contact arrangement element is comparatively far away, and response element response is poor; When response element is between fingerprint Identification sensor and equipment component, fingerprint Identification sensor assembly distance users finger is far away, fingerprint recognition performance can be deteriorated again, causes there is contradiction between fingerprint recognition and response limiting, and the structure of fingerprint recognition sensing apparatus haves much room for improvement.
Summary of the invention
The present invention is intended to solve one of technical matters in correlation technique at least to a certain extent.For this reason, the present invention proposes a kind of fingerprint recognition sensing apparatus, described fingerprint recognition sensing apparatus not only has good fingerprint identification function, and response element response performance is good.
The invention allows for a kind of electronic equipment with above-mentioned fingerprint recognition sensing apparatus.
The invention allows for a kind of mobile device with above-mentioned fingerprint recognition sensing apparatus.
According to the fingerprint recognition sensing apparatus of the embodiment of the present invention, comprising: equipment component; Fingerprint sensor assembly, described fingerprint sensor assembly is located at below equipment component, and described fingerprint sensor assembly can be coupled to the user fingerprints of user's finger; To user's finger close to responsive response element, described response element be connected with described equipment component and described response element at least partially higher than described fingerprint sensor assembly.
According to the fingerprint recognition sensing apparatus of the embodiment of the present invention, not only have good fingerprint identification function, and response element response is good, control performance is good.
In addition, following additional technical characteristic can also be had according to the fingerprint recognition sensing apparatus of the embodiment of the present invention:
According to some embodiments of the present invention, fingerprint recognition sensing apparatus also comprises pedestal, described pedestal is provided with pilot hole, and described equipment component and described fingerprint sensor assembly are located in described pilot hole, and described response element is connected with described pedestal and is positioned at the periphery of described fingerprint sensor assembly.
According to some embodiments of the present invention, described pilot hole comprises the first hole section and the second hole section, the radial dimension of described first hole section is greater than the radial dimension of described second hole section, described equipment component is located in described first hole section, being located at least partially in described second hole section of described fingerprint sensor assembly.
According to some embodiments of the present invention, described response element is located in described first hole section, and one end of described response element is connected with the lower surface of described equipment component, and diapire face or the side wall surface of the other end and described first hole section are connected.
According to some embodiments of the present invention, described fingerprint sensor assembly comprises one group of capacitive element of the fingerprint that can be coupled to user's finger in a capacitive manner.
According to some embodiments of the present invention, described fingerprint sensor assembly comprises silicon wafer and sensor circuit, and described sensor circuit is arranged on the top of close user's finger of described silicon wafer.
According to some embodiments of the present invention, be formed with at least one through hole and/or at least one fluting in described silicon wafer, described sensor circuit is coupled with the closing line in being located at described through hole and/or slot.
According to some embodiments of the present invention, described fingerprint sensor assembly also comprises the encapsulated layer with upper opening, and described sensor circuit is located in described encapsulated layer, and the circuit of described sensor circuit or described sensor circuit exposes in described upper opening.
According to some embodiments of the present invention, described fingerprint sensor assembly also comprises the soldered elements of at least one compression, and described sensor circuit is coupled with described soldered elements.
According to some embodiments of the present invention, described equipment component is made up of at least one in glass, pottery and sapphire material.
According to electronic equipment of the present invention, comprise according to fingerprint recognition sensing apparatus of the present invention.
According to mobile device of the present invention, comprise according to fingerprint recognition sensing apparatus of the present invention.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Fig. 1 is the structural representation of fingerprint recognition sensing apparatus according to an embodiment of the invention;
Fig. 2 is the structural representation of fingerprint recognition sensing apparatus in accordance with another embodiment of the present invention.
Reference numeral:
Fingerprint recognition sensing apparatus 100;
Equipment component 10;
Fingerprint sensor assembly 20; Silicon crystal 21; Sensor circuit 22;
Response element 30;
Pedestal 40; Pilot hole 41; First hole section 411; Second hole section 412; Diapire face 401; Side wall surface 402.
Embodiment
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the present invention, and can not limitation of the present invention be interpreted as.
The fingerprint recognition sensing apparatus 100 according to the embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Shown in seeing figures.1.and.2, equipment component 10, fingerprint sensor assembly 20 and response element 30 can be comprised according to the fingerprint recognition sensing apparatus 100 of the embodiment of the present invention.Fingerprint sensor assembly 20 can be located at below equipment component 10, and fingerprint sensor assembly 20 can be coupled to the user fingerprints of user's finger.Response element 30 be connected with equipment component 10 and response element 30 at least partially higher than fingerprint sensor assembly 20.The close sensitivity of response element 30 pairs of user's fingers.
In other words, equipment component 10 is positioned at above fingerprint sensor assembly 20, and when user's finger is placed on equipment component 10, fingerprint sensor assembly 20 can recognize the fingerprint of user's finger, and now response element 30 also action occurs.Specifically, response element 30 externally can send control signal, miscellaneous part can be controlled, realize response limiting function.
Because fingerprint sensor assembly 20 is located at below equipment component 10, fingerprint sensor assembly 20 and user point comparatively close, and can identify the fingerprint of user's finger preferably, recognition performance is good.Meanwhile, response element 30 is no longer arranged on the below of fingerprint sensor assembly 20, and response element 30 is arranged on the position pointed closer to user than fingerprint sensor assembly 20, and the response performance of response element 30 improves, and response limiting performance is good.
Be understandable that, the setting position of response element 30 can have multiple, if meet make response element 30 at least partially higher than the requirement of fingerprint sensor assembly 20.Alternatively, as depicted in figs. 1 and 2, in some embodiments of the invention, response element 30 can also comprise pedestal 40, pedestal 40 is provided with pilot hole 41, equipment component 10 and fingerprint sensor assembly 20 are located in pilot hole 41, and response element 30 is connected with pedestal 40 and is positioned at the periphery of fingerprint sensor assembly 20.
Thus, response element 30 is independent of each other with the installation of fingerprint sensor assembly 20, fingerprint sensor assembly 20 and response element 30 can be simultaneously nearer apart from equipment component 10, namely there is good fingerprint identification function, also have good response limiting effect, assembly structure design rationally and be convenient to manufacture.
Further, shown in seeing figures.1.and.2, pilot hole 41 can comprise the first hole section 411 and the second hole section 412, the radial dimension of the first hole section 411 can be greater than the radial dimension of the second hole section 412, equipment component 10 can be located in the first hole section 411, can being located at least partially in the second hole section 412 of fingerprint sensor assembly 20.Thus, be not only convenient to install, and the accuracy that equipment component 10 and fingerprint sensor assembly 20 are installed can be ensured.
Alternatively, response element 30 can be located in the first hole section 411, and one end of response element 30 can be connected with the lower surface of equipment component 10, and the other end can be connected with the diapire face 401 of the first hole section 411 or side wall surface 402.Such as, in the example depicted in fig. 1, one end of response element 30 is connected with the lower surface of equipment component 10, and the other end of response element 30 is connected with the diapire face 401 of the first hole section 411.Again such as, in the illustrated example shown in fig. 2, one end of response element 30 is connected with the lower surface of equipment component 10, and the other end of response element 30 is connected with the side wall surface 402 of the first hole section 411.
In these two kinds of structures, when user finger by equipment component 10 time, first one end of response element 30 can experience, and then response element 30 can be responded, response performance good and be convenient to manufacture and assemble.
Alternatively, pedestal 40 can adopt the anodized aluminum of such as SOS aluminium and so on to build.When reality uses, fingerprint recognition sensing apparatus 100 can use according to the placed angle shown in Fig. 1 and Fig. 2, also can the certain angle of integral-rotation use, and such as, fingerprint recognition sensing apparatus 100 can be clockwise overall or be rotated counterclockwise 90 degree of uses.Can coordinate formation sunk structure between equipment component 10 with pedestal 40, as shown in Figure 1, pedestal 40 can arrange chamfering, a part for sunk structure can be formed by chamfering.
Sunk structure can guide user's finger into button, and user is pointed can be located well, to carry out fingerprint recognition.Simultaneously, pedestal 40 can be used to provide electrical isolation or be used to shield galvanomagnetic effect, with the effect providing Capacitor apart or other electromagnetic isolation, the electric capacity measured is made to be that user points between fingerprint sensor assembly 20, instead of between any other object and fingerprint sensor assembly 20, fingerprint detection is more accurate.
Be understandable that, the shape of response element 30 can be formed as multiple, such as, can be formed as the straight rod-shaped shown in Fig. 1, also can be formed as the L shape shown in Fig. 2.Certainly, response element 30 can also be formed as other shapes, is not described in detail at this.
The concrete structure of response element 30 can be formed as multiple, such as, in concrete examples more of the present invention, response element 30 can be provided with to the control element of user's finger with the sensitivity that is coupled between equipment component 10, such as control circuit, this control element is connected with miscellaneous part.When user's finger contacts equipment component 10, response element 30 can be experienced and externally send control signal, thus realizes response limiting function.Response element 30 can also have the part that can be out of shape, and when presses element 10, response element 30 can deform, and with response apparatus element 10, user can be had and press down sense of touch.
Alternatively, according to some embodiments of the present invention, fingerprint sensor assembly 20 can comprise one group of capacitive element, and this group capacitive element can be coupled to the fingerprint of user's finger in a capacitive manner, thus realize identifying the fingerprint of user's finger, recognition performance is good.
According to some embodiments of the present invention, fingerprint sensor assembly 20 can comprise sensor circuit 22 and silicon wafer 21, and sensor circuit 22 is located on silicon wafer 21.Sensor circuit 22 may be used for the fingerprint (electric capacity between the supracutaneous ridge of such as user's finger and paddy) measuring user's finger, with the effect provided about the ridge of user's finger and the information in fingerprint of paddy.Wherein, sensor circuit 22 can be arranged on the top of close user's finger of silicon wafer 21.
Specifically, equipment component 10 can be positioned at the top of silicon wafer 21, and sensor circuit 22 can be arranged on the end face of silicon wafer 21.Thus, fingerprint Identification sensor circuit 22 can be placed closer to user's finger, and can have better resolution and validity comparatively speaking.Such as, sensor circuit 22 can directly be printed on the end face of silicon wafer 21, and sensor circuit 22 can overlap with button part, or all overlaps.
Further, at least one through hole and/or at least one fluting 201 in silicon wafer 21, can be formed with, sensor circuit 22 can be located at through hole and/or the closing line 23 of slotting in 201 is coupled.That is, silicon wafer 21 can be arranged separately through hole or fluting 201 is set separately, or through hole and fluting 201 are all arranged, when silicon wafer 21 is provided with through hole, through hole can be one also can be multiple, when silicon wafer 21 is provided with fluting 201, fluting 201 can be one also can be multiple.Fluting 201 be provided with the closing line 23 be connected with miscellaneous part or circuit in through hole, when sensor circuit 22 can by with the connection realization of closing line 23 and the connection of miscellaneous part or circuit.
Thus, can realize the connection of sensor circuit 22 and other circuit or parts easily, syndeton is more regular.Meanwhile, in the through hole that closing line 23 is arranged on silicon wafer 21 and/or fluting 201, and need not to arch upward from the surface of silicon wafer 21, so that sensor circuit 22 is connected to other places from silicon wafer 21.Thus, joint line can not occupy the vertical space between the object above silicon wafer 21 and adjacent silicon wafer 21, sensor circuit 22 can be connected to another location, such as, the circuit of the circuit bottom silicon wafer 21 or silicon wafer 21 side), the vertical space amount that fingerprint Identification sensor assembly needs is less.
Wherein, other circuit that through hole can connect as required or the position of parts are arranged, and such as, through hole can be positioned at silicon wafer 21, and side or the bottom surface of silicon wafer 21 can be extended to, to realize being connected with other circuit on the side of silicon wafer 21 or end face.Fluting 201 can be arranged on the top of silicon wafer 21 or top and sidepiece, to realize being connected with other circuit on the side of silicon wafer 21 or bottom surface.As shown in Figure 1, the end face that fluting 201 is located at silicon wafer 21 extends to the side of silicon wafer 21, make closing line 23 can the circuit etc. of connecting sensor circuit 22 and sidepiece.
Alternatively, according to some embodiments of the present invention, fingerprint sensor assembly 20 can also comprise the encapsulated layer with upper opening, and sensor circuit 22 can be located in encapsulated layer, and the circuit of sensor circuit 22 or sensor circuit 22 can expose from upper opening.Specifically, the top of encapsulated layer can open wide formation upper opening at least partly, sensor circuit 22 comprises logicalnot circuit part and circuit, and circuit can expose from upper opening, and logicalnot circuit part can be exposed in upper opening, or does not expose.Thus, encapsulated layer can protect sensor circuit 22, can also ensure the fingerprint identification function of sensor circuit 22 simultaneously.
Wherein, when sensor circuit 22 exposes in encapsulated layer, namely when the circuit of sensor circuit 22 and logicalnot circuit part are all upwards exposed in encapsulated layer, the silicon wafer 21 of manufacture can be made as far as possible reasonably to use vertical space less, because the amount that the silicon wafer 21 of finger identification sensor encapsulates the extra vertical space used is limited comparatively speaking.Wherein, not limiting for the material preparing encapsulated layer, such as, can be plastics, resin or pottery etc.
Alternatively, fingerprint sensor assembly 20 can also comprise the soldered elements of at least one compression, and sensor circuit 22 can be coupled with soldered elements.Such as, in embodiments more of the present invention, silicon wafer 21 is built as and comprises an assembly welding ball, and this assembly welding ball randomly (or pseudorandomly) is coupled with silicon wafer 21.Alternatively, soldered ball need not comprise actual solder, but can comprise other conductive materials, such as gold, other deformable metals, or in response to other conduction or semiconductor materials that the physical process of such as pressure and so on can be out of shape.
Next for the fingerprint sensor assembly 20 with encapsulated layer, soldered ball can be encapsulated in encapsulated layer, compression soldered ball and encapsulated layer, to soldered ball and encapsulated layer by the degree compressed.Thus, encapsulated layer is extruded away from soldered ball substantially, and soldered ball can be positioned between other elements of silicon wafer 21 and such as button and so on, with conducting electrical signals.Because soldered ball or other materials flatly disperse in their layer, therefore this also has such effect: their layer operation with the one deck below being transmitted to from one deck of top, not across their layer or any level conduction in their layer.
When silicon wafer 21 is coupled to button, this has such effect: the conduction between the capacitor plate of silicon wafer 21 and the surface of button strengthens; Simultaneously, Distance Shortened between the epidermis pointed due to user and silicon wafer 21, electric capacity between user's finger and silicon wafer 21 increases, and this can make again fingerprint sensor assembly 20 realize the capacitance sensing of the brilliance of the information in fingerprint to user, and fingerprint recognition is comparatively accurate.
Alternatively, equipment component 10 can be made up of at least one in glass, pottery and sapphire material.What material of concrete employing, can be arranged as required.Further, in order to identify fingerprint better, being suitable for of equipment component 10 can adopt anisotropic dielectric material to make with the part of user's finger contacts.Such as, in some embodiments of the invention, equipment component 10 can comprise at least one in button and display element, and being suitable for the part of user's finger contacts can be press section, and press section can be located on button, also can arrange on the display element.Press section can adopt sapphire to make.Wherein, sapphire can be monocrystalline also can be polycrystalline.
Sapphire has anisotropy, can make the epidermis (or optionally, the subcutaneous part of the finger of user) of sensor circuit 22 sensing user finger preferably.Thus, sensor circuit 22 by means of sapphire anisotropy, can show and point capacitive coupling remarkable comparatively speaking with user, and sensor circuit 22 will obtain one group of remarkable comparatively speaking information in fingerprint.
Certainly, with the part of user's finger contacts, such as, button, can also be made up of one or more in llowing group of materials or its equivalent: aluminium oxide, glass or through chemically treated glass, through the chemically treated compound with its at least some feature, or there is the another kind of compound of similarity.Similarly, under applicable circumstances, sensor circuit 22 can also utilize the electromagnetic property of other materials, with by means of these electromagnetic propertys, shows the capacitive coupling remarkable comparatively speaking pointed with user.
According to some embodiments of the present invention, equipment component 10 can be formed as plane with the part of user's finger contacts.Thus, the placement of user's finger and the collection of user fingerprints is convenient to.
The fingerprint recognition sensing apparatus 100 according to the embodiment of the present invention is comprised according to the electronic equipment of the embodiment of the present invention.Wherein, electronic equipment can be desktop computer etc.The fingerprint recognition sensing apparatus 100 according to the embodiment of the present invention is comprised according to the mobile device of the embodiment of the present invention.Mobile device can be mobile phone or panel computer etc.Wherein, the installation of fingerprint recognition sensing apparatus 100 on electronic equipment or mobile device and be appreciated that for a person skilled in the art with the annexation of miscellaneous part and easily realize, does not repeat them here.
To form according to other of the electronic equipment of the embodiment of the present invention and mobile device and operation is known for the person of ordinary skill of the art, be not described in detail at this.
In describing the invention, it will be appreciated that, orientation or the position relationship of the instruction such as term " " center ", " on ", D score, "front", "rear", " vertically ", " level ", " top ", " end ", " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be only the present invention for convenience of description and simplified characterization; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise at least one this feature.In describing the invention, the implication of " multiple " is at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection or each other can communication; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " top " and " above " can be fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment " or " specific embodiment ", " example " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and describe embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, and those of ordinary skill in the art can change above-described embodiment within the scope of the invention, revises, replace and modification.
Claims (12)
1. a fingerprint recognition sensing apparatus, is characterized in that, comprising:
Equipment component;
Fingerprint sensor assembly, described fingerprint sensor assembly is located at below equipment component, and described fingerprint sensor assembly can be coupled to the user fingerprints of user's finger;
To user's finger close to responsive response element, described response element be connected with described equipment component and described response element at least partially higher than described fingerprint sensor assembly.
2. fingerprint recognition sensing apparatus according to claim 1, it is characterized in that, also comprise pedestal, described pedestal is provided with pilot hole, described equipment component and described fingerprint sensor assembly are located in described pilot hole, and described response element is connected with described pedestal and is positioned at the periphery of described fingerprint sensor assembly.
3. fingerprint recognition sensing apparatus according to claim 2, it is characterized in that, described pilot hole comprises the first hole section and the second hole section, the radial dimension of described first hole section is greater than the radial dimension of described second hole section, described equipment component is located in described first hole section, being located at least partially in described second hole section of described fingerprint sensor.
4. fingerprint recognition sensing apparatus according to claim 3, it is characterized in that, described response element is located in described first hole section, and one end of described response element is connected with the lower surface of described equipment component, and diapire face or the side wall surface of the other end and described first hole section are connected.
5. fingerprint recognition sensing apparatus according to claim 1, is characterized in that, described fingerprint sensor assembly comprises one group of capacitive element of the fingerprint that can be coupled to user's finger in a capacitive manner.
6. fingerprint recognition sensing apparatus according to claim 1, is characterized in that, described fingerprint sensor assembly comprises silicon wafer and sensor circuit, and described sensor circuit is arranged on the top of close user's finger of described silicon wafer.
7. fingerprint recognition sensing apparatus according to claim 6, is characterized in that, be formed with at least one through hole and/or at least one fluting in described silicon wafer, described sensor circuit is coupled with the closing line in being located at described through hole and/or slot.
8. fingerprint recognition sensing apparatus according to claim 6, it is characterized in that, described fingerprint sensor assembly also comprises the encapsulated layer with upper opening, described sensor circuit is located in described encapsulated layer, and the circuit of described sensor circuit or described sensor circuit exposes from described upper opening.
9. fingerprint recognition sensing apparatus according to claim 6, is characterized in that, described fingerprint sensor assembly also comprises the soldered elements of at least one compression, and described sensor circuit is coupled with described soldered elements.
10. the fingerprint recognition sensing apparatus according to any one of claim 1-9, is characterized in that, described equipment component is made up of at least one in glass, pottery and sapphire material.
11. 1 kinds of electronic equipments, is characterized in that, comprise the fingerprint recognition sensing apparatus according to any one of claim 1-10.
12. 1 kinds of mobile devices, is characterized in that, comprise the fingerprint recognition sensing apparatus according to any one of claim 1-10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710975492.XA CN107862250B (en) | 2015-10-09 | 2015-10-09 | Fingerprint identification sensing device, electronic equipment and mobile equipment |
| CN201510650265.0A CN105224928B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition sensing device further, electronic equipment and mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510650265.0A CN105224928B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition sensing device further, electronic equipment and mobile device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710975492.XA Division CN107862250B (en) | 2015-10-09 | 2015-10-09 | Fingerprint identification sensing device, electronic equipment and mobile equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105224928A true CN105224928A (en) | 2016-01-06 |
| CN105224928B CN105224928B (en) | 2017-11-17 |
Family
ID=54993888
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710975492.XA Active CN107862250B (en) | 2015-10-09 | 2015-10-09 | Fingerprint identification sensing device, electronic equipment and mobile equipment |
| CN201510650265.0A Expired - Fee Related CN105224928B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition sensing device further, electronic equipment and mobile device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710975492.XA Active CN107862250B (en) | 2015-10-09 | 2015-10-09 | Fingerprint identification sensing device, electronic equipment and mobile equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN107862250B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105512648A (en) * | 2016-01-21 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint recognizing and sensing device |
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN105740764A (en) * | 2016-01-21 | 2016-07-06 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint identification sensing device |
| CN105740811A (en) * | 2016-01-28 | 2016-07-06 | 广东欧珀移动通信有限公司 | Electronic equipment, mobile equipment and fingerprint recognition sensing device |
| CN107832706A (en) * | 2017-11-09 | 2018-03-23 | 深圳市晓控通信科技有限公司 | A kind of identification with functions/drying accurately capacitance type fingerprint identification equipment |
| CN109389108A (en) * | 2017-08-08 | 2019-02-26 | 金佶科技股份有限公司 | Image capturing device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100079309A1 (en) * | 2008-09-26 | 2010-04-01 | John Benjamin Filson | Configurable buttons for electronic devices |
| CN103425965A (en) * | 2012-05-18 | 2013-12-04 | 苹果公司 | Capacitive sensor packaging |
| CN205193824U (en) * | 2015-10-09 | 2016-04-27 | 广东欧珀移动通信有限公司 | Fingerprint identification sensing apparatus, electronic equipment and mobile device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4266363B2 (en) * | 2004-09-27 | 2009-05-20 | 日本開閉器工業株式会社 | Pressure sensitive fingerprint sensor |
| US10359857B2 (en) * | 2013-07-18 | 2019-07-23 | Immersion Corporation | Usable hidden controls with haptic feedback |
| CN104751124A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
-
2015
- 2015-10-09 CN CN201710975492.XA patent/CN107862250B/en active Active
- 2015-10-09 CN CN201510650265.0A patent/CN105224928B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100079309A1 (en) * | 2008-09-26 | 2010-04-01 | John Benjamin Filson | Configurable buttons for electronic devices |
| CN103425965A (en) * | 2012-05-18 | 2013-12-04 | 苹果公司 | Capacitive sensor packaging |
| CN104700102A (en) * | 2012-05-18 | 2015-06-10 | 苹果公司 | Capacitive sensor packaging |
| CN104951776A (en) * | 2012-05-18 | 2015-09-30 | 苹果公司 | Capacitive sensor packaging |
| CN205193824U (en) * | 2015-10-09 | 2016-04-27 | 广东欧珀移动通信有限公司 | Fingerprint identification sensing apparatus, electronic equipment and mobile device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105512648A (en) * | 2016-01-21 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint recognizing and sensing device |
| CN105740764A (en) * | 2016-01-21 | 2016-07-06 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint identification sensing device |
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN105740811A (en) * | 2016-01-28 | 2016-07-06 | 广东欧珀移动通信有限公司 | Electronic equipment, mobile equipment and fingerprint recognition sensing device |
| CN109389108A (en) * | 2017-08-08 | 2019-02-26 | 金佶科技股份有限公司 | Image capturing device |
| CN107832706A (en) * | 2017-11-09 | 2018-03-23 | 深圳市晓控通信科技有限公司 | A kind of identification with functions/drying accurately capacitance type fingerprint identification equipment |
| CN107832706B (en) * | 2017-11-09 | 2021-10-22 | 深圳市蓝海经略科技有限公司 | Accurate capacitanc fingerprint identification equipment of discernment with drying function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105224928B (en) | 2017-11-17 |
| CN107862250A (en) | 2018-03-30 |
| CN107862250B (en) | 2021-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105224928A (en) | Fingerprint recognition sensing apparatus, electronic equipment and mobile device | |
| US10783347B2 (en) | Capacitive sensor packaging | |
| US10528176B2 (en) | Touch display panel with near field communication antenna circuit | |
| CN104408434B (en) | Fingerprint acquisition apparatus and electronic equipment | |
| CN108108726B (en) | Capacitive sensor package | |
| EP3285207A1 (en) | Input assembly and manufacturing method | |
| CN205193823U (en) | Fingerprint identification sensing apparatus, electronic equipment and mobile device | |
| CN106775100B (en) | Touch display panel and touch display device comprising same | |
| CN205193824U (en) | Fingerprint identification sensing apparatus, electronic equipment and mobile device | |
| CN205193825U (en) | Fingerprint identification sensing apparatus, electronic equipment and mobile device | |
| CN107132976B (en) | Fingerprint identification module, home key, electronic equipment and sliding direction detection method | |
| CN207354411U (en) | Protective case component | |
| CN207354412U (en) | Housing unit and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171117 |