CN105188173B - A kind of structure thermal environment simulation method and device based on sensing heating - Google Patents
A kind of structure thermal environment simulation method and device based on sensing heating Download PDFInfo
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- CN105188173B CN105188173B CN201510474742.2A CN201510474742A CN105188173B CN 105188173 B CN105188173 B CN 105188173B CN 201510474742 A CN201510474742 A CN 201510474742A CN 105188173 B CN105188173 B CN 105188173B
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Abstract
A kind of structure thermal environment simulation method and device based on sensing heating is disclosed, wherein, the structure thermal environment simulation method based on sensing heating includes：According to material, profile and the size of subject structure and the thermograde of Service Environment, the profile and size and heating current magnitude and heated current frequency of copper induction coil are determined；Subject structure is placed in induction coil, electric signal is applied to induction coil according to heating current magnitude and heated current frequency；Thermograde and strain field of the collection subject structure under electromagnetic field effect, the safety and reliability of subject structure is determined according to strain field.The present invention heats subject structure by sensing heating, it can avoid using complicated heater, and different thermal environments can be simulated by adjusting Distribution of Magnetic Field and skin depth, so that the electromagnetic field of sensing heating possesses designability, the method and apparatus for greatly simplifying structure thermal environment simulation, improve the efficiency of structure thermal environment simulation.
Description
Technical field
The present invention relates to structure thermal environment simulation field, more particularly to a kind of structure thermal environment simulation based on sensing heating
Method and device.
Background technology
Heat structure is widely used in industry, aerospace field, and heat structure stress includes should caused by external force load
Thermal stress caused by power and thermal force, wherein thermal stress play vital effect, in the non-homogeneous thermal histories of structure, by
It is inconsistent in heat distribution, cause structure thermograde occur, and then thermal stress is produced, it is more than material when thermograde produces thermal stress
During material intensity itself, structure is destroyed, and now thermal stress directly determines the safety and reliability of heat structure.Thermo-structure analysis calculates
Largely assuming to carry out under the premise of (analysis model border and constraint), variant with actual environment, experimental study can be examined
Consider the comprehensive function of Multiple factors, it is significant during Thermal structures design.Typical Thermal Stress Experiment research can be commented directly
The valency structure safety and reliability that thermal stress is horizontal under thermal environment load and structure is under the thermal stress level.
Sensing heating carries out non-contact thermal by electromagnetic field to workpiece, has the faster rate of heat addition, easily office
Portion heats and the advantages that the heating environment of cleaning, and is used widely in industrial circle, such as metal material is heat-treated and forges,
Induction welding, sensing Metal Melting and sensing heating etc..And sensing heating is used for characterization of structure and properties under thermal environment and yet there are no
Corresponding report.
Therefore, the needs to the structure thermal environment simulation technology based on sensing heating in the prior art be present.
The content of the invention
The embodiment provides a kind of structure thermal environment simulation method and device based on sensing heating, can save
Complicated heater, and cause sensing heating electromagnetic field to possess designability, greatly simplify the side of structure thermal environment simulation
Method and device, improve the efficiency of structure thermal environment simulation.
According to an aspect of the invention, there is provided a kind of structure thermal environment simulation method based on sensing heating, described
Method includes：
S1, according to subject structure material, profile and size and Service Environment thermograde, determine the copper line of induction
The profile and size and heating current magnitude and heated current frequency of circle；
S2, will subject structure be placed in the copper induction coil, according to the heating current magnitude and heated current frequency
Apply electric signal to the copper induction coil, produce electromagnetic field to heat the subject structure；
The thermograde and strain field of S3, the collection subject structure under the electromagnetic field effect, according to the strain
Field determines the safety and reliability of the subject structure.
Preferably, copper induction coil is Reducing screw coil or square coil.
Preferably, in step S1, according to the thermograde of the Service Environment of subject structure, determine that the subject structure is different
The service temperature in region；The service temperature of the subject body structure surface is higher, and induction coil is more intensive around it, the sense
Answer coil and the distance of the subject structure smaller；The service temperature of the subject body structure surface is lower, the sensing around it
Coil is more sparse, and the induction coil and the distance of the subject structure are bigger.
Preferably, in step S1, the relation for being tested the skin depth and heated current frequency of structure is：
In formula, δ represents the skin depth of subject structure, unit m：；σ represents the electrical conductivity of subject structure, and unit is：s/
m；μ0The absolute permeability of subject structure is represented, unit is：H/m；μrRepresent the relative permeability of subject structure, dimensionless unit；
F represents heated current frequency, and unit is：Hz.
Preferably, step S1 is specially：
S11, the profile and size for determining copper induction coil；
S12, according to the scope of heating current magnitude and the scope of heated current frequency, and the subject structure not same district
The vortex density distribution in domain and the governing equation of structure thermal environment system different zones, iteration are obtained in different current values and different electricity
Flow the thermograde that structure is tested under frequency values；By the temperature of the thermograde of acquisition and subject structure Service Environment after each iteration
Spend gradient and carry out error analysis, if error is less than a certain threshold value, terminate iterative process, and using current current value as copper sense
Answer heated current frequency, the current profile of the heating current magnitude, current power frequency value of coil as copper induction coil
With profile and size of the size as copper induction coil；Wherein, the scope of heating current magnitude be 300A~3000A in the range of,
The scope of heated current frequency is 20kHz~100kHz；
If the thermograde and the error for the thermograde for being tested structure Service Environment that are obtained after S13, each iteration are big
In a certain threshold value, then change the profile and size of copper induction coil, continue iteration, until the temperature ladder that iteration obtains
Degree and the thermograde of subject structure Service Environment meet requirement, obtain heating current magnitude, the heated current of copper induction coil
Frequency, coil shape and coil dimension.
Preferably, in step S1,
The vortex density of subject structure different zones is distributed as：
The governing equation of structure thermal environment system different zones includes：The governing equation of copper induction coil, it is tested structure
Governing equation, and air or vacuum area Electromagnetic Control equation, wherein,
The governing equation of copper induction coil is：
Subject structure governing equation be：
Air or vacuum area Electromagnetic Control equation are as follows：
J=0 formula 9
In formula, J is inductive loop density, and unit is：A/m2；JeFor current density in copper induction coil, unit is：A/m2；
A is magnetic potential gesture, and unit is：A/m；μ0Absolute permeability is represented, unit is：H/m；μrRepresent relative permeability, dimensionless unit；σ
The electrical conductivity of material is represented, unit is：s/m.
Preferably, in step S2, subject structure is placed in copper induction coil specially：
Subject structure is placed in copper induction coil, the big end end face of subject structure is supported using support platform so that quilt
The big end end face for trying structure can be along the normal direction displacement of support platform；
Or
Subject structure is placed in induction coil, big the end end face and small end end of subject structure are supported using support platform
Face so that big the end end face and small end end face for being tested structure can not be along the normal direction displacements of support platform.
Preferably, step S2 further comprises：During electric signal is applied to copper induction coil, subject structure is entered
Row anti-oxidant treatment, it is oxidized with preventing from being tested structure.
Preferably, anti-oxidant treatment is specially：Structure thermal environment simulation system is placed in vacuum chamber, passes through vacuum environment
Prevent that being tested structure is oxidized.
Preferably, vacuum chamber is vacuum water cooling cabin, and vacuum chamber is carried out by the cooling water in the dead level in vacuum water cooling cabin
Cooling treatment, to prevent vacuum chamber from destroying under the high temperature conditions.
Preferably, transparent observing window is provided with vacuum water cooling cabin, the temperature field of structure is tested with real-time monitoring and answered
Variable field.
Preferably, the thin-wall construction that structure is axisymmetric hollow taper type is tested, its wall thickness is 10mm, axial length is
150mm, semi-cone angle are 16.7 °, small end inside radius is 18mm；It is tested the axial direction phase of the axial direction and induction coil of structure
Together.
Preferably, the material of copper induction coil is hollow T2 copper tubes, and its inside radius is 3mm, outer radius 4mm；Copper sense
That answers coil is shaped as taper, and its small end radius is 50mm, totally 9 circle, and semi-cone angle is 31 °.
According to another aspect of the present invention, there is provided a kind of structure thermal environment simulation device based on sensing heating, bag
Include：
Test chamber, keep apart for providing simulated environment, and by simulated environment and external environment；
Copper induction coil, is arranged at the surrounding of subject structure, and is fixed on test chamber inwall, outside the copper induction coil
Induction heating power is connect, structure is tested for heating；
Support platform, the inside of the test chamber is fixedly provided in, is tested structure for placing, and constrain subject structure
Deformation；
Thermal imaging system, one end of subject structure is arranged at, for detecting the temperature field data of subject structure, and by temperature field
Data are transferred to data handling system；
DIC (Digital Image Correlation, digital image correlation technique) testing lens, it is arranged at subject knot
One end of structure, for detecting the strain field data of subject structure, and strain field data are transferred to data handling system；
Data handling system, for obtaining the actual temperature of the subject structure according to the temperature field data analysis of reception
Spend gradient；Determine whether the subject structure structure occurs and destroy and deform according to the strain field data of reception.
Preferably, copper induction coil is Reducing screw coil or square coil.
Preferably, it is higher to be tested the service temperature of body structure surface, copper induction coil is more intensive around it, copper induction coil with
The distance for being tested structure is smaller；The service temperature of subject body structure surface is lower, and copper induction coil is more sparse around it, the copper line of induction
Enclose bigger with the distance of subject structure.
Preferably, test chamber is vacuum chamber, to prevent the subject structure to be oxidized.
Preferably, vacuum chamber is vacuum water cooling cabin, and vacuum chamber is carried out by the cooling water in the dead level in vacuum water cooling cabin
Cooling treatment, to prevent vacuum chamber from destroying under the high temperature conditions.
Preferably, transparent observing window is provided with vacuum water cooling cabin, the temperature field of structure is tested with real-time monitoring and answered
Variable field.
Preferably, it is of the invention to further comprise：Sensor and oscillograph, wherein,
Sensor is arranged at the surrounding of induction coil, for detecting induced-current and induced-current frequency data, and by number
According to transmitting to the oscillograph；
Oscillograph, receives the data of sensor transmissions, and analysis obtains induced-current and induced-current frequency.
Preferably, the thin-wall construction that structure is axisymmetric hollow taper type is tested, its wall thickness is 10mm, axial length is
150mm, semi-cone angle are 16.7 °, small end inside radius is 18mm；It is tested the axial direction phase of the axial direction and induction coil of structure
Together.
Preferably, the material of copper induction coil is hollow T2 copper tubes, and its inside radius is 3mm, outer radius 4mm；Copper sense
That answers coil is shaped as taper, and its small end radius is 50mm, totally 9 circle, and semi-cone angle is 31 °.
Preferably, subject structure is placed in induction coil, the big end end face of support platform support subject structure so that subject
The big end end face of structure can be along the normal direction displacement of support platform；
Or
Subject structure is placed in copper induction coil, big the end end face and small end end face of support platform support subject structure, is made
Big the end end face and small end end face that structure must be tested can not be along the normal direction displacements of support platform.
The structure thermal environment simulation method based on sensing heating of the embodiment of the present invention, according to the material of subject structure, outside
The thermograde of shape and size and Service Environment, determine copper induction coil profile and size and heating current magnitude and
Heated current frequency；Subject structure is placed in the copper induction coil, given according to heating current magnitude and heated current frequency
Copper induction coil applies electric signal, produces electromagnetic field to heat subject structure；Temperature of the collection subject structure under electromagnetic field effect
Gradient and strain field are spent, the safety and reliability of subject structure is determined according to strain field.The present invention based on sensing heating
Structure thermal environment simulation method and apparatus, subject structure is heated by sensing heating, can avoided using complicated heating dress
Put, and different thermal environments can be simulated by adjusting Distribution of Magnetic Field and skin depth so that the electromagnetic field tool of sensing heating
Standby designability, the method and apparatus for greatly simplifying structure thermal environment simulation, the efficiency of raising structure thermal environment simulation.
Brief description of the drawings
Fig. 1 is the flow chart according to the structure thermal environment simulation method based on sensing heating of the present invention.
Fig. 2 is the schematic diagram of the structure thermal environment simulation device based on sensing heating of the present invention.
Embodiment
For the objects, technical solutions and advantages of the present invention are more clearly understood, referring to the drawings and preferred reality is enumerated
Example is applied, the present invention is described in more detail.However, it is necessary to illustrate, many details listed in specification are only to be
Reader is set to have a thorough explanation to the one or more aspects of the present invention, even without these specific details can also
Realize the aspects of the invention.
The present invention heats subject structure by sensing heating, can avoid using complicated heater, and pass through
Regulation Distribution of Magnetic Field and skin depth can simulate different thermal environments so that and the electromagnetic field of sensing heating possesses designability,
The method and apparatus for greatly simplifying structure thermal environment simulation, improve the efficiency of structure thermal environment simulation.
The technical scheme for embodiment that the invention will now be described in detail with reference to the accompanying drawings.In the present invention, the knot based on sensing heating
The device of structure thermal environment simulation method uses structure as shown in Figure 2.Filled namely based on the structure thermal environment simulation of sensing heating
Put, including：Test chamber 4, copper induction coil 2, support platform 3, thermal imaging system 5 and DIC (Digital Image
Correlation, digital image correlation technique) testing lens 6.Test chamber 4 is used to provide simulated environment, and by simulated environment with
External environment is kept apart.Structure 1 is tested during to prevent long in experimentation to aoxidize, according to a preferred embodiment of the invention, test
Cabin 4 is vacuum chamber.Preferably, vacuum chamber is vacuum water cooling cabin, by the cooling water in the dead level in vacuum water cooling cabin to vacuum chamber
Cooling treatment is carried out, to prevent vacuum chamber from destroying under the high temperature conditions.Preferably, transparent windows are provided with vacuum water cooling cabin
Mouth (not shown), temperature field and the strain field of structure 1 are tested with real-time monitoring.
Copper induction coil 2, is arranged at the surrounding of subject structure 1, and is fixed on the inwall of test chamber 4, outside copper induction coil
Induction heating power is connect, structure 1 is tested for heating.According to a preferred embodiment of the invention, it is axisymmetric sky to be tested structure 1
The thin-wall construction of heart taper type, its wall thickness is 10mm, axial length 150mm, semi-cone angle are 16.7 °, small end inside radius is
18mm；The axial direction for being tested structure 1 is identical with the axial direction of copper induction coil 2.
The magnetic flux line number passed through in the subject unit area of structure 1 is defined as magnetic flux, and magnetic distribution is different, is tested structure
The magnetic flux of 1 different zones is also different, and then vortex density is big greatly for magnetic flux, and caused Joule heat is big；Magnetic flux is small, is vortexed close
Spend small, caused Joule heat is small.When alternating current passes through conductor, electric current will focus on conductive surface and flow through, this phenomenon
Kelvin effect, it is called Kelvin effect.Kelvin effect causes current density to concentrate on skin depth region, and then causes the region
Joule heat is big.Therefore, varying environment thermal environment can be simulated by adjusting Distribution of Magnetic Field and skin depth so that sensing heating
Electromagnetic field possesses designability.Heating current magnitude, heated current frequency and conductive material influence the skin depth of sensing heating,
The profile and heating current magnitude of copper induction coil influence the magnetic distribution of the subject different zones of structure 1.According to the present invention's
Preferred embodiment, copper induction coil 2 are Reducing screw coil or square coil, can easily be realized on coil axis direction
Thermograde designs, the thermograde of model configuration thermal environment.Preferably, it is higher to be tested the service temperature on the surface of structure 1, its week
Enclose that copper induction coil 2 is more intensive, copper induction coil 2 and be tested structure 1 distance it is smaller；It is tested the service temperature on the surface of structure 1
Lower, copper induction coil 2 is more sparse around it, and copper induction coil 2 and the distance for being tested structure 1 are bigger.Preferably, the copper line of induction
The material of circle 2 is hollow T2 copper tubes, and its inside radius is 3mm, outer radius 4mm；Copper induction coil is shaped as taper, and its is small
End radius is 50mm, totally 9 circle, and semi-cone angle is 31 °.
Support platform 3, the inside of test chamber 4 is fixedly provided in, structure 1 is tested for placing, and constrain subject structure 1
Deformation.Preferably, subject structure 1 is placed in copper induction coil 2, the big end end face of the support subject structure 1 of support platform 3, is made
The big end end face that structure 1 must be tested can be along the normal direction displacement of support platform 3；Or subject structure 1 is placed in copper sensing
In coil 2, support platform 3 support subject structure 1 big end end face and small end end face so that subject structure 1 big end end face and
Small end end face can not be along the normal direction displacement of support platform 3.
Thermal imaging system 5, one end of subject structure 1 is arranged at, for detecting the temperature field data of subject structure 1, and by temperature
Degree field data is transferred to data handling system 7.
DIC (Digital Image Correlation, digital image correlation technique) testing lens, it is arranged at subject knot
One end of structure 1, for detecting the strain field data of subject structure 1, and strain field data are transferred to data handling system 7.
Data handling system 7, for obtaining the actual temperature ladder of subject structure 1 according to the temperature field data analysis of reception
Degree；Determine whether subject structure 1 structure occurs and destroy and deform according to the strain field data of reception.The safety of test subject structure 1
Property and the experimental period of reliability determined according to the active time of subject structure 1.After test terminates, according to the strain field of reception
Data determine whether subject structure 1 structure occurs and destroy and deform.If subject structure occurs deforming and/or crackle, show by
It is poor to try safety and reliability of the structure in actual temperature gradient and active time.
Preferably, it is of the invention to further comprise：Sensor 8 and oscillograph 9, wherein, sensor 8 is arranged at the copper line of induction
The surrounding of circle 2, for detecting induced-current and induced-current frequency, and data transfer will be detected to oscillograph 9；Oscillograph 9, connects
The detection data that sensor 2 transmits are received, analysis obtains induced-current and induced-current frequency.
In order to avoid using the efficiency of complicated heater, raising structure thermal environment simulation, the invention provides one kind
The embodiment of structure thermal environment simulation method based on sensing heating, as shown in Figure 1.
According to an embodiment of the invention, the flow of the structure thermal environment simulation method based on sensing heating originates in step
S1, according to material, profile and the size of subject structure and the thermograde of Service Environment, determine the profile of copper induction coil
With size and heating current magnitude and heated current frequency.Preferably, structure is tested as the thin of axisymmetric hollow taper type
Wall construction, its wall thickness is 10mm, axial length 150mm, semi-cone angle are 16.7 °, small end inside radius is 18mm；The subject knot
The axial direction of structure is identical with the axial direction of the copper induction coil.
The magnetic flux line number passed through in the subject unit area of structure 1 is defined as magnetic flux, and magnetic distribution is different, is tested structure
The magnetic flux of 1 different zones is also different, and then vortex density is big greatly for magnetic flux, and caused Joule heat is big；Magnetic flux is small, is vortexed close
Spend small, caused Joule heat is small.When alternating current passes through conductor, electric current will focus on conductive surface and flow through, this phenomenon
Kelvin effect, it is called Kelvin effect.Kelvin effect causes current density to concentrate on skin depth region, and then causes the region
Joule heat is big.Therefore, varying environment thermal environment can be simulated by adjusting Distribution of Magnetic Field and skin depth so that sensing heating
Electromagnetic field possesses designability.Heating current magnitude, heated current frequency and conductive material influence the skin depth of sensing heating,
Copper induction coil profile and heating current magnitude influence the magnetic distribution of the subject different zones of structure 1.According to the excellent of the present invention
Embodiment is selected, copper induction coil is Reducing screw coil or square coil, can easily realize the temperature on coil axis direction
Spend gradient design, the thermograde of model configuration thermal environment.Preferably, in step S1, according to the theoretical temperatures ladder of subject structure
Degree, it is determined that the service temperature of the different zones of subject structure；It is higher to be tested the service temperature of body structure surface, the copper line of induction around it
Circle is more intensive, and copper induction coil and the distance for being tested structure are smaller；It is lower to be tested the service temperature of body structure surface, copper sense around it
Answer coil more sparse, copper induction coil and the distance for being tested structure are bigger.Preferably, the material of copper induction coil is hollow T2 purple
Copper pipe, its inside radius is 3mm, outer radius 4mm；Copper induction coil is shaped as taper, and its small end radius is 50mm, totally 9 circle,
Semi-cone angle is 31 °.
Preferably, in step S1, the skin depth and the relation of the power frequency of copper induction coil that are tested structure are：
In formula, δ represents the skin depth of subject structure, unit m：；σ represents the electrical conductivity of subject structure, and unit is：s/
m；μ0The absolute permeability of subject structure is represented, unit is：H/m；μrRepresent the relative permeability of subject structure, dimensionless unit；
F represents power frequency, and unit is：Hz.
After the material and profile of copper induction coil determine, Distribution of Magnetic Field is adjusted and only heated current width during skin depth
Value, the change of heated current frequency.According to a preferred embodiment of the invention, step S1 is specially：
S11, the profile and size for determining copper induction coil；
S12, the foundation scope of current amplitude and the scope of power frequency, and the vortex density of subject structure different zones
Distribution and the governing equation of structure thermal environment system different zones, iteration obtain the quilt under different current values and different power frequency values
Try the thermograde of structure；The thermograde of acquisition is missed with being tested the thermograde of structure Service Environment after each iteration
Difference is analysed, if error is less than a certain threshold value, terminates iterative process, and the electric current using current current value as copper induction coil
Amplitude, current power frequency value are as the power frequency of copper induction coil, current profile and size as copper induction coil
Profile and size；Wherein, the scope of current amplitude is in the range of 300A~3000A, the scope of power frequency for 20kHz~
100kHz；
If the thermograde and the error for the thermograde for being tested structure Service Environment that are obtained after S13, each iteration are big
In a certain threshold value, then change the profile and size of copper induction coil, continue iteration, until the temperature ladder that iteration obtains
Degree and the thermograde of subject structure Service Environment meet requirement, obtain current amplitude, power frequency, the coil of copper induction coil
Profile and coil dimension.
Preferably, the vortex density for being tested structure different zones is distributed as：
The governing equation of structure thermal environment system different zones includes：The governing equation of copper induction coil, it is tested structure
Governing equation, and air or vacuum area Electromagnetic Control equation, wherein,
The governing equation of copper induction coil is：
Subject structure governing equation be：
Air or vacuum area Electromagnetic Control equation are as follows：
J=0 formula 9
In formula, J is inductive loop density, and unit is：A/m2；JeFor current density in copper induction coil, unit is：A/m2；
A is magnetic potential gesture, and unit is：A/m；μ0Absolute permeability is represented, unit is：H/m；μrRepresent relative permeability, dimensionless unit；σ
The electrical conductivity of material is represented, unit is：s/m.Heating current magnitude and heated current frequency can determine that according to formula 2-10.
S2, will subject structure be placed in induction coil, give the copper line of induction according to heating current magnitude and heated current frequency
Circle applies electric signal, produces electromagnetic field to heat the subject structure.
Preferably, in step S2, subject structure is placed in copper induction coil specially：Subject structure is placed in copper sensing
In coil, the big end end face of subject structure is supported using support platform so that the big end end face for being tested structure can be along support
The normal direction displacement of platform；Or subject structure is placed in copper induction coil, support subject structure using support platform
Big end end face and small end end face so that big the end end face and small end end face for being tested structure can not be along the normal directions of support platform
Displacement.
Preferably, step S2 further comprises：During electric signal is applied to copper induction coil, subject structure is entered
Row cooling treatment, it is oxidized with preventing from being tested structure.Preferably, cooling treatment is specially：Structure thermal environment simulation system is put
In vacuum water cooling cabin, cooling treatment is carried out to subject structure by the cooling water in the dead level in vacuum water cooling cabin.Preferably, very
Transparent observing window is provided with air water cooling cabin, temperature field and the strain field of structure are tested with real-time monitoring.
The thermograde and strain field of S3, collection subject structure under electromagnetic field effect, subject knot is determined according to strain field
The safety and reliability of structure.The actual temperature gradient of subject structure is obtained according to the temperature field data analysis of reception；According to connecing
The strain field data of receipts determines whether subject structure structure occurs and destroy and deform.Test subject safety of structure and reliability
Experimental period determines according to the active time of subject structure.After test terminates, determine to be tested according to the strain field data of reception
The safety and reliability of structure.If subject structure occurs deforming and/or crackle, show to be tested structure in actual temperature gradient
With occur structure destruction in active time, safety and reliability is poor.
Compared with prior art, the embodiment of the present invention heats subject structure by sensing heating, can avoid using multiple
Miscellaneous heater, and can simulate different thermal environments by adjusting Distribution of Magnetic Field and skin depth so that sensing heating
Electromagnetic field possess designability, the method and apparatus for greatly simplifying structure thermal environment simulation, improve structure thermal environment simulation
Efficiency..
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (13)
1. a kind of structure thermal environment simulation method based on sensing heating, methods described include：
S1, according to subject structure material, profile and size and Service Environment thermograde, determine copper induction coil
Profile and size and heating current magnitude and heated current frequency；
S2, will subject structure be placed in the copper induction coil, according to the heating current magnitude and heated current frequency to institute
State copper induction coil and apply electric signal, produce electromagnetic field to heat the subject structure；
The thermograde and strain field of S3, the collection subject structure under the electromagnetic field effect, it is true according to the strain field
The safety and reliability of the fixed subject structure.
2. structure thermal environment simulation method as claimed in claim 1, wherein, the copper induction coil be Reducing screw coil or
Square coil.
3. structure thermal environment simulation method as claimed in claim 1, wherein, in step S1, according to the military service ring of subject structure
The thermograde in border, determine the service temperature of the subject structure different zones；The service temperature of the subject body structure surface is got over
Height, copper induction coil is more intensive around it, and the copper induction coil and the distance of the subject structure are smaller；The subject
The service temperature of body structure surface is lower, and copper induction coil is more sparse around it, and the copper induction coil is tied with the subject
The distance of structure is bigger.
4. structure thermal environment simulation method as claimed in claim 3, wherein, in step S1, the skin depth that becomes of the subject structure
Spend and be with the relation of the heated current frequency：
In formula, δ represents the skin depth of subject structure, unit m；σ represents the electrical conductivity of subject structure, and unit is：s/m；μ0Table
Show the absolute permeability of subject structure, unit is：H/m；μrRepresent the relative permeability of subject structure, dimensionless unit；F is represented
Heated current frequency, unit are：Hz.
5. structure thermal environment simulation method as claimed in claim 4, wherein, step S1 is specially：
S11, the profile and size for determining copper induction coil；
S12, the foundation scope of heating current magnitude and the scope of heated current frequency, and the subject structure different zones
Vortex density is distributed and the governing equation of structure thermal environment system different zones, and iteration is obtained in different current values and different electric currents frequency
The thermograde of structure is tested under rate value；By the temperature ladder of the thermograde of acquisition and subject structure Service Environment after each iteration
Degree carries out error analysis, if error is less than a certain threshold value, terminates iterative process, and using current current value as the copper line of induction
The heated current frequency, current profile and chi of the heating current magnitude of circle, current power frequency value as copper induction coil
Very little profile and size as copper induction coil；Wherein, the scope of heating current magnitude is heating in the range of 300A~3000A
The scope of power frequency is 20kHz~100kHz；
If the error of the thermograde and the thermograde of subject structure Service Environment obtained after S13, each iteration is all higher than institute
State a certain threshold value, then change copper induction coil profile and size, continue iteration, until iteration obtain thermograde with
The thermograde for being tested structure Service Environment meets to require, obtain the heating current magnitude of copper induction coil, heated current frequency,
Coil shape and coil dimension.
6. structure thermal environment simulation method as claimed in claim 5, wherein,
The vortex density of the subject structure different zones is distributed as：
The governing equation of structure thermal environment system different zones includes：The governing equation of the copper induction coil, the subject knot
The governing equation of structure, and air or vacuum area Electromagnetic Control equation, wherein,
The governing equation of the copper induction coil is：
It is described subject structure governing equation be：
Air or vacuum area Electromagnetic Control equation are as follows：
J=0 formula 9
In formula, J is inductive loop density, and unit is：A/m2；JeFor current density in copper induction coil, unit is：A/m2；A is
Magnetic potential gesture, unit are：A/m；μ0Absolute permeability is represented, unit is：H/m；μrRepresent relative permeability, dimensionless unit；σ tables
Show the electrical conductivity of material, unit is：s/m.
7. structure thermal environment simulation method as claimed in claim 1, wherein, it is described that subject structure is placed in institute in step S2
State in copper induction coil and be specially：
Subject structure is placed in the copper induction coil, using the big end end face of the support platform support subject structure, made
Obtain normal direction displacement of the big end end face of the subject structure along the support platform；
Or
Subject structure is placed in the copper induction coil, utilizes the support platform support subject big end end face of structure and small
Hold end face so that big the end end face and small end end face of the subject structure can not be along the normal direction positions of the support platform
Move.
8. structure thermal environment simulation method as claimed in claim 1, wherein, the step S2 further comprises：To described
During copper induction coil applies electric signal, anti-oxidant treatment is carried out to the subject structure, to prevent the subject structure
It is oxidized.
9. structure thermal environment simulation method as claimed in claim 8, wherein, the anti-oxidant treatment is specially：By structure heat
Environmental simulation system is placed in vacuum chamber, prevents the subject structure to be oxidized by vacuum environment.
10. structure thermal environment simulation method as claimed in claim 9, wherein, the vacuum chamber is vacuum water cooling cabin, passes through institute
The cooling water stated in the dead level in vacuum water cooling cabin carries out cooling treatment to the vacuum chamber, to prevent the vacuum chamber in high temperature bar
Destroyed under part.
11. structure thermal environment simulation method as claimed in claim 10, wherein, it is provided with transparent sight on the vacuum water cooling cabin
Window is examined, to monitor the temperature field of the subject structure and strain field in real time.
12. structure thermal environment simulation method as claimed in claim 1, wherein, the subject structure is axisymmetric hollow cone
The thin-wall construction of platform shape, its wall thickness is 10mm, axial length 150mm, semi-cone angle are 16.7 °, small end inside radius is 18mm；Institute
The axial direction for stating subject structure is identical with the axial direction of the copper induction coil.
13. structure thermal environment simulation method as claimed in claim 12, wherein, the material of the copper induction coil is hollow T2
Copper tube, its inside radius is 3mm, outer radius 4mm；The copper induction coil is shaped as taper, and its small end radius is 50mm,
Totally 9 circle, semi-cone angle are 31 °.
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